EP4225960A1 - Matériau électroconducteur avec revêtement - Google Patents

Matériau électroconducteur avec revêtement

Info

Publication number
EP4225960A1
EP4225960A1 EP20838897.5A EP20838897A EP4225960A1 EP 4225960 A1 EP4225960 A1 EP 4225960A1 EP 20838897 A EP20838897 A EP 20838897A EP 4225960 A1 EP4225960 A1 EP 4225960A1
Authority
EP
European Patent Office
Prior art keywords
coating
silver
rich
tin
precipitations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20838897.5A
Other languages
German (de)
English (en)
Inventor
Michael Bohsmann
Robert Zauter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wieland Werke AG
Original Assignee
Wieland Werke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wieland Werke AG filed Critical Wieland Werke AG
Publication of EP4225960A1 publication Critical patent/EP4225960A1/fr
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/027—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal matrix material comprising a mixture of at least two metals or metal phases or metal matrix composites, e.g. metal matrix with embedded inorganic hard particles, CERMET, MMC.
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component

Definitions

  • the invention relates to an electrically conductive material with a coating. Such materials are used to manufacture connectors.
  • a reduction in the insertion forces can be achieved by the thickness of the applied tin layer is kept small.
  • the volume of tin, which is pushed in front of the contact zone during the mating process and thus generates increased friction, can be reduced as a result.
  • a surface coating made of an alloy is applied to the base material of a plug element in a molten manner, which, in addition to tin and optionally lead, also contains up to a total of 10% by weight contains at least one of the elements from the group silver, aluminum, silicon, copper, magnesium, iron, nickel, manganese, zinc, zirconium, antimony, rhodium, palladium and platinum. These elements preferably form mixed crystals or intermetallic phases with tin, the hardness of which is greater than the hardness of tin.
  • tin coatings applied to copper materials are known from publication WO 2019/224 197 A1, which contain the insoluble, precipitation-forming element silver in a proportion of 0.08 to 0.5% by weight in the form of an AgaSn phase.
  • the AgaSn phase is present in the coating in particle sizes with an area average of 0.01 to 0.03 pm 2 .
  • the special composition of the coating improves the Adhesion of the coating to the substrate.
  • the effect of improving the adhesive strength is based on the fact that the element silver forms an intermetallic phase with tin, which reduces or suppresses the formation of the CuaSn phase.
  • the invention is based on the object of specifying a material for connectors with reduced insertion and removal forces compared to the prior art, while at the same time having a low electrical contact resistance.
  • the invention includes an electrically conductive material comprising a copper or copper alloy substrate and a coating of at least one layer.
  • the coating has an outermost layer which consists of at least 90% by volume of an intermetallic phase which comprises or is CueSns.
  • the surface of the outermost layer facing away from the substrate i.e. the outer surface of the material, has island-like, silver-rich precipitations which, based on the entire outer surface of the coating, have an area percentage of 7 to 20%, preferably up to 15%.
  • Silver-rich precipitations are understood as meaning precipitations of intermetallic phase whose molar proportion of silver is more than 50%, preferably more than 70%.
  • the precipitates can have the composition AgsSn.
  • the silver-rich precipitates are present in a form that can be described as insular. Insular here means that several individual, there are compact areas of silver-rich phase surrounded by another phase. The individual areas of the silver-rich phase are predominantly arranged at a distance from one another. However, it cannot be ruled out that two or more such areas directly adjoin one another.
  • the areas of silver-rich phase can be approximately circular or elliptical in shape. However, it is also possible that areas of silver-rich phase have a shape corresponding to a deformed circle or a deformed ellipse, or that they have a shape with corners.
  • the individual regions of silver-rich phase are surrounded by an intermetallic phase that includes or is CueSns. In particular, this intermetallic phase can contain small amounts of silver, for example in the form of an intermetallic phase with the approximate composition CueSnsAgx, where x is significantly less than 1.
  • the outermost layer of the coating may preferably be 0.5 to 5 ⁇ m thick.
  • the island-like, silver-rich precipitations are located on the surface of the outermost layer facing away from the substrate. They are at least partially embedded in the surrounding intermetallic phase in such a way that they are located in a zone that extends from the outer surface up to 50% of the thickness of the outermost layer, typically up to 0.3 ⁇ m deep into the intermetallic phase extends into. Furthermore, the island-like, silver-rich precipitations can at least partially be slightly raised above the surface of the intermetallic phase surrounding them.
  • the island-like, silver-rich precipitations can have a thickness measured perpendicularly to the surface of up to 1 ⁇ m, preferably 0.2 to 0.4 ⁇ m.
  • the relatively high proportion of silver-rich precipitates on the outer surface of the material has an influence on the interaction of the material with the material of the partner of the connector.
  • the silver rich Precipitations cause a reduction in the insertion and withdrawal forces.
  • the silver-rich precipitates are slightly raised, they can reduce the effective contact area between the partners and thus the effective frictional forces.
  • a reduction in the insertion and withdrawal forces of up to 40% compared to the coating, which does not have the large proportion of silver-rich precipitations on the surface according to the invention, can thus be achieved.
  • a material described above can be produced by first applying a coating of a tin-silver alloy to a substrate, in particular to a strip-shaped substrate, made of copper or a copper alloy by means of hot-dip tinning.
  • Hot-dip tinning means that the coating is applied to the substrate from the molten phase.
  • the silver content in the tin-silver alloy is 1.5 to 10% by weight, preferably 2 to 6% by weight, particularly preferably at most 5% by weight.
  • the coated material is then subjected to a heat treatment at a temperature between 160 and 200 °C. The duration of the heat treatment depends, among other things, on the thickness of the coating and is between 10 and 200 hours.
  • AgaSn precipitates are present in a tin matrix in the coating of a tin-silver alloy applied by hot-dip tinning.
  • the AgaSn precipitates are finely distributed homogeneously throughout the volume of the tin matrix. Its proportion of the area on the outer surface of the coating, ie the surface of the outermost layer facing away from the substrate, corresponds to its proportion by volume in the tin matrix immediately after the layer has been applied.
  • copper diffuses from the substrate into the tin-silver coating, converting the tin to Cu-Sn intermetallic phases, particularly CueSns.
  • the originally finely distributed AgaSn precipitations are displaced from the matrix and pushed in front of the growth front of the intermetallic Cu-Sn phases.
  • the AgaSn precipitations grow together and are thus enlarged.
  • coarse AgaSn precipitations are present directly on the surface of the outermost layer facing away from the substrate, while the volume of the coating below the outer surface of the coating is largely free of silver, i.e. at most residues of contains AgaSn.
  • the heat treatment thus results in a depletion of AgaSn in the volume of the coating below the outer surface of the coating and, as a result, a significant enrichment, i.e. an increase in the concentration, of AgaSn directly on the outer surface of the coating, so that after the heat treatment the Area percentage of silver-rich precipitations on the surface is 7 to 20%.
  • the material is preferably in the form of a band or strip.
  • more than 50%, preferably at least 70%, of the surface area of the island-like, silver-rich precipitations can be formed by precipitations which have a size of at least 0.4 ⁇ m.
  • the size here is understood to mean the diameter of a circle whose area is equal to the area of an island-like excretion when viewed in plan on the outer surface.
  • precipitations with a size of less than 0.4 ⁇ m are present on the outer surface of the coating.
  • these smaller precipitations only contribute to a smaller proportion of the surface area of 7 to 20% than the precipitations with a size of at least 0.4 ⁇ m.
  • an intermediate layer between the outermost layer and the substrate which comprises a copper-rich intermetallic phase, which comprises or is in particular CuaSn.
  • a phase with a molar proportion of copper of more than 65% is referred to as rich in copper.
  • a copper-rich phase which is essentially CuaSn, forms at the interface between copper and tin during a heat treatment.
  • the temperature and duration of the heat treatment influence both the formation of this copper-rich phase and the formation of the silver-rich precipitations on the outer surface of the coating.
  • the existence of the intermediate layer of copper-rich phase thus gives a degree of freedom that makes it possible to optimize the number and size of the silver-rich precipitates on the outer surface.
  • the coating can consist of the intermediate layer and the outermost layer with the island-like, silver-rich precipitations. At this particular According to one aspect of the invention, there are no further layers in the coating. This has the advantage that the coating is inexpensive compared to coatings consisting of more than these two layers.
  • the proportion of silver in the coating can be 2 to 10% by weight, preferably at least 2.5% by weight, particularly preferably at least 3% by weight and preferably at most 6% by weight. more preferably at most 5% by weight of the total amount of tin and silver in the coating.
  • the silver is mainly present in the silver-rich precipitates on the outer surface of the coating, while the tin is bound both in the intermetallic phases, which are essentially CuaSn and CueSns, and in the silver-rich precipitates. If the content of silver is less than 2% by weight, the silver-rich precipitates are not sufficiently formed on the outer surface of the material. If the proportion of silver is more than 10% by weight, then the coating is no longer economically interesting.
  • FIG. 1 shows a cross-section of a material with a tin-silver layer according to the prior art
  • FIG. 3 shows a cross section of a material with a coating according to the invention.
  • FIG. 4 shows an SEM image of the surface of a coating according to the invention.
  • FIG. 1 schematically shows a cross section through a material 1 with a layer 5 known from the prior art made of a tin-silver alloy with approximately 4% by weight silver.
  • the layer 5 was applied to the substrate 10 by hot-dip tinning.
  • Layer 5 consists of a matrix of free tin 51 and finely distributed AgaSn precipitations 52 embedded therein the black background is shown.
  • tin is converted at the interface between substrate 10 and the tin-silver alloy layer 5 into a relatively thin, tin-rich intermetallic phase 41 with the composition CueSns.
  • FIG. 2 shows an image (SEM image) of the surface of a tin-silver layer 5 according to the prior art, produced by means of a scanning electron microscope. 2 thus represents, as it were, the outer surface of the material 1 according to FIG.
  • the area percentage of the AgaSn precipitates 52 is approximately 4%.
  • the size of most of the AgaSn precipitates 52 is below 0.3 pm.
  • Fig. 3 shows schematically a cross section through a material 1 with a coating 2 according to the invention.
  • the coating 2 has an outer layer 21 and an intermediate layer 22 of copper-rich intermetallic phase 42 CuaSn, which is located between the substrate 10 and the outer layer 21.
  • the outer layer 21 contains intermetallic phase 41 with the composition CueSns.
  • On the surface of the outermost layer 21 facing away from the substrate 10 are island-like, silver-rich Precipitations 3. These precipitations 3 are at least partially embedded in the outermost zone of the intermetallic phase 41. They partially protrude beyond the outer surface of the intermetallic phase 41 .
  • FIG. 4 shows a scanning electron microscope image (SEM image) of the surface of the outermost layer 21 of a coating 2 according to the invention.
  • FIG. 4 thus represents the outer surface of the material 1 according to FIG Regions can be seen which are arranged like islands on the intermetallic phase 41 shown in dark.
  • the area percentage of the silver-rich precipitations 3 is approximately 11%.
  • the size of most silver-rich precipitates 3 is between 0.4 and 3 pm.
  • the coating shown in FIG. 4 was produced by subjecting the material 1 shown in FIG. 2, which has a 3 ⁇ m thick layer of a tin-silver alloy containing 4% by weight silver, to a heat treatment for a period of 30 hours at 200°C.
  • a coating produced in this way shows, in laboratory tests simulating the use of the material as a connector, a contact resistance that is about the same low level as that of a tin-silver coating that has not been subjected to a heat treatment.
  • insertion and withdrawal forces were determined which are up to 25% lower than those determined on a non-heat-treated sample.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating With Molten Metal (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

L'invention concerne un matériau électroconducteur (1) comprenant un substrat (10) de cuivre ou d'un alliage de cuivre et un revêtement (2) d'au moins une couche (21, 22), le revêtement (2) ayant une couche la plus à l'extérieur (21) dont au moins 90 % en volume est constitué d'une phase intermétallique (41) qui comprend ou est du Cu6Sn5. Selon l'invention, la surface de la couche la plus extérieure (21) opposée au substrat (10) présente des précipités riches en argent (3) isolés couvrant une proportion de la surface de 7 à 20 %.
EP20838897.5A 2020-10-05 2020-12-21 Matériau électroconducteur avec revêtement Pending EP4225960A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020006059.5A DE102020006059A1 (de) 2020-10-05 2020-10-05 Elektrisch leitendes Material mit Beschichtung
PCT/EP2020/000215 WO2022073575A1 (fr) 2020-10-05 2020-12-21 Matériau électroconducteur avec revêtement

Publications (1)

Publication Number Publication Date
EP4225960A1 true EP4225960A1 (fr) 2023-08-16

Family

ID=74175710

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20838897.5A Pending EP4225960A1 (fr) 2020-10-05 2020-12-21 Matériau électroconducteur avec revêtement

Country Status (7)

Country Link
US (1) US12071692B2 (fr)
EP (1) EP4225960A1 (fr)
JP (1) JP2023546769A (fr)
KR (1) KR20230080393A (fr)
CN (1) CN116075601A (fr)
DE (1) DE102020006059A1 (fr)
WO (1) WO2022073575A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114905106B (zh) * 2022-05-23 2023-03-24 北京科技大学 一种基于Cu6Sn5取向复合涂层制备的Cu/SnAgCu/Cu钎焊方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4005836C2 (de) 1990-02-23 1999-10-28 Stolberger Metallwerke Gmbh Elektrisches Steckverbinderpaar
US5849424A (en) 1996-05-15 1998-12-15 Dowa Mining Co., Ltd. Hard coated copper alloys, process for production thereof and connector terminals made therefrom
DE19752329A1 (de) 1997-11-26 1999-05-27 Stolberger Metallwerke Gmbh Verfahren zur Herstellung eines metallischen Verbundbands
DE10025106A1 (de) 2000-05-20 2001-11-22 Stolberger Metallwerke Gmbh Elektrisch leitfähiges Metallband und Steckverbinder hieraus
DE10025107A1 (de) 2000-05-20 2001-11-22 Stolberger Metallwerke Gmbh Elektrisch leifähiges Metallband und Steckverbinder
DE10139953A1 (de) 2001-08-21 2003-03-27 Stolberger Metallwerke Gmbh Werkstoff für ein Metallband
JP4016637B2 (ja) * 2001-10-24 2007-12-05 松下電器産業株式会社 錫−銀合金めっき皮膜を有する電子部品用リードフレーム及びその製造方法
US20080308300A1 (en) 2007-06-18 2008-12-18 Conti Mark A Method of manufacturing electrically conductive strips
JP2010126766A (ja) 2008-11-27 2010-06-10 Toyota Motor Corp Ｓｎめっき層を有するめっき基材およびその製造方法
DE102010020427A1 (de) 2010-05-12 2011-11-17 Kme Germany Ag & Co. Kg Produkt mit einer antimikrobiell wirkenden Oberflächenschicht und Verfahren zu seiner Herstellung
JP5387742B2 (ja) 2012-04-06 2014-01-15 株式会社オートネットワーク技術研究所 めっき部材、コネクタ用めっき端子、めっき部材の製造方法、及びコネクタ用めっき端子の製造方法
DE102018208116A1 (de) 2018-05-23 2019-11-28 Aurubis Stolberg Gmbh & Co. Kg Kupferband zur Herstellung von elektrischen Kontakten und Verfahren zur Herstellung eines Kupferbandes und Steckverbinder

Also Published As

Publication number Publication date
KR20230080393A (ko) 2023-06-07
US20230265549A1 (en) 2023-08-24
WO2022073575A1 (fr) 2022-04-14
JP2023546769A (ja) 2023-11-08
DE102020006059A1 (de) 2022-04-07
CN116075601A (zh) 2023-05-05
US12071692B2 (en) 2024-08-27

Similar Documents

Publication Publication Date Title
DE112015001594B4 (de) Anschlusspaar und Steckverbinderpaar, das das Anschlusspaar einschließt
DE3650280T2 (de) Verfahren zur Behandlung von Teilchen, die zur Herstellung von Material zur elektromagnetischen Abschirmung benutzt werden.
EP1430489B1 (fr) Composant electroceramique comportant plusieurs surfaces de contact
DE112012006189T5 (de) Plattiertes Element, plattierter Anschluss für einen Verbinder, Verfahren zum Herstellen eines plattierten Elementes und Verfahren zum Herstellen eines plattierten Anschlusses für einen Verbinder
DE102007047007A1 (de) Elektrisches Kontaktelement und ein Verfahren zum Herstellen desselben
DE202013012583U1 (de) Scheibe mit einem elektrischen Anschlusselement
DE102010012609A1 (de) Sn-plattiertes Kupfer oder Sn-plattierte Kupferlegierung mit hervorragender Wärmebeständigkeit und Herstellungsverfahren dafür
EP2888075A1 (fr) Vitre dotée d'un élément de connexion électrique
DE112016002685B4 (de) Anschlussstück und Verbinder
DE112014004500T5 (de) Elektrisches Kontaktmaterial für einen Verbinder und Verfahren zur Herstellung desselben
DE69909569T2 (de) Korrosionsbeständiger dauermagnet und verfahren zu seiner herstellung
DE102010027463A1 (de) Zündkerze und Verfahren zu ihrer Herstellung
DE102006010760A1 (de) Kupferlegierung und Verfahren zur Herstellung derselben
DE102012215041A1 (de) Verfahren zur Herstellung eines Halbleiterelementes eines direktkonvertierenden Röntgendetektors
DE102014117410B4 (de) Elektrisches Kontaktelement, Einpressstift, Buchse und Leadframe
DE10350343B4 (de) Chipförmiger Varistor und Verfahren zu dessen Herstellung
WO2022073575A1 (fr) Matériau électroconducteur avec revêtement
DE112014004497T5 (de) Aluminiumbasierter poröser Körper und Verfahren zu seiner Herstellung
EP3797181B1 (fr) Bande de cuivre pour la fabrication de contacts électriques, procédé pour la fabrication d'une bande de cuivre et connecteur enfichable
WO2014060254A1 (fr) Élément de contact électrique
DE112020001475T5 (de) Metallmaterial und Anschlussklemme
DE102011088211A1 (de) Kontaktelement und Verfahren zu seiner Herstellung
DE112017005378B4 (de) Elektrischer Kontaktpunkt, Verbinderanschlusspaar und Verbinderpaar
DE2303050A1 (de) Zusammengesetztes elektrisches kontaktmaterial
DE112017005326T5 (de) Verbindungsanschluss und Verfahren zum Herstellen eines Verbindungsanschlusses

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: UNKNOWN

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20230315

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)