EP4200375A1 - Formulation adhésive pour la production de corps moulés de matériau comprimé - Google Patents

Formulation adhésive pour la production de corps moulés de matériau comprimé

Info

Publication number
EP4200375A1
EP4200375A1 EP21762039.2A EP21762039A EP4200375A1 EP 4200375 A1 EP4200375 A1 EP 4200375A1 EP 21762039 A EP21762039 A EP 21762039A EP 4200375 A1 EP4200375 A1 EP 4200375A1
Authority
EP
European Patent Office
Prior art keywords
adhesive formulation
weight
chip
fiber material
functionalized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21762039.2A
Other languages
German (de)
English (en)
Inventor
Herbert Mikowitsch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lignom Holding Sarl
Original Assignee
Lignom Holding Sarl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lignom Holding Sarl filed Critical Lignom Holding Sarl
Publication of EP4200375A1 publication Critical patent/EP4200375A1/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/13—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board all layers being exclusively wood
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09J161/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C09J161/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/025—Particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/72—Cured, e.g. vulcanised, cross-linked
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2329/00—Polyvinylalcohols, polyvinylethers, polyvinylaldehydes, polyvinylketones or polyvinylketals
    • B32B2329/04—Polyvinylalcohol
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2333/00—Polymers of unsaturated acids or derivatives thereof
    • B32B2333/04—Polymers of esters
    • B32B2333/08—Polymers of acrylic acid esters, e.g. PMA, i.e. polymethylacrylate

Definitions

  • the invention relates to a chemically curable, aqueous adhesive formulation for the production of moldings made of pressed material, in particular panels made of pressed material, and methods for producing molded bodies of pressed material, in particular panels made of pressed material, by continuous or discontinuous pressing of mixtures of the adhesive formulation and chip or fiber material or by pressing layers of the adhesive formulation and chipboard or fiberboard.
  • molded molded body is generally understood to mean a molded body which is formed into the molded molded body by joining materials comprising chip or fiber material, curing an admixed adhesive formulation, subjecting it to compression pressure and optionally heating.
  • pressed material moldings therefore includes, for example, chipboard, in particular coarse chipboard (also known as OSB boards), medium-density (wood) fiber boards (so-called MDF boards), high-density (wood) fiber boards (so-called HDF boards), but also layered or layered panel structures, such as laminated veneer lumber panels.
  • chip or fiber material generally includes materials which fibers such as wood or cellulosic fibers including fibers from waste paper, other recycled material such as waste from sawmills or recycled timber, other naturally occurring fibers such as straw, bamboo etc., but also synthetic fibers such as polyester fibers.
  • chip or fiber material also includes mixtures of fibers of different nature.
  • the chip or fiber material can certainly have different shapes and degrees of comminution.
  • the chip or fiber material can already be in a shaped form, ie as a fiber composite body, such as in the case of the above-mentioned laminated veneer panels.
  • the chip or fiber material can also be provided in more or less loose form with different degrees of freeness, such as with a relatively low degree of freeness as so-called chip as in the chipboard or OSB boards mentioned above, or in loose form with relatively high degree of grinding, such as so-called broken down wood flour, such as with the MDF and HDF boards mentioned above.
  • the (different) processes for the production of pressed material moldings have in common that fiber material provided with an adhesive formulation is pressed into shape under pressure and, if necessary, heating.
  • Adhesive formulations for these applications are known in principle, although these known adhesive formulations have to be adapted depending on the type of molded body or panel to be produced, and thus depending on the process control to be used in each case. In some cases, adhesive formulations that are chemically completely different are even used for different procedures. For example, in the production of so-called fiber boards, primarily urea-formaldehyde resins, so-called UF resins, and to a lesser extent isocyanate-based resins are used, while phenolic resins are primarily used for joining or gluing veneer layers. This need to adapt an adhesive formulation to a specific process and/or product can have an adverse effect on economics.
  • Chipboard and fiberboard are typically manufactured at temperatures of 200 °C to 250 °C. This high Above all, high temperatures are necessary in order to achieve sufficient and as complete as possible curing in the core of the press mixture, since heating, for example a press cake made of chip or fiber material and adhesive, takes place from the sides, and the heat in must be directed to the inner core.
  • these high temperatures often lead to damage to a molded body, such as tearing of the molded body, and can therefore cause a high reject rate.
  • the object of the present invention was to overcome the disadvantages of the prior art and to provide an adhesive formulation by means of which the most reliable possible production of pressed bodies while avoiding large quantities of rejects and a process with reduced emissions can be achieved, and which at the same time is as universal as possible with different production methods can be used for moldings made of pressed material. It was also an object of the invention to provide a method for producing molded articles using such an adhesive formulation.
  • a chemically curable, aqueous adhesive formulation for the production of moldings made of pressed material, in particular plates made of pressed material, by continuous or discontinuous pressing of mixtures of the adhesive formulation and chip or fiber material or by pressing layers of the adhesive formulation and fiber material plates loosened.
  • the chemically curable, aqueous adhesive formulation comprises at least one chemically curable reactive resin and at least one crosslinker or hardener for the reactive resin.
  • the chemically curable, aqueous adhesive formulation specifically comprises 35% by weight to 85% by weight of an aqueous phase of a hydroxyl-functional reactive resin or a mixture of hydroxyl-functional reactive resins with a resin content of 30% to 65% by weight .%, and 12% by weight to 25% by weight of an aqueous phase of a urea resin crosslinker, which is a reaction product formed from a urea and a multifunctional aldehyde, with a resin content of 30% by weight to 65% by weight, and 0 from .1% to 4% by weight of an acid catalyst having a pKa of 2 or less.
  • the chemically curable, aqueous adhesive formulation can preferably comprise 50% by weight to 80% by weight of the aqueous phase of the reactive resin functionalized with hydroxyl groups or of the mixture of reactive resins functionalized with hydroxyl groups.
  • the resin content of this aqueous phase can preferably be 35% by weight to 60% by weight.
  • the adhesive formulation can preferably comprise 14% by weight to 22% by weight of the aqueous phase of the urea resin crosslinking agent.
  • a resin content of this aqueous phase can preferably be 35% by weight to 60% by weight.
  • the adhesive formulation may comprise from 0.5% to 3.5% by weight of the acid catalyst.
  • an aqueous phase is to be understood as meaning an aqueous dispersion and/or an aqueous suspension and/or an aqueous emulsion and/or an aqueous solution of these reactive substances.
  • the remainder in wt.%, ie to 100 wt.% of an aqueous phase, can be formed at least predominantly by water.
  • the aqueous phases can also contain other components, such as dispersion aids and/or suspension aids or stabilizers, emulsifiers, defoamers and the like.
  • the adhesive formulation can also include other components or substances or additives, such as pigment(s) apart from the specified aqueous phases. Examples of preferred additives are explained in more detail below. If the adhesive formulation also includes other components, in particular additives, the person skilled in the art must of course adjust the proportions by weight of the specified aqueous phases (reactive resin, crosslinking agent) and acid catalyst accordingly.
  • the adhesive formulation can also be referred to as a glue formulation, sizing agent or, as is customary in the technical jargon of the relevant technical field, also as a glue liquor.
  • the adhesive formulation may be intended for the manufacture of particleboard, fiberboard and laminated board structures such as laminated veneer lumber panels.
  • the adhesive formulation with the specified features is distinguished on the one hand by the fact that it can be used without the release of pollutants. As tests have shown, with the specified adhesive formulation, in particular, no formaldehyde or isocyanate is released during the curing of the adhesive formulation in the course of the production of molded molded bodies.
  • the adhesive formulation in the specified composition can be used universally in the technical field of press material molding production without the need for significant adjustments.
  • chipboard, MDF, HDF, OSB and layered boards made of chipboard or fiber material can be produced using the adhesive formulation, or the corresponding production processes can be carried out using the adhesive formulation.
  • a temperature during the pressing process can be significantly reduced compared to the conventional adhesive formulations according to the prior art.
  • a temperature during the pressing process when using the adhesive formulation could be reduced to approx. 160° C. or less. This is in comparison to the temperatures of over 200 °C that are usually required when using conventional adhesive formulations. In principle, this also provides a reduction in energy costs, and thus also a reduction in production costs.
  • the adhesive formulation has also proven to be advantageous with regard to a waste-free or at least reduced-waste production of molded molded bodies.
  • good heat conduction is provided from the outer areas, for example of a press cake made of chip or fiber material and adhesive formulation, so that in the course of pressing such a press cake, sufficiently high core temperatures can be achieved in the core area for as complete a curing as possible.
  • This can be demonstrated, among other things, by the achievable mechanical properties, such as the mechanical flexural strength and/or transverse tensile strength of molded bodies produced as boards, which are well within or above the standardized requirements for a respective board, for example MDF or HDF board .
  • due to the relatively low temperatures that are required for curing the adhesive formulation in question as completely as possible there appears to be hardly any damage during a pressing process, and the rejects caused as a result can be prevented.
  • an H-active equivalent weight of the aqueous phase of the reactive resin functionalized with hydroxyl groups or the mixture of reactive resins functionalized with hydroxyl groups can be 200 g/mol to 1500 g/mol.
  • H-active equivalent weight in this range has proven to be particularly suitable for the curing reaction of the hydroxyl-functional reactive resin.
  • the aqueous phase of the reactive resin functionalized with hydroxyl groups or of the mixture of reactive resins functionalized with hydroxyl groups can preferably have an H active equivalent weight of 500 g/mol to 1300 g/mol.
  • the term functionalized resin can be understood very generally as a chemical substance in which the respective functional groups, in the present case for example hydroxyl groups of the reactive resin, are chemically bonded to an oligomeric or polymeric carrier or a hydrocarbon skeleton .
  • the type of carrier can be of various kinds.
  • the reactive resin functionalized with hydroxyl groups or the mixture of reactive resins functionalized with hydroxyl groups can be selected from a group consisting of acrylate resins, functionalized styrene acrylate resins, functionalized acrylic acid copolymers, functionalized acrylate-urethane copolymers and functionalized ( meth)acrylate copolymers.
  • the corresponding aqueous phase can be in the form of an aqueous dispersion, suspension, emulsion or solution, for example.
  • suitable aqueous phases of reactive resins functionalized with hydroxyl groups are Macrynal SC 6826 WA 42 and Viacryl SC 6834WA 42 from Allnex and AC 31 from Alberdingk Boley.
  • the product Cymel NF 3030 from Allnex can be mentioned as an example of a suitable aqueous phase of a urea resin crosslinking agent or hardener for the hydroxyl-functional reactive resin.
  • acid catalyst for example, sulphonic acids such as (modified) para-toluenesulphonic acid and derivatives thereof can be used, a suitable example being Cycat 4045 from Allnex.
  • the adhesive formulation may include 0.1% to 20% by weight of one or more polyhydric alcohols.
  • a polyhydric alcohol acts as a reaction retardant for the specified reactive resin(s) or hardener(s)/crosslinking agent(s) of the adhesive formulation.
  • the necessary mixing with the chip or fiber material and/or the coating of boards comprising chip or fiber material can be carried out without there being a great risk of curing which is too rapid.
  • This feature makes sense above all in the case of process procedures in which, for example, the adhesive formulation is mixed with the chip or fiber material at elevated temperature, such as in a so-called blowline.
  • the adhesive formulation comprises 1% by weight to 10% by weight of a polyhydric alcohol or of a plurality of polyhydric alcohols.
  • glycols such as butyl diglycol can be used as polyhydric alcohols.
  • the adhesive formulation can comprise 0.1% by weight to 5% by weight of an anionic or neutral wax, or a mixture of corresponding waxes.
  • the adhesive formulation can preferably comprise 0.5% by weight to 3% by weight of an anionic or neutral wax, or a mixture of corresponding waxes.
  • the product Hydrowax 46 from Sasol for example, is suitable as a wax or wax mixture.
  • a solid wax can also be added during the gluing of the chip or fiber material with the adhesive formulation, as described in more detail below with reference to the method for producing a molded molded body.
  • the adhesive formulation it can be provided that it comprises 0.1% by weight to 35% by weight of a filler or a plurality of fillers and/or pigment(s).
  • a filler and/or a pigment can ultimately influence the mechanical properties and/or coloring of the molded molded body.
  • the adhesive formulation comprises 0.1% by weight to 6% by weight of a wetting agent or several wetting agents or surfactants.
  • a suitable wetting agent is, for example, Disperbyk 190 from Byk.
  • the adhesive formulation comprises 0.1% by weight to 8% by weight of a defoamer or multiple defoamers.
  • this feature can have an advantageous effect on the pressing process in the course of the production of moldings made from pressed material, for example to prevent the formation of bubbles.
  • suitable antifoams are Surfynol 420 or Surfynol DF 75 from Evonik Corporation.
  • the adhesive formulation may also include from 0.1% to 8% by weight of one or more thickeners.
  • suitable thickeners include Rheolate 310 D from Elementis and/or Acrysol RM 8 W from Dow.
  • Such thickeners can be used to influence the rheology and thus above all the processing properties of the two-component adhesive formulation or to adapt it to requirements.
  • adhesive formulations comprising a thickener are particularly well suited for producing coatings, such as by roller application.
  • the adhesive formulation as a mixed formulation comprising all substances contained, i.e. the aqueous phases of the reactive resin functionalized with hydroxyl groups or the mixture of reactive resins functionalized with hydroxyl groups and the aqueous phase of the urea resin crosslinker and the described above Acid catalyst and any additional additives or ingredients are present.
  • this can go hand in hand with only a limited shelf life.
  • the adhesive formulation comprises a first aqueous component A comprising the aqueous phase of the reactive resin functionalized with hydroxyl groups or the mixture of reactive resins functionalized with hydroxyl groups, and that it comprises a second component B comprising the aqueous phase of the urea resin crosslinker, said components A and B being intended to form the adhesive formulation by mixing components A and B.
  • the curable adhesive formulation can be formed by mixing the two components A and B, or the curable adhesive formulation can be formed by mixing the two components A and B.
  • Components A and B can preferably be mixed immediately before use, ie immediately before the chipboard or fiber material is glued and/or before the chipboard or fiberboard is glued, as will be described in more detail below.
  • the adhesive formulation may consist, for example, of 60% to 90% by weight of component A and 10% to 40% by weight of component B.
  • the adhesive formulation may be formed by mixing 60% to 90% by weight of component A and 10% to 40% by weight of component B.
  • either component A or component B can also comprise the acid catalyst.
  • any other components or substances or additives apart from the specified aqueous phases and the acid catalyst, such as the additives described above, either component A or component B may be added.
  • component A and/or component B also comprise further constituents, in particular additives, the person skilled in the art must of course adjust the corresponding proportions by weight of components A and B. If component A and/or component B comprise further additives, the percentage by weight ratio of component A to component B may also need to be adjusted within the percentage by weight ranges given above.
  • the object of the invention is also achieved by a first method for producing molded bodies made of pressed material, in particular panels made of pressed material.
  • the procedure includes the steps
  • the press cake or the press cake pieces have a weight proportion of chip or fiber material or chip or fiber material mixture of 77% by weight to 98.5% by weight and a weight proportion of adhesive formulation of 1% by weight to 20% by weight.
  • the advantages that can be achieved by such a method using the specified adhesive formulation have already been explained in connection with the above description of the adhesive formulation.
  • the corresponding 2-component adhesive formulation can be formed by combining the two components A and B in the process.
  • a merging or mixing of the two components A and B can before the step or in the course of the step of mixing the chip or fiber material or the chip or fiber material mixture with the adhesive formulation to form the press cake.
  • Chip or fiber material and chip or fiber material mixture is understood to mean a material which contains fibers such as wood or cellulosic fibers, including fibers from waste paper, other recycled material such as waste from sawmills or recycled timber, other naturally occurring fibers, such as straw, bamboo etc., but also synthetic fibers such as polyester fibers.
  • the chip or fiber material or the chip or fiber material mixture can have different configurations, in particular different degrees of comminution.
  • the chip or fiber material or the chip or fiber material mixture can be provided, for example, with different degrees of freeness, such as with a relatively low degree of freeness as so-called chip as in the known chipboard or OSB panels, or with a relatively high degree of freeness, such as Example as so-called wood flour, such as with the well-known MDF and HDF boards.
  • the gluing of the chip or fiber material or the chip or fiber material mixture ie the mixing of the adhesive formulation with the chip or fiber material or the chip or fiber material mixture, can be improved.
  • a weight proportion of plates in the plate layering is from 80% by weight to 99% by weight and a weight proportion of adhesive formulation in the plate layering is from 1% by weight to 20% by weight.
  • composition of a chemically curable adhesive formulation within the scope of the invention is:
  • Component A is a compound having Component A:
  • Component B is a compound having Component B:
  • the adhesive formulation is designed as a 2-component adhesive formulation, the wt.% Shares of the individual components of the 2-component adhesive formulation being 100% by weight Component B related.
  • component A in the specified embodiment based on 100% by weight of component A, consists of 90.2% by weight Macrynal SC 6826 WA 42, 6.1% by weight butyl diglycol, 2.5% by weight Cycat 4045 and 1 2.2% by weight of Hydrowax 46.
  • component B consists of 100% by weight of Cymel NF 3030.
  • the adhesive formulation consists of 81.6% by weight of component A and 18.4% by weight of the component B composed.
  • such a 2-component embodiment of the adhesive formulation is preferably used due to improved shelf life, but an embodiment as a ready-mixed formulation comprising all the substances contained, i.e. the above-described aqueous phases of the reactive resin functionalized with hydroxyl groups or the mixture of reactive resins functionalized with functional hydroxyl groups and the aqueous phase of the urea resin crosslinker and the acid catalyst as well as any additional additives or ingredients.
  • Macrynal SC 6826 WA 42 is an aqueous phase or dispersion of a hydroxyl-functional acrylic polyol resin having a non-volatile content of 43% by weight and an H-active equivalent weight (HEW) of 900 g /mol
  • Cymel NF 3030 is an aqueous phase of a reaction product of ureas and multifunctional aldehydes with a non-volatile content of approximately 43% by weight.
  • Cycat 4045 is a partially amine blocked para-toluenesulfonic acid catalyst.
  • the adhesive formulation specified has proved to be fundamentally good and universally suitable for use in the known processes for the production of molded molded bodies.
  • the specified adhesive formulation is only to be regarded as an exemplary embodiment and, depending on the specific requirements of a process for the production of molded molded bodies, adapted or other formulations or recipes can also be used instead of the adhesive formulation specified above.
  • the product Macrynal SC 6826 WA 42 can be replaced by other, aqueous phases of a reactive resin functionalized with hydroxyl groups or a mixture of reactive resins functionalized with hydroxyl groups, such as Viacryl SC 6834 W, also from Allnex.
  • the reactive resin functionalized with hydroxyl groups or the mixture of reactive resins functionalized with hydroxyl groups can preferably be selected from a group consisting of acrylate resins, functionalized styrene acrylate resins, functionalized acrylic acid copolymers, functionalized acrylate-urethane copolymers and functionalized ( meth)acrylate copolymers.
  • the same also applies to the other components of the exemplary adhesive formulation listed above in the exemplary embodiment, i.e. Cymel NF 3030, butyldiglycol, Cycat 4045 and Hydrowax 46.
  • the adhesive formulation is designed as a 2-component adhesive formulation, it also applies that any additives can be added to component B instead of component A, as indicated in the above exemplary embodiment for butyl diglycol and Hydrowax 46.
  • the adhesive formulation can contain 0.1% by weight to 35% by weight of one or more fillers and/or pigment(s), 0.1% by weight to 6% by weight of one or more wetting agents, 0 1% by weight to 8% by weight of one or more defoamers and/or 0.1% by weight to 8% by weight of one or more thickeners.
  • the adhesive formulation may comprise 0.1% to 20% by weight of one or more polyhydric alcohols and 0.1% to 5% by weight of an anionic or neutral wax.
  • additives can in principle be added either to component A or to component B in the case of a 2-component embodiment of the adhesive formulation.
  • the percentages by weight of the components of the adhesive formulation i.e. the aqueous phases, acid catalyst(s), polyhydric alcohols and various additives can of course be adjusted.
  • a person skilled in the art can make appropriate adjustments to the proportions by weight of the components within the percentage by weight ranges given above for the individual components.
  • the proportions by weight of components A and B relative to one another can, of course, also be adjusted accordingly within the specified weight % ranges.
  • the aqueous adhesive formulation comprises 35% by weight to 85% by weight of an aqueous phase of a reactive resin functionalized with hydroxyl groups or a mixture of reactive resins functionalized with hydroxyl groups with a resin content of 30% by weight to 65% by weight.
  • the aqueous adhesive formulation further comprises 12% to 25% by weight of an aqueous phase of a urea resin crosslinker, which is a reaction product formed from a urea and a multifunctional aldehyde, with a resin content of 30% to 65% by weight.
  • the aqueous adhesive formulation also includes from 0.1% to 4% by weight of an acid catalyst having a pKa of 2 or less.
  • An H active equivalent weight of the aqueous phase of the reactive resin functionalized with hydroxyl groups or of the mixture of reactive resins functionalized with hydroxyl groups can be 200 g/mol to 1500 g/mol.
  • FIG. 1 shows an exemplary embodiment for a continuous pressing process of a press cake to form a pressed material panel using a double-belt press
  • FIG. 2 shows an exemplary embodiment of a discontinuous pressing process for a layering of plates comprising chipboard or fiber material and layers of the adhesive formulation.
  • a method for the production of pressed material moldings, in particular pressed material panels basically comprises the following steps
  • a chemically curable, aqueous adhesive formulation as described above and defined in the relevant claims can be used as the adhesive formulation.
  • the mixing of the chip or fiber material or the chip or fiber material mixture with the adhesive formulation can be carried out in various ways, as is known per se.
  • the most common methods listed here are mechanical gluing or mixing in mixing devices, gluing using a so-called blowline and the less common dry gluing. Since these sizing and mixing methods are known to those skilled in the art, a detailed description at this point is not necessary.
  • the adhesive formulation can be produced by mixing components A and B, for example before mixing with the chip or fiber material, or also in the course of mixing with the chip or fiber material. Fiber material done.
  • press cake is formed or obtained after or as a result of the mixing of the chip or fiber material or the chip or fiber material mixture with the adhesive formulation, which press cake is then subjected to compression.
  • FIG. 1 shows an exemplary embodiment of a continuous pressing process for a press cake 1 .
  • a continuous pressing process of the press cake 1 can be accomplished by means of a double belt press 2, as in the exemplary embodiment shown in FIG.
  • the double belt press 2 shown in the exemplary embodiment according to FIG. 1 has a so-called lower belt 3, on which the press cake 1 is applied and conveyed, and an upper belt 4 as a pressing element.
  • the press cake 1 is guided between the lower belt 3 and upper belt 4 of the double belt press 2, as illustrated in FIG.
  • the adhesive formulation is also cured, with curing of the adhesive formulation being able to be initiated or accelerated by heating, for example by means of heating means 5 illustrated in FIG. 1 .
  • press cake pieces that have been produced in a targeted manner in advance which can be obtained, for example, by dividing a continuously discharged press cake, can also be discontinuously processed to press material, again with curing of the adhesive formulation - Molded bodies are pressed.
  • Such discontinuous pressing can be carried out, for example, in press molds with adjustable press rams.
  • the press cake or pieces of press cake have a weight proportion of chip or fiber material or chip or fiber material mixture of 77% by weight to 98.5% by weight and a proportion by weight of 2-component adhesive formulation of 1% by weight to 20% by weight.
  • FIG. 2 shows an exemplary embodiment of an alternative method for producing molded bodies, in particular molded panels, in a highly simplified and roughly schematic manner, in which the adhesive formulation according to the invention can also be used.
  • This alternate method includes the steps - Provision of a plurality of boards comprising chip or fiber material, in particular laminated veneer boards
  • FIG. 2 shows a corresponding panel layering 7, in which panels 8 comprising chip or fiber material are alternately layered, and in each case a layer of the adhesive formulation 9 arranged between two panels 2 is layered.
  • the layering 7 illustrated in a roughly schematic manner in FIG. 2 can be pressed, for example, by means of a press stamp 10, optionally also in a press mold not shown in FIG.
  • Coating or gluing of the panels 8 with the adhesive formulation 9 can be carried out before pressing, it being possible in principle for either one surface 11 of the panels or both surfaces 11 of at least the inner panels 8 to be coated with the adhesive formulation 9 .
  • an adhesive formulation 9 as described above can be used as the adhesive formulation, with a weight proportion of plates of the plate layering of 80% by weight to 99% by weight and a weight proportion of adhesive formulation of the plate layering is from 1% to 20% by weight.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)

Abstract

L'invention se rapporte à une formulation adhésive aqueuse, durcissable chimiquement, pour la production de corps moulés de matériau comprimé, en particulier de plaques comprimées. La formulation adhésive comprend 35 % en poids à 85 % en poids d'une phase aqueuse d'une résine réactive fonctionnalisée avec des groupes hydroxyle ou d'un mélange de résines réactives fonctionnalisées avec des groupes hydroxyle fonctionnels. La formulation adhésive comprend également 12 % en poids à 25 % en poids d'une phase aqueuse d'un agent de réticulation résine d'urée qui est un produit de réaction formé par une urée et un aldéhyde multifonctionnel. La formulation adhésive comprend en outre 0,1 % en poids à 4 % en poids d'un catalyseur acide. L'invention concerne également des procédés pour la production de corps moulés de matériau comprimé, en particulier de plaques comprimées, au moyen d'une telle formulation adhésive.
EP21762039.2A 2020-08-18 2021-08-17 Formulation adhésive pour la production de corps moulés de matériau comprimé Pending EP4200375A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA50696/2020A AT524134B1 (de) 2020-08-18 2020-08-18 Klebstoffformulierung zur Herstellung von Pressstoff-Formkörpern
PCT/EP2021/072780 WO2022038110A1 (fr) 2020-08-18 2021-08-17 Formulation adhésive pour la production de corps moulés de matériau comprimé

Publications (1)

Publication Number Publication Date
EP4200375A1 true EP4200375A1 (fr) 2023-06-28

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EP21762039.2A Pending EP4200375A1 (fr) 2020-08-18 2021-08-17 Formulation adhésive pour la production de corps moulés de matériau comprimé

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US (1) US20240269966A1 (fr)
EP (1) EP4200375A1 (fr)
JP (1) JP7676050B2 (fr)
AT (1) AT524134B1 (fr)
CA (1) CA3192843A1 (fr)
WO (1) WO2022038110A1 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007084307A1 (fr) * 2006-01-12 2007-07-26 Dynea Oy Systeme de liant a base d'aldehyde polymere destine a la fabrication de produits en bois

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5774354A (en) * 1980-10-28 1982-05-10 Matsushita Electric Works Ltd Phenol resin molding compound
JPH108014A (ja) * 1996-06-25 1998-01-13 Mitsui Petrochem Ind Ltd 合板用接着剤組成物
DE10335673B4 (de) * 2003-08-04 2007-01-18 Celanese Emulsions Gmbh Wässrige Dispersionsklebstoffe, Verfahren zu deren Herstellung und deren Verwendung
WO2013188323A1 (fr) * 2012-06-13 2013-12-19 E. I. Du Pont De Nemours And Company Composition mélangée à chaud thermoplastique avec stabilisant thermique de polyéthérol

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007084307A1 (fr) * 2006-01-12 2007-07-26 Dynea Oy Systeme de liant a base d'aldehyde polymere destine a la fabrication de produits en bois

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JP7676050B2 (ja) 2025-05-14
US20240269966A1 (en) 2024-08-15
AT524134A1 (de) 2022-03-15
JP2023539181A (ja) 2023-09-13
AT524134B1 (de) 2024-12-15
WO2022038110A1 (fr) 2022-02-24
CA3192843A1 (fr) 2022-02-24

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