EP4163345A1 - Dispersionszusammensetzung aus ceroxid-verbundpulver - Google Patents

Dispersionszusammensetzung aus ceroxid-verbundpulver Download PDF

Info

Publication number
EP4163345A1
EP4163345A1 EP21838427.9A EP21838427A EP4163345A1 EP 4163345 A1 EP4163345 A1 EP 4163345A1 EP 21838427 A EP21838427 A EP 21838427A EP 4163345 A1 EP4163345 A1 EP 4163345A1
Authority
EP
European Patent Office
Prior art keywords
cerium oxide
composite powder
dispersion composition
oxide particles
oxide composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21838427.9A
Other languages
English (en)
French (fr)
Inventor
Se Ho Song
Moon Sung Cho
Jung Wan Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Nano Products Co Ltd
Original Assignee
Advanced Nano Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Nano Products Co Ltd filed Critical Advanced Nano Products Co Ltd
Publication of EP4163345A1 publication Critical patent/EP4163345A1/de
Pending legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01FCOMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00Compounds of rare earth metals
    • C01F17/20Compounds containing only rare earth metals as the metal element
    • C01F17/206Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224Oxides or hydroxides of lanthanides
    • C01F17/235Cerium oxides or hydroxides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1409Abrasive particles per se
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00Crystal-structural characteristics
    • C01P2002/70Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/78Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by stacking-plane distances or stacking sequences
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/01Particle morphology depicted by an image
    • C01P2004/04Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/64Nanometer sized, i.e. from 1-100 nanometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/10Solid density
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/12Surface area
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/22Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability

Definitions

  • the present invention relates to a dispersion composition including a cerium oxide composite powder containing two types of cerium oxide particles having different particle sizes.
  • borophosphorus silicate glass (BPSG) reflow As semiconductor devices are highly integrated, an under-layer planarization technique is required to secure a photolithography margin and minimize the wiring length.
  • BPSG borophosphorus silicate glass
  • SOG spin-on-glass
  • CMP chemical mechanical polishing
  • the CMP process is considered a powerful planarization technology for next-generation semiconductor devices because it can achieve low-temperature planarization and large-area planarization that are difficult to achieve with the reflow process or the etch-back process.
  • the thickness of wirings is increased to reduce the wiring resistance, the thickness of inter-metal dielectric (IMD) layers for electrical insulation between metal wirings needs to be increased. This significantly increases the amount of an IMD layer to be removed in a CMP process for planarization.
  • the CMP process with existing CMP slurry has a problem in that the removal rate is slow and the CMP time is long, so that the process productivity is deteriorated.
  • a surface-modified colloidal ceria abrasive particle dispersion composition in which ceria abrasive particles are coated with a cerium element and a hydroxyl group (-OH) is considered.
  • a dispersion composition is formed such that the surface of large ceria abrasive particles is coated with small ceria abrasive particles with relatively high activity, the mechanical properties of the large ceria abrasive particles cannot be sufficiently exhibited, and the polishing rate cannot be not sufficiently improved.
  • Patent Literature 1 Korean Patent Application Publication No. 10-2002-0007607
  • the present invention is made to solve the problems occurring in the related art, and an objective of the present invention is to provide a dispersion in which first cerium oxide particles have a prismatic shape to maximize mechanical effects on an insulating film and in which second cerium oxide particles smaller than the first cerium oxide particles are shaped to have an increased specific surface area to maximize chemical effects on the insulating film. That is, the objective of the present invention is to achieve both the mechanical effect and the chemical effect by mixing the first particles exhibiting a strong mechanical action and the second particles exhibiting a strong chemical action.
  • the present invention provides a cerium oxide composite powder having high stability not to aggregate and providing a high polishing rate and provides a dispersion composition including the cerium oxide composite powder.
  • the inventors of the present application made diligent research and have finally developed a dispersion composition including particles that have high dispersion stability, good crystallinity, and highly activate surfaces so that the dispersion composition has good chemical and mechanical polishing properties.
  • the present invention is a dispersion composition in which first cerium oxide particles and second cerium oxide particles are combined, in which the first cerium oxide particles have a sharp prismatic shape, have excellent crystallinity, and are relatively large to have a powder density of 6.5 g/mL or more, and the second cerium oxide particles have a spherical shape, have excellent crystallinity, have a surface activated by hydrothermal synthesis, and are relatively small to have a powder density of 2.5 g/mL or less.
  • the first cerium oxide particles and the second cerium oxide particles are not present in a core-shell form in a solution and are separately dispersed and aggregated.
  • the dispersion composition exhibits both mechanical and chemical polishing properties, thereby realizing a high polishing rate for an oxide film.
  • the present invention provides a cerium oxide composite powder including first cerium oxide particles having an average particle of 15 nm or more and second cerium oxide particles having an average particle size of 10 nm or less.
  • the mixing ratio of the first cerium oxide particles and the second cerium oxide particles may be in a range of 9.5:0.5 to 0.5:9.5 (wt./wt.), preferably in a range of 8:2 to 2:8 (wt./ wt.), and more preferably in a range of 6:4 to 4:6 (wt./wt.).
  • the cerium oxide composite powder when the cerium oxide composite powder is observed under a transmission electron microscope (TEM), the powder may contain 50 to 19,000 second cerium oxide particles on average per unit area (550 nm in width and 550 nm in length) per one first cerium oxide particle.
  • the average BET specific surface area of the cerium oxide composite powder may be 50.00 m 2 /g or more.
  • the D50 particle size of the cerium oxide composite powder slurry may be
  • the present invention provides a dispersion composition containing the cerium oxide composite powder described above.
  • the average density of the cerium oxide composite powder contained in the dispersion composition may range from 2.55 g/mL to 2.95 g/mL when the dispersion composition is dried at 60° C under vacuum conditions for 72 hours.
  • the average density of the cerium oxide composite powder contained in the dispersion composition may range from 1.0 g/mL to 2.95 g/mL when the dispersion composition is in the form of a solution.
  • the dispersion composition dispersed at a concentration of 0.007 wt% may exhibit an absorbance of 0.02 to 0.19% at a wavelength of 450 to 600 nm and a transmittance of 70 to 90% at a wavelength of 500 nm.
  • the dispersion composition may exhibit a change of 5% or less in average particle size when the dispersion composition is stored at 40°C for 30 days or longer.
  • the cerium oxide composite powder according to the present invention contains two types of cerium oxide particles satisfying different specific particle size ranges. Since the average density of the cerium oxide composite powder contained in a dispersion composition solution is controlled, and the cerium oxide composite powder with the controlled average density is used for a dispersion composition, the dispersion composition can provide a high polishing rate without causing damage to a substrate and has good storage stability.
  • a to B indicating a range means a range that is equal to A or greater and is equal to B or less.
  • the present invention provides a cerium oxide composite powder including first cerium oxide particles having an average particle size of 15 nm or more and second cerium oxide particles having an average particle size of 10 nm or less.
  • the two types of particles may be separately present or may be in contact with each other.
  • the two types of particles may for separate aggregates, respectively.
  • the composite powder does not exist in a core-shell form in which the second cerium oxide particles cover the surface of each of the first cerium oxide particles to maintain the good mechanical polishing properties of the first cerium oxide particles.
  • the cerium oxide composite powder according to the present invention includes two types of cerium oxide particles having different average particle sizes, and the two types of cerium oxide particles have different specific particle size ranges from each other.
  • the cerium oxide composite powder includes first cerium oxide particles having an average particle size of 15 nm or more and second cerium oxide particles having an average particle size of 10 nm or less. More specifically, the average particle size of the first cerium oxide particles may be in a range of 15 to 60 nm, 20 to 55 nm, 25 to 50 nm, or 30 to 45 nm. Alternatively, the average particle size of the first cerium oxide particles may be or 20 nm or more and less than 40 nm.
  • the average particle size of the second cerium oxide particles may be in a range of 1 to 10 nm, 1 to 6 nm, or 2 to 5 nm.
  • the average particle size of the second cerium oxide particles may be 1 nm or more and less than 3 nm.
  • the cerium oxide composite powder may include two types of cerium oxide particles having different average particle sizes in the above-mentioned ratio.
  • the average particle size range may vary depending on measurement methods.
  • the particle sizes of the cerium oxide composite powder may be distributed:
  • the particle size is a D50 particle size corresponding to the particle size of 50% of the total particles
  • the particle size values obtained with a zeta potential measuring device (Zetasizer) and a laser particle size analyzer (Microtrac) are volume average diameters Dv(50).
  • the particle size is large, the small specific surface area of the particles is reduced, the chemical activity of the abrasive is reduced, and damage is caused to the surface of a polished substrate.
  • the cerium oxide particles have a small size, the chemical activity of the abrasive is improved and damage to the surface of a polished substrate is reduced.
  • the polishing rate is significantly lowered.
  • the cerium oxide composite powder includes two types of cerium oxide particles having different particle sizes, and the average particle size of the cerium oxide particles and the particle size distribution D50 of the cerium oxide composite powder in which the two types of particles are mixed are controlled to fall within the ranges described above, it is possible to prevent the surface of a polished substrate from being damaged, to significantly improve the polishing rate by maximizing the chemical and mechanical activity of the abrasive, and to improve the storage stability of the abrasive.
  • the average BET specific surface area of the cerium oxide composite powder may be 50.00 m 2 /g or more.
  • the average BET specific surface area of the cerium oxide composite powder may range from 70.00 to 250 m 2 /g, from 70.00 to 150 m 2 /g, from 70.00 to 90 m 2 /g, from 120.00 to 200 m 2 /g, from 150.00 to 250 m 2 /g, from 110.00 to 160 m 2 /g, from 130.00 to 150 m 2 /g, or from 180.00 to 240 m 2 /g.
  • the present invention by controlling the average BET specific surface area of the cerium oxide composite powder to fall within the above-mentioned range, it is possible to maximize the contact between a to-be-polished surface and a dispersion composition containing the powder during a polishing process. Therefore, it is possible to chemically polish the surface of the substrate while preventing damage to the surface of the substrate.
  • the present invention provides a dispersion composition containing the cerium oxide composite powder described above.
  • the dispersion composition according to the present invention contains a cerium oxide composite powder having two types of cerium oxide particles having different particle sizes that specify specific ranges. Therefore, the dispersion composition provides a high polishing rate without damaging a substrate during polishing and has good storage stability.
  • the average density of the cerium oxide composite powder may range from 2.70 g/mL to 2.85 g/mL in the same conditions.
  • the average density of the cerium oxide composite powder contained in the dispersion composition may be 2.81 ⁇ 0.05 g/mL.
  • the average density of the cerium oxide composite powder contained in the solution of the dispersion composition may range from 1.0 g/mL to 2.8 g/mL when the dispersion composition is dried for 2 hours, and more specifically range from 1.6 g/mL to 1.8 g/mL.
  • the average density of the cerium oxide composite powder contained in the dispersion composition may be 1.69 ⁇ 0.05 g/mL.
  • the density of the cerium oxide composite powder contained in the solution of the dispersion composition to fall within the above-mentioned range. Therefore, it is possible to improve the polishing rate that is deteriorated when the density of the cerium oxide composite powder is low and thus the action of particles on a film to be polished is week. In addition, it is possible to prevent damage to a substrate surface while maintaining the high density of the cerium oxide composite powder.
  • the dispersion composition according to the present invention has good storage stability to the extent that the change in average particle size is within 5% when the dispersion composition is stored at 40°C for 30 or more days. Therefore, the good polishing properties of the dispersion composition can be uniformly exhibited even when the dispersion composition is used after a lengthy period of storage.
  • the dispersion composition may use water as a solvent.
  • one or more organic solvents may be mixed with water.
  • the dispersion composition may be a mixture in which the cerium oxide composite powder of the present invention is dispersed in an amount of 0.3% to 15% by weight in a solvent.
  • the dispersion composition may include various additives including, for example, a dispersant, a defect inhibitor, an oxidizing agent, a polishing accelerator, a pH adjusting agent, and the like.
  • the dispersant may be at least one selected from the group consisting of nitric acid, formic acid, acetic acid, benzoic acid, oxalic acid, succinic acid, malic acid, maleic acid, malonic acid, citric acid, lactic acid, aspartic acid, glutaric acid, adipic acid, and salts thereof.
  • the method for preparing the cerium oxide composite powder and dispersion composition according to the present invention is not particularly limited, and any method commonly used in the related art may be used.
  • the cerium oxide composite powder may be prepared by a wet oxidation method, a sol gel method, a hydrothermal synthesis method, a calcination method, or the like.
  • a cerium oxide is obtained by mixing a cerium precursor and a basic material to oxidize the cerium precursor. Then, the cerium oxide is sequentially washed, dried, pulverized, thermally treated, and diluted with water to prepare a dispersion composition containing a cerium oxide composite powder.
  • the cerium precursor is not particularly limited and may be preferably in the form of a salt.
  • the non-limiting examples of the cerium precursor include cerium nitrate, cerium acetate, cerium chloride, and cerium carbonate, cerium ammonium nitrate, hydrates thereof. These materials may be used alone or in combination of two or more.
  • a precursor solution was prepared by dissolving 1.85 kg of cerium carbonate hydrate (Ce 2 (CO 3 ) 3 ) ⁇ xH 2 O) in 18.15 kg of water and 2.4 kg of nitric acid (HNO3), followed by stirring for 1 hour. 6 kg of aqueous ammonia was added to the precursor solution. After the addition was completed, the temperature of the resulting solution was raised to 75°C and the solution was reacted for 6 hours while being stirred. The obtained precipitate was filtered with a filter press, was washed, and was heat-treated at 1000°C to prepare first cerium oxide particles. At this point, the density of the obtained particles was 6.5 g/mL or more.
  • a second precursor solution was prepared by dissolving 1.2 kg of cerium ammonium nitrate ((NH 4 ) 2 Ce(NO 3 ) 6 ) in 2 kg of water and then adding 10 g of hydrogen peroxide (H 2 O 2 ) to the resulting mixture, followed by stirring for 1 hour. 2 kg of aqueous ammonia was added to the precursor solution, and the reaction solution was subjected to a hydrothermal synthesis reaction at 200°C. The obtained precipitate was filtered with a filter press, was washed, and was heat-treated at 60°C to prepare second cerium oxide particles. At this point, the density of the obtained particles was 2.5 g/mL or more.
  • cerium ammonium nitrate (NH 4 ) 2 Ce(NO 3 ) 6 ) was dissolved in 7825 g of water and stirred to prepare a precursor solution.
  • 750 g of imidazole was added to the precursor solution at a rate of 5 mL/min, to obtain a precipitate containing cerium hydroxide.
  • the obtained precipitate was filtered with a filter press and washed to obtain cerium hydroxide particles.
  • the first cerium oxide particles obtained in Preparation Example 1 and the second cerium oxide particles obtained in Preparation Example 2 were mixed as shown in Table 1 below, followed by crushing and wet milling.
  • the milled dispersion composition was vacuum dried at 60°C to prepare a cerium oxide composite powder.
  • Example 1 Classification Mixing ratio of the first cerium oxide particles and the second cerium oxide particles (wt./wt.) Example 1 80:20 Example 2 70:30 Example 3 60:40 Example 4 50:50 Example 5 40:60 Example 6 30:70 Example 7 20:80 Comparative Example 1 90:10 Comparative Example 2 10:90 Comparative Example 3 a 50:50 a*
  • the mixing ratio is the ratio of the first cerium oxide particles of Preparation Example 1 to the cerium hydroxide particles of Comparative Preparation Example 1. In this case, wet milling was not performed.
  • each of the cerium oxide composite powders obtained in Examples 1 to 7 and Comparative Examples 1 to 3 was mixed with water to be a concentration of 1.0 wt % and then dispersed to prepare a dispersion composition.
  • Table 2 Classification Composite powder used Classification Composite powder used Example 8 Composite powder prepared in Example 1 Example 13 Composite powder prepared in Example 6 Example 9 Composite powder prepared in Example 2 Example 14 Composite powder prepared in Example 7 Example 10 Composite powder prepared in Example 3 Comparative Example 4 Composite powder prepared in Comparative Example 1 Example 11 Composite powder prepared in Example 4 Comparative Example 5 Composite powder prepared in Comparative Example 2 Example 12 Composite powder prepared in Example 5 Comparative Example 6 Composite powder prepared in Comparative Example 3
  • the cerium oxide composite powders of Examples have an average particle size of 20 to 50 nm. Each powder is composed of first cerium oxide particles having a polygonal shape and having an average particle size of 1 to 5 nm and second cerium oxide particles having a spherical shape.
  • the crystallinity of the cerium oxide particles was observed with an X-ray diffraction (XRD) analyzer, and the results are shown in FIG. 3 .
  • the second cerium oxide particles prepared in Preparation Example 2 had an average lattice spacing of 0.31 ⁇ 0.005 nm, and it was confirmed that each of the cerium oxide composite powders obtained in Examples 1 to 7, respectively, contains 50 to 19,000 second cerium oxide particles per one first cerium oxide particle.
  • the cerium oxide composite powder according to the present invention includes only oxidized cerium particles, the cerium oxide particles are composed of two types of particles having specific sizes, and the two types of particles are mixed and/or dispersed at a specific ratio.
  • the cerium oxide composite powder according to the present invention includes two types of cerium oxide particles having different particle sizes that are in different ranges depending on measurement methods.
  • the dispersion composition when the dispersion composition was dispersed to be a concentration of 0.007 wt.%, it was confirmed that the absorbance measured at the wavelength range of 450 to 600 nm was 0.027 ⁇ 0.005%, meaning the range of 0.02 to 0.19%.
  • the transmittance at a wavelength of 500 nm was 85.35 ⁇ 0.005%, which was found to have a value within the range of 70 to 90%.
  • the sample was dried at 60°C for 72 hours under vacuum conditions, and the density of the composite powder was measured.
  • the density of the composite powder included in the solution of the dispersion composition was measured:
  • the dispersion composition according to the present invention has a specific density range for the cerium oxide composite powder.
  • the dispersion composition according to the present invention contains the first cerium oxide particles having a first specific particle size and the second cerium oxide particles having a second specific size in a predetermined mixing ratio. It is found that with the use of the dispersion composition according to the present invention, polishing can be performed without damaging the surface of a polished substrate. In addition, a higher polishing rate can be obtained compared to compositions comprising only the first cerium oxide particles having large particles or only the second cerium oxide particles having small particles.
  • the dispersion compositions of Examples did not cause damage to the surface of the polished substrate, whereas the dispersion compositions of Preparation Example 1 or Comparative Example 3 containing the first cerium oxide particles alone or containing the first cerium oxide particles in a higher content ratio than the dispersion compositions of Examples caused damage to the surface of the polished substrate.
  • the dispersion compositions of Examples all exhibited a high polishing rate of about 12,000 ⁇ /min or more.
  • the dispersion compositions of Examples 10 to 12 in which the mixing ratio of the first cerium oxide particles and the second cerium oxide particles is in the range of 6:4 to 4:6 (wt./wt.) were found to exhibit a remarkably high polishing rate of 17000 ⁇ /min or more.
  • the dispersion composition according to the present invention contains a cerium oxide composite powder in which two types of cerium oxide particles having specific sizes are mixed in a specific ratio, and the dispersion composition according to the present invention exhibits high polishing efficiency without damaging a substrate surface.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP21838427.9A 2020-07-07 2021-07-07 Dispersionszusammensetzung aus ceroxid-verbundpulver Pending EP4163345A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020200083681A KR102453292B1 (ko) 2020-07-07 2020-07-07 산화세륨 복합분말의 분산 조성물
PCT/KR2021/008650 WO2022010257A1 (ko) 2020-07-07 2021-07-07 산화세륨 복합분말의 분산 조성물

Publications (1)

Publication Number Publication Date
EP4163345A1 true EP4163345A1 (de) 2023-04-12

Family

ID=79343090

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21838427.9A Pending EP4163345A1 (de) 2020-07-07 2021-07-07 Dispersionszusammensetzung aus ceroxid-verbundpulver

Country Status (6)

Country Link
US (1) US20230121006A1 (de)
EP (1) EP4163345A1 (de)
JP (1) JP7393829B2 (de)
KR (1) KR102453292B1 (de)
CN (1) CN114667328A (de)
WO (1) WO2022010257A1 (de)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100336598B1 (ko) 1996-02-07 2002-05-16 이사오 우치가사키 산화 세륨 연마제 제조용 산화 세륨 입자
KR100674895B1 (ko) 2000-07-18 2007-01-26 삼성전자주식회사 산화막 cmp용 슬러리
KR100599327B1 (ko) * 2004-03-12 2006-07-19 주식회사 케이씨텍 Cmp용 슬러리 및 그의 제조법
KR101406758B1 (ko) 2012-12-11 2014-07-03 주식회사 케이씨텍 슬러리 조성물 및 이를 이용하여 기판 또는 웨이퍼를 연마하는 방법
US9340706B2 (en) * 2013-10-10 2016-05-17 Cabot Microelectronics Corporation Mixed abrasive polishing compositions
KR101613359B1 (ko) * 2014-07-15 2016-04-27 에스케이하이닉스 주식회사 화학적 기계적 연마용 나노 세리아 슬러리 조성물 및 이의 제조방법
KR20190068806A (ko) * 2017-12-11 2019-06-19 주식회사 케이씨텍 Cmp용 슬러리 조성물
EP3614640B1 (de) 2018-01-25 2022-03-02 Lg Electronics Inc. Verfahren zur übertragung von nprach-präambeln in einem drahtloskommunikationssystem mit unterstützung von tdd
WO2019182061A1 (ja) 2018-03-22 2019-09-26 日立化成株式会社 研磨液、研磨液セット及び研磨方法
KR20200062796A (ko) * 2018-11-27 2020-06-04 주식회사 케이씨텍 구형의 연마입자를 포함하는 연마용 슬러리 조성물

Also Published As

Publication number Publication date
US20230121006A1 (en) 2023-04-20
CN114667328A (zh) 2022-06-24
WO2022010257A1 (ko) 2022-01-13
KR20220005918A (ko) 2022-01-14
KR102453292B1 (ko) 2022-10-12
JP7393829B2 (ja) 2023-12-07
JP2022545805A (ja) 2022-10-31

Similar Documents

Publication Publication Date Title
JP5090920B2 (ja) Cmpスラリー用酸化セリウム粉末の製造方法及びこれを用いたcmp用スラリー組成物の製造方法
JP3883969B2 (ja) 水性分散液、その製造方法及びその使用
EP1948568B1 (de) Verfahren zur Herstellung von Cercarbonat-Pulver
US11578235B2 (en) Cerium based particles
KR102484582B1 (ko) 산화 세륨 입자, 이를 포함하는 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
KR20220133773A (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
WO2018124017A1 (ja) 酸化セリウム砥粒
Lee et al. Preparation and characterization of slurry for CMP
EP4163345A1 (de) Dispersionszusammensetzung aus ceroxid-verbundpulver
US6475407B2 (en) Composition for polishing metal on semiconductor wafer and method of using same
KR101056615B1 (ko) Cmp 슬러리용 산화세륨 분말의 제조방법 및 이를 이용한cmp용 슬러리 조성물의 제조방법
TW202342688A (zh) 氧化鈰複合粉末的分散組合物
KR102373919B1 (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
KR102373924B1 (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
KR20240062240A (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
KR20240062236A (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
KR20240062239A (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
KR20240062241A (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
KR20240062237A (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
KR20240062238A (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
JP2024058420A (ja) 酸化珪素膜用研磨液組成物
KR20240062242A (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
KR20240008895A (ko) 세륨계 코어-셸 입자의 액체 분산물 및 분말, 이를 생성하기 위한 공정 및 폴리싱에서의 이의 용도
KR20240062235A (ko) 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
JP2000160140A (ja) 研磨用組成物

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20230104

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)