EP4089664B1 - Anzeigevorrichtung - Google Patents

Anzeigevorrichtung

Info

Publication number
EP4089664B1
EP4089664B1 EP20911743.1A EP20911743A EP4089664B1 EP 4089664 B1 EP4089664 B1 EP 4089664B1 EP 20911743 A EP20911743 A EP 20911743A EP 4089664 B1 EP4089664 B1 EP 4089664B1
Authority
EP
European Patent Office
Prior art keywords
plate
display device
pcb
absorbing part
vapor chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP20911743.1A
Other languages
English (en)
French (fr)
Other versions
EP4089664A4 (de
EP4089664A1 (de
Inventor
Jaeyong JUNG
Jihwan HYUN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Electronics Inc
Original Assignee
LG Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Electronics Inc filed Critical LG Electronics Inc
Publication of EP4089664A1 publication Critical patent/EP4089664A1/de
Publication of EP4089664A4 publication Critical patent/EP4089664A4/de
Application granted granted Critical
Publication of EP4089664B1 publication Critical patent/EP4089664B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/2099—Liquid coolant with phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details

Definitions

  • the present disclosure relates to a display device.
  • LCD liquid crystal display
  • PDP plasma display panel
  • ELD electroluminescent display
  • VFD vacuum fluorescent display
  • OLED Organic Light Emitting Diode
  • a display device using an organic light emitting diode has excellent luminance and viewing angle characteristics in comparison with a liquid crystal display device, and requires no backlight unit, such that the OLED display device can be implemented as an ultrathin display device.
  • OLED organic light emitting diode
  • a vapor chamber which serves as a heat dissipation structure applied to the display device, is an element embedded in the display device and cools a heating element that generates high-temperature heat. Accordingly, it is possible to prevent thermal damage to electronic elements located adjacent to the heating element due to spatial constraints.
  • US 2015/0323262 A1 is directed to an electronic device having a heat dissipating apparatus.
  • the electronic device is a TV and the heat dissipating apparatus includes a vapor chamber.
  • the electronic device further includes a body with a display unit, an internal circuit board having at least one heat generating element as well as an interference element, and a rear case.
  • a predetermined portion on a surface of the vapor chamber is engaged with the heat generating element so that the edges are located at a position near the periphery of the inside of the body, in order to widely diffuse the heat generated by the heat generating element, so that the high temperature heat generated by the heat generating element is diffused to an outermost end of the vapor chamber.
  • the vapor chamber includes a first metal plate, a second metal plate, a refrigerant provided therebetween, and embedded members for absorbing and transferring the refrigerant according to the phase change of the refrigerant.
  • the vapor chamber has a cut surface (e.g., indentations or cutouts) formed by cutting a part of the vapor chamber according to a position of the interference element.
  • a titanium thermal ground plane comprises a titanium substrate with a wicking structure, a backplane, and a vapor chamber.
  • the thermal ground plane is charged with a working fluid, such as water in a thermodynamically saturated state, where the liquid phase resides predominantly in the wicking structure, and the vapor phase resides predominantly in the vapor chamber.
  • a portable device based on the titanium thermal ground plane includes a middle frame member and a thermal ground plane with a wicking structure and a backplane formed by the middle frame member.
  • the device includes an integrated circuit affixed to and in thermal communication with the wicking structure.
  • KR 2019 0060074 A describes a mobile communication terminal including a housing, a circuit substrate with a heating element, and a bracket to support a vapor chamber.
  • the vapor chamber includes a first metal plate, a second metal plate, and a refrigerant portion.
  • the refrigerant portion can fill the inside of the refrigerant member and transfer heat from a high temperature portion to a low temperature portion through phase change of the refrigerant member.
  • the vapor chamber is formed in a shape that at least partially extends in the circumferential direction of the inner surface of the terminal and at least a portion of the area of the vapor chamber is engaged with the heating element.
  • KR 2011 0070155 A describes a heat plate with a heat radiation area and having a pinch that can deflate the inside to form a vacuum. A refrigerant is injected inside the heat radiation area after it deflates, and a cock shielding the pinch is installed by welding the outer circumference of the pinch to the cock so as to maintain a vacuum.
  • the display device according to the present disclosure has the following effects.
  • a display device capable of avoiding contact or interference between a vapor chamber and elements, except for a heating element to be cooled, among elements mounted on a PCB.
  • FIGS. 1 to 10 are diagrams illustrating examples of a display device according to embodiments of the present disclosure.
  • module and “unit” for elements used in the following description are given simply in view of the ease of the description, and do not have a distinguishing meaning or role.
  • a display device 1 may include a display panel 10.
  • the display panel 10 may display images.
  • the display device 1 may include a first long side LS1, a second long side LS2 opposite to the first long side LS1, a first short side SS1 adjacent to the first long side LS1 and the second long side LS2, and a second short side SS2 opposite to the first short side SS1.
  • first and second long sides LS1 and LS2 are longer than the first and second short sides SS1 and SS2, but there may also be a case in which lengths of the first and second long sides LS1 and LS2 may be approximately equal to lengths of the first and second short sides SS1 and SS2.
  • a direction parallel to the first and second long sides LS1 and LS2 of the display device 1 may be referred to as a first direction DR1 or a left-right direction LR.
  • a direction parallel to the first and second short sides SS1 and SS2 of the display device 1 may be referred to as a second direction DR2 or an up-down direction UD.
  • a direction perpendicular to the long sides LS1 and LS2 and the short sides SS1 and SS2 of the display device 1 may be referred to as a third direction DR3 or a front-rear direction FR.
  • a side on which the display panel 10 displays an image may be referred to as a front side, and a side opposite thereto may be referred to as a rear side.
  • the frame 20 may form side surfaces of the display device 1.
  • the frame 20 may be disposed at the rear of the display panel 10 and may be coupled to the display panel 10.
  • the frame 20 may have a generally square ring shape.
  • the frame 20 may include a metal material.
  • the frame 20 may include an aluminum (Al) material.
  • various electronic components which are electrically connected to the display panel 10, may be installed in the module cover 30.
  • a Printed Circuit Board (PCB) P on which a plurality of elements are mounted, may be coupled to the module cover 30.
  • the PCB P may be a main board.
  • the display device 1 may include a vapor chamber 100.
  • the vapor chamber 100 is coupled to the PCB P and comes into contact with a contact element 51 which is at least any one of the plurality of elements mounted on the PCB P.
  • the contact element 51 may be a heating element that generates heat when a current flows.
  • the contact element 51 may be an IC chip.
  • the vapor chamber 100 may cool the contact element 51 by radiating heat, transferred from the contact element 51, to the outside. Accordingly, the vapor chamber 100 may prevent overheating of the contact element 51, thereby preventing thermal damage to the contact element 51 and elements adjacent thereto.
  • the first plate 110 may form a rear surface of the vapor chamber 100.
  • the first plate 110 may include a heat absorbing part 112 that comes into contact with the contact element 51 to absorb heat generated in the contact element 51. That is, heat generated in the contact element 51 may be transferred to the fluid FL through the heat absorbing part 112 to evaporate the fluid FL.
  • the fluid FL may flow in a space S between the first plate 110 and the second plate 120. That is, by the above process of evaporation and condensation of the fluid FL, the fluid FL may move upward and downward in the space S. To this end, a portion of an inner surface of the first plate 110 and a portion of an inner surface of the second plate 120 may be spaced apart from each other to form the space S.
  • the fluid FL may be water.
  • a plurality of recesses 123 may be recessed inwardly from the second body 121.
  • the plurality of recesses 123 may have an embossing shape.
  • the plurality of recesses 123 may prevent the second plate 120 and the first plate 110 from coming into close contact with each other when the space S is made into a vacuum state. Accordingly, the plurality of recesses 123 may be useful for providing the space S in a fixed size and in a vacuum state.
  • a cap 150 may cover the pipe 125 coupled to the second plate 120 and inserted into the inlet hole 124.
  • the cap 150 may be formed in a cylindrical shape.
  • the cap 150 may include a rubber material.
  • a bracket 160 may have one side coupled to the vapor chamber 100 and the other side coupled to the PCB P. That is, the vapor chamber 100 may be coupled to the PCB P by a plurality of brackets 160.
  • the bracket 160 may include a plurality of brackets 160: 161, 162, and 163 which are spaced apart from each other.
  • the other side of the bracket 160 may have a hole 1601 formed therein, through which a fastening member SC fastened to the PCB P passes. Further, the other side of the bracket 160 may be spaced apart from the PCB P. In this case, by adjusting a degree of fastening of the fastening member SC fastened to the PCB P, a coupling force between the bracket 160 and the PCB P may be adjusted. For example, the fastening member SC corresponding to a screw may be screw-fastened to the PCB P through the hole 1601 (see FIG. 4 ). In this case, as the fastening member SC is rotated in a fastening direction of the screw, the coupling force between the bracket 160 and the PCB P may increase.
  • the heat absorbing part 112 may come into closer contact with the contact element 51, such that the heat generated in the contact element 51 may be easily transferred to the heat absorbing part 112.
  • the vapor chamber 100 may be coupled to the PCB P by another method, such as welding and the like.
  • the bracket 160 may include a metal material.
  • the bracket 160 may include chrome (Cr).
  • the first plate 110 is formed by bypassing the protruding element 52, thereby not interfering with the protruding element 52.
  • the protruding element 52 may be prevented from coming into contact with the vapor chamber 100, thereby facilitating the above process of evaporation and condensation of the fluid FL.
  • the protruding element 52 may include a plurality of protruding elements 52: 52a and 52b which are spaced apart from each other.
  • the first plate 110 may bypass each of the plurality of protruding elements 52 in the same direction. That is, after bypassing any one of the plurality of protruding elements 52 in a first direction, the first plate 110 may also bypass the rest of the protruding elements in the first direction.
  • the heat absorbing part 112 may protrude outwardly or rearwardly from the first body 111. That is, the heat absorbing part 112 may be disposed closer to the PCB P than the first body 111, except for the heating absorbing part 112.
  • any heating element, disposed on the PCB P is prevented from coming into contact with the first body 111 except for the heat absorbing part, thereby facilitating the above process of evaporation and condensation of the fluid FL.
  • a lower end of the first plate 110 may be spaced apart from the heat absorbing part 112.
  • the lower end of the first plate 110 and the heat absorbing part 112 may be spaced apart from each other according to a position of the contact element 51, a size and shape of the vapor chamber 100, a position, size, and shape of elements mounted on the PCB P, and the like.
  • the vapor chamber 100 may include a sheet 130 (see FIG. 3 ).
  • the sheet 130 may move the fluid FL in a liquid state, which is adjacent to the lower end of the first plate 110, to the heat absorbing part 112.
  • one end of the sheet 130 may be adjacent to the lower end of the first plate 110, and the other end of the sheet 130 may be adjacent to an upper end of the heat absorbing part 112.
  • the fluid FL in a liquid state which is adjacent to the lower end of the first plate 110 may be moved by the sheet 130 to the heat absorbing part 112 to be evaporated in the heat absorbing part 112.
  • the sheet 130 may move the fluid FL in a liquid state, which is adjacent to the lower end of the first plate 110, to the heat absorbing part 112 by capillary action.
  • the sheet 130 may include a porous material.
  • the sheet 130 may include a fiber material.
  • the sheet 130 may have a thickness of about 0.5 mm. Meanwhile, the sheet 130 may be referred to as a microfilter.
  • a first flange 1111 formed around a circumference of the first body 111 and a second flange 1211 formed at an outer portion of the second body 121 may be coupled to each other while facing each other.
  • the first flange 1111 and the second flange 1211 may be coupled to each other by a method, such as welding and the like.
  • an inner surface of the first body 111, except for the first flange 1111 may be spaced apart from an inner surface of the second body 121, except for the second flange 1211, to form the space S.
  • the heat absorbing part 112 may include a seating portion 1121 and an inclined portion 1122.
  • a portion of the sheet 130 may be seated on the seating portion 1121.
  • the contact element 51 may come into contact with the seating portion 1121.
  • the seating portion 1121 may be generally flat.
  • the inclined portion 1122 may connect the seating portion 1121 and the first body 111.
  • the inclined portion 1122 may be inclined at an obtuse angle with respect to the seating portion 1121. In this case, the sheet 130 adjacent to the lower end of the first plate 110 may extend upward and may pass through the inclined portion 1122 to be seated on the seating portion 1121.
  • the sheet 130 may be spaced apart from the second plate 120 or the inner surface of the second body 121.
  • a gap between the sheet 130 and the second plate 120 or the inner surface of the second body 121 may be largest at a portion where the sheet 130 is seated on the seating portion 1121.
  • a recess 122 disposed opposite to the seating portion 1121 with the sheet 130 disposed therebetween may be recessed inward by about 1.0 mm from the second body 121, so as to be spaced apart from the seating portion 1121 by a gap (g) of about 3.6 mm.
  • a fluid FL in a gaseous state may be generated and may smoothly flow through the space S.
  • the seating portion 1121 may be generally rectangular.
  • the inclined portion 1122 may include first to fourth inclined portions 1122a, 1122b, 1122c, and 1122d which extend from each side of the seating portion 1121.
  • the first inclined portion 1122a may be disposed between one end and the other end of the sheet 130. That is, the sheet 130 having one end adjacent to the lower end of the first plate 110 may extend upward and may pass through the first inclined portion 1122a to be seated on the seating portion 1121.
  • the sheet 130 may be spaced apart from the second to fourth inclined portions 1122b, 1122c, and 1122d of the inclined portion 1122, except for the first inclined portion 1122a disposed between the one end and the other end of the sheet 130.
  • a left side of the sheet 130 may be spaced apart from the second inclined portion 1122b, disposed on the left of the seating portion 1121, by a predetermined gap g2.
  • an upper side of the sheet 130 may be spaced apart from the third inclined portion 1122c, disposed over the seating portion 1121, by a predetermined gap g3.
  • the right side of the sheet 130 may be spaced apart from the fourth inclined portion 1122d, disposed on the right of the seating portion 1121, by a predetermined gap g4.
  • the sheet 130 is placed on the seating portion 1121 without overlapping with the second to fourth inclined portions 1122b, 1122c, and 1122d, thereby preventing the sheet 130, which increases in volume by absorbing the fluid FL, from narrowing the space S formed between the second to fourth inclined portions 1122b, 1122c, and 1122d and the second body 121.
  • a mesh 40 may be disposed opposite to the seating portion 1121 with the sheet disposed therebetween 130.
  • the mesh 140 may have a plurality of pores formed therein.
  • the mesh 140 may be coupled to the sheet 130.
  • the mesh 130 may reduce noise occurring when bubbles of the fluid FL jetting through the sheet 130 burst. That is, the bubbles, generated when the fluid FL is evaporated from the sheet 130, may be reduced in size by the plurality of pores of the mesh 140, such that the bubbles may burst without causing loud noise.
  • the mesh 140 is generally rectangular.
  • the mesh 140 may include a metal material.
  • the mesh 140 may include stainless steel which is excellent in corrosion resistance.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Claims (9)

  1. Anzeigevorrichtung (1) mit:
    ein Anzeigefeld (10);
    eine Modulabdeckung (30), die auf der Rückseite des Anzeigefelds (10) angeordnet ist;
    eine Leiterplatte (P), auf der eine Mehrzahl von Elementen angeordnet ist, wobei die Leiterplatte mit der Modulabdeckung (30) verbunden ist;
    ein Kontaktelement (51); und
    eine Dampfkammer (100), die mit dem Kontaktelement in Kontakt steht, bei dem es sich um mindestens eines aus der Mehrzahl der Elemente handelt, wobei die Dampfkammer mit der Leiterplatte (P) gekoppelt ist,
    wobei die Dampfkammer (100) umfasst:
    eine erste Platte (110) mit einem wärmeabsorbierenden Teil (112), der das Kontaktelement (51) berührt;
    eine zweite Platte (120), die mit der ersten Platte (110) gekoppelt ist; und
    ein Fluid, das durch einen zwischen der ersten Platte (110) und der zweiten Platte (120) vorgesehenen Raum fließt,
    dadurch gekennzeichnet, dass sich die erste Platte (110) von dem wärmeabsorbierenden Teil (112) aus vertikal nach oben erstreckt, während sie ein auf der Leiterplatte (P) angebrachtes vorstehendes Element (52) horizontal umgeht, so dass sie sich mit dem vorstehenden Element (52) in einer Vorne-hinten-Richtung nicht überlappt, wobei das vorstehende Element (52) die erste Platte (110) in einer Oben-Unten-Richtung unter der Mehrzahl von Elementen vertikal überlappt,
    wobei das Fluid durch die Wärme in dem wärmeabsorbierenden Teil (112) verdampft wird, um vertikal nach oben zu fließen, und in einem oberen Abschnitt des Raums kondensiert wird, um vertikal nach unten zu fließen.
  2. Anzeigevorrichtung (1) nach Anspruch 1, wobei das vorstehende Element (52) eine Mehrzahl von vorstehenden Elementen (52a, 52b) umfasst, die voneinander beabstandet sind,
    wobei die erste Platte (110) jedes der Mehrzahl von vorstehenden Elementen (52a, 52b) in einer gleichen Richtung umgeht.
  3. Anzeigevorrichtung (1) nach Anspruch 1, wobei die erste Platte (110) in Abschnitten mit Ausnahme des wärmeabsorbierenden Teils (112) von der Mehrzahl von Elementen beabstandet ist.
  4. Anzeigevorrichtung (1) nach Anspruch 3, wobei die erste Platte (110) einen ersten Körper (111) umfasst, in dem der wärmeabsorbierende Teil (112) ausgebildet ist,
    wobei der wärmeabsorbierende Teil (112) von dem ersten Körper (111) in Richtung der Leiterplatte (P) vorsteht.
  5. Anzeigevorrichtung (1) nach Anspruch 4, ferner umfassend: einen Klebstoff (AM), der zwischen dem wärmeabsorbierenden Teil (112) und dem Kontaktelement (51) angeordnet und sowohl mit dem wärmeabsorbierenden Teil (112) als auch mit dem Kontaktelement (51) gekoppelt ist.
  6. Anzeigevorrichtung (1) nach Anspruch 4, ferner umfassend: eine Halterung (160), deren eine Seite mit der Dampfkammer (100) und deren andere Seite mit der Leiterplatte (P) verbunden ist.
  7. Anzeigevorrichtung (1) nach Anspruch 6, wobei die andere Seite der Halterung (160) ein darin ausgebildetes Loch (1601) aufweist, durch das ein an der Leiterplatte (P) befestigtes Befestigungselement (SC) hindurchgeht, und von der Leiterplatte (P) beabstandet ist.
  8. Anzeigevorrichtung (1) nach Anspruch 1, ferner umfassend:
    eine Leitung (125), die in ein in der zweiten Platte (120) ausgebildetes Loch (124) eingesetzt ist und durch die das dem Raum durch das Loch (124) zugeführte Fluid fließt; und
    eine Kappe (150), die mit der zweiten Platte (120) verbunden ist und die Leitung (125) abdeckt,
    wobei die Kappe (150) in der Vorne-Hinten-Richtung länglich ist.
  9. Anzeigevorrichtung (1) nach Anspruch 1, wobei ein oberes Ende der Dampfkammer (100) an ein oberes Ende der Modulabdeckung (30) angrenzt.
EP20911743.1A 2020-01-06 2020-01-06 Anzeigevorrichtung Active EP4089664B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2020/000201 WO2021141148A1 (ko) 2020-01-06 2020-01-06 디스플레이 디바이스

Publications (3)

Publication Number Publication Date
EP4089664A1 EP4089664A1 (de) 2022-11-16
EP4089664A4 EP4089664A4 (de) 2023-11-08
EP4089664B1 true EP4089664B1 (de) 2025-08-27

Family

ID=76788048

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20911743.1A Active EP4089664B1 (de) 2020-01-06 2020-01-06 Anzeigevorrichtung

Country Status (4)

Country Link
US (1) US20230032004A1 (de)
EP (1) EP4089664B1 (de)
KR (1) KR102751012B1 (de)
WO (1) WO2021141148A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113891620B (zh) * 2021-09-27 2023-05-23 联想(北京)有限公司 一种散热装置及电子设备
KR102718736B1 (ko) * 2022-07-07 2024-10-16 엘지전자 주식회사 디스플레이 디바이스

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8172097B2 (en) * 2005-11-10 2012-05-08 Daktronics, Inc. LED display module
US20090040726A1 (en) * 2007-08-09 2009-02-12 Paul Hoffman Vapor chamber structure and method for manufacturing the same
KR101056323B1 (ko) * 2009-09-15 2011-08-11 삼성모바일디스플레이주식회사 평판표시장치
KR101057885B1 (ko) * 2009-12-18 2011-08-19 이상갑 발열소자용 방열장치 및 그 제조방법
KR20120103261A (ko) * 2011-03-10 2012-09-19 삼성전자주식회사 액정 표시 장치
US8857502B2 (en) * 2011-07-26 2014-10-14 Kunshan Jue-Chung Electronics Co., Ltd. Vapor chamber having heated protrusion
US20140076995A1 (en) * 2012-09-14 2014-03-20 Chin-Wen Wang Vapor chamber and method of manufacturing the same
KR101996653B1 (ko) * 2012-10-30 2019-07-05 삼성디스플레이 주식회사 평판표시장치
JP2014214985A (ja) * 2013-04-26 2014-11-17 富士通株式会社 蒸発器、冷却装置及び電子装置
US20150026981A1 (en) * 2013-07-24 2015-01-29 Asia Vital Components Co., Ltd. Manufacturing mehtod of vapor chamber structure
KR20150091905A (ko) * 2014-02-04 2015-08-12 엘지전자 주식회사 증기 챔버
KR102099255B1 (ko) * 2014-05-07 2020-04-10 삼성전자주식회사 방열장치 및 이를 구비한 전자장치
US11397057B2 (en) * 2014-09-26 2022-07-26 Asia Vital Components Co., Ltd. Vapor chamber structure
KR102317133B1 (ko) * 2015-01-21 2021-10-22 엘지디스플레이 주식회사 유기전계발광 표시장치, 그리고 이를 구비한 디스플레이 장치
US20170038154A1 (en) * 2015-08-06 2017-02-09 Chaun-Choung Technology Corp. Vapor chamber structure having stretchable heated part
US10561041B2 (en) * 2017-10-18 2020-02-11 Pimems, Inc. Titanium thermal module
KR102487229B1 (ko) * 2017-11-24 2023-01-11 삼성전자 주식회사 방열 구조를 포함하는 전자 장치
US20190343021A1 (en) * 2018-05-07 2019-11-07 Asia Vital Components Co., Ltd. Heat dissipation unit connection reinforcement structure
JP7279151B2 (ja) * 2019-03-19 2023-05-22 株式会社ソニー・インタラクティブエンタテインメント ヘッドマウントディスプレイ
US20220151113A1 (en) * 2019-03-28 2022-05-12 Nec Corporation Electronic device
KR20210001152A (ko) * 2019-06-27 2021-01-06 삼성전자주식회사 방열 구조를 포함하는 전자장치

Also Published As

Publication number Publication date
EP4089664A4 (de) 2023-11-08
US20230032004A1 (en) 2023-02-02
KR20220062078A (ko) 2022-05-13
WO2021141148A1 (ko) 2021-07-15
KR102751012B1 (ko) 2025-01-06
EP4089664A1 (de) 2022-11-16

Similar Documents

Publication Publication Date Title
EP4089664B1 (de) Anzeigevorrichtung
US11547028B2 (en) Display device
US20100097783A1 (en) Light emitting device, display device and solid-state light emitting element substrate
US10365547B2 (en) Digital micro-mirror device with a heat dissipation structure
KR102899395B1 (ko) 디스플레이 디바이스
CN112349206B (zh) 一种可折叠显示装置
KR102304816B1 (ko) 디스플레이 디바이스
US20060133049A1 (en) Electronic apparatus and display apparatus equipped with the electric apparatus
JP5188245B2 (ja) 表示装置
US8770805B2 (en) Backlight module for liquid crystal display and liquid crystal display
CN117539113A (zh) 光透射型光学元件模块以及电子设备
JPH10116036A (ja) プラズマディスプレイ装置
JPH1124072A (ja) 液晶表示装置
CN116096036B (zh) 显示组件、制备方法及装置
US11337342B2 (en) Display device
JP4912844B2 (ja) 発光装置、およびこれを用いた表示装置
CN215220133U (zh) 一种具有护眼功能的led显示屏
JP2006227427A (ja) 表示装置
JPH11327449A (ja) プラズマディスプレイ装置
KR100640766B1 (ko) 플라즈마 디스플레이 패널의 피씨비 방열판
KR102718736B1 (ko) 디스플레이 디바이스
CN217767117U (zh) 一种有效散热、降低表面温升的显示组件和车载显示装置
CN119105209A (zh) 一种显示装置以及电子设备
JP2007280745A (ja) 光源用冷却装置及びそれを備えたプロジェクタ
KR20030005527A (ko) 플라즈마 디스플레이 패널의 방열구조

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20220803

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
REG Reference to a national code

Ref country code: DE

Free format text: PREVIOUS MAIN CLASS: G09F0009330000

Ref country code: DE

Ref legal event code: R079

Ref document number: 602020057746

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: G09F0009330000

Ipc: H05K0007200000

A4 Supplementary search report drawn up and despatched

Effective date: 20231009

RIC1 Information provided on ipc code assigned before grant

Ipc: H10K 50/84 20230101ALI20231002BHEP

Ipc: H05K 7/20 20060101AFI20231002BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20250331

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602020057746

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20250827

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20251227

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20251208

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20251127

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20251229

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250827

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250827

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250827

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20251209

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20251128

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250827

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250827

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250827

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250827

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20251127

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250827

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1831708

Country of ref document: AT

Kind code of ref document: T

Effective date: 20250827

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250827

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250827

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20251208

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250827

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250827