EP4079520A1 - Composition de résine pour encapsulation de cellule solaire, matériau d'encapsulation de cellule solaire ainsi que procédé de fabrication de celui-ci, et module de cellules solaires - Google Patents
Composition de résine pour encapsulation de cellule solaire, matériau d'encapsulation de cellule solaire ainsi que procédé de fabrication de celui-ci, et module de cellules solaires Download PDFInfo
- Publication number
- EP4079520A1 EP4079520A1 EP20900900.0A EP20900900A EP4079520A1 EP 4079520 A1 EP4079520 A1 EP 4079520A1 EP 20900900 A EP20900900 A EP 20900900A EP 4079520 A1 EP4079520 A1 EP 4079520A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- solar cell
- ethylene
- copolymer
- resin composition
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 81
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000003566 sealing material Substances 0.000 title 3
- 229920001577 copolymer Polymers 0.000 claims abstract description 166
- 239000008393 encapsulating agent Substances 0.000 claims abstract description 115
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 77
- 239000005977 Ethylene Substances 0.000 claims abstract description 77
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 62
- 239000000178 monomer Substances 0.000 claims abstract description 59
- 239000004711 α-olefin Substances 0.000 claims abstract description 45
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 34
- 230000000415 inactivating effect Effects 0.000 claims abstract description 26
- 229920001567 vinyl ester resin Polymers 0.000 claims abstract description 17
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 40
- 239000000470 constituent Substances 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 23
- 150000001875 compounds Chemical class 0.000 claims description 20
- 239000007769 metal material Substances 0.000 claims description 19
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229920000554 ionomer Polymers 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 7
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine group Chemical group NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 239000011133 lead Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 125000001425 triazolyl group Chemical group 0.000 claims 1
- 239000010410 layer Substances 0.000 description 50
- -1 hydrazine compound Chemical class 0.000 description 32
- 238000004383 yellowing Methods 0.000 description 28
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 19
- 239000000463 material Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 14
- 230000001681 protective effect Effects 0.000 description 13
- 150000001733 carboxylic acid esters Chemical class 0.000 description 12
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical group CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 11
- 239000005038 ethylene vinyl acetate Substances 0.000 description 11
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 11
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 230000004048 modification Effects 0.000 description 9
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- MZZYGYNZAOVRTG-UHFFFAOYSA-N 2-hydroxy-n-(1h-1,2,4-triazol-5-yl)benzamide Chemical compound OC1=CC=CC=C1C(=O)NC1=NC=NN1 MZZYGYNZAOVRTG-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 230000002349 favourable effect Effects 0.000 description 6
- 239000003505 polymerization initiator Substances 0.000 description 6
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 6
- 150000003852 triazoles Chemical class 0.000 description 6
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 5
- 125000005907 alkyl ester group Chemical group 0.000 description 5
- 125000003277 amino group Chemical group 0.000 description 5
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical group CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 238000002715 modification method Methods 0.000 description 4
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 4
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000001530 fumaric acid Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 3
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- VQOXUMQBYILCKR-UHFFFAOYSA-N 1-Tridecene Chemical compound CCCCCCCCCCCC=C VQOXUMQBYILCKR-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- ADOBXTDBFNCOBN-UHFFFAOYSA-N 1-heptadecene Chemical compound CCCCCCCCCCCCCCCC=C ADOBXTDBFNCOBN-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N 1-nonene Chemical compound CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- PJLHTVIBELQURV-UHFFFAOYSA-N 1-pentadecene Chemical compound CCCCCCCCCCCCCC=C PJLHTVIBELQURV-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- DCTOHCCUXLBQMS-UHFFFAOYSA-N 1-undecene Chemical compound CCCCCCCCCC=C DCTOHCCUXLBQMS-UHFFFAOYSA-N 0.000 description 2
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- WROUWQQRXUBECT-UHFFFAOYSA-N 2-ethylacrylic acid Chemical compound CCC(=C)C(O)=O WROUWQQRXUBECT-UHFFFAOYSA-N 0.000 description 2
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- SMEPRGMDOPTYGL-UHFFFAOYSA-N 6-(3,5-ditert-butyl-4-hydroxyphenyl)-n'-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyl]-4-oxohexanehydrazide Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)CCC(=O)NNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 SMEPRGMDOPTYGL-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 2
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 2
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 239000002530 phenolic antioxidant Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- 229940106006 1-eicosene Drugs 0.000 description 1
- FIKTURVKRGQNQD-UHFFFAOYSA-N 1-eicosene Natural products CCCCCCCCCCCCCCCCCC=CC(O)=O FIKTURVKRGQNQD-UHFFFAOYSA-N 0.000 description 1
- HBYVGFWJEBZGJJ-UHFFFAOYSA-N 1-n',3-n'-bis(2-phenoxypropanoyl)benzene-1,3-dicarbohydrazide Chemical compound C=1C=CC(C(=O)NNC(=O)C(C)OC=2C=CC=CC=2)=CC=1C(=O)NNC(=O)C(C)OC1=CC=CC=C1 HBYVGFWJEBZGJJ-UHFFFAOYSA-N 0.000 description 1
- FXNDIJDIPNCZQJ-UHFFFAOYSA-N 2,4,4-trimethylpent-1-ene Chemical compound CC(=C)CC(C)(C)C FXNDIJDIPNCZQJ-UHFFFAOYSA-N 0.000 description 1
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 1
- JJRUAPNVLBABCN-UHFFFAOYSA-N 2-(ethenoxymethyl)oxirane Chemical compound C=COCC1CO1 JJRUAPNVLBABCN-UHFFFAOYSA-N 0.000 description 1
- NPSJHQMIVNJLNN-UHFFFAOYSA-N 2-ethylhexyl 4-nitrobenzoate Chemical group CCCCC(CC)COC(=O)C1=CC=C([N+]([O-])=O)C=C1 NPSJHQMIVNJLNN-UHFFFAOYSA-N 0.000 description 1
- 239000004808 2-ethylhexylester Chemical group 0.000 description 1
- HCILJBJJZALOAL-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)-n'-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyl]propanehydrazide Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 HCILJBJJZALOAL-UHFFFAOYSA-N 0.000 description 1
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- UDWIZRDPCQAYRF-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C=C UDWIZRDPCQAYRF-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- MCDBEBOBROAQSH-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C=C MCDBEBOBROAQSH-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- XTVRLCUJHGUXCP-UHFFFAOYSA-N 3-methyleneheptane Chemical compound CCCCC(=C)CC XTVRLCUJHGUXCP-UHFFFAOYSA-N 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- UDBVWWVWSXSLAX-UHFFFAOYSA-N 4-[2,3-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)C(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)CC1=CC(C(C)(C)C)=C(O)C=C1C UDBVWWVWSXSLAX-UHFFFAOYSA-N 0.000 description 1
- PRKPGWQEKNEVEU-UHFFFAOYSA-N 4-methyl-n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC(C)C PRKPGWQEKNEVEU-UHFFFAOYSA-N 0.000 description 1
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical compound C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- BHPQYMZQTOCNFJ-UHFFFAOYSA-N Calcium cation Chemical compound [Ca+2] BHPQYMZQTOCNFJ-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- XLYMOEINVGRTEX-ARJAWSKDSA-N Ethyl hydrogen fumarate Chemical compound CCOC(=O)\C=C/C(O)=O XLYMOEINVGRTEX-ARJAWSKDSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- JLVVSXFLKOJNIY-UHFFFAOYSA-N Magnesium ion Chemical compound [Mg+2] JLVVSXFLKOJNIY-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 1
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910001422 barium ion Inorganic materials 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 description 1
- 229910001423 beryllium ion Inorganic materials 0.000 description 1
- PWOSZCQLSAMRQW-UHFFFAOYSA-N beryllium(2+) Chemical compound [Be+2] PWOSZCQLSAMRQW-UHFFFAOYSA-N 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RPPBZEBXAAZZJH-UHFFFAOYSA-N cadmium telluride Chemical compound [Te]=[Cd] RPPBZEBXAAZZJH-UHFFFAOYSA-N 0.000 description 1
- 229910001424 calcium ion Inorganic materials 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229910001429 cobalt ion Inorganic materials 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- UIPVMGDJUWUZEI-UHFFFAOYSA-N copper;selanylideneindium Chemical compound [Cu].[In]=[Se] UIPVMGDJUWUZEI-UHFFFAOYSA-N 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000012685 gas phase polymerization Methods 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 150000003840 hydrochlorides Chemical class 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- RVPVRDXYQKGNMQ-UHFFFAOYSA-N lead(2+) Chemical compound [Pb+2] RVPVRDXYQKGNMQ-UHFFFAOYSA-N 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910001425 magnesium ion Inorganic materials 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 150000004702 methyl esters Chemical group 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- HMDRAGZZZBGZJC-UHFFFAOYSA-N n-[3-[3-aminopropoxy(dimethoxy)silyl]propyl]-1-phenylprop-2-en-1-amine Chemical compound NCCCO[Si](OC)(OC)CCCNC(C=C)C1=CC=CC=C1 HMDRAGZZZBGZJC-UHFFFAOYSA-N 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000004978 peroxycarbonates Chemical class 0.000 description 1
- 125000005634 peroxydicarbonate group Chemical class 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229910001414 potassium ion Inorganic materials 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical group CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001427 strontium ion Inorganic materials 0.000 description 1
- PWYYWQHXAPXYMF-UHFFFAOYSA-N strontium(2+) Chemical compound [Sr+2] PWYYWQHXAPXYMF-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/07—Flat, e.g. panels
- B29C48/08—Flat, e.g. panels flexible, e.g. films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
- C08F210/02—Ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
- C08F210/16—Copolymers of ethene with alpha-alkenes, e.g. EP rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F218/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid
- C08F218/02—Esters of monocarboxylic acids
- C08F218/04—Vinyl esters
- C08F218/08—Vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
- C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
- C08F230/085—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
- C08K5/24—Derivatives of hydrazine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3472—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
- C08L23/0884—Epoxide containing esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2323/00—Polyalkenes
- B32B2323/04—Polyethylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2333/00—Polymers of unsaturated acids or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a resin composition for a solar cell encapsulant, a solar cell encapsulant, a manufacturing method of a solar cell encapsulant, and a solar cell module.
- Photovoltaic power generation directly converts solar energy into electrical energy using a semiconductor (solar cell element) such as a silicon cell.
- a semiconductor solar cell element
- the solar cell element is sandwiched between encapsulants to protect the solar cell element and to prevent the incorporation of a foreign matter or the intrusion of moisture or the like into the solar cell element.
- the solar cell element usually has a metal electrode for collecting electric charges that are obtained by photovoltaic power and is usually configured by connecting a plurality of cells for a solar cell with metal wiring in order to obtain a high electric output.
- a metal electrode for collecting electric charges that are obtained by photovoltaic power
- the yellowing of these solar cell encapsulants reduces the amount of light received by the solar cell element. Therefore, the yellowing of the solar cell encapsulants causes a decrease in the power generation efficiency of solar cell modules, and a solar cell encapsulant capable of effectively preventing yellowing is desired.
- Examples of techniques for suppressing such yellowing of solar cell encapsulants include techniques described in Patent Document 1 ( Japanese Unexamined Patent Publication No. 2014-107323 ) and Patent Document 2 ( Japanese Unexamined Patent Publication No. 2018-174202 ) .
- Patent Document 1 discloses an encapsulating film for a solar cell containing an ethylene-based copolymer, a pigment, and a metal inactivating agent, in which the metal inactivating agent contains at least one kind of compound selected from the group consisting of a triazole-based compound, a benzotriazole-based compound, and a hydrazine compound. Patent Document 1 describes that such an encapsulating film for a solar cell is capable of suppressing the occurrence of yellowing.
- Patent Document 2 discloses an encapsulant for a solar cell containing an ethylene-polar monomer copolymer, a cross-linking agent, an ultraviolet absorber, and a carbodiimide compound, in which the cross-linking agent has a specific structure, the ultraviolet absorber is a benzotriazole-based ultraviolet absorber, and the carbodiimide compound is a cyclic carbodiimide compound having a specific structure.
- Patent Document 2 describes that such an encapsulant for a solar cell is capable of maintaining an acid trapping function for a long period of time even in a high temperature and high humidity environment and in an environment exposed to ultraviolet rays for a long period of time, suppresses yellowing, and is highly transparent and excellent in terms of the cross-linking efficiency.
- a demand for suppressing the yellowing of solar cell encapsulants is growing more intense.
- the present invention has been made in view of the above-described circumstances and provides a solar cell encapsulant having improved yellowing resistance.
- the present inventors repeated intensive studies to solve the above-described problems. As a result, the present inventors found that it is possible to improve the yellowing resistance of a solar cell encapsulant that is obtained, by combining at least one kind of ethylene-polar monomer copolymer selected from an ethylene-vinyl ester copolymer and an ethylene-unsaturated carboxylic acid ester copolymer, an epoxy group-containing ethylene-based copolymer, an ethylene- ⁇ -olefin copolymer, and a metal inactivating agent and reached the present invention.
- ethylene-polar monomer copolymer selected from an ethylene-vinyl ester copolymer and an ethylene-unsaturated carboxylic acid ester copolymer, an epoxy group-containing ethylene-based copolymer, an ethylene- ⁇ -olefin copolymer, and a metal inactivating agent and reached the present invention.
- a resin composition for a solar cell encapsulant, a solar cell encapsulant, a manufacturing method of a solar cell encapsulant, and a solar cell module which will be described below, are provided.
- Fig. 1 is a cross-sectional view schematically illustrating an example of the structure of a solar cell module of an embodiment according to the present invention.
- (meth)acryl means acryl or methacryl.
- a resin composition for a solar cell encapsulant according to the present embodiment is a resin composition which is used for forming a solar cell encapsulant, the resin composition containing at least one kind of ethylene-polar monomer copolymer (A1) selected from an ethylene-vinyl ester copolymer and an ethylene-unsaturated carboxylic acid ester copolymer, an epoxy group-containing ethylene-based copolymer (A2) (excluding the ethylene-polar monomer copolymer (A1)), an ethylene- ⁇ -olefin copolymer (B), and a metal inactivating agent (C).
- A1 ethylene-polar monomer copolymer
- A2 epoxy group-containing ethylene-based copolymer
- B ethylene- ⁇ -olefin copolymer
- C metal inactivating agent
- the resin composition (P) contains the ethylene-polar monomer copolymer (A1), the epoxy group-containing ethylene-based copolymer (A2), the ethylene- ⁇ -olefin copolymer (B), and the metal inactivating agent (C) and is thus capable of improving the yellowing resistance of a solar cell encapsulant to be obtained.
- the epoxy group-containing ethylene-based copolymer (A2) and a functional group of the metal inactivating agent (C) interact or react with each other, which makes it easier for a metal ion to be coordinated to the metal inactivating agent (C) and thus suppresses the promotion of deterioration of a resin due to the metal ion.
- the use of the resin composition for a solar cell encapsulant according to the present embodiment enables the obtainment of a solar cell encapsulant having improved yellowing resistance.
- the total content of the ethylene-polar monomer copolymer (A1), the epoxy group-containing ethylene-based copolymer (A2), and the ethylene- ⁇ -olefin copolymer (B) is preferably equal to or more than 60% by mass, more preferably equal to or more than 70% by mass, even more preferably equal to or more than 80% by mass, far even more preferably equal to or more than 90% by mass, and particularly preferably equal to or more than 95% by mass.
- the total content of the ethylene-polar monomer copolymer (A1), the epoxy group-containing ethylene-based copolymer (A2), and the ethylene- ⁇ -olefin copolymer (B) is within the above-described range, it is possible to further improve the balance of the transparency, interlayer adhesiveness, insulating properties, rigidity, water resistance, flexibility, mechanical properties, heat resistance, handleability, and processability of solar cell encapsulants to be obtained and the PID resistance and the like of solar cell modules to be obtained.
- the ethylene-polar monomer copolymer (A1) contains one or more kinds selected from an ethylene-vinyl ester copolymer and an ethylene-unsaturated carboxylic acid ester copolymer.
- ethylene-vinyl ester copolymer it is possible to use one or more kinds selected from an ethylene-vinyl acetate copolymer, an ethylene-vinyl propionate copolymer, an ethylene-vinyl butyrate copolymer, an ethylene-vinyl stearate copolymer and the like.
- the ethylene-unsaturated carboxylic acid ester copolymer according to the present embodiment is a polymer obtained by copolymerizing ethylene and at least one kind of unsaturated carboxylic acid ester.
- a copolymer made up of ethylene and an alkyl ester of an unsaturated carboxylic acid can be exemplified.
- Examples of an unsaturated carboxylic acid in the unsaturated carboxylic acid ester include acrylic acid, methacrylic acid, ethacrylic acid, crotonic acid, fumaric acid, maleic acid, maleic anhydride, itaconic acid, itaconic anhydride, and the like.
- Examples of an alkyl moiety in the alkyl ester of the unsaturated carboxylic acid include alkyl groups having 1 to 12 carbon atoms, and more specifically, alkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, secondary butyl, 2-ethylhexyl, and isooctyl can be exemplified.
- the number of carbon atoms in the alkyl moiety of the alkyl ester is preferably 1 to 8.
- unsaturated carboxylic acid ester one or more kinds selected from (meth) acrylic acid esters such as methyl (meth) acrylate, ethyl (meth)acrylate, isopropyl (meth)acrylate, n-propyl (meth)acrylate, isobutyl (meth)acrylate, n-butyl (meth)acrylate, isooctyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate are preferably contained.
- These unsaturated carboxylic acid esters may be used singly or two or more kinds thereof may be used in combination.
- one or more kinds selected from methyl (meth) acrylate, ethyl (meth)acrylate, isopropyl (meth)acrylate, n-propyl (meth)acrylate, isobutyl (meth)acrylate, and n-butyl (meth)acrylate are more preferably contained.
- the ethylene-unsaturated carboxylic acid ester copolymer is preferably an ethylene-(meth)acrylic acid ester copolymer.
- a copolymer containing one kind of compound as the (meth)acrylic acid ester is preferable.
- Examples of such a copolymer include an ethylene-methyl (meth)acrylate copolymer, an ethylene-ethyl (meth)acrylate copolymer, an ethylene-isopropyl (meth)acrylate copolymer, an ethylene-n-propyl (meth)acrylate copolymer, an ethylene-isobutyl (meth)acrylate copolymer, an ethylene-n-butyl (meth)acrylate copolymer, an ethylene-isooctyl (meth)acrylate copolymer, an ethylene-2-ethylhexyl (meth)acrylate copolymer, and the like.
- the ethylene-polar monomer copolymer (A1) preferably contains one or more kinds selected from an ethylene-vinyl acetate copolymer, an ethylene-methyl (meth)acrylate copolymer, an ethylene-ethyl (meth)acrylate copolymer, an ethylene-isopropyl (meth)acrylate copolymer, an ethylene-n-propyl (meth)acrylate copolymer, an ethylene-isobutyl (meth) acrylate copolymer, and an ethylene-n-butyl (meth)acrylate copolymer and more preferably contains an ethylene-vinyl acetate copolymer.
- the ethylene-polar monomer copolymer (A1) may be used singly or two or more kinds may be used in combination.
- the content of a polar monomer in the ethylene-polar monomer copolymer (A1) is preferably equal to or more than 5% by mass and equal to or less than 50% by mass, more preferably equal to or more than 8% by mass and equal to or less than 45% by mass, and particularly preferably equal to or more than 8% by mass and equal to or less than 30% by mass.
- the content of the polar monomer can be measured according to, for example, JIS K7192: 1999.
- the content of the polar monomer is measured from, for example, the infrared absorption spectrum (IR) attributable to the unsaturated carboxylic acid ester.
- IR infrared absorption spectrum
- the unsaturated carboxylic acid ester is ethyl acrylate (EA)
- the content of the polar monomer is obtained from the absorbance at 860 cm -1 attributable to EA.
- the calibration curve is obtained from the correlation between the EA concentration obtained from the nuclear magnetic resonance spectrum (NMR) and the absorbance at 860 cm -1 of IR.
- the melt mass flow rate (MFR) of the ethylene-polar monomer copolymer (A1) as measured according to JIS K 7210: 1999 under conditions of 190°C and a load of 2160 g is preferably equal to or more than 0.1 g/10 minutes and equal to or less than 300 g/10 minutes, more preferably equal to or more than 0.2 g/10 minutes and equal to or less than 200 g/10 minutes, even more preferably equal to or more than 0.5 g/10 minutes and equal to or less than 180 g/10 minutes, and particularly preferably equal to or more than 1.0 g/10 minutes and equal to or less than 30 g/10 minutes.
- the MFR of the ethylene-polar monomer copolymer (A1) may be adjusted by blending a plurality of ethylene-polar monomer copolymers (A1) having different MFRs.
- a manufacturing method of the ethylene-polar monomer copolymer in the ethylene-polar monomer copolymer (A1) according to the present embodiment is not particularly limited, and the ethylene-polar monomer copolymer can be produced by a known method.
- the ethylene-polar monomer copolymer can be obtained by the radical copolymerization of the individual polymerization components at a high temperature and a high pressure.
- a commercially available product may be used as the ethylene-polar monomer copolymer in the ethylene-polar monomer copolymer (A1).
- At least a part of the ethylene-polar monomer copolymer (A1) is preferably modified with a silane coupling agent. In such a case, the adhesiveness of solar cell encapsulants to be obtained can be further improved.
- the silane coupling agent in the ethylene-polar monomer copolymer (A1) according to the present embodiment preferably contains one or more kinds selected from a silane coupling agent having a polymerizable group, a silane coupling agent having an amino group, and a silane coupling agent having an epoxy group.
- the amount of the silane coupling agent that can be contained is usually equal to or less than 5 parts by mass and preferably 0.02 to 4 parts by mass with respect to 100 parts by mass of the ethylene-polar monomer copolymer (A1).
- the silane coupling agent is contained within the above-described range, the adhesiveness of solar cell encapsulants to be obtained can be further improved.
- the modification of the silane coupling agent into the ethylene-polar monomer copolymer (A1) can be performed by, for example, the same method as for the modification of the silane coupling agent into the epoxy group-containing ethylene-based copolymer (A2) to be described below.
- the modification of the silane coupling agent into the ethylene-polar monomer copolymer (A1) and the modification of the silane coupling agent into the epoxy group-containing ethylene-based copolymer (A2) may be performed at the same time.
- the amount of a polymerization initiator that is used for the modification and can be contained is, for example, 0.1 to 5 parts by mass and preferably 0.2 to 3 parts by mass with respect to a total of 100 parts by mass of the ethylene-polar monomer copolymer (A1) and the epoxy group-containing ethylene-based copolymer (A2).
- the amount of the silane coupling agent that can be contained is, for example, equal to or less than 5 parts by mass and preferably 0.02 to 3 parts by mass with respect to a total of 100 parts by mass of the ethylene-polar monomer copolymer (A1) and the epoxy group-containing ethylene-based copolymer (A2).
- the silane coupling agent is contained within the above-described range, the adhesiveness of solar cell encapsulants to be obtained can be further improved.
- the content of the silane coupling agent is preferably equal to or more than 0.01% by mass and equal to or less than 2% by mass and more preferably equal to or more than 0.05% by mass and equal to or less than 1.0% by mass.
- the content of the silane coupling agent also includes the silane coupling agent that has been grafted to the ethylene-polar monomer copolymer (A1) and the epoxy group-containing ethylene-based copolymer (A2).
- the content of the ethylene-polar monomer copolymer (A1) in the resin composition (P) according to the present embodiment is preferably equal to or more than 1% by mass and equal to or less than 10% by mass, more preferably equal to or more than 2% by mass and equal to or less than 8% by mass, and particularly preferably equal to or more than 3% by mass and equal to or less than 7% by mass.
- the content of the ethylene-polar monomer copolymer (A1) is within the above-described range, the performance balance of the transparency, adhesiveness, moisture resistance, insulating properties, flexibility, heat resistance, and processability of solar cell encapsulants to be obtained can be further improved.
- Examples of the epoxy group-containing ethylene-based copolymer (A2) include glycidyl group-containing ethylene-based copolymers.
- Examples of the glycidyl group-containing ethylene-based copolymers include at least one kind selected from an ethylene-glycidyl (meth)acrylate copolymer, an ethylene-glycidyl (meth)acrylate-vinyl acetate copolymer, an ethylene-glycidyl (meth)acrylate-(meth)acrylate ester copolymer, and the like.
- the epoxy group-containing ethylene-based copolymer (A2) can be obtained by copolymerizing a polymerizable group such as glycidyl (meth)acrylate, glycidyl vinyl ether, 1,2-epoxy-4-vinylcyclohexane, or 3,4-epoxycyclohexylmethyl methacrylate and a monomer having an epoxy group with ethylene.
- a polymerizable group such as glycidyl (meth)acrylate, glycidyl vinyl ether, 1,2-epoxy-4-vinylcyclohexane, or 3,4-epoxycyclohexylmethyl methacrylate
- an epoxy group may be introduced by the graft polymerization of a monomer having an epoxy group into an ethylene-based copolymer.
- the content proportion of a constituent unit derived from a monomer containing an epoxy group in the epoxy group-containing ethylene-based copolymer (A2) is preferably equal to or more than 2% by mass and equal to or less than 30% by mass, more preferably equal to or more than 3% by mass and equal to or less than 25% by mass, and even more preferably equal to or more than 3% by mass and equal to or less than 15% by mass.
- the content proportion of the constituent unit derived from the monomer containing an epoxy group is equal to or more than the lower limit value, the interlayer adhesiveness of solar cell encapsulants to be obtained to solar cell modules become more favorable, and the transparency and flexibility of the solar cell encapsulants also become more favorable.
- the content proportion is equal to or less than the upper limit value, the processability of the solar cell encapsulants improves.
- Glycidyl (meth)acrylate represents one or both of glycidyl methacrylate and glycidyl acrylate.
- the "ethylene-based copolymer” in the epoxy group-containing ethylene-based copolymer (A2) means that a constituent unit derived from ethylene is the main component.
- the "main component” mentioned herein means that the content of the "ethylene-derived constituent unit” is the largest among all of the constituent units.
- the fraction of the constituent unit derived from ethylene is larger than the fraction of a constituent unit derived from glycidyl (meth)acrylate or a constituent unit derived from vinyl acetate.
- the fraction of the ethylene-derived constituent unit in the epoxy group-containing ethylene-based copolymer (A2) is preferably equal to or more than 50% by mass, more preferably equal to or more than 65% by mass, even more preferably equal to or more than 70% by mass, and particularly preferably equal to or more than 75% by mass and is preferably equal to or less than 95% by mass, more preferably equal to or less than 90% by mass, and even more preferably equal to or less than 85% by mass.
- the epoxy group-containing ethylene-based copolymer may further contain a different monomer unit other than ethylene and the monomers having an epoxy group.
- Examples of the different monomer include vinyl esters such as vinyl acetate and vinyl propionate; unsaturated carboxylic acid esters such as acrylic acid ester, methacrylic acid ester, ethacrylic acid ester, crotonic acid ester, fumaric acid ester, maleic acid ester, maleic anhydride ester, itaconic acid ester, and itaconic acid anhydride ester; and the like.
- vinyl esters such as vinyl acetate and vinyl propionate
- unsaturated carboxylic acid esters such as acrylic acid ester, methacrylic acid ester, ethacrylic acid ester, crotonic acid ester, fumaric acid ester, maleic acid ester, maleic anhydride ester, itaconic acid ester, and itaconic acid anhydride ester
- unsaturated carboxylic acid esters such as acrylic acid ester, methacrylic acid ester, ethacrylic acid ester, crotonic acid ester, fumaric acid
- Examples of an ester group include alkyl ester groups having 1 to 12 carbon atoms, and more specifically, alkyl ester groups such as methyl ester, ethyl ester, n-propyl ester, isopropyl ester, n-butyl ester, isobutyl ester, secondary butyl ester, 2-ethylhexyl ester, and isooctyl ester can be exemplified.
- At least one kind selected from vinyl acetate and (meth)acrylic acid ester is preferable.
- copolymers including the constituent unit derived from ethylene and the constituent unit derived from glycidyl (meth) acrylate
- copolymers further containing, in addition to these two constituent units, at least one of a constituent unit derived from vinyl acetate and a constituent unit derived from (meth)acrylic acid ester are exemplified.
- the upper limit value of the content proportion of the constituent unit derived from a vinyl ester such as vinyl acetate and the constituent unit derived from an unsaturated carboxylic acid ester such as (meth) acrylic acid ester is preferably equal to or less than 30% by mass and more preferably equal to or less than 20% by mass. In such a case, the moisture permeability of solar cell encapsulants decreases, and the moisture resistance can be further improved.
- the lower limit value of the content proportion of the constituent unit derived from the vinyl ester such as vinyl acetate and the constituent unit derived from the unsaturated carboxylic acid ester such as (meth) acrylic acid ester is not particularly limited, but is preferably equal to or more than 0.1% by mass, more preferably equal to or more than 0.5% by mass, and even more preferably equal to or more than 1% by mass.
- the content proportion of the constituent unit derived from the vinyl ester such as vinyl acetate and the constituent unit derived from the unsaturated carboxylic acid ester such as (meth) acrylic acid ester is preferably within a range of 0.1% to 30% by mass, more preferably within a range of 0.5% to 20% by mass, and particularly preferably within a range of 1% to 20% by mass.
- epoxy group-containing ethylene-based copolymer (A2) one kind of copolymer can be used singly or two or more kinds of copolymers having different copolymerization rates or the like can be used in combination.
- the content of the epoxy group-containing ethylene-based copolymer (A2) in the resin composition (P) according to the present embodiment is preferably equal to or more than 1% by mass and equal to or less than 10% by mass, more preferably equal to or more than 2% by mass and equal to or less than 8% by mass, and particularly preferably equal to or more than 3% by mass and equal to or less than 7% by mass.
- the content of the epoxy group-containing ethylene-based copolymer (A2) is within the above-described range, the performance balance of the transparency, adhesiveness, moisture resistance, insulating properties, flexibility, heat resistance, and processability of solar cell encapsulants to be obtained can be further improved.
- At least a part of the epoxy group-containing ethylene-based copolymer (A2) is preferably modified with a silane coupling agent. In such a case, the adhesiveness of solar cell encapsulants to be obtained can be further improved.
- the silane coupling agent in the epoxy group-containing ethylene-based copolymer (A2) preferably contains one or more kinds selected from a silane coupling agent having a polymerizable group, a silane coupling agent having an amino group, and a silane coupling agent having an epoxy group.
- the modification of the silane coupling agent into the epoxy group-containing ethylene-based copolymer (A2) is, for example, a method in which the epoxy group-containing ethylene-based copolymer (A2) and a silane coupling agent having an amino group or an epoxy group are reacted with each other under heating (at, for example, 100°C to 200°C) (modification method 1), a method in which a silane coupling agent having a polymerizable group is graft-polymerized into the epoxy group-containing ethylene-based copolymer (A2) using a polymerization initiator (modification method 2), or the like.
- the amino group or the epoxy group in the silane coupling agent and a glycidyl group in the epoxy group-containing ethylene-based copolymer (A2) react with each other, whereby the silane coupling agent is introduced into a side chain of the epoxy group-containing ethylene-based copolymer (A2).
- the silane coupling agent can be manufactured by, for example, melting and kneading the epoxy group-containing ethylene-based copolymer (A2), the silane coupling agent having a polymerizable group, and a radical polymerization initiator using an extruder, a kneader, a Banbury mixer, or the like at a temperature equal to or higher than the melting point of the epoxy group-containing ethylene-based copolymer (A2) and equal to or higher than the decomposition temperature of the radical polymerization initiator. These reactions can also be performed in solutions.
- polymerization initiator a usually-used polymerization initiator can be used, but an organic peroxide is preferable.
- organic peroxide a known organic peroxide that can be used as a polymerization initiator can be used, and specific examples thereof include diacyl peroxide compounds, alkyl peroxy ester compounds, peroxydicarbonate compounds, peroxycarbonate compounds, peroxyketal compounds, dialkyl peroxide compounds, hydroperoxide compounds, ketone peroxide compounds, and the like.
- dialkyl peroxide compounds are preferable, and 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 1,3-di(2-t-butylperoxyisopropyl)benzene, di-t-butyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexyne-3 are more preferable.
- silane coupling agent having a polymerizable group examples include vinyltrimethoxysilane, vinyltriethoxysilane,
- silane coupling agent having an amino group examples include hydrochlorides of
- silane coupling agent having an epoxy group examples include 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane,
- the melt mass flow rate (MFR) of the epoxy group-containing ethylene-based copolymer (A2) as measured according to JIS K 7210:1999 under conditions of 190°C and a load of 2160 g is preferably equal to or more than 0.1 g/10 minutes and equal to or less than 50 g/10 minutes, more preferably equal to or more than 0.5 g/10 minutes and equal to or less than 30 g/10 minutes, and even more preferably equal to or more than 1 g/10 minutes and equal to or less than 20 g/10 minutes.
- the amount of the polymerization initiator that is used for the modification and can be contained is usually 0.1 to 5 parts by mass and preferably 0.5 to 3 parts by mass with respect to 100 parts by mass of the epoxy group-containing ethylene-based copolymer (A2).
- the amount of the silane coupling agent that can be contained is usually equal to or less than 5 parts by mass and preferably 0.02 to 4 parts by mass with respect to 100 parts by mass of the epoxy group-containing ethylene-based copolymer (A2).
- the silane coupling agent is contained within the above-described range, the adhesiveness of solar cell encapsulants to be obtained can be further improved.
- the mass ratio of the content of the ethylene-polar monomer copolymer (A1) to the content of the epoxy group-containing ethylene-based copolymer (A2) in the resin composition (P) is preferably equal to or more than 0.1 and equal to or less than 10 and more preferably equal to or more than 0.5 and equal to or less than 5. In such a case, it is possible to further improve the balance of the adhesiveness, flexibility, mechanical properties, heat resistance, handleability, processability, and the like of solar cell encapsulants to be obtained.
- the content proportion of a constituent unit derived from an ⁇ -olefin is preferably equal to or more than 5 mol%.
- the content proportion is more preferably equal to or more than 10 mol%.
- the upper limit is less than 50 mol%, preferably equal to or less than 40 mol%, and particularly preferably equal to or less than 30 mol%.
- an ⁇ -olefin having 3 to 20 carbon atoms is preferable.
- 3 to 20 carbon atoms include linear ⁇ -olefins such as propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene, 1-undecene, 1-dodecene, 1-tridecene, 1-tetradecene, 1-pentadecene, 1-hexadecene, 1-heptadecene, 1-octadecene, 1-nanodecene, and 1-eicosene; branched ⁇ -olefins such as 3-methyl-1-butene, 3-methyl-1-pentene, 4-methyl-1-pentene, 2-ethyl-1-hexene, and 2,2,4-trimethyl-1-pentene; and the like, and these ⁇ -olefin
- the number of carbon atoms in the ⁇ -olefin is preferably 3 to 10 and more preferably 3 to 8 from the viewpoint of versatility (cost, mass productivity, or easiness in procurement).
- the ethylene- ⁇ -olefin copolymer is preferably an ethylene-propylene copolymer, an ethylene-1-butene copolymer, an ethylene-4-methyl-1-pentene copolymer, an ethylene-1-hexene copolymer, or an ethylene-1-octene copolymer, and, in all of the ethylene- ⁇ -olefin copolymers, the content of an ethylene-derived constituent unit is equal to or more than 50 mol%.
- the ethylene- ⁇ -olefin copolymers may be used singly or two or more kinds thereof may be used in combination.
- the ethylene- ⁇ -olefin copolymer can be manufactured by, for example, a slurry polymerization method, a solution polymerization method, a bulk polymerization method, a gas phase polymerization method or the like in which a metallocene-based catalyst is used.
- the density of the ethylene- ⁇ -olefin copolymer as measured according to JIS K 7112: 1999 is preferably equal to or more than 850 kg/m 3 , more preferably equal to or more than 860 kg/m 3 , and particularly preferably equal to or more than 870 kg/m 3 .
- the density of the ethylene- ⁇ -olefin copolymer is equal to or more than the above-described lower limit value, the heat resistance becomes more favorable.
- the density of the ethylene- ⁇ -olefin copolymer as measured according to JIS K 7112: 1999 is preferably equal to or less than 910 kg/m 3 .
- the density of the ethylene- ⁇ -olefin copolymer is equal to or less than the above-described upper limit value, the balance of the adhesiveness, flexibility and transparency of solar cell encapsulants becomes more favorable.
- the content of the ethylene- ⁇ -olefin copolymer (B) in the resin composition (P) according to the present embodiment is preferably equal to or more than 80% by mass, more preferably equal to or more than 84% by mass, and even more preferably equal to or more than 86% by mass.
- the upper limit of the content of the ethylene- ⁇ -olefin copolymer (B) is not particularly limited, but is, for example, preferably equal to or less than 98% by mass, more preferably equal to or less than 96% by mass, and even more preferably equal to or less than 94% by mass.
- the content of the ethylene- ⁇ -olefin copolymer (B) is within the above-described range, the performance balance of the transparency, adhesiveness, moisture resistance, insulating properties, flexibility, heat resistance, and processability of solar cell encapsulants to be obtained can be further improved.
- metal inactivating agent (C) As the metal inactivating agent (C) according to the present embodiment, an agent well known as a compound that suppresses metal damage of thermoplastic resins can be used. Two or more kinds of metal inactivating agents may be jointly used.
- Examples of the metal inactivating agent (C) according to the present embodiment include a compound having a hydrazine skeleton, a compound having a triazole skeleton, and the like.
- Examples of the compound having a hydrazine skeleton include decamethylene dicarboxyl-disalicyloyl hydrazide, 2',3-bis[3-[3,5-di-tert-butyl-4-hydroxyphenyl] propionyl] propionohydrazide, isophthalic acid bis(2-phenoxypropionylhydrazide) .
- Examples of the compound having a triazole skeleton include 3-(N-salicyloyl) amino-1,2,4-triazole.
- decamethylene dicarboxyl-disalicyloyl hydrazide is put into commercially available under the product name of ADEKA STAB CDA-6S manufactured by ADEKA Corporation, and 2',3-bis[3-[3,5-di-tert-butyl-4-hydroxyphenyl] propionyl] propionohydrazide is put into commercially available under the product name of IRGANOX MD1024 manufactured by Ciba Specialty Chemicals Co., Ltd. (currently BASF Japan Ltd.).
- 3-(N-salicyloyl) amino-1,2,4-triazole is put into commercially available under the product name of ADEKA STAB CDA-1 and CDA-1M manufactured by ADEKA Corporation.
- the content of the metal inactivating agent (C) in the resin composition (P) is preferably equal to or more than 0.05 parts by mass and more preferably equal to or more than 0.10 parts by mass.
- the content of the metal inactivating agent (C) is equal to or more than the above-described lower limit value, it is possible to further improve the yellowing resistance of solar cell encapsulants.
- the upper limit of the content of the metal inactivating agent (C) is not particularly limited, but is, for example, equal to or less than 5.0 parts by mass, preferably equal to or less than 3.0 parts by mass, and more preferably equal to or less than 1.0 part by mass.
- components other than the ethylene-polar monomer copolymer (A1), the epoxy group-containing ethylene-based copolymer (A2), the ethylene- ⁇ -olefin copolymer (B), and the metal inactivating agent (C) can be contained to an extent that the object of the present invention is not impaired.
- the other components are not particularly limited, and examples thereof include a plasticizer, an oxidation inhibitor, an ultraviolet absorber, a wavelength conversion agent, an antistatic agent, a surfactant, a colorant, a lightfastness stabilizer, a foaming agent, a lubricating agent, a crystal nucleating agent, a crystallization accelerator, a crystallization retardant, a catalyst deactivator, a heat ray absorber, a heat ray reflecting agent, a heat dissipating agent, a thermoplastic resin, a thermosetting resin, an inorganic filler, an organic filler, an impact resistance improving agent, a slip agent, a cross-linking agent, a cross-linking aid, a tackifier, a processing aid, a mold release agent, a hydrolysis inhibitor, a heat-resistant stabilizer, an antiblocking agent, an antifogging agent, a flame retardant, a flame retardant aid, a light diffusing agent, an antibacterial agent, an antifungal
- a solar cell encapsulant according to the present embodiment includes a layer formed of the resin composition (P) according to the present embodiment.
- the solar cell encapsulant according to the present embodiment may have a single-layer constitution or may have a multilayer constitution of two or more layers.
- the solar cell encapsulant according to the present embodiment may be a film having a single-layer constitution made of a layer formed of the resin composition (P) according to the present embodiment, may be a film having a multilayer constitution made up of two or more layers formed of the resin composition (P) according to the present embodiment, or may be a film having a multilayer constitution having at least one layer formed of the resin composition (P) according to the present embodiment and at least one layer other than the layer formed of the resin composition (P) according to the present embodiment.
- a layer formed of the solar cell encapsulant according to the present embodiment is also referred to as an encapsulated resin layer.
- the encapsulated resin layer may have a single-layer constitution or a multilayer constitution of two or more layers.
- Examples of the layer other than the layer formed of the resin composition (P) according to the present embodiment include layers formed of a resin composition containing at least one kind of ethylene-based copolymer selected from an ethylene-vinyl ester copolymer, an ethylene- ⁇ -olefin copolymer, and an ionomer of an ethylene-unsaturated carboxylic acid-based copolymer.
- ethylene-vinyl ester copolymer and the ethylene- ⁇ -olefin copolymer for example, the above-described ethylene-vinyl ester copolymer and ethylene- ⁇ -olefin copolymer can be used.
- the ionomer of the ethylene-unsaturated carboxylic acid-based copolymer is a resin in which at least a part of carboxyl groups in a polymer obtained by copolymerizing ethylene and at least one kind of unsaturated carboxylic acid have been neutralized with metal ions .
- a copolymer containing ethylene and an unsaturated carboxylic acid a copolymer containing ethylene, an unsaturated carboxylic acid, and an unsaturated carboxylic acid ester, and the like can be exemplified.
- the unsaturated carboxylic acid that constitutes the ionomer of the ethylene-unsaturated carboxylic acid-based copolymer include acrylic acid, methacrylic acid, 2-ethylacrylic acid, crotonic acid, maleic acid, fumaric acid, itaconic acid, maleic anhydride, fumaric anhydride, itaconic anhydride, monomethyl maleate, monoethyl maleate, and the like.
- the ethylene-unsaturated carboxylic acid-based copolymer is particularly preferably an ethylene- (meth) acrylic acid copolymer and an ethylene- (meth) acrylic acid- (meth) acrylic acid ester copolymer.
- Examples of the metal ions that constitute the ionomer of the ethylene-unsaturated carboxylic acid-based copolymer according to the present embodiment include one or more kinds selected from the group consisting of a lithium ion, a potassium ion, a sodium ion, a silver ion, a copper ion, a calcium ion, a magnesium ion, a zinc ion, an aluminum ion, a barium ion, a beryllium ion, a strontium ion, a tin ion, a lead ion, an iron ion, a cobalt ion, and a nickel ion.
- the layer other than the layer composed of the resin composition (P) according to the present embodiment is preferably a resin sheet formed of an ethylene-vinyl acetate copolymer (EVA), an ethylene- ⁇ -olefin copolymer, and an ionomer of an ethylene-unsaturated carboxylic acid-based copolymer.
- EVA ethylene-vinyl acetate copolymer
- ethylene- ⁇ -olefin copolymer ethylene- ⁇ -olefin copolymer
- an ionomer of an ethylene-unsaturated carboxylic acid-based copolymer for example, a layer known as a solar cell encapsulant can be used.
- the layer formed of the resin composition (P) according to the present embodiment is used on a side where the solar cell encapsulant comes into contact with a metal material. This makes it possible to more effectively suppress the yellowing of the solar cell encapsulant.
- the thickness of the solar cell encapsulant according to the present embodiment is, for example, equal to or more than 0.001 mm and equal to or less than 10 mm, preferably equal to or more than 0.01 mm and equal to or less than 5 mm, and more preferably equal to or more than 0.05 mm and equal to or less than 2 mm.
- the thickness of the solar cell encapsulant is equal to or more than the lower limit value, it is possible to further improve the mechanical strength or insulating properties of the solar cell encapsulant.
- the thickness of the solar cell encapsulant is equal to or less than the upper limit value, it is possible to further improve the transparency of solar cell encapsulants to be obtained.
- the solar cell encapsulant according to the present embodiment has a laminated structure in which a layer formed of the resin composition (P) and a layer formed of a resin composition containing at least one kind of ethylene-based copolymer selected from an ethylene-vinyl ester copolymer, an ethylene- ⁇ -olefin copolymer, and an ionomer of an ethylene-unsaturated carboxylic acid-based copolymer are laminated
- the thickness of the layer formed of the resin composition (P) is, for example, equal to or more than 10 ⁇ m and equal to or less than 900 ⁇ m.
- a manufacturing method of a solar cell encapsulant according to the present embodiment is not particularly limited, and a conventionally known manufacturing method can be used.
- the manufacturing method of a solar cell encapsulant according to the present embodiment for example, a press molding method, an extrusion molding method, a T-die molding method, an injection molding method, a compression molding method, a cast molding method, a calender molding method, an inflation molding method, and the like can be used.
- the extrusion molding method is preferable. That is, the solar cell encapsulant according to the present embodiment can be obtained by, for example, a manufacturing method including a step of extruding the resin composition (P) according to the present embodiment into a sheet shape.
- Fig. 1 is a cross-sectional view schematically illustrating an example of the structure of a solar cell module 1 according to the embodiment of the present invention.
- the solar cell module 1 according to the present embodiment includes, for example, solar cell elements 3 and an encapsulated resin layer 5 formed of the solar cell encapsulant according to the present embodiment that encapsulates the solar cell elements 3.
- the solar cell module 1 according to the present embodiment may further include a substrate 2 on which sunlight is incident, a protective material 4, or the like as necessary. There will be cases where the substrate 2 on which sunlight is incident is simply referred to as the substrate 2.
- the solar cell elements 3 are sandwiched by the encapsulated resin layer 5, and these are further sandwiched by the substrate 2 and the protective material 4 to form a laminate.
- the solar cell module 1 can be produced by heating and pressurizing the laminate to attach the individual members.
- a solar cell module 1 various types of solar cell modules may be exemplified. Examples thereof include a solar cell module having a constitution in which a solar cell element is sandwiched by encapsulants from both sides by laminating a substrate, the encapsulant, the solar cell element, the encapsulant, and a protective material in this order; a solar cell module constituted by laminating a solar cell element formed in advance on the surface of a substrate such as glass in the order of the substrate, the solar cell element, a encapsulant, and a protective material; a solar cell module having a constitution in which a encapsulant and a protective material are formed on a solar cell element formed on the inner peripheral surface of a substrate, for example, an amorphous solar cell element produced on a fluororesin-based sheet by sputtering; and the like.
- the protective material 4 is provided on a side of the solar cell module 1 opposite to the substrate 2, that is, in the lower part, and is thus referred to as the lower protective material or rear surface protective material in some cases.
- various solar cell elements such as silicon-based solar cell elements containing single crystal silicon, polycrystalline silicon, amorphous silicon, or the like; Group III-V or Group II-VI compound semiconductor-based solar cell elements containing gallium-arsenic, copper-indium-selenium, copper-indium-gallium-selenium, cadmium-tellurium, or the like; and heterojunction-type solar cell elements of amorphous silicon and single crystal silicon can be used.
- a plurality of the solar cell elements 3 are electrically connected in series through interconnectors 6.
- the solar cell module 1 usually includes a metal material provided adjacent to the encapsulated resin layer 5.
- a layer formed of the resin composition (P) is in contact with at least a part of the metal material.
- the layer formed of the resin composition (P) is positioned on at least one surface of the encapsulated resin layer 5, and the surface of the encapsulated resin layer 5 on the side of the layer formed of the resin composition (P) is in contact with at least a part of the metal material, for example, one surface of the metal material. Since the layer formed of the resin composition (P) according to the present embodiment is excellent in terms of yellowing resistance, it is possible to suppress yellowing even in a case where the encapsulated resin layer 5 is in contact with the metal material.
- Examples of the metal material include a bus bar electrode, an interconnector, a finger electrode, and the like. Such metal materials are usually wiring, electrodes, and the like.
- the bus bar electrode, the interconnector, and the finger electrode are used in modules to join solar cell elements or to collect generated electricity.
- the metal material contains, for example, at least one metal selected from copper, tin, lead, iron, bismuth, aluminum, and silver.
- the solar cell encapsulant according to the present embodiment is particularly effective for solar cell modules in which the metal material contains copper.
- Examples of the substrate 2 that constitutes the solar cell module 1 according to the present embodiment include glass, an acrylic resin, a polycarbonate, a polyester, a fluorine-containing resin, and the like.
- the protective material 4 (lower protective material) is a single substance of metal, various inorganic materials, various thermoplastic resin films, or the like or a multilayer sheet thereof, and examples thereof include single-layer or multilayer sheets made of metal such as tin, aluminum, or stainless steel; an inorganic material such as glass; a thermoplastic resin film of a polyester, an inorganic vapor deposited polyester, a fluorine-containing resin, a polyolefin, or the like.
- the solar cell encapsulant according to the present embodiment exhibits favorable adhesiveness to the substrate 2 or the protective material 4.
- the manufacturing method of the solar cell module 1 is not particularly limited, and examples thereof include the following method.
- a plurality of the solar cell elements 3 electrically connected using the interconnectors 6 are sandwiched by the solar cell encapsulants, and these solar cell encapsulants are further sandwiched by the substrate 2 and the protective material 4, thereby producing a laminate.
- the laminate is heated and pressurized to attach the individual members, thereby obtaining the solar cell module 1.
- Laminates obtained in examples and comparative examples were left to stand at 140°C for 144 hours or 288 hours.
- the central parts of the laminates were visually observed, and the yellowing resistance was evaluated based on the following criteria.
- ethylene-glycidyl methacrylate-vinyl acetate copolymer (EGMAVA, manufactured by Sumitomo Chemical Co., Ltd., BONDFAST 7B, ethylene content: 83% by mass, glycidyl methacrylate content: 12% by mass, vinyl acetate content: 5% by mass, MFR (190°C, load of 2160 g): 7 g/10 minutes), 49 parts by mass of an ethylene-vinyl acetate copolymer (vinyl acetate content: 19% by mass, MFR (190°C, load of 2160 g): 47 g/10 minutes), 1.5 parts by mass of 3-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name "KBM503”), and 0.5 parts by mass of 2,5-dimethyl-2,5-di(t-butylperoxy)hexane (manufactured by
- Ethylene- ⁇ -olefin copolymer (B-1) Ethylene- ⁇ -olefin copolymer (manufactured by Mitsui Chemicals, Inc., TAFMER A-4090S, MFR: 3.6 g/10 minutes, density: 893 kg/m 3 )
- Examples 1 to 4 and Comparative Example 3 Individual components were melted and kneaded at 175°C in formulation proportions shown in Table 1 to obtain individual resin compositions. Next, the obtained resin compositions were press-molded with a heat press machine to produce sheet-shaped solar cell encapsulants having a thickness of 0.1 mm.
- TPT back sheet (BEC-301, manufactured by Hangzhou First PV MATERIAL Co., Ltd) cut out to 25 mm ⁇ 25 mm, and each of the sheet-shaped solar cell encapsulants obtained above (second layer), the first layer sheet, and a PET (polyethylene terephthalate) sheet were overlaid in this order in a constitution shown in Table 1 on the copper wires, thereby manufacturing a laminated sheet.
- the obtained laminated sheets were heated to 150°C for 3 minutes under a vacuum and then heated at 150°C for 5 minutes under pressure to produce individual laminates.
- the units (phr) of the amounts of various additives formulated indicate parts by mass when the total of the resin components was defined as 100 parts by mass.
- Copper wires having a diameter of 0.4 mm were bundled and arranged on a TPT back sheet (BEC-301, manufactured by Hangzhou First PV MATERIAL Co., Ltd) cut out to 25 mm ⁇ 25 mm, and the first layer sheet and a PET (polyethylene terephthalate) sheet were overlaid in this order in a constitution shown in Table 1 on the copper wires, thereby manufacturing a laminated sheet.
- the obtained laminated sheets were heated to 150°C for 3 minutes under a vacuum and then heated at 150°C for 5 minutes under pressure to produce individual laminates.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019226268 | 2019-12-16 | ||
PCT/JP2020/045805 WO2021125004A1 (fr) | 2019-12-16 | 2020-12-09 | Composition de résine pour encapsulation de cellule solaire, matériau d'encapsulation de cellule solaire ainsi que procédé de fabrication de celui-ci, et module de cellules solaires |
Publications (2)
Publication Number | Publication Date |
---|---|
EP4079520A1 true EP4079520A1 (fr) | 2022-10-26 |
EP4079520A4 EP4079520A4 (fr) | 2024-01-03 |
Family
ID=76477454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20900900.0A Pending EP4079520A4 (fr) | 2019-12-16 | 2020-12-09 | Composition de résine pour encapsulation de cellule solaire, matériau d'encapsulation de cellule solaire ainsi que procédé de fabrication de celui-ci, et module de cellules solaires |
Country Status (8)
Country | Link |
---|---|
US (1) | US20230006081A1 (fr) |
EP (1) | EP4079520A4 (fr) |
JP (1) | JP7410179B2 (fr) |
KR (1) | KR20220115991A (fr) |
CN (1) | CN114845872A (fr) |
BR (1) | BR112022011794A2 (fr) |
TW (1) | TW202132453A (fr) |
WO (1) | WO2021125004A1 (fr) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100546435C (zh) * | 2003-11-14 | 2009-09-30 | 日立化成工业株式会社 | 金属层的树脂层的形成方法、印刷线路板及其制造方法 |
BR112012002097A2 (pt) * | 2009-07-31 | 2019-09-24 | Du Pont | composição de mescla, produto de reticulação da composição de mescla processo para produzir uma folha, folha formada pelo processo modulo de culula solar processo para a reparação de um modulo de celula solar, modulo de controle solar processo para produzir a composição de mescla, folha extrudada e folha extrudada de multiplas camadas |
JP2011052147A (ja) * | 2009-09-03 | 2011-03-17 | Sumitomo Chemical Co Ltd | ポリオレフィン樹脂組成物およびその成形体 |
CN102576748A (zh) * | 2009-11-13 | 2012-07-11 | 三井-杜邦聚合化学株式会社 | 无定形硅太阳能电池组件 |
WO2012138986A1 (fr) * | 2011-04-07 | 2012-10-11 | Specialized Technology Resources, Inc | Matériau d'encapsulation pour modules photovoltaïques terrestres |
JP2014107323A (ja) | 2012-11-26 | 2014-06-09 | Sekisui Film Kk | 太陽電池用封止膜 |
EP3358629B1 (fr) * | 2015-09-29 | 2020-08-26 | Dow-Mitsui Polychemicals Co., Ltd. | Feuille multicouche pour produit d'étanchéité de cellule solaire, procédé de fabrication de feuille multicouche pour produit d'étanchéité de cellule solaire, et module de cellule solaire |
EP3357987B1 (fr) * | 2015-09-30 | 2021-02-17 | Dow-Mitsui Polychemicals Co., Ltd. | Feuille multicouche isolante et module de cellule solaire |
JP6838876B2 (ja) * | 2016-07-08 | 2021-03-03 | 旭化成株式会社 | 感光性樹脂組成物、感光性樹脂積層体、樹脂パターンの製造方法、硬化膜及び表示装置 |
JP2018174202A (ja) | 2017-03-31 | 2018-11-08 | 株式会社ブリヂストン | 太陽電池用封止材及びこれを用いた太陽電池モジュール |
-
2020
- 2020-12-09 WO PCT/JP2020/045805 patent/WO2021125004A1/fr unknown
- 2020-12-09 US US17/783,820 patent/US20230006081A1/en active Pending
- 2020-12-09 BR BR112022011794A patent/BR112022011794A2/pt unknown
- 2020-12-09 JP JP2021565510A patent/JP7410179B2/ja active Active
- 2020-12-09 CN CN202080085357.8A patent/CN114845872A/zh active Pending
- 2020-12-09 KR KR1020227023842A patent/KR20220115991A/ko not_active Application Discontinuation
- 2020-12-09 EP EP20900900.0A patent/EP4079520A4/fr active Pending
- 2020-12-15 TW TW109144200A patent/TW202132453A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP7410179B2 (ja) | 2024-01-09 |
KR20220115991A (ko) | 2022-08-19 |
BR112022011794A2 (pt) | 2022-08-30 |
WO2021125004A1 (fr) | 2021-06-24 |
CN114845872A (zh) | 2022-08-02 |
TW202132453A (zh) | 2021-09-01 |
JPWO2021125004A1 (fr) | 2021-06-24 |
EP4079520A4 (fr) | 2024-01-03 |
US20230006081A1 (en) | 2023-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105679867B (zh) | 包含具有硅烷基团的绝缘层的光伏组件 | |
EP2804223A1 (fr) | Module de cellule solaire doté d'une excellente apparence et son procédé de fabrication | |
EP3358629B1 (fr) | Feuille multicouche pour produit d'étanchéité de cellule solaire, procédé de fabrication de feuille multicouche pour produit d'étanchéité de cellule solaire, et module de cellule solaire | |
KR101738797B1 (ko) | 태양 전지 밀봉재 및 태양 전지 모듈 | |
EP2860766B1 (fr) | Module de batterie solaire et son procédé de fabrication | |
EP3255682B1 (fr) | Feuille d'interconnexion, structure et module de génération photovoltaïque | |
EP3357987B1 (fr) | Feuille multicouche isolante et module de cellule solaire | |
JP2011216804A (ja) | 太陽電池用封止膜、これを用いた太陽電池、及び太陽電池の製造方法 | |
JP4762377B2 (ja) | アモルファスシリコン太陽電池モジュール | |
WO2015107905A1 (fr) | Composition de résine pour matériaux d'étanchéité de cellule solaire, lot maître pour matériaux d'étanchéité de cellule solaire, et matériau d'étanchéité de cellule solaire | |
EP2913358B1 (fr) | Composition de résine pour matériaux d'encapsulation pour cellules solaires | |
EP2680318B1 (fr) | Film d'étanchéité de photopile et photopile utilisant ledit film | |
JP2015162498A (ja) | 太陽電池封止材用積層体、太陽電池封止材及び太陽電池モジュール | |
EP2966694A1 (fr) | Matériaux d'encapsulation pour batterie solaire, et module de batterie solaire | |
EP4079520A1 (fr) | Composition de résine pour encapsulation de cellule solaire, matériau d'encapsulation de cellule solaire ainsi que procédé de fabrication de celui-ci, et module de cellules solaires | |
JP2013118281A (ja) | 太陽電池用封止材および太陽電池モジュール | |
JP2010226045A (ja) | 樹脂封止シート及びそれを用いた太陽電池モジュール | |
JP7311613B2 (ja) | 太陽電池封止材用樹脂組成物、太陽電池封止材、太陽電池封止材の製造方法および太陽電池モジュール | |
CN115720550A (zh) | 具有改善的储存稳定性的聚合物组合物 | |
JP2016039207A (ja) | 太陽電池モジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20220712 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
P01 | Opt-out of the competence of the unified patent court (upc) registered |
Effective date: 20230526 |
|
RAP3 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: DOW-MITSUI POLYCHEMICALS CO., LTD. |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20231206 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 31/048 20140101ALI20231130BHEP Ipc: B32B 15/092 20060101ALI20231130BHEP Ipc: B32B 15/085 20060101ALI20231130BHEP Ipc: C08L 23/26 20060101ALI20231130BHEP Ipc: C08L 23/08 20060101ALI20231130BHEP Ipc: C08K 5/3472 20060101ALI20231130BHEP Ipc: C08K 5/24 20060101ALI20231130BHEP Ipc: B32B 27/38 20060101ALI20231130BHEP Ipc: B32B 27/32 20060101AFI20231130BHEP |