EP4079114A1 - Carte de circuit imprimé présentant un composant électronique monté en surface et procédé de fabrication de ladite carte de circuit imprimé - Google Patents

Carte de circuit imprimé présentant un composant électronique monté en surface et procédé de fabrication de ladite carte de circuit imprimé

Info

Publication number
EP4079114A1
EP4079114A1 EP20820456.0A EP20820456A EP4079114A1 EP 4079114 A1 EP4079114 A1 EP 4079114A1 EP 20820456 A EP20820456 A EP 20820456A EP 4079114 A1 EP4079114 A1 EP 4079114A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
plastic film
conductive adhesive
printed circuit
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20820456.0A
Other languages
German (de)
English (en)
Inventor
Dietmar KIESLINGER
Roman Führinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZKW Group GmbH
Original Assignee
ZKW Group GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZKW Group GmbH filed Critical ZKW Group GmbH
Publication of EP4079114A1 publication Critical patent/EP4079114A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10575—Insulating foil under component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0186—Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a circuit board with at least one electronic component mounted on an outside of the circuit board. Furthermore, methods for producing such a printed circuit board are specified within the scope of the invention.
  • a printed circuit board (printed circuit board, PCB for short) is a carrier for electronic components. It is used for mechanical fastening and electrical connection of such components. Almost every electronic device contains one or more printed circuit boards.
  • Circuit boards consist of electrically insulating material with conductive connections (conductor tracks) adhering to them. Fiber-reinforced plastic is usually used as the insulating material.
  • the conductor tracks are mostly etched from a thin layer of copper.
  • the electronic components are soldered on soldering surfaces (contact pads) or in soldering eyes. In this way, they are mechanically held in the installed position on these contact pads and electrically connected to the corresponding conductor tracks.
  • substrate can be understood in this context as a carrier for electrical connections or a component carrier similar to a PCB circuit board, but such a substrate has a significantly higher density of lateral (conductor tracks) and / or vertical (bores) connection points such as are used, for example, to produce electrical and mechanical connections between housed or unhoused electronic components and a printed circuit board.
  • lateral conductor tracks
  • bores vertical connection points
  • substrate therefore also includes so-called "IC substrates”.
  • connection plate for electronic components in the form of a printed circuit board or a substrate or an IC substrate, the connection plate usually comprising a plurality of insulation layers and conductive layers.
  • Unwired electronic components which are soldered directly onto the conductor tracks of a circuit board and which are referred to as surface mounted devices (SMD for short) make it possible to increase the packing density of circuit boards.
  • SMD surface-mounted components
  • a major advantage of SMD components is their easy handling in automatic assembly systems.
  • the disadvantage here is that automatic placement machines place the electronic components with a certain placement force on the support points provided for this on the outside of the circuit board, which, especially when using conductive adhesive for the assembly of sensitive components, can damage the contact pads on their underside and / or can lead to excessive compression of the conductive adhesive deposit below the contact pads.
  • Conductive adhesive which overflows laterally over the actual adhesive point, can lead to electrical short circuits underneath the assembled components.
  • solder paste instead of conductive adhesive
  • a corresponding selection of the particle size or the grading curve of solder balls in the solder paste can be used to define how far such a solder paste deposit can be compressed.
  • the gap thickness of the solder paste can thus be determined by appropriate selection of a specific solder paste.
  • a conductive adhesive offers only very little resistance to compressing the conductive adhesive in the adhesive gap between the circuit board and the contact pads of the electronic component, which is why when conductive adhesive is used, the adhesive gap is usually very thin during the assembly process.
  • the typically desired adhesive gap thickness of about 20 ⁇ m to 100 mhi is reduced during the assembly process using conductive adhesive, for example to a thickness of 0 ⁇ m to 10 ⁇ m.
  • the conductive adhesive is therefore usually pressed laterally beyond the actual adhesive point on the outside of the circuit board, which can lead to the desired short circuits on the underside of the mounted electronic component.
  • failures under thermal stress due to undesired cracking of the glue point can occur.
  • the present invention thus has the object of avoiding the disadvantages known from the prior art for circuit boards with surface-mounted electronic components of the type mentioned and to provide an improved circuit board in which even sensitive electronic components using conductive adhesive with a conventional assembler can be fitted without undesired short circuits of the electronic components and / or cracks forming in the adhesive points during fitting.
  • a plastic film with a foil thickness and with several recesses is arranged between the at least one electronic component and the outer side of the circuit board assigned to the component, the plastic film being attached to the outside of the circuit board and wherein the recesses in the plastic film are at least partially filled with conductive adhesive and these recesses are positioned at the set position of the component in such a way that with the conductive adhesive within a recess, a conductor track section on the outside of the circuit board with a contact pad on the underside of the at least one component is conductively connected.
  • the plastic film advantageously acts as a spacer during assembly and, depending on the selected film thickness, defines on the one hand the distance between the underside of the electronic component and the corresponding outside of the circuit board and, on the other hand, the height of the conductive adhesive layer within the recesses, i.e. the height of the adhesive gap during assembly.
  • Another advantage is that the plastic film acts as an insulator and thus offers additional protection against the desired contact errors and short circuits between the surface-mounted component and the circuit board.
  • the conductive adhesive used for example a silver conductive adhesive, is applied within the recesses of the plastic film.
  • the recesses thus serve as lateral boundaries comparable to templates for the conductive adhesive, which advantageously cannot run laterally, but rather ensures that the contact pads make contact with the corresponding conductor track sections of the circuit board within the recesses.
  • one or more electronic components can be surface-mounted on one outside or on both outside of a printed circuit board.
  • corresponding plastic films are then arranged as spacers on both outer sides of the circuit board.
  • the at least one electronic component can advantageously rest at least in sections with its underside on the outside of the plastic film.
  • the plastic film as a spacer helps to reduce the pressure force or assembly force by making the component flat with at least sections of it Underside rests on the plastic film.
  • the contact pads of the component are in the set position within the recesses provided for this in the plastic film. This offers the advantage that mechanical damage to the component or its contact pads as a result of the placement force can be avoided.
  • a filling level of the conductive adhesive within the recesses of the plastic film can expediently be less than or equal to the film thickness of the plastic film.
  • the fill level of the conductive adhesive within the recesses of the plastic film can be adapted to the type of electronic components to be assembled.
  • the fill level of the conductive adhesive within the recesses is expediently chosen so that it is the same as the film thickness of the plastic film or slightly greater than this and thus the fill level of the conductive adhesive protrudes slightly beyond the film thickness.
  • Such components are called lower Connection components (English: bottom termination components, short: BTC) and are also known under other names in the electronics industry such as QFN (Quad Flat No Feads Package) or EGA (Fand Grid Array).
  • QFN Quad Flat No Feads Package
  • EGA Fand Grid Array
  • the fill level of the adhesive within the recesses can be selected correspondingly lower than the film thickness of the plastic film, in order to still ensure fault-free electrical contact between the respective contact pad and the to ensure according to the Feiterbahnabêt assigned to the contact pad on the outside of the Feiterplatten.
  • the plastic film as a spacer with the corresponding recesses for receiving the adhesive, the flexibility in assembly is significantly increased and different types of electronic components with flat contact surfaces (BTCs) as well as components with contact pads that protrude from their underside can be used. can be mounted on the same PCB.
  • each contact pad of the at least one electronic component can be assigned its own recess in the plastic film.
  • 1: 1 assignment with each contact pad being assigned exactly its own recess in the plastic film, contact errors when fitting the components can be avoided particularly efficiently.
  • the plastic film in the case of a circuit board, can be glued to the outside of the circuit board, at least in sections, with an adhesive layer.
  • the plastic film has a softening temperature that is lower than the hardening temperature of the conductive adhesive.
  • a temperature treatment of the circuit board is required after assembly. If a plastic film is used, the softening temperature of which is lower than the hardening temperature, this offers the advantage that when the plastic film exceeds the softening temperature, the component can still be mechanically aligned before the conductive adhesive reaches the higher hardening temperature, and thus hardens the component is fixed in its set position.
  • plastic films are used whose softening temperature is somewhat below the hardening temperature of the conductive adhesive, but which do not yet melt when the hardening temperature of the conductive adhesive is reached. Because then an exact fixing of the component in its set position on the outside of the circuit board would no longer be guaranteed. However, in such an application, it may be necessary to ensure that the plastic film does not hermetically seal and enclose the component and the adhesive points between the contact pads and the conductor track sections, since the plastic film should not melt completely.
  • the plastic film can expediently have a softening temperature of 90 ° to 120 ° C. and the conductive adhesive a hardening temperature of 100 ° to 150 ° C.
  • polybutadiene-based polymers which have a softening temperature of about 100 ° to 120 ° C.
  • PBS polybutylene succinate
  • Usual conductive silver adhesives have curing temperatures of 100 ° to 150 ° C.
  • the plastic film in the case of a printed circuit board, can have a softening temperature that is greater than the hardening temperature of the conductive adhesive.
  • the curing temperature of common conductive silver adhesives is around 100 ° to 150 ° C.
  • Plastic films that only begin to soften at these temperatures are, for example, polycarbonate (PC) with a softening temperature of around 148 ° C or polymethyl methacrylate (PMMA), which has a glass temperature of around 105 ° C and can only be plastically deformed beyond 100 ° C becomes.
  • the plastic film can have a softening temperature of 140.degree. To 160.degree. C. and the conductive adhesive can have a curing temperature of 100.degree. To 150.degree.
  • PMMA whose melting point is 160 ° C, for example, only melts completely at temperatures above 160 ° C.
  • the heating profile for example as a two-stage heating profile with a first holding temperature at around 125 ° C and a subsequent, second holding temperature at 160 ° C, it can be ensured that the adhesive layer thickness of the conductive adhesive is first fixed at the lower holding temperature and the conductive adhesive is cured, before the plastic film then subsequently melts at the second, higher holding temperature and thus the conductive adhesive contact connections within the recesses of the plastic film are remelted and thereby sealed as hermetically as possible.
  • plastic film with a liner thickness wherein the plastic film can be fastened at least in sections to an outside of the circuit board in the area of the electronic component to be fitted;
  • the position of the recesses corresponding to the position of the contact pads of the electronic component to be fitted in its set position and the recesses are each complementary to a section of a conductor track on the outside of the circuit board;
  • conductive adhesive in the recesses of the attached plastic film the fillet height of the conductive adhesive within the recesses being selected to be less than or equal to the thickness of the blind; -f- Equipping an electronic component, the component being pressed with its underside in its set position on the plastic film so that the contact pads of the component come to lie in the area of the recesses and are contacted with the conductive adhesive, the component at least on its underside rests in sections on the plastic film.
  • a major advantage of the invention is that a plastic film is placed on the circuit board before the conductive adhesive is applied.
  • the contact pads are exposed in the form of recesses or openings or windows in the plastic film.
  • the thickness of the film should correspond approximately to the desired adhesive gap for electronic components with flat contact surfaces (BTCs).
  • step -d- the plastic film can be glued at least in sections to an outside of the printed circuit board with an adhesive layer.
  • the conductive adhesive can expediently be introduced into the recesses of the plastic film with a dispenser in step -e-.
  • a 3D topology of the contact surfaces of the corresponding electronic components can advantageously be implemented with a dispenser.
  • BTC components with contact surfaces that are essentially flat with the underside of these components will therefore require adhesive depots for secure contact, in which the filling level of the conductive adhesive corresponds to the film thickness of the plastic film or, if necessary, even slightly exceeds this film thickness without it a lateral running of the conductive adhesive over the contours of the plastic recesses also comes.
  • the fill level of the conductive adhesive thus essentially corresponds to the film thickness of the plastic film and can, if necessary, go for example by up to 10% over the film thickness.
  • the filling level of the conductive adhesive can be set slightly below the film thickness of the plastic film in order to nevertheless ensure that the contact pads are reliably contacted.
  • the volumes of conductive adhesive required in each case can advantageously be set individually. On the one hand, this has the advantage that overdosing of conductive adhesive can be avoided and the conductive adhesive does not pass over the recesses to the outside or top when the component is set, and undesirable short circuits occur on the underside of the surface-mounted components.
  • the exact dosage of the respectively required conductive adhesive deposits during dispensing the material consumption of conductive adhesive can be reduced, which offers advantages for reasons of cost as well as sustainability and resource conservation.
  • the conductive adhesive can be introduced into the recesses of the plastic film by a stencil printing process in step -e-, the recesses of the plastic film serving as templates.
  • a plastic film with a softening temperature that is lower than the hardening temperature of the conductive adhesive can advantageously be provided in the production method according to the invention, wherein after mounting (step -f-) in a subsequent heat treatment step -g- the mounted circuit board is up to the hardening temperature of the conductive adhesive is heated, the setting position of the electronic component being mechanically aligned after the softening temperature of the plastic film has been exceeded.
  • the plastic film is left on the circuit board or the circuit carrier after the conductive adhesive has been applied. The components are placed on the conductive adhesive and the plastic film.
  • the plastic film has a softening temperature which is below the hardening temperature of the conductive adhesive. If the assembly is heated to harden the adhesive or to solder soldering points that are also on the assembly, the plastic film softens, flows around the adhesive deposit and the component and thus forms an additional passivation of the adhesive point and fixation of the component.
  • step -b- a plastic film with a softening temperature that is higher than the hardening temperature of the conductive adhesive can be provided, wherein after the assembly (according to step -f-) in a subsequent heat treatment step -g'- the assembled circuit board is first heated to the hardening temperature of the conductive adhesive, and after the hardening of the conductive adhesive, the assembled circuit board is then heated to the softening temperature of the plastic film, optionally up to the melting temperature of the plastic film.
  • This embodiment variant offers the advantage that by adapting a suitable heating profile, depending on the plastic film material used, on the one hand an exact fixation of the component in its set position and, on the other hand, a subsequent complete remelting and sealing of the already hardened contact connections with the melted plastic material can be ensured.
  • the curing temperature of common conductive silver adhesives is around 100 ° to 150 ° C.
  • Plastic films that only begin to soften at these temperatures are, for example, polycarbonate (PC) with a softening temperature of around 148 ° C or polymethyl methacrylate (PMMA), which has a glass temperature of around 105 ° C and can only be plastically deformed beyond 100 ° C becomes.
  • FIG. 1A and 1B each show, in sectional views from the side, the assembly process known from the prior art of an electronic component on the outside of a printed circuit board;
  • FIGS. 2A and 2B each show, in sectional views from the side, the assembly process according to the invention of an electronic component on the outside of a circuit board using a plastic film as a spacer;
  • FIG. 3 shows, in an isometric view obliquely from above, a detail of the printed circuit board shown in FIG. 2A with a plastic film attached to its outside directly before it is fitted with an electronic component (not shown here).
  • FIGS. 1A and 1B each relate to an assembly process known from the prior art and each show in section a detail of a circuit board 10 in which an electronic component 20 with a assembler is mounted on its outer side 11 of the circuit board 10, which is here in the picture above .
  • the circuit board 10 is shown in a purely schematic manner and comprises on its outside 11 conductor tracks 12 which are applied to an insulation layer 13 below.
  • a substrate 15 is shown schematically under the insulation layer 13, wherein, depending on the application, the substrate 15 can have, for example, a plurality of a sequence of conductive and non-conductive, insulating layers.
  • the electronic component 20, which is also shown purely schematically, has a plurality of contact pads 25 on its underside 21, which here protrude downward at a height 26 from the underside 21 of the component 20.
  • FIG 1A shows the assembly process shortly before the electronic component 20 is placed on its set position 29 on the outside 11 of the printed circuit board 10.
  • sections of conductive adhesive 50 with a certain layer thickness are applied to the top or outside 11 of the circuit board 10 at the corresponding set positions 29 of the electronic component 20 or at the set positions 29 of its contact pads 25.
  • the electronic component 20 When fitting, for example, with an automatic fitting machine, the electronic component 20 is pressed with a certain fitting force 100, which is symbolized as an arrow 100, with its contact pads 25 in the respective setting position 29 onto the sections with conductive adhesive 50.
  • conductive adhesive 50 By means of conductive adhesive 50 conductive contacts are made between the corresponding Contact pads 25 of the electronic component 20 and the corresponding conductor tracks 12 of the circuit board 10 are produced.
  • the conductive adhesive 50 is squeezed out laterally under the contact pads 25 and is distributed in the gap between the underside 21 of the component 20 and the outside 11 of the circuit board 10 in such a way that undesirable Short-circuit formation is coming. This is shown schematically in FIG. 1B.
  • the layer thickness of the conductive adhesive 50 that is to say the adhesive gap thickness 55 of the conductive adhesive, can become too thin in the bonded state in order to ensure reliable contact.
  • the contact pads 25 can be damaged during fitting if too high a fitting force 100 is applied.
  • FIGS. 2A and 2B each show, in sectional views from the side, the assembly process according to the invention of an electronic component 20 on the outside 11 of a circuit board 10 using a plastic film 30 as a spacer.
  • the circuit board 10 is also shown purely schematically in FIGS. 2A and 2B and comprises conductor tracks 12 on its outside 11, which are applied to an insulation layer 13 below.
  • a substrate 15 is shown schematically under the insulation layer 13, wherein, depending on the application, the substrate 15 can have, for example, a plurality of a sequence of conductive and non-conductive, insulating layers.
  • Reinforced or unreinforced resins such as epoxy resin (for example FR-4, FR-5), Teflon, polyamide, or polyimide, cyanate ester and / or bismaleimide-triazine resin can be used as the insulation layer 13 or as the electrically insulating base material of the carrier for electrical connections can be used, alternatively or in addition, glasses and glass-like or reinforcing carrier materials (for example multilayer glass), as well as ceramics or metal oxides.
  • the electronic component 20 which is also shown purely schematically, has a plurality of contact pads 25 on its underside 21, which here protrude downward at a height 26 from the underside 21 of the component 20.
  • any active electronic component such as an electronic chip, in particular a semiconductor chip
  • any passive electronic component such as a capacitor, a resistor, an inductance or a magnetic element such as a ferrite core
  • the electronic component 20 can be used as the electronic component 20 become.
  • Examples of such electronic components can be a data memory such as a DRAM (or any other memory), a filter (which can be configured as a high-pass filter, a low-pass filter or a band-pass filter, for example, and which can be used for frequency filtering, for example) integrated circuit (such as a logic IC), a signal processing component (such as a microprocessor), a power management component, an opto-electrical interface element (such as an optoelectronic component), a voltage converter (such as a DC / DC converter or an AC / DC converter), an electromechanical converter (eg a PZT (lead zirconate titanate) sensor and / or actuator), a transmitting and / or receiving unit for electromagnetic waves (e.g.
  • a data memory such as a DRAM (or any other memory)
  • a filter which can be configured as a high-pass filter, a low-pass filter or a band-pass filter, for example, and which can be used for frequency filtering, for example
  • an RFID chip or transponder a cryptographic component
  • a capacitance for example, a capacitance
  • an inductance Switches for example, a transistor-based switch
  • Such an electronic component can also be or have a microelectromechanical system (MEMS), a battery, a camera or an antenna.
  • MEMS microelectromechanical system
  • FIG 2A shows the assembly process shortly before the electronic component 20 is placed on its set position 29 on the outside 11 of the printed circuit board 10.
  • FIG. 2B shows the assembly process with the electronic component 20 already attached.
  • a plastic film 30 with a film thickness 31 and with recesses 32 is fastened to the outside 11 of the circuit board 10 in FIGS. 2A and 2B.
  • the plastic film 30 is glued to the outside 11 with an adhesive layer 40 in each case.
  • the plastic film 30 lies flat on the outside 11 of the circuit board 10 and serves as a spacer for the electronic components 20 to be fitted.
  • the recesses 32 are positioned in the plastic film 30 in such a way that, on the one hand, they exactly match the set positions of the contact pads 25 of the respective component 20 and on the other hand expose that conductor track section 12 of the circuit board 10 which is assigned to a specific contact pad 25.
  • the recesses 32 with their film thickness 31 act as upwardly open containers for receiving conductive adhesive 50, which is filled into the recesses 32 with a filling level 51 of the conductive adhesive 50 up to the film thickness 31 or slightly above, depending on the geometry of the contact pads.
  • the precisely required amount of conductive adhesive 50 can advantageously be filled into the recesses by means of a dispenser. This is illustrated in Figure 2A.
  • the component 20 is pressed with an assembly force 100 onto the corresponding setting position 29 on the circuit board 11.
  • the plastic film 30 now advantageously serves as a spacer and the component 20 rests on its underside 21 at least in sections on the plastic film 30.
  • the contact pads 25 of the component 20 cannot be damaged during assembly, since they hit the already prepared conductive adhesive depot in the area of the recesses 32.
  • plastic film 30 as a spacer according to the invention not only prevents short circuits below the surface-mounted electronic components 20, but sensitive components 20 can also be assembled with automatic assemblers without mechanical damage to components 20 and their contact pads 25 and / or the underlying conductor track sections 12 on the circuit board 10.
  • FIG. 2B it can be seen on the fully assembled component 20 that it rests on its underside 21 on the plastic film 30.
  • an adhesive gap thickness 55 is established within the recesses 32, which corresponds essentially to the film thickness 31 of the plastic film 30 minus the height 26 of the respective contact pads 26 on the underside 21 of the component 20.
  • FIG. 3 shows diagonally from above a detail of the printed circuit board 10 shown in FIG. 2A with a plastic film 30 fastened on its outside directly before it is fitted with an electronic component not shown here for the sake of clarity.
  • the two recesses 32 in the plastic film 30 are here filled with conductive adhesive 50 in accordance with their film thickness 31.
  • the filling level 51 of the conductive adhesive 50 here essentially corresponds to the film thickness 31.
  • These contact points are thus prepared for fitting with a BTC component (bottom termination component) in which the contact pads on the underside of the component are essentially flat with the underside .
  • the BTC component then advantageously rests on its underside at least between the two recesses 32 filled with conductive adhesive 50 on the plastic film 30. This serves as a spacer, which is why a lateral squeezing out of the conductive adhesive 50 from the recesses 32 can be reliably prevented.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

L'invention concerne une carte de circuit imprimé (10), comprenant au moins un composant électronique (20) monté sur un côté extérieur (11) de la carte de circuit imprimé (10). Un film plastique (30), ayant une épaisseur de film (31) et présentant une pluralité d'ouvertures (32), est disposé entre le ou les composants électroniques (20) et le côté extérieur (11) de la carte de circuit imprimé (10) qui est attribué au composant (20). Ce film plastique (30) est fixé sur le côté extérieur (11) de la carte de circuit imprimé (10). Les ouvertures (32) ménagées dans le film plastique (30) sont au moins partiellement remplies d'un adhésif conducteur (50) et lesdites ouvertures (32) sont positionnées au niveau de la position de mise en place (29) du composant (x) de telle sorte qu'une partie de piste conductrice (12) sur le côté extérieur (11) de la carte de circuit imprimé (10) est reliée de manière conductrice à un plot de contact (25) sur le côté inférieur (21) du ou des composants (20) au moyen de l'adhésif conducteur (50) à l'intérieur d'une ouverture (32). L'invention concerne en outre un procédé de production d'une carte de circuit imprimé (10) de ce type.
EP20820456.0A 2019-12-20 2020-12-14 Carte de circuit imprimé présentant un composant électronique monté en surface et procédé de fabrication de ladite carte de circuit imprimé Pending EP4079114A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP19218479.4A EP3840549A1 (fr) 2019-12-20 2019-12-20 Carte de circuit imprimé dotée d'un composant électronique monté en surface et son procédé de fabrication
PCT/EP2020/085927 WO2021122428A1 (fr) 2019-12-20 2020-12-14 Carte de circuit imprimé présentant un composant électronique monté en surface et procédé de fabrication de ladite carte de circuit imprimé

Publications (1)

Publication Number Publication Date
EP4079114A1 true EP4079114A1 (fr) 2022-10-26

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Family Applications (2)

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EP19218479.4A Withdrawn EP3840549A1 (fr) 2019-12-20 2019-12-20 Carte de circuit imprimé dotée d'un composant électronique monté en surface et son procédé de fabrication
EP20820456.0A Pending EP4079114A1 (fr) 2019-12-20 2020-12-14 Carte de circuit imprimé présentant un composant électronique monté en surface et procédé de fabrication de ladite carte de circuit imprimé

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP19218479.4A Withdrawn EP3840549A1 (fr) 2019-12-20 2019-12-20 Carte de circuit imprimé dotée d'un composant électronique monté en surface et son procédé de fabrication

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Country Link
EP (2) EP3840549A1 (fr)
CN (1) CN218388141U (fr)
WO (1) WO2021122428A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021130128A1 (de) 2021-11-18 2023-05-25 Endress+Hauser SE+Co. KG Baugruppe für eine Verbindung mindestens eines Bauteils mit einer Leiterplatte

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134873A (ja) * 2000-10-24 2002-05-10 Nippon Dempa Kogyo Co Ltd チップ素子の実装方法及び表面実装用の水晶発振器
DE102017102999A1 (de) * 2017-02-15 2018-08-16 Endress+Hauser SE+Co. KG Leiterplatte und Verfahren zur deren Herstellung

Also Published As

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WO2021122428A1 (fr) 2021-06-24
EP3840549A1 (fr) 2021-06-23
CN218388141U (zh) 2023-01-24

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