Classifications

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Definitions

• the present invention relates to techniques for producing glued assemblies.
• Fixing or connection solutions by gluing make it possible to remedy these drawbacks.
• such fixings or connections by gluing are vulnerable to significant mechanical stresses.
• stress concentrations or edge effects appear in particular at the periphery of the adhesive layer which can damage the fixing or the connection.
• the assembly of two substrates bonded with an adhesive can be subjected to external forces, in particular causing differential deformations between the substrates.
• the adhesive should generally perform at least two functions:
• FIG. 1A an example of a conventional adhesive bonded ACC assembly has been illustrated comprising a first substrate S1 and a second substrate S2, which substrates are secured by means of a conventional adhesive ADC.
• a and B marks are shown at the corners of the ADC adhesive to see an example of the deformation undergone by the adhesive below.
• FIG. 1B illustrates an example of a sectional view of the adhesive assembly ACC when the latter is subjected to deformation forces F (for example opposite forces applied respectively to the substrates S1 and S2).
• F deformation forces
• ADC adhesive deforms under the influence of stresses imposed by F forces. The most pronounced deformations usually occur at the edges of ADC adhesive.
• FIG. 1 C there is shown an example of the evolution of the shear stresses t, inherent to the forces F applied, undergone by the ADC adhesive between the marks A and B. Due to the application of the forces F, the ADC adhesive also undergoes peel stresses o between the marks A and B as shown in FIG. 1 C.
• the differential displacements of the substrates S1 and S2 generate shear and peel stresses which are high in particular in the region of the edges of the ADC adhesive.
• the ADC adhesive is little, or in some cases not at all, constrained in a central zone between the marks A and B.
• the forces are mainly transmitted from one substrate to another by the edge regions.
• Figures 2A to 2C illustrate by way of example the first substrate S1 whose role is to reinforce the second substrate S2 which may be a structural part. It should be noted that when the second substrate S2 is subjected to deformations under the stress of forces F for example (produced by deformations of the structure typically), the adhesive at least partially absorbs the differential deformations, generating stresses of high shear t and peel o at the edges of the adhesive (at marks A and B and their vicinity).
• a solution can consist in increasing the adhesion surface of the adhesive with that of the substrates, more particularly by lengthening the length of this surface ( i.e. increasing the distance between marks A and B). Indeed, with such an increase in the adhesion surface of the adhesive with that of the substrates, the mechanical capacities of the glued assembly are improved, at least up to a certain limit.
• Figure 3 is illustrated a graphical representation of the force F necessary to obtain a rupture of the adhesive, and this as a function of the length L of the contact surface of the adhesive with the substrates (i.e. i.e. length separating marks A and B). It should be noted that the force F applied to the break increases linearly up to a limit value F m corresponding to a limit length Lmax from which the force applied for a break is substantially identical.
• the adhesive when the adhesive is installed between a structure and a reinforcing element of the structure, it is appropriate to perform the operation of adding excess adhesive on site, which can be restrictive, or even impossible, due to external conditions or the configuration of the structure.
• an adhesive to perform the aforementioned functions (adhesion to substrates and absorption of deformations) may turn out to be antagonistic. Indeed, it is generally observed that the more flexible an adhesive is (ie better absorption capacity), the more the adhesion capacities are reduced. Conversely, the stiffest adhesives provide the best adhesion capacities, but are more sensitive to deformation stresses.
• the present invention improves the situation.
• the invention relates to a glued assembly comprising at least:
• the intermediate deformation layer secured to the first substrate, the intermediate deformation layer comprising a material in which recesses are provided so that the intermediate deformation layer has a stiffness which is variable in a direction parallel to the intermediate deformation layer,
• variable stiffness provides the intermediate layer and adhesive assembly with deformation absorption capacities which may vary in parallel with the first substrate. These variations in stiffness make it possible to locally control the level of deformation, and therefore the stresses.
• the deformation behavior can in particular be controlled so as to distribute shear and peel stresses more evenly, which are usually localized in the vicinity of the edges of the adhesive (as explained above).
• the local deformations are effectively absorbed by the intermediate deformation layer whose stiffness (the reverse of flexibility) is controlled, the edges of the adhesive then being less exposed to the stresses generated by external forces applied to glued assembly.
• the edge effects and more generally the stress concentrations in the intermediate deformation layer, in the adhesive as well as on the surface of the substrates can be significantly reduced, correspondingly increasing the strength and integrity capacities of the adhesive. , and reinforcing the bonding of the substrates and the structural capacities of the glued assembly.
• the force necessary to obtain a rupture is therefore much higher than in the state of the art. It will be understood that the bonded assembly is thus less vulnerable to deformation forces which are absorbed or distributed along the intermediate deformation layer.
• the object of the present invention is to maintain good deformability without compromising the adhesive function by selecting high performance and stiff adhesives.
• the deformation behavior of the intermediate deformation layer can be controlled so as to reduce the stresses transmitted between the intermediate deformation layer and the substrate at these areas (for example by reducing the stiffness of the intermediate deformation layer which faces the weak or highly stressed area).
• the control of the deformation behavior which takes place by varying the stiffness of the intermediate deformation layer in a direction parallel to the latter is obtained by means of recesses located in the intermediate deformation layer.
• the intermediate deformation layer is made from a single material and recesses are provided in the mass of the material forming the intermediate deformation layer.
• the recesses are configured to give the intermediate deformation layer a stiffness which is variable in a direction parallel to the intermediate deformation layer.
• the stiffness that is to say the macroscopic stiffness
• the microscopic stiffness Young's modulus
• the CID can be entirely formed of a material having such a Young's modulus value.
• the intermediate deformation layer nevertheless retains a good ability to deform without compromising the adhesive function.
• the value of Young's modulus of the material can be similar to a value of Young's modulus of the adhesive.
• adhesive affinity is meant a good compatibility between two materials resulting in good mechanical strength and, in the ultimate state, a cohesive rupture, that is to say a rupture of one of the two materials involved (CID , Adhesive) and not a rupture at the interface between the adhesive and the CID.
• CID Adhesive
• shape of the recesses it is understood the geometry thereof, the recesses form microstructures within the intermediate deformation layer.
• density of the recesses or density of the microstructures is meant the number of recesses or microstructures per unit area or volume of the intermediate deformation layer.
• the intermediate deformation layer comprises perforated volumes.
• the openwork volumes can give way to residual elements forming microstructures.
• stiffness which is variable in a direction parallel to the intermediate deformation layer
• stiffness varies along the substrate, that is to say that the stiffness of the intermediate deformation layer (CID ) at points located in a (possibly planar) surface substantially parallel to the CID varies in that surface.
• the parallel surfaces considered are, for example, all the surfaces included between the two faces of the CID and parallel to one of them. In other words, the stiffness is variable from one portion of the intermediate deformation layer to another portion, the two portions being distributed longitudinally.
• stiffness is meant the stiffness in one or more directions, for example, the stiffness in a direction of vector (z) to the intermediate deformation layer or the stiffness in a direction parallel to the intermediate deformation layer, for example the direction of vector (x) or vector (y) or even according to a linear combination of vector (x) and vector (y) ((vector (x), vector (y), vector (z)) forming a reference of l 'space and (vector (x), vector (y)) forming a coordinate system of the surface parallel to the intermediate deformation layer, the vector (z) being optionally orthogonal to the coordinate system (vector (x), vector (y)), with vector (u) the notation designating).
• the stiffness at a point (x, y) of the surface parallel to the CID can be represented by the triplet (Rvector (x) (x, y); Rvector (y) (x, y); R vector (z) (x, y)), where Rvector (x) (x, y) represents the value of the stiffness in the direction of vector (x) at the point (x, y), Rvector (y) (x, y) represents the value of the stiffness in the direction of vector (y) at point (x, y) and Rvector (z) (x, y) represents the value at point (x, y) of the stiffness in the direction of vector (z) which is optionally orthogonal to the intermediate strain layer.
• stiffness which is variable in a direction parallel to the intermediate deformation layer it may for example be the stiffness Rvector (z) (x, y) in the direction of vector (z) at the intermediate layer of deformation which is variable and / or of the stiffnesses Rvector (x) (x, y) and / or Rvector (y) (x, y) in the directions parallel to the intermediate deformation layer.
• the edge effects are particularly attenuated when the stiffness Rvector (z) (x, y) is reduced in the direction of vector (z) (which may be orthogonal to the intermediate deformation layer) at the edges of the intermediate deformation layer.
• the forces on the weakened areas or subjected to significant stresses are particularly attenuated when the stiffness of the intermediate deformation layer facing the zones is reduced in the same direction as those of the forces generating these forces.
• the substrate and the intermediate deformation layer are joined to each other so as to form an inseparable whole, this can be obtained with adhesives, but it is also possible to form the intermediate deformation layer directly on the substrate with which it becomes integral.
• a first face of the intermediate deformation layer and / or a second face of the intermediate deformation layer respectively have complementary shapes to the surface of the first substrate and / or of the second substrate.
• the intermediate deformation layer is complementary to the surfaces of the substrates, the intermediate deformation layer matches the surfaces of the substrates better, creating a uniform and almost constant adhesive layer thickness between the intermediate deformation layer and the substrates.
• the microstructures formed by the recesses can be elongated elements connecting the two faces of the intermediate deformation layer.
• the intermediate deformation layer can comprise two outer layers forming the two faces of the intermediate deformation layer.
• Elongated elements connect the two outer layers.
• the set of the two outer layers and the elongated elements thus form the intermediate deformation layer.
• the elongated elements form spacers between the two outer layers.
• the elongated elements can have constant or variable sections and the sections can be circular, triangular, rectangular or any other shape.
• the outer layers which are made of the intermediate strain layer material can be continuous, in order to adhere more strongly to each substrate.
• the use of elongated shapes makes it possible to create a structure having the desired mechanical characteristics, namely that the intermediate deformation layer has a stiffness in at least one direction which is suitable and varies in a direction parallel to the layer. intermediate deformation.
• the stiffness of the intermediate deformation layer in one direction can be adapted by adapting the sections of the elongated elements and / or the spacings between the elongated elements and / or the directions of the elongated elements.
• the stiffness in one direction can be increased by orienting the elongated elements in this same direction.
• the adaptation of the elongated elements makes it possible to adapt the stiffness in one direction regardless of the level of stiffness in another direction.
• the elongated elements can form a lattice or mesh structure.
• a lattice structure makes it possible in particular to adapt the stiffness as a function of the direction. Thus, it is easier in a trellis structure to adapt a stiffness in a weak direction and to maintain a high stiffness in another direction (for example a low Rvector (z) value and a high Rvector (x) value).
• the elongated elements can be aligned in a direction orthogonal to the intermediate deformation layer, for example, arranged in a comb.
• Such a structure of the intermediate deformation layer makes it possible to adapt the stiffness Rvector (z) in the direction orthogonal to the intermediate deformation layer while maintaining a low stiffness in the direction parallel to the intermediate deformation layer.
• the Rvector stiffness (z) in the orthogonal direction can easily be reduced (respectively increased), for example by reducing (respectively increasing) the section of the elongated elements or by spacing (respectively narrowing) the elongated elements.
• the recesses provided are not compartmentalized from each other.
• non-compartmentalized is meant that the recesses do not form a compartment and are therefore open.
• fluid flow is made possible between the recesses of the intermediate straining layer and the exterior of the intermediate straining layer, at least before it is secured to the first and second substrates. This allows when photopolymerization type 3D printing techniques are used to fabricate the strainer interlayer to drain the uncured liquid polymer contained in the strainer interlayer at the end of printing.
• the intermediate deformation layer is formed of a material which is homogeneous in composition.
• a material which may be, for example, of the type:
• the material can be:
• an adhesion primer or an interface layer may be used between the intermediate deformation layer and the adhesive.
• the first substrate is a reinforcing part suitable for reinforcing the second substrate.
• the term “reinforcing part” is understood to mean a part providing structural and / or mechanical reinforcement of the second substrate.
• the first substrate is integral with an attachment means.
• a mechanical connector is secured to the substrate (it can for example be glued to the latter).
• the stiffness of the intermediate layer varies gradually. This makes it possible to reduce the stress concentrations which appear at the level of the zones of excessively sudden transition of the stiffness within the zone concerned, involving at the same time, adhesive, intermediate deformation layer and substrate. In fact, in these transition zones, phenomena similar to those of edge effects appear between the parts of high stiffness and the parts of low stiffness. In addition, this ensures good control of the deformation and absorption behavior of the intermediate deformation layer, over its entire length.
• the intermediate layer comprises a portion disposed at the edge of the intermediate layer and having, in one direction, a lower stiffness than the stiffness in the direction of another. portion of the middle layer. That is, the stiffness of the intermediate deformation layer is lower at the periphery of the intermediate deformation layer.
• This lower stiffness at the periphery or in the portion arranged at the edge of the intermediate deformation layer is obtained by means of recesses suitably arranged in the intermediate deformation layer: for example, by increasing the density of the recesses at the periphery or in the portion arranged at the edge. It is also possible to obtain a lower stiffness in these same portions of the intermediate deformation layer by increasing the size of the recesses or even by adapting the shape of the recesses.
• the shape of the edge can also be adapted to progressively reduce the stiffness at the periphery of the intermediate deformation layer, for example with an edge of the intermediate deformation layer bevelled or in the shape of a nose.
• the peripheral stiffness can be reduced for all directions (Rvector (x), Rvector (y), Rvector (z)) or mainly in one direction.
• Rvector (x), Rvector (y), Rvector (z) or mainly in one direction.
• stiffness Rvector (z) in a direction of vector (z) (which can be orthogonal or mainly orthogonal to the intermediate deformation layer) when the bonded assembly works mainly in tension.
• the stiffness can optionally be reduced locally at the precise location where the tensile force is applied.
• portion of the intermediate deformation layer is meant a localized part of the intermediate deformation layer for which a desired level of stiffness has been assigned during manufacture.
• edge of the intermediate deformation layer or in an equivalent manner the edge of the intermediate deformation layer, it is meant the peripheral zone of the intermediate deformation layer.
• the portion disposed at the edge may for example be the part of the intermediate deformation layer located at a distance less than a threshold (for example 10mm) from the edge; the other portion of the intermediate deformation layer being for example a portion located at a distance greater than the threshold of the edge.
• the intermediate deformation layer comprises a portion covering a zone of weakness of the second substrate and / or a crack of the second substrate, said portion of the intermediate deformation layer having, in one direction, a stiffness lower than a stiffness in said direction of another portion of the intermediate deformation layer. That is to say, the stiffness of the intermediate deformation layer is lower at the level of the portion covering the zone of weakness or the crack. This lower stiffness of the intermediate strain layer at the portion covering the area of weakness or the crack of the intermediate strain layer is achieved by means of recesses suitably disposed in the intermediate strain layer.
• the stiffness of this portion can be reduced for all directions (Rvector (x), Rvector (y), Rvector (z)) or mainly in one direction.
• region of weakness of the substrate or area of high stress of the substrate it is meant any area where the substrate presents risks of rupture or crack, either because of its structure or because of the forces which are applied to it.
• the mechanical resistance in traction and / or in shear of the intermediate deformation layer is less than a mechanical resistance of at least one of the first substrate and the second substrate. This resistance can be determined in a preliminary step.
• a gap between the substrates comprises, around the intermediate layer, a seal arranged so as to be compressed by the substrates held relative to each other by means of the adhesive.
• the compressed gasket isolates the entire intermediate layer and adhesive from the environment surrounding the bonded assembly. This isolation provided by the seal keeps this assembly in conditions of use that ensure good durability. It is thus possible to choose the material of the intermediate layer and of the adhesive as a function of the desired properties and of the compositions of the substrates to be maintained with respect to one another, while being confident in the effective and lasting obtaining of these. properties.
• the invention relates to a method of manufacturing an element of a glued assembly, the method comprising:
• an intermediate deformation layer comprising a material, said formation of the intermediate deformation layer being carried out so in obtaining recesses in the material so that the intermediate deformation layer has a stiffness which is variable in a direction parallel to the intermediate deformation layer;
• the intermediate deformation layer is formed on a support consisting of one of the aforementioned substrates.
• the formation of the intermediate layer is carried out by an additive manufacturing technique.
• additive manufacturing technique is meant the techniques defined as such by ASTM.
• Additive manufacturing is also called 3D printing.
• the additive manufacturing techniques which can in particular be used are:
• the method further comprises:
• the data relating to a shape of a surface of the substrate characterize the surface of the substrate and more precisely its relief. Obtaining a surface of the CID of a shape complementary to the shape of the surface of the second substrate is achieved by means of these data relating to the shape of the surface of the second substrate.
• the invention relates to a method of manufacturing a glued assembly comprising the manufacture of an element of a glued assembly according to one of the methods as described above, the method further comprising the bonding of the intermediate deformation layer to the second substrate by means of an adhesive.
• the bonding of the intermediate deformation layer to the second substrate by means of the adhesive is carried out so that said surface of the intermediate deformation layer is secured to the surface of the second substrate in a complementary manner .
• the invention relates to a method for reinforcing a structure comprising at least one substrate to be reinforced, the method comprising:
• an intermediate layer comprising a material in which recesses are provided so that the intermediate deformation layer has a stiffness which is variable in a direction parallel to the intermediate deformation layer
• FIG. 1A] to [Fig. 1C] illustrate examples of typical embodiments of a glued assembly, and represent the deformations and shear stresses conventionally undergone by the adhesive, in particular at its edges.
• FIG. 2A] to [Fig. 2C] illustrate examples of embodiments of a reinforcing element bonded to a structure, generating deformations and stresses similar to the examples of FIGS. 1A to 1C.
• FIG. 3 shows the evolution, as a function of the overlapping length of two substrates of the adhesive bonding interface, of the ultimate force to be applied to achieve a rupture of the conventional bonded joint adhesive.
• FIG. 4A] to [Fig. 4B] illustrate examples of a bonded assembly according to the invention.
• FIG. 5A] to [Fig. 5G] illustrate examples of an intermediate deformation layer according to the invention.
• FIG. 6 illustrates a method of manufacturing an AC according to the invention.
• FIGS. 4A and 4B are illustrated examples of an AC bonded assembly according to the invention.
• the assembly includes a first substrate S1 and a second substrate S2.
• a mechanical connector (CM) is secured to the first substrate S1, the second substrate may be a wall.
• the glued assembly (AC) forms an attachment means on the wall.
• the first substrate S1 is a reinforcing element intended to repair, protect and / or reinforce a structure comprising the second substrate S2.
• the reinforcing element can take the form of a rigid plate superimposed on a wall of the structure, typically a metal plate, composite or any other material of sufficient rigidity to reinforce the structure. This reinforcement can in particular be used to reinforce:
• the AC assembly comprises an intermediate deformation layer, CID, called “deformation”, and an AD adhesive.
• the adhesive AD is placed between the substrates S1 and S2 and it is intended to make them integral with one another via the CID.
• the CID comprises a first connection interface INT1 with the substrate S1, and a second connection interface INT2 with the adhesive AD.
• the CID has varying stiffness along the INT1 and INT2 interfaces.
• CID and AD adhesive can be made from the same material.
• CID may have a Young's modulus, close to that of AD adhesive.
• the material used for the CID can in particular be chosen from the following list of polymers:
• the stiffness Rvector (v) (xi, yi) of the CID at a point (xi; yi) thereof according to vector (v), expresses the relation of proportionality between the force F applied at this point and according to the same direction as that of vector (v) and the resulting deflection at this point.
• the vector (v) is perpendicular to the CID one speaks of stiffness in traction and compression
• the vector (v) is parallel to the CID one speaks of stiffness in shear. This is expressed in newtons per meter (N / m).
• AD adhesive can be relatively rigid and has good adhesion capacities:
• the intermediate deformation layer CID makes it possible to improve:
• variable stiffness CID allows in this case to obtain a controlled behavior which more evenly distributes the shear and peel stresses generated by external forces applied to the bonded assembly AC.
• the desired value of the stiffness of the CID along a direction and the variation of the stiffness along the CID are obtained via recesses within the layer, as specified previously.
• Rvector (v) (xi, yi) at the point (xi, yi) it is, for example, possible to:
• a portion P1 disposed at the edge of the CID is shown.
• This portion has a lower level of stiffness of the CID than that of the portion P2 disposed in a central part of the CID.
• the portion P1 can be for example the peripheral part of the CID, namely the part representing the 20% of the CID furthest at the edge in the longitudinal direction. More specifically, the edge effects are greatly reduced when we reduce in P1:
• FIG. 4B there is shown a portion P3 disposed at a region of weakness of the CID, namely a crack in the wall.
• the portion P3 of the CID has a lower level of stiffness than that of the portion P2.
• the transfer of stresses between the first substrate (S1) and the second substrate (S2) in the vicinity of the crack is greatly reduced when the stiffness in P3 is reduced according to the direction or directions in which the stresses are applied at the level of P3 (namely along the direction perpendicular to the CID if the stresses are peel stresses and / or along one or more longitudinal directions if the stresses are shear stresses).
• FIG. 4A relates to a mechanical connector and that of FIG. 4B relates to a reinforcement
• the CID described in FIG. 4A can also include a portion P3 as described in FIG. 4B when the second substrate (S2) shows areas of weakness.
• the CID described in Figure 4B may also include a portion P1 as described in Figure 4A when the glued assembly (AC) is subjected to high stresses resulting in edge effects.
• FIGS. 5A to 5G in which embodiments of the intermediate deformation layer (CID) with variable stiffness have been shown. All of these CIDs can be used both in the embodiment of Figure 4A and that of Figure 4B.
• Figure 5A is a sectional view of the CID shown in Figure 5B.
• the CID comprises a first outer layer CEx1 which is secured to the first substrate S1, and a second layer CEx2 which is secured to the second substrate S2 via the adhesive AD.
• Microstructures, MS connect the two outer layers CEx1 and CEx2.
• the MS form spacers between the two outer layers CEx1 and CEx2.
• the recesses, EV are the spaces not occupied by the MS between the CEx1 and CEx2 of the CID.
• Each CID, and in particular its stiffness and the variation thereof in the plane of the CID, are characterized by the material used to form the CID and the structure formed by the MS or, in an equivalent manner, the structure formed by the recesses.
• the MS of Figures 5A and 5B are elongated elements of rectangular section.
• the MS form a lattice.
• the stiffness of the CID can be adapted to obtain the desired properties as described in FIGS. 4A and 4B. For example, to reduce the stiffness at the edge of the CID in all directions:
• the MS at the edge of the layer may have a thinner section than the MS at the heart of the CID, for example MS2;
• the MS which are not located at the edge of the CID, for example MS2, can also be adapted in the same way to vary the stiffness, in particular in the case where the second substrate S2 exhibits areas of weakness, for example at the level of MS2.
• Such a trellis structure of the MS makes it possible to adapt the stiffness in the direction orthogonal to the CID and the stiffness in a direction parallel to the CID without being constrained with respect to each other.
• the MS of Figures 5C and 5D are elongated elements of rectangular section.
• the MS are substantially aligned in the direction orthogonal to the CID.
• the stiffness of the CID can be adapted to obtain the desired properties as described in FIGS. 4A and 4B. For example, to reduce the stiffness at the edge of the CID in all directions:
• the MS at the edge of the layer may have a thinner section than the MS at the heart of the CID, for example MS4;
• the MS which are not located at the edge of the CID, for example MS4, can also be adapted in the same way to vary the stiffness, in particular in the case where the second substrate S2 would have areas of weakness for example. at the level of MS4.
• the MS of FIG. 5E are elements of elongated shape and of rectangular section.
• the embodiment of Figure 5E combines MS substantially aligned in the direction orthogonal to the CID and MS tilted to CEx1 and CEx2.
• the stiffness of the CID of FIG. 5E can be adapted to obtain the desired properties as described in FIGS. 4A and 4B. [0125] For example, to reduce the stiffness at the edge of the CID in all directions:
• the MS at the edge of the layer for example MS5
• the MS which are not located at the edge of the CID, for example MS6, can also be adapted in the same way to vary the stiffness, in particular in the case where the second substrate S2 would present areas of weakness for example. at MS6.
• FIG. 5F is an alternative to the embodiment of Figure 5D, where the MS are elongated elements aligned in the direction orthogonal to the CID. However, here, the MS are of circular section.
• the MS are free-form allowing great adaptability of the stiffness within the CID. These free forms can be obtained by numerical simulation.
• the thickness of the CID is for example between 2 and 20mm.
• the material of the CID namely the CEx1 and CEx2 as well as the MS are in a material which is homogeneous in composition with a Young's modulus value of between 1000 and 5000 MPa.
• the CID can be the same material as the adhesive or have a Young's modulus comparable to that of the AD adhesive. This homogeneity of stiffness between the CID and the adhesive ensures good adhesion conditions between the CID and the AD adhesive.
• a first step ST1 data relating to the shape of the surface of the second substrate are obtained.
• the second substrate S2 is scanned by means of a 3D laser or structured light scanner, or even by photogrammetry.
• the CID is formed.
• the stiffness thereof is obtained by an appropriate arrangement of the MS as previously described.
• the CID can in particular be formed by an additive manufacturing technique, for example by photopolymerization. As the recesses do not form a partition, it is possible to extract the non-solidified polymer.
• the CEx2 is formed so that its surface forming the outer face of the CID is complementary with the second substrate S2.
• the CID is made integral (for example by means of an adhesive) with the first substrate (this joining can be carried out in the factory). This step is not performed when the CID is formed directly on the first substrate.
• the assembly formed by the CID and the first substrate S1 is bonded to the second substrate S2 by means of the adhesive AD.
• the second substrate S2 is prepared beforehand (cleaning, surfacing, etc.).
• a dab of adhesive is placed on the CID, more precisely on the INT2 securing interface.
• the CID is then positioned facing the second substrate S2 so that the surfaces face each other in a complementary fashion.
• the assembly made up of the first substrate S1, the CID and the adhesive nut is translated onto the second substrate S2 and held in position during the exposure time.
• a fifth step ST5 in the case where the bonded assembly AC forms an attachment means on the wall, an item of equipment can be attached to the bonded assembly AC via the mechanical connector, for example by bolting.
• the present invention is not limited to the embodiments described above by way of example and they extend to other variants.
• the layers making up the intermediate deformation layer may for example comprise a chamfered profile in which cells are also provided.
• Such an embodiment of the glued assembly can in particular make it possible to refine the control of the deformation behavior of the adhesive, in particular at the edges.

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• 2019
  • 2019-12-17 FR FR1914681A patent/FR3104488B1/fr active Active
• 2020
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