EP4051720A1 - KATIONISCH FEUCHTEINDUZIERT HÄRTBARE MASSE, VERWENDUNG DER MASSE SOWIE VERFAHREN ZUM FÜGEN, VERGIEßEN UND BESCHICHTEN VON SUBSTRATEN - Google Patents
KATIONISCH FEUCHTEINDUZIERT HÄRTBARE MASSE, VERWENDUNG DER MASSE SOWIE VERFAHREN ZUM FÜGEN, VERGIEßEN UND BESCHICHTEN VON SUBSTRATENInfo
- Publication number
- EP4051720A1 EP4051720A1 EP20789573.1A EP20789573A EP4051720A1 EP 4051720 A1 EP4051720 A1 EP 4051720A1 EP 20789573 A EP20789573 A EP 20789573A EP 4051720 A1 EP4051720 A1 EP 4051720A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- mass
- moisture
- composition
- weight
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 129
- 239000000758 substrate Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000000576 coating method Methods 0.000 title claims abstract description 17
- 239000011248 coating agent Substances 0.000 title claims abstract description 16
- 238000005304 joining Methods 0.000 title claims description 13
- 239000003999 initiator Substances 0.000 claims abstract description 32
- -1 aliphatic epoxide Chemical class 0.000 claims abstract description 18
- 238000010538 cationic polymerization reaction Methods 0.000 claims abstract description 17
- 230000007062 hydrolysis Effects 0.000 claims abstract description 8
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 8
- 238000000465 moulding Methods 0.000 claims abstract description 6
- 150000001875 compounds Chemical class 0.000 claims description 90
- 125000001931 aliphatic group Chemical group 0.000 claims description 28
- 239000002253 acid Substances 0.000 claims description 26
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 150000002118 epoxides Chemical class 0.000 claims description 13
- 239000000654 additive Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 12
- 238000010526 radical polymerization reaction Methods 0.000 claims description 12
- 230000005855 radiation Effects 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 150000003839 salts Chemical class 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000004382 potting Methods 0.000 claims description 7
- 150000001298 alcohols Chemical class 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 5
- 150000001450 anions Chemical class 0.000 claims description 4
- 150000002921 oxetanes Chemical class 0.000 claims description 4
- 125000005410 aryl sulfonium group Chemical group 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- 239000004971 Cross linker Substances 0.000 claims description 2
- 150000008065 acid anhydrides Chemical class 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 claims description 2
- 239000002318 adhesion promoter Substances 0.000 claims description 2
- 230000003712 anti-aging effect Effects 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 claims description 2
- 239000002274 desiccant Substances 0.000 claims description 2
- 239000003085 diluting agent Substances 0.000 claims description 2
- 239000000975 dye Substances 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 239000007850 fluorescent dye Substances 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- 239000004014 plasticizer Substances 0.000 claims description 2
- 239000003381 stabilizer Substances 0.000 claims description 2
- 239000002562 thickening agent Substances 0.000 claims description 2
- 239000013008 thixotropic agent Substances 0.000 claims description 2
- 239000000080 wetting agent Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 description 49
- 238000001723 curing Methods 0.000 description 15
- 150000007513 acids Chemical class 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- 125000003118 aryl group Chemical group 0.000 description 10
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 10
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 8
- 238000009472 formulation Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 150000002009 diols Chemical class 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 6
- 238000005266 casting Methods 0.000 description 6
- 239000000470 constituent Substances 0.000 description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 6
- 229920002857 polybutadiene Polymers 0.000 description 6
- 229920005862 polyol Polymers 0.000 description 6
- 150000003077 polyols Chemical class 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 239000005062 Polybutadiene Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 125000002091 cationic group Chemical group 0.000 description 5
- 239000012986 chain transfer agent Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 229910015900 BF3 Inorganic materials 0.000 description 4
- 239000002841 Lewis acid Substances 0.000 description 4
- 150000008064 anhydrides Chemical class 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 4
- 150000007517 lewis acids Chemical class 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000013008 moisture curing Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 125000005907 alkyl ester group Chemical class 0.000 description 3
- 125000005103 alkyl silyl group Chemical class 0.000 description 3
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 3
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 3
- FTVLMFQEYACZNP-UHFFFAOYSA-N trimethylsilyl trifluoromethanesulfonate Chemical compound C[Si](C)(C)OS(=O)(=O)C(F)(F)F FTVLMFQEYACZNP-UHFFFAOYSA-N 0.000 description 3
- VKQJCUYEEABXNK-UHFFFAOYSA-N 1-chloro-4-propoxythioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C(OCCC)=CC=C2Cl VKQJCUYEEABXNK-UHFFFAOYSA-N 0.000 description 2
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 2
- SURWYRGVICLUBJ-UHFFFAOYSA-N 2-ethyl-9,10-dimethoxyanthracene Chemical compound C1=CC=CC2=C(OC)C3=CC(CC)=CC=C3C(OC)=C21 SURWYRGVICLUBJ-UHFFFAOYSA-N 0.000 description 2
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 2
- 239000007848 Bronsted acid Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000013032 Hydrocarbon resin Substances 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical class [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- JCJNNHDZTLRSGN-UHFFFAOYSA-N anthracen-9-ylmethanol Chemical compound C1=CC=C2C(CO)=C(C=CC=C3)C3=CC2=C1 JCJNNHDZTLRSGN-UHFFFAOYSA-N 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 150000007860 aryl ester derivatives Chemical class 0.000 description 2
- 125000005104 aryl silyl group Chemical group 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical class NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000011143 downstream manufacturing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920006270 hydrocarbon resin Polymers 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 150000004010 onium ions Chemical class 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Chemical class 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- WJKHJLXJJJATHN-UHFFFAOYSA-N triflic anhydride Chemical compound FC(F)(F)S(=O)(=O)OS(=O)(=O)C(F)(F)F WJKHJLXJJJATHN-UHFFFAOYSA-N 0.000 description 2
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 2
- 229960000834 vinyl ether Drugs 0.000 description 2
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 1
- QFWUIGWOSVHZMC-UHFFFAOYSA-N (2-chloro-6-trimethylsilylphenyl) trifluoromethanesulfonate Chemical compound C[Si](C)(C)c1cccc(Cl)c1OS(=O)(=O)C(F)(F)F QFWUIGWOSVHZMC-UHFFFAOYSA-N 0.000 description 1
- XBHPFCIWRHJDCP-UHFFFAOYSA-N (2-trimethylsilylphenyl) trifluoromethanesulfonate Chemical compound C[Si](C)(C)C1=CC=CC=C1OS(=O)(=O)C(F)(F)F XBHPFCIWRHJDCP-UHFFFAOYSA-N 0.000 description 1
- ZMTBGVBNTHTBEC-UHFFFAOYSA-N (3,3,5-trimethylcyclohexyl) prop-2-enoate Chemical compound CC1CC(OC(=O)C=C)CC(C)(C)C1 ZMTBGVBNTHTBEC-UHFFFAOYSA-N 0.000 description 1
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- XXSBXVHIYGQWDV-UHFFFAOYSA-N (4-methylphenyl) trifluoromethanesulfonate Chemical compound CC1=CC=C(OS(=O)(=O)C(F)(F)F)C=C1 XXSBXVHIYGQWDV-UHFFFAOYSA-N 0.000 description 1
- LLCJFYYASDIOJN-UHFFFAOYSA-N (4-trimethylsilyl-1H-indol-5-yl) trifluoromethanesulfonate Chemical compound C[Si](C)(C)c1c(OS(=O)(=O)C(F)(F)F)ccc2[nH]ccc12 LLCJFYYASDIOJN-UHFFFAOYSA-N 0.000 description 1
- YFQPRQIVKLIGMR-UHFFFAOYSA-N 1,1,2,2,2-pentafluoroethylsulfonyl 1,1,2,2,2-pentafluoroethanesulfonate Chemical compound FC(F)(F)C(F)(F)S(=O)(=O)OS(=O)(=O)C(F)(F)C(F)(F)F YFQPRQIVKLIGMR-UHFFFAOYSA-N 0.000 description 1
- OYAIIXZQTVFGAT-UHFFFAOYSA-N 1,1,2,2,3,3,3-heptafluoropropylsulfonyl 1,1,2,2,3,3,3-heptafluoropropane-1-sulfonate Chemical compound FC(F)(F)C(F)(F)C(F)(F)S(=O)(=O)OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)F OYAIIXZQTVFGAT-UHFFFAOYSA-N 0.000 description 1
- QKIHLPFZYGFMDK-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,4-nonafluorobutylsulfonyl 1,1,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)S(=O)(=O)OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F QKIHLPFZYGFMDK-UHFFFAOYSA-N 0.000 description 1
- PAEHHCFUJDYELS-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,7-pentadecafluoroheptylsulfonyl 1,1,2,2,3,3,4,4,5,5,6,6,7,7,7-pentadecafluoroheptane-1-sulfonate Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)S(=O)(=O)OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F PAEHHCFUJDYELS-UHFFFAOYSA-N 0.000 description 1
- ZXHDVRATSGZISC-UHFFFAOYSA-N 1,2-bis(ethenoxy)ethane Chemical class C=COCCOC=C ZXHDVRATSGZISC-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- DQNSRQYYCSXZDF-UHFFFAOYSA-N 1,4-bis(ethenoxymethyl)cyclohexane Chemical compound C=COCC1CCC(COC=C)CC1 DQNSRQYYCSXZDF-UHFFFAOYSA-N 0.000 description 1
- YDIZFUMZDHUHSH-UHFFFAOYSA-N 1,7-bis(ethenyl)-3,8-dioxatricyclo[5.1.0.02,4]oct-5-ene Chemical compound C12OC2C=CC2(C=C)C1(C=C)O2 YDIZFUMZDHUHSH-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- SXWDYSVCBQYACT-UHFFFAOYSA-N 1-(cyclohexen-1-ylmethyl)cyclohexane-1-carboxylic acid Chemical compound C=1CCCCC=1CC1(C(=O)O)CCCCC1 SXWDYSVCBQYACT-UHFFFAOYSA-N 0.000 description 1
- NDZFNTHGIIQMQI-UHFFFAOYSA-N 1-benzylpyridin-1-ium Chemical class C=1C=CC=C[N+]=1CC1=CC=CC=C1 NDZFNTHGIIQMQI-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- FOOVEGXEARQUBR-UHFFFAOYSA-N 1-o-tert-butyl 4-o-ethyl 4-prop-2-enylpiperidine-1,4-dicarboxylate Chemical compound CCOC(=O)C1(CC=C)CCN(C(=O)OC(C)(C)C)CC1 FOOVEGXEARQUBR-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- NAKUEGXKNSDYGY-UHFFFAOYSA-N 2,2'-((octahydro-4,7-methano-1h-indenediyl)bis(methyleneoxymethylene))dioxirane Chemical class C1OC1COCC1(C2C3CCC(C3)C2CC1)COCC1CO1 NAKUEGXKNSDYGY-UHFFFAOYSA-N 0.000 description 1
- KXPCNCOXUGCONJ-UHFFFAOYSA-N 2,2,2-trifluoroethylsulfonyl 2,2,2-trifluoroethanesulfonate Chemical compound FC(F)(F)CS(=O)(=O)OS(=O)(=O)CC(F)(F)F KXPCNCOXUGCONJ-UHFFFAOYSA-N 0.000 description 1
- RROZRFLLVCBVQB-UHFFFAOYSA-N 2,4-dihydroxy-2,4-dimethyl-1,5-bis(4-propan-2-ylphenyl)pentan-3-one Chemical compound C1=CC(C(C)C)=CC=C1CC(C)(O)C(=O)C(C)(O)CC1=CC=C(C(C)C)C=C1 RROZRFLLVCBVQB-UHFFFAOYSA-N 0.000 description 1
- ASUQXIDYMVXFKU-UHFFFAOYSA-N 2,6-dibromo-9,9-dimethylfluorene Chemical compound C1=C(Br)C=C2C(C)(C)C3=CC=C(Br)C=C3C2=C1 ASUQXIDYMVXFKU-UHFFFAOYSA-N 0.000 description 1
- WVXLLHWEQSZBLW-UHFFFAOYSA-N 2-(4-acetyl-2-methoxyphenoxy)acetic acid Chemical group COC1=CC(C(C)=O)=CC=C1OCC(O)=O WVXLLHWEQSZBLW-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- AZMMSEASPQHHTC-UHFFFAOYSA-N 2-[1,1-bis(2-hydroxyphenyl)ethyl]phenol Chemical compound C=1C=CC=C(O)C=1C(C=1C(=CC=CC=1)O)(C)C1=CC=CC=C1O AZMMSEASPQHHTC-UHFFFAOYSA-N 0.000 description 1
- OGRULRAOMCDCBO-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC1=CC=C2C=CC=CC2=C1OCC1CO1 OGRULRAOMCDCBO-UHFFFAOYSA-N 0.000 description 1
- MIENFLGMPIGKAL-UHFFFAOYSA-N 2-[[2-(oxiran-2-ylmethyl)phenyl]-[oxiran-2-yl-[2-(oxiran-2-ylmethyl)phenyl]methoxy]methyl]oxirane Chemical compound C=1C=CC=C(C(OC(C2OC2)C=2C(=CC=CC=2)CC2OC2)C2OC2)C=1CC1CO1 MIENFLGMPIGKAL-UHFFFAOYSA-N 0.000 description 1
- LJBWJFWNFUKAGS-UHFFFAOYSA-N 2-[bis(2-hydroxyphenyl)methyl]phenol Chemical compound OC1=CC=CC=C1C(C=1C(=CC=CC=1)O)C1=CC=CC=C1O LJBWJFWNFUKAGS-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- FZIIBDOXPQOKBP-UHFFFAOYSA-N 2-methyloxetane Chemical compound CC1CCO1 FZIIBDOXPQOKBP-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- QOZLLNFAKXRSQL-UHFFFAOYSA-N 3-ethyl-3-(prop-2-enoxymethyl)oxetane Chemical compound C=CCOCC1(CC)COC1 QOZLLNFAKXRSQL-UHFFFAOYSA-N 0.000 description 1
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 1
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 1
- BMVWCPGVLSILMU-UHFFFAOYSA-N 5,6-dihydrodibenzo[2,1-b:2',1'-f][7]annulen-11-one Chemical compound C1CC2=CC=CC=C2C(=O)C2=CC=CC=C21 BMVWCPGVLSILMU-UHFFFAOYSA-N 0.000 description 1
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- KSMGAOMUPSQGTB-UHFFFAOYSA-N 9,10-dibutoxyanthracene Chemical compound C1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 KSMGAOMUPSQGTB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 241001247482 Amsonia Species 0.000 description 1
- 229910017008 AsF 6 Inorganic materials 0.000 description 1
- 229910017048 AsF6 Inorganic materials 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- MKEWYGIHZQYQAH-UHFFFAOYSA-N C1=CC(NCC)(NCC)CC=C1C(=O)C1=CC=CC=C1 Chemical compound C1=CC(NCC)(NCC)CC=C1C(=O)C1=CC=CC=C1 MKEWYGIHZQYQAH-UHFFFAOYSA-N 0.000 description 1
- XXAAOLRWDXWBBY-UHFFFAOYSA-N C=COC(CCCCC(OCC1CC2OC2CC1)=O)=O Chemical compound C=COC(CCCCC(OCC1CC2OC2CC1)=O)=O XXAAOLRWDXWBBY-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- 229920003344 Epilox® Polymers 0.000 description 1
- ZMDDERVSCYEKPQ-UHFFFAOYSA-N Ethyl (mesitylcarbonyl)phenylphosphinate Chemical compound C=1C=CC=CC=1P(=O)(OCC)C(=O)C1=C(C)C=C(C)C=C1C ZMDDERVSCYEKPQ-UHFFFAOYSA-N 0.000 description 1
- ZNKAHJCGEPVEBA-UHFFFAOYSA-N FC(S(=O)(=O)OC1=C(C=CC=C1Br)[Si](C)(C)C)(F)F Chemical compound FC(S(=O)(=O)OC1=C(C=CC=C1Br)[Si](C)(C)C)(F)F ZNKAHJCGEPVEBA-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 1
- OFSAUHSCHWRZKM-UHFFFAOYSA-N Padimate A Chemical compound CC(C)CCOC(=O)C1=CC=C(N(C)C)C=C1 OFSAUHSCHWRZKM-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical class [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920012196 Polyoxymethylene Copolymer Polymers 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 229910010165 TiCu Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- FYYIUODUDSPAJQ-XVBQNVSMSA-N [(1S,6R)-7-oxabicyclo[4.1.0]heptan-3-yl]methyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1CC[C@H]2O[C@H]2C1 FYYIUODUDSPAJQ-XVBQNVSMSA-N 0.000 description 1
- HUHKPYLEVGCJTG-UHFFFAOYSA-N [ditert-butyl(trifluoromethylsulfonyloxy)silyl] trifluoromethanesulfonate Chemical compound FC(F)(F)S(=O)(=O)O[Si](C(C)(C)C)(OS(=O)(=O)C(F)(F)F)C(C)(C)C HUHKPYLEVGCJTG-UHFFFAOYSA-N 0.000 description 1
- WLLIXJBWWFGEHT-UHFFFAOYSA-N [tert-butyl(dimethyl)silyl] trifluoromethanesulfonate Chemical compound CC(C)(C)[Si](C)(C)OS(=O)(=O)C(F)(F)F WLLIXJBWWFGEHT-UHFFFAOYSA-N 0.000 description 1
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 230000002152 alkylating effect Effects 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 150000001454 anthracenes Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 125000001309 chloro group Chemical class Cl* 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- BOXSCYUXSBYGRD-UHFFFAOYSA-N cyclopenta-1,3-diene;iron(3+) Chemical class [Fe+3].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 BOXSCYUXSBYGRD-UHFFFAOYSA-N 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 239000012955 diaryliodonium Substances 0.000 description 1
- 125000005520 diaryliodonium group Chemical group 0.000 description 1
- BQQUFAMSJAKLNB-UHFFFAOYSA-N dicyclopentadiene diepoxide Chemical compound C12C(C3OC33)CC3C2CC2C1O2 BQQUFAMSJAKLNB-UHFFFAOYSA-N 0.000 description 1
- KHAYCTOSKLIHEP-UHFFFAOYSA-N docosyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCOC(=O)C=C KHAYCTOSKLIHEP-UHFFFAOYSA-N 0.000 description 1
- JZRGFKQYQJKGAK-UHFFFAOYSA-N ethenyl cyclohexanecarboxylate Chemical compound C=COC(=O)C1CCCCC1 JZRGFKQYQJKGAK-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229940052303 ethers for general anesthesia Drugs 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- UVECLJDRPFNRRQ-UHFFFAOYSA-N ethyl trifluoromethanesulfonate Chemical compound CCOS(=O)(=O)C(F)(F)F UVECLJDRPFNRRQ-UHFFFAOYSA-N 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- AKGOLHAGFGPGKB-UHFFFAOYSA-N methyl 1,1,2,2,2-pentafluoroethanesulfonate Chemical compound COS(=O)(=O)C(F)(F)C(F)(F)F AKGOLHAGFGPGKB-UHFFFAOYSA-N 0.000 description 1
- HWBZFXOJXWFURZ-UHFFFAOYSA-N methyl 1,1,2,2,3,3,3-heptafluoropropane-1-sulfonate Chemical compound COS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)F HWBZFXOJXWFURZ-UHFFFAOYSA-N 0.000 description 1
- OIRDBPQYVWXNSJ-UHFFFAOYSA-N methyl trifluoromethansulfonate Chemical compound COS(=O)(=O)C(F)(F)F OIRDBPQYVWXNSJ-UHFFFAOYSA-N 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- MDWRQYBWVTXIIJ-UHFFFAOYSA-N naphthalen-2-yl trifluoromethanesulfonate Chemical compound C1=CC=CC2=CC(OS(=O)(=O)C(F)(F)F)=CC=C21 MDWRQYBWVTXIIJ-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical class NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- GRJHONXDTNBDTC-UHFFFAOYSA-N phenyl trifluoromethanesulfonate Chemical compound FC(F)(F)S(=O)(=O)OC1=CC=CC=C1 GRJHONXDTNBDTC-UHFFFAOYSA-N 0.000 description 1
- 239000011574 phosphorus Chemical class 0.000 description 1
- 229910052698 phosphorus Chemical class 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- ZGSOBQAJAUGRBK-UHFFFAOYSA-N propan-2-olate;zirconium(4+) Chemical compound [Zr+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] ZGSOBQAJAUGRBK-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 229910001545 sodium hexafluoroantimonate(V) Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- LHJCZOXMCGQVDQ-UHFFFAOYSA-N tri(propan-2-yl)silyl trifluoromethanesulfonate Chemical compound CC(C)[Si](C(C)C)(C(C)C)OS(=O)(=O)C(F)(F)F LHJCZOXMCGQVDQ-UHFFFAOYSA-N 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- ISSIWIRDZGCLAH-UHFFFAOYSA-N triethylsilyl 2,2,2-trifluoroethanesulfonate Chemical compound FC(F)(F)CS(=O)(=O)O[Si](CC)(CC)CC ISSIWIRDZGCLAH-UHFFFAOYSA-N 0.000 description 1
- STMPXDBGVJZCEX-UHFFFAOYSA-N triethylsilyl trifluoromethanesulfonate Chemical compound CC[Si](CC)(CC)OS(=O)(=O)C(F)(F)F STMPXDBGVJZCEX-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- QJMMCGKXBZVAEI-UHFFFAOYSA-N tris(trimethylsilyl) phosphate Chemical compound C[Si](C)(C)OP(=O)(O[Si](C)(C)C)O[Si](C)(C)C QJMMCGKXBZVAEI-UHFFFAOYSA-N 0.000 description 1
- ULNJZOIDTANZKR-UHFFFAOYSA-N tris[4-(4-acetylphenyl)sulfanylphenyl]sulfanium Chemical compound C1=CC(C(=O)C)=CC=C1SC1=CC=C([S+](C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=C1 ULNJZOIDTANZKR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/02—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonates or saturated polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4064—Curing agents not provided for by the groups C08G59/42 - C08G59/66 sulfur containing compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
Definitions
- the invention relates to a cationically polymerizable mass which can be hardened by the action of moisture, the use of this mass and a method for joining, casting and coating substrates using the mass.
- Sulfonium and iodonium salts are often used as photolatent acids.
- An overview of suitable photoinitiators can be found in the publications by J.V. Crivello and K. Dietliker in "Photoinitiators for Free Radical, Cationic & Anionic Photopolymerization", Volume III of "Chemistry & Technology of UV & EB Formulation for Coatings, Inks & Paints", 2nd Ed., J. Wiley and Sons / SITA Technology (London), 1998.
- HSO 4 As anions for the sulfonium or iodonium salts, HSO 4 , PFe, SbF 6 , AsF 6 , CI, Br,
- N-benzylpyridinium salts and N-benzylammonium salts are suitable as thermal acid generators.
- thermally latent sulfonium salts as described in WO 2019 043 778 A1, can also be used as acid generators.
- Cationically curable compositions based on the initiators mentioned are described, inter alia, in EP 0066 543 A2, WO 2019002 360 A1, EP 3088465 B1 and US 6455 121.
- the disclosed formulations can be cured by the introduction of heat and / or actinic radiation.
- No. 9,688,892 shows the use of an epoxy resin with a latent epoxy curing agent, the epoxy curing agent being stable at room temperature and, in particular, being activated at elevated temperatures.
- Bronsted acids such as trifluoromethanesulfonic acid and silyl esters of these Bronsted acids are proposed as cationic latent epoxy curing agents.
- the invention is based on the object of avoiding the above-described disadvantages of the methods and compositions known from the prior art and of providing cationically curable compositions which, induced by moisture, also cure at room temperature and in shadowy zones.
- this object is achieved by a cationically curable mass according to claim 1, a method according to one of claims 13 to 15 and the use of the mass according to claim 16.
- the cationically moisture-induced curable composition according to the invention comprises: a) at least one cationically polymerizable component; and b) at least one organic moisture latent initiator; wherein the cationically polymerizable component contains an epoxy compound with an aliphatic and / or cycloaliphatic skeleton in a proportion of at least 10% by weight, based on the total weight of the mass, and the moisture-latent initiator under the action of moisture releases a hydrolysis product which has a pKa less than 0 Has.
- no inorganic salts such as BF3 or TiCU are used as moisture-latent initiators, since when they are used it is not possible to formulate materials that are stable in storage.
- composition according to the invention can additionally contain a photoinitiator for the cationic polymerization.
- a photoinitiator for the cationic polymerization can additionally contain at least one free-radically polymerizable component and a photoinitiator for the free-radical polymerization, as well as further formulation constituents, can also be included.
- the cationically curable composition is used in a method for joining, casting or coating substrates, the method comprising the following steps: a) providing the cationically curable composition described above; b) metering the mass onto a first substrate; c) optionally supplying a second substrate; and d) allowing moisture to act until sufficient handling strength has been built up.
- the method using the composition according to the invention does not require any additional activation of the composition by light and / or heat for curing.
- handling strength particularly describes the dimensional stability of the mass.
- the required minimum handling strength depends on the type of application of the components and the requirements of any downstream processes.
- an additional exposure step takes place before or after the second substrate is fed in.
- the invention also relates to the use of the cationically moisture-induced curable composition according to the invention for joining, casting and coating.
- the mass is suitable for thermally sensitive electronic, optical and / or electro-optical components.
- One-component or “one-component compound” means in the context of the invention that the stated components of the compound are present together in a packaging unit.
- “Liquid” in the sense of the invention means that at 23 ° C the loss modulus G ”determined by viscosity measurement is greater than the storage modulus G 'of the mass in question.
- “humidity” is defined as 50% relative humidity at room temperature or the humidity on substrate surfaces under these conditions.
- At least difunctional means that two or more units of the functional group mentioned are contained per molecule.
- the compositions contain at least one cationically polymerizable component (A) which contains at least one epoxy compound with an aliphatic and / or cycloaliphatic basic structure, preferably a cycloaliphatic epoxy compound, and at least one organic moisture-latent initiator (B), the hydrolysis product of which is a pKa -Value less than 0.
- A cationically polymerizable component
- B organic moisture-latent initiator
- the epoxy compound with an aliphatic and / or cycloaliphatic basic structure is referred to below for short as an aliphatic and / or cycloaliphatic epoxide.
- compositions according to the invention of the first embodiment preferably contain no photolatent or heat-latent initiators.
- compositions contain, in addition to the at least one cationically polymerizable component (A) and the moisture-latent initiator (B), a photoinitiator for the cationic polymerization (C).
- the compositions contain, in addition to the at least one cationically polymerizable component (A) and the moisture-latent initiator (B), a radical radiation-curable compound (D) and a photoinitiator for radical polymerization (E).
- the compositions also contain a tackifier (F) in addition to the components of the third embodiment.
- additional further additives (G) can be contained.
- Component (A) cationically polymerizable components
- the cationically polymerizable components are not restricted further with regard to their chemical basis as long as at least one aliphatic and / or cycloaliphatic epoxy compound is present.
- the cationically polymerizable components are preferably selected from the group consisting of epoxy-containing compounds (A1), oxetane-containing compounds (A2), vinyl ethers (A3) and combinations thereof, at least one aliphatic and / or cycloaliphatic epoxy compound having to be included.
- the cationically polymerizable component can optionally also contain one or more alcohols (A4) as chain transfer agents and / or cationically polymerizable hybrid compounds (A5).
- A4 alcohols
- A5 cationically polymerizable hybrid compounds
- the use of cyclic lactones as a cationically polymerizable component is also possible.
- the cationically polymerizable component (A) preferably comprises at least one compound which is at least difunctional with respect to the cationically polymerizable group. As a result, good crosslinking of the cationically polymerizable component can be achieved.
- the epoxy-containing compound (A1) preferably comprises the at least one aliphatic and / or cycloaliphatic epoxy compound contained in the compositions according to the invention and optionally one or more further epoxy compounds.
- the epoxy-containing compound (A1) from the group of the cycloaliphatic epoxides, the aromatic and aliphatic Glycidyl ethers, glycidyl esters or glycidylamines and mixtures of the components mentioned can be selected.
- the epoxy-containing compound (A1) in the compositions according to the invention preferably comprises one or more at least difunctional epoxy-containing compounds. At least “difunctional” means that the epoxy-containing compound contains at least two epoxy groups.
- Component (A1) particularly preferably comprises an at least difunctional cycloaliphatic epoxide.
- compositions according to the invention contain at least 10% by weight of the aliphatic and / or cycloaliphatic epoxy compound, based on the total weight of all components (A) to (G).
- the moisture-latent initiator is not soluble in the masses without the addition of at least 10% by weight of an aliphatic and / or cycloaliphatic epoxy compound.
- Difunctional cycloaliphatic epoxy resins are known in the prior art and contain compounds which carry both a cycloaliphatic group and at least two oxirane rings. Exemplary representatives are 3-cyclohexenylmethyl-3-cyclohexylcarboxylate diepoxide, 3,4-epoxycyclohexylalkyl 3 ', 4'-epoxycyclohexane carboxylate, 3,4-epoxy-6-methylcyclohexylmethyl-3', 4'-epoxy-6-methylcyclohexane carboxylate, vinylcyclohexane carboxylate, vinyl (3,4-epoxycyclohexylmethyl) adipate, dicyclopentadiene dioxide, diycyclopentadienyloxyethyl glycidyl ether and 1,2-epoxy-6- (2,3-epoxypropoxy) hexahydro-4,7-methanindane, and mixtures thereof.
- Aromatic epoxy resins can be used as further epoxy compounds in addition to the aliphatic and / or cycloaliphatic epoxy in the compositions according to the invention.
- aromatic epoxy resins are Bisphenol A epoxy resins, bisphenol F epoxy resins, phenol novolak epoxy resins, cresol novolak epoxy resins, biphenyl epoxy resins, 4,4'-
- Biphenyl epoxy resins divinylbenzene dioxide, 2-glycidylphenylglycidyl ether,
- Isocyanurates substituted with epoxy-containing groups and other heterocyclic compounds can also be used in the compositions according to the invention.
- examples are triglycidyl isocyanurate and
- polyfunctional epoxy resins of all the resin groups mentioned, tough elasticized epoxy resins and mixtures of different epoxy resins can be used in the compositions according to the invention.
- monofunctional epoxides can also be used as reactive thinners.
- Examples of commercially available epoxy-containing compounds are products sold under the trade names CELLOXIDE TM 2021 P, CELLOXIDE TM 8000 from Daicel Corporation, Japan, as EPIKOTE TM RESIN 828 LVEL, EPIKOTE TM RESIN 166, EPIKOTE TM RESIN 169 from Momentive Specialty Chemicals BV, the Netherlands , as Epilox TM resins of the product lines A, T and AF from Leuna Harze, Germany, or as EPICLON TM 840, 840-S, 850, 850-S, EXA850CRP, 850-LC from DIC KK, Japan, Omnilane 1005 and Omnilane 2005 from IGM Resins BV, Syna Epoxy 21 and Syna Epoxy 06 from Synasia Inc., TTA21, TTA26, TTA60 and TTA128 from Jiangsu Tetra New Material Technology Co. Ltd. are available.
- oxetane-containing compounds (A2) can also be used in the compositions as a constituent of the cationically curable component (A). Processes for the production of oxetanes are known in particular from US 2017/0198093 A1.
- oxetanes are bis (1-ethyl-3-oxetanyl-methyl) ether (DOX), 3-allyloxymethyl-3-ethyloxetane (AQX), 3-ethyl-3 - [(phenoxy) methyloxetane (POX), 3-ethyl-3-hydroxymethyl-oxetane (OXA), 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene (XDO), 3-ethyl-3 - [(2-ethylhexyloxy) methyl] oxetane (EHOX).
- DOX 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene
- EHOX 3-ethyl-3 - [(2-ethylhexyloxy) methyl] oxetane
- the named oxetanes are from TOAG
- vinyl ethers (A3) can also be used as cationically curable components in the compositions.
- Suitable vinyl ethers are trimethylolpropane trivinyl ethers, ethylene glycol divinyl ethers and cyclic vinyl ethers and mixtures thereof. Vinyl ethers of polyfunctional alcohols can also be used.
- the cationically polymerizable component can also comprise one or more alcohols (A4) which are used as chain transfer agents.
- A4 alcohols
- higher molecular weight polyols can be used to make cationic compositions more flexible. Suitable polyols are available, for example, based on polyethers, polyesters, polycaprolactones, polycarbonates, polybutadiene diols or hydrogenated polybutadiene diols.
- Examples of commercially available higher molecular weight polyols are products sold under the trade names ETERNACOLL UM-90 (1/1), Eternacoll UHC50-200 from UBE Industries Ltd., as Capa TM 2200, Capa TM 3091 from Perstorp, as Liquiflex H from Petroflex, as Merginol 901 from HOBUM Oleochemicals, as Placcel 305, Placcel CD 205 PL from Daicel Corporation, as Priplast 3172, Priplast 3196 from Croda, as Kuraray Polyol F-3010, Kuraray Polyol P-6010 from Kuraray Co., Ltd., as Krasol LBH-2000, Krasol HLBH-P3000 from Cray Valley or as Hoopol S-1015-35 or Hoopol S-1063-35 from Synthesia Internacional SLU.
- hybrid connections (A5) can also be used.
- these also contain radical radiation-curable groups.
- epoxy (meth) acrylate hybrid compounds in particular are within the meaning of the invention.
- examples of commercially available epoxy (meth) acrylates are CYCLOMER M100 from Daicel, epoxy acrylate Solmer SE 1605, UVACURE 1561 from UCB, and Miramer PE210HA from Miwon Europe GmbH and Solmer PSE 1924 from Soltech Ltd.
- Oxetane (meth) acrylates such as Eternacoll OXMA from UBE Industries LTD can also be used as hybrid compounds (A5).
- the list of the cationically polymerizable components (A) is to be seen as exemplary and not conclusive.
- a mixture of the cationically polymerizable components (A1) to (A5) mentioned is likewise within the meaning of the invention.
- the cationically polymerizable component (A) is present in the composition according to the invention, based on the total weight of the composition, preferably in a proportion of 10 to 99% by weight, particularly preferably in a proportion of 10 to 90% by weight, with at least 10 wt .-% of an aliphatic and / or cycloaliphatic epoxy compound are contained in the mass.
- the cationically polymerizable component (A) consists of the epoxy-containing component (A1), comprising at least one aliphatic and / or cycloaliphatic epoxy compound, and optionally at least one alcohol (A4) as a chain transfer agent.
- an oxetane-containing compound (A2) in addition to the epoxy-containing compound (A1), which comprises at least one aliphatic and / or cycloaliphatic epoxy compound, an oxetane-containing compound (A2) can be contained.
- the oxetane-containing compound (A2) is present in a proportion of 1 to 50% by weight, preferably in a proportion of 10 to 30% by weight, based in each case on the total weight of the composition.
- one or more vinyl ethers (A3) can also be present.
- the vinyl ether (A3) is present in a proportion of 1 to 20% by weight, preferably in a proportion of 1 to 15% by weight, based in each case on the total weight of the composition.
- component (A4) is present in the compositions according to the invention in a proportion of 0 to 80% by weight, preferably in a proportion of 0 to 60% by weight, particularly preferably 1 to 50% by weight, each based on the total weight of the mass.
- component (A5) is present in the compositions according to the invention in a proportion of 0 to 50% by weight, preferably in a proportion of 0 to 30% by weight.
- the aliphatic and / or cycloaliphatic epoxy compound can also comprise a hybrid compound which has an aliphatic or cycloaliphatic basic structure and which, in addition to epoxy groups, also carries further radically radiation-curable groups.
- compositions according to the invention contain at least one organic moisture-latent initiator (B) which, when exposed to moisture, releases a hydrolysis product which has a pKa value of less than 0, preferably less than -1, particularly preferably less than -5.
- the moisture-latent initiator (B) is not structurally restricted as long as it releases a strong acid as a hydrolysis product with ingress of moisture, which acid has a pKa value of less than 0.
- Suitable classes of substances which release strong acids upon hydrolysis are, for example, acid anhydrides, alkyl esters, aryl esters, arylsilyl esters or alkylsilyl esters.
- Such moisture-latent initiators (B) can be prepared in particular starting from fluorinated sulfonic acids.
- electron-withdrawing substituted compounds from the classes of substances mentioned are particularly suitable as moisture-latent initiators.
- anhydrides of strong acids are trifluoromethanesulfonic anhydride, pentafluoroethanesulfonic anhydride, Heptafluoropropanesulfonic anhydride, nonafluorobutanesulfonic anhydride, undecafluoropentanesulfonic anhydride and perfluoroheptanesulfonic anhydride.
- alkyl esters of strong acids are methyl trifluoromethanesulfonate, ethyl trifluoromethanesulfonate, methylpentafluoroethanesulfonate and methylheptafluoropropanesulfonate.
- aryl esters of strong acids are phenyl trifluoromethanesulphonate, p-tolyl trifluoromethanesulphonate, 2-naphthyl trifluoromethanesulphonate, 3,5-dimethoxyphenyltrifluoromethanesulphonate, 4-acetylphenyltrifluoromethanesulphonyl trifluoromethanesulphonate and 4-acetyltrifluoromethanesulphonate.
- arylsilyl esters of strong acids are 2- (trimethylsilyl) phenyl trifluoromethanesulfonate, 2-bromo-6- (trimethylsilyl) phenyl triflate, 2-chloro-6- (trimethylsilyl) phenyl triflate, 4- (trimethylsilyl) -1 H-indole- 5-yl trifluoromethanesulfonate.
- alkylsilyl esters of strong acids are trimethylsilyl trifluoromethanesulfonate, triethylsilyl trifluoromethanesulfonate,
- Suitable moisture-latent initiators (B) can also have several hydrolyzable groups which can release a strong acid.
- Lewis acids such as BF3 and its etherate complexes, chlorine salts of tin, titanium or phosphorus or strong mineral acids are not within the meaning of the invention. These compounds do not show sufficient latency to formulate storage-stable masses which only cure when moisture is exposed.
- the moisture-latent initiator (B) is contained in a proportion of at least 0.01% by weight, based on the total weight of the composition, preferably in a proportion of at least 0.1% by weight, particularly preferably in a proportion of at least 0.3 wt%.
- the compositions according to the invention preferably contain at most 10% by weight of the moisture-latent initiator.
- compositions optionally contain a photoinitiator for the cationic polymerization (C). This can be activated by actinic radiation and enables additional fixation of the mass.
- Component (C) is selected from the group of photolatent acid generators. This is not structurally restricted and includes, for example, initiators based on metallocenium and / or onium compounds.
- metallocenium salts An overview of various metallocenium salts is disclosed in EP 0 542 716 B1.
- Examples of different anions of the metallocenium salts are HS0 4 -, PF 6 -, SbF e -, AsF e -, CI, Br,
- the photoinitiator based on a metallocenium compound is preferably selected from the group of ferrocenium salts.
- Preferred onium compounds are selected from the group of the arylsulfonium salts and the aryliodonium salts, and combinations thereof, and are described in the prior art.
- Triarylsulfonium bases are available under the brand names Chivacure 1176, Chivacure 1190 from Chitech, Irgacure 290, Irgacure 270, Irgacure GSID 26-1 from BASF, Speedcure 976 and Speedcure 992 from Lambson, TTA UV-692, TTA UV-694 from Jiangsu Tetra New Material Technology Co., Ltd. or UVI-6976 and UVI-6974 available from Dow Chemical Co.
- Diaryliodonium bases are available under the brand names UV1242 or UV2257 from Deuteron and Bluesil 2074 from Bluestar.
- the photoinitiators (C) used in the compositions according to the invention can preferably be activated by exposure to actinic radiation having a wavelength of 200 to 480 nm.
- the photoinitiator (C) is contained, based on the total weight of the composition, in particular in a proportion of 0.01 to 5% by weight, preferably in proportions of 0.3 to 3% by weight.
- compositions for use in the process according to the invention optionally contain, in addition to components (A) to (C), further compounds curable by free radicals.
- the free-radically polymerizable compounds are preferably radiation-curable compounds based on (meth) acrylates.
- Their chemical structure is not restricted any further.
- both aliphatic and aromatic (meth) acrylates can be used.
- Both the derivatives of acrylic acid and of methacrylic acid and combinations and mixtures thereof are referred to here and below as (meth) acrylates.
- the free-radically polymerizable compounds (D) can be used to achieve rapid light fixation by irradiating the compositions.
- the radiation-curable compound is preferably at least difunctional.
- the following radiation-curable compounds are suitable: isobornyl acrylate, stearyl acrylate, tetrahydrofurfuryl acrylate, cyclohexyl acrylate, 3,3,5-trimethylcyclohexanol acrylate, behenyl acrylate, 2-methoxyethyl acrylate and other mono- or poly-alkoxylated alkyl acrylate, isobutyl acrylate, isobutyl acrylate, trido-octyl acrylate, isobutyl acrylate, tridostyl acrylate, isobutyl acrylate, tridostyl acrylate, isobutyl acrylate, tridostyl acrylate, isobutyl acrylate, tridostyl acrylate, isobutyl acrylate, isobutyl acrylate, tetrahydrofurfuryl
- radiation-curable compounds (D) with allyl groups such as 1, 3,5-triazine-2,4,6 (1H, 3H, 5H) -trione
- the TAICROS ® is commercially available as suitable.
- unhydrogenated polybutadienes with free double bonds such as the Poly BD ® grades can be used as radiation-curable compound (D).
- urethane acrylates based on polyesters, polyethers, polycarbonate diols, polybutadiene diols and / or hydrogenated polybutadiene diols can be used as component (D).
- a combination of several radiation-curable compounds (D) is also within the meaning of the invention.
- the free-radically polymerizable compound (D) is preferably present in the composition according to the invention in a proportion of up to 50% by weight, particularly preferably in a proportion of up to 30% by weight, based in each case on the total weight of the composition.
- compositions optionally also contain a photoinitiator (E) for activating the free-radical polymerization.
- photoinitiators such as a-hydroxyketone, benzophenone, a, a'-diethoxyacetophenone, 4,4-diethylaminobenzophenone, 2,2-dimethoxy-2-phenyl-acetophenone, 4-isopropylphenyl- 2-hydroxy-2-propyl ketone, 1-hydroxy cyclohexyl phenyl ketone, isoamyl p-dimethylaminobenzoate, methyl 4-dimethyl aminobenzoate, methyl o-benzoyl benzoate, benzoin, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2-hydroxy-2-methyl- 1-phenylpropan-1-one, 2-isopropylthioxanthone, dibenzosuberone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bisacylphos
- the IRGACURE TM types from BASF SE can be used as UV photoinitiators, for example the types IRGACURE 184, IRGACURE 500, IRGACURE 1179, IRGACURE 2959, IRGACURE 745, IRGACURE 651, IRGACURE 369, IRGACURE 907, IRGACURE 1300, IRGACURE 819 , IRGACURE 819DW, IRGACURE 2022, IRGACURE 2100, IRGACURE 784, IRGACURE 250, IRGACURE TPO, IRGACURE TPO-L
- DAROCUR ® types from BASF SE can also be used, for example the types DAROCUR MBF, DAROCUR 1173, DAROCUR TPO and DAROCUR 4265.
- the photoinitiator used as component (E) in the compositions according to the invention can preferably be activated by actinic radiation having a wavelength of 200 to 400 nm, particularly preferably 250 to 365 nm.
- the photoinitiator (E) is present in the composition according to the invention in particular in a proportion of up to 5% by weight, preferably in a proportion of 0.01 to 3% by weight, based on the total weight of the composition.
- compositions according to the invention can also contain tackifiers.
- These are selected, for example, from the group of hydrogenated hydrocarbon resins and / or aromatic resins.
- examples are rosins, terpene resins, terpene phenol resins and styrene resins.
- the tackifier (F) is present in the composition according to the invention in particular in a proportion of up to 10% by weight, preferably in a proportion of 20 to 30% by weight, based on the total weight of the composition.
- Component (G) additives
- compositions described can also contain optional constituents as additives (G).
- the additives (G) are preferably selected from the group consisting of fillers, dyes, pigments, anti-aging agents, fluorescent agents, sensitizers, accelerators, stabilizers, Adhesion promoters, drying agents, crosslinkers, flow improvers, wetting agents, thixotropic agents, diluents, non-reactive flexibilizers, non-reactive polymeric thickeners, flame retardants, corrosion inhibitors, plasticizers and combinations thereof.
- the additives (G) are present in the composition according to the invention in particular in a proportion of up to 70% by weight, based on the total weight of the composition.
- component (G) Some of the additives that can be used as component (G) are described in more detail below.
- sensitizers (G1) are anthracene, perylene, phenothiazine, xanthone, thioxanthone, benzophenone, ethyl 4-dimethylaminobenzoate or sterically hindered amines.
- thioxanthone derivatives can be used, such as, for example, 2,4-diethylthioxanthone (DETX), 1-chloro-4-propoxythioxanthone (CPTX) and isopropyl thioxanthone (ITX), which are commercially available from Lambson.
- DETX 2,4-diethylthioxanthone
- CPTX 1-chloro-4-propoxythioxanthone
- ITX isopropyl thioxanthone
- Anthracene derivatives such as 2-ethyl-9,10-dimethoxyanthracene (EDMA), 9-hydroxymethyl-anthracene (HMA), 9,10-dibutoxyanthracene, available from Sigma-Aldrich, can also be used.
- the sensitizing agent (G1) is contained in the composition preferably in a proportion of 0 to 5% by weight, more preferably in proportions of 0 to 3% by weight, and particularly preferably from 0 to 1% by weight, based on each case on the total weight of the mass.
- salts of weak coordinating anions such as PFe, SbF6, AsF6, CIO4, PO4, SO3CF3, OTf, OTs and borate anions such as BF4 and B (CeF5) 4 _ can be used.
- heat-latent acid generators can also act as accelerators for moisture curing.
- Thermally latent acid formers based on quaternary benzylammonium salts which are suitable for acceleration are described in EP 0 343 690 A2 and WO 2005/097883 A1.
- Commercially available products are available from King Industries under the designation K PURE CXC-1612 or K-PURE CXC-1733.
- aromatic sulfonium or iodonium salts also act as accelerators.
- various metal chelate complexes based on titanium or aluminum can be used as heat-latent acid generators.
- Combinations of these substance classes can also be used as accelerators (G2) in the composition according to the invention.
- the accelerator (G2) is contained in a proportion of 0 to 5% by weight, based on the total weight of the mass, preferably in a proportion of 0.3 to 3% by weight.
- a formulation of the composition according to the invention comprises at least components (A) and (B).
- the composition comprises or consists of the following components, each based on the total weight of the composition: a) 10 to 99% by weight of the cationically polymerizable component (A), the cationically polymerizable component (A) preferably consisting of the from epoxy-containing compounds (A1), oxetane-containing compounds (A2), vinyl ethers (A3) and combinations thereof existing group is selected, optionally together with an alcohol as a chain transfer agent (A4); b) at least 0.1% by weight of the moisture-latent initiator (B) c) 0 to 70% by weight of the additives (G).
- the cationically polymerizable component (A) in each case has at least 10% by weight of an aliphatic and / or cycloaliphatic epoxide, based on the total weight of the composition, preferably at least 10% by weight of a cycloaliphatic epoxide.
- the cationically polymerizable component (A) preferably consists of the epoxy-containing component (A1) and optionally at least one alcohol (A4) as a chain transfer agent.
- the epoxy-containing compound (A1) can also, with the exception of the necessary amount of 10% by weight of an aliphatic and / or cycloaliphatic epoxy resin, be at least partially replaced by an oxetane-containing compound (A2).
- the composition comprises or consists of the following components, each based on the total weight of the composition: a) 10 to 99% by weight of the cationically polymerizable component (A), the cationically polymerizable component (A) preferably consisting of the is selected from epoxy-containing compounds (A1), oxetane-containing compounds (A2), vinyl ethers (A3) and combinations thereof, optionally together with an alcohol as chain transfer agent (A4); b) at least 0.1% by weight of the moisture-latent initiator (B) c) 0.01 to 5% by weight of a photoinitiator for the cationic polymerization (C), preferably an arylsulfonium salt, an aryliodonium salt or a combination thereof; d) 0 to 70% by weight of the additives (G).
- the cationically polymerizable component (A) preferably consisting of the is selected from epoxy-containing compounds (A1), oxetane-containing compounds (A2), vinyl
- the cationically polymerizable component (A) also in this embodiment has in each case at least 10% by weight of an aliphatic and / or cycloaliphatic epoxide, based on the total weight of the mass, preferably at least 10% by weight of a cycloaliphatic epoxide.
- the composition comprises or consists of the following components, each based on the total weight of the composition: a) 10 to 99% by weight of the cationically polymerizable component (A), the cationically polymerizable component (A) preferably consisting of the is selected from epoxy-containing compounds (A1), oxetane-containing compounds (A2), vinyl ethers (A3) and combinations thereof, optionally together with an alcohol as chain transfer agent (A4) and / or a cationically polymerizable hybrid compound (A5); b) at least 0.1% by weight of the moisture-latent initiator (B); c) 0.1 to 50% by weight of the free-radically radiation-curable compound (D); d) 0.01 to 5% by weight of the photoinitiator for the radical polymerization (E); and e) 0 to 70% by weight of the additives (G).
- the cationically polymerizable component (A) preferably consisting of the is selected from epoxy-containing compounds (A1), oxe
- the cationically polymerizable component (A) has in each case at least 10% by weight of an aliphatic and / or cycloaliphatic epoxide, based on the total weight of the composition, preferably at least 10% by weight of a cycloaliphatic epoxide.
- the mass in addition to the components of the third embodiment, also contains the tackifier (F) in proportions of up to 30% by weight, preferably 5 to 30% by weight.
- compositions according to the invention are preferably provided as one-component compositions. Use of the masses according to the invention
- the mass hardens at room temperature, especially over a period of less than 7 days, preferably within 5 days and more preferably within 2 days.
- the compound according to the invention is particularly suitable for joining, coating and potting components which can be damaged by warping or deformation at elevated temperatures.
- the hardening reaction can be accelerated either by heating or by increased humidity.
- the curing time can be shortened by moistening the substrates before joining.
- the thickness of the layer to be cured and the access options for moisture which are determined, for example, by the geometry of the components to be joined, determine the duration until complete curing.
- the individual components of the formulation also play a role in relation to the duration of moisture curing.
- a mass with hydrophilic components facilitates the entry of moisture.
- compositions of the second and third embodiment can also be fixed by exposure to actinic radiation. This is particularly suitable for manufacturing processes in which components have to be fixed in position quickly, preferably within a few seconds, before downstream processing steps.
- fixation denotes the build-up of a strength from which the mass can no longer flow at room temperature, or a degree of strength from which joined parts can be handled in subsequent processes without destroying the Adhesive bond comes.
- sufficient handling strength is considered to be achieved if a shear strength of> 1 MPa is preferably achieved.
- the masses of the fourth embodiment can be converted into a so-called “B-stage state” by exposure.
- the mass is tacky and can be handled essentially without flowing, but still allows joining with a second substrate with the formation of an adhesive bond.
- the final strength of the adhesive bond is achieved in this embodiment by the moisture curing.
- the cationically moisture-induced curable composition is used in a method for joining, casting or coating substrates, the method comprising the following steps: a) providing the composition according to the invention; b) metering the mass onto a first substrate; c) optionally supplying a second substrate to the mass; and d) allowing moisture to act until the mass is sufficiently stable to handle.
- the second substrate can be supplied within an open time of the mass, the end of the open time being defined by the beginning of a skin formation on the mass.
- the cationically moisture-induced curable compositions of the second and third embodiment can be used according to the invention in a method for joining, casting or coating substrates, the method comprising the following steps: a) providing the composition according to the invention; b) metering the mass onto a first substrate; c) optionally supplying a second substrate to the mass with the formation of an adhesive bond; d) fixing the mass by exposure to actinic radiation to activate the photoinitiator for cationic or radical polymerization; and e) allowing moisture to act on the fixed mass until the final strength is built up.
- the composition or the adhesive bond can be quickly fixed by exposure to light.
- the mass is preferably dimensionally stable after light fixation.
- compositions of the fourth embodiment which additionally contain the tackifier (F) can be converted into a so-called B-stage state by exposure to actinic radiation before joining. In this state, the flowability is restricted and the mass has pressure-sensitive adhesive properties.
- a method for joining, potting or coating substrates using a compound of the fourth embodiment can comprise the following steps: a) providing the compound according to the invention of the fourth embodiment; b) metering the mass onto a first substrate; c) exposing the mass to actinic radiation to activate the photoinitiator for free-radical polymerization; d) feeding a second substrate to the activated mass within the open time of the mass with the formation of an adhesive bond; and e) Allowing moisture to act on the adhesive bond until sufficient handling strength has been established.
- a waiting time can be observed between steps c) and d). This must not exceed the open time of the mass.
- All methods according to the invention are characterized in that the final strength of the masses can be achieved without additional heating of the substrate or adhesive bond.
- compositions according to the invention were treated with a DELOLUX 20/365 LED lamp from DELO Industrie Klebstoffe GmbH & Co. KGaA with an emission maximum at 365 nm with an intensity of 200 ⁇ 20 mW / cm 2 irradiated for a period of 60 s.
- Crosslinking or “curing” are defined as a polymerization or addition reaction beyond the gel point.
- the gel point is the point at which the storage modulus G ‘becomes equal to the loss modulus G ′′.
- the test specimens were cured at room temperature for 7 days.
- Room temperature is defined as 23 ⁇ 2 ° C.
- the strength after moisture curing and dual curing was in each case determined using the Dage Series 4000 bond tester, available from Nordson. For this purpose, a 4 x 4 x 4 mm glass cube was glued to a 20 x 20 x 5 mm aluminum test specimen (layer thickness 100 ⁇ m), and the glue was stored for 7 days at 50% relative humidity and 23 ° C. The glass cube was then separated from the aluminum test specimen under shear stress.
- the strength after dual curing was determined using the Dage Series 4000 bond tester, available from Nordson.
- a 4 x 4 x 4 mm glass cube was glued to a 20 x 20 x 5 mm aluminum test specimen (layer thickness 100 ⁇ m), and the gluing was carried out for 60 s with a DELOLUX 20/365 LED lamp at a wavelength of 365 nm and an intensity of 200 ⁇ 20 mW / cm 2 .
- the bonded test specimen was then tempered for 24 hours at room temperature and the glass cube was separated from the aluminum test specimen under shear stress. Open time (moisture hardening)
- the open time is the time between the dosing of the mass and the start of a skin formation.
- the skin formation is checked haptically on an activated drop of adhesive with a spatula.
- a skin is considered to have formed as soon as there is no more string. Production of the hardenable masses
- the cationically moisture-induced curable compositions used in the following examples are produced at a relative humidity of less than 20%, preferably less than 10%.
- production can take place in a glove box in which there is a dry (inert) atmosphere.
- the liquid components are mixed and then the fillers and optionally other solids are incorporated using a laboratory stirrer, laboratory dissolver or a speed mixer (Hauschild) until a homogeneous mass is created.
- Compositions which contain photoinitiators and which are sensitive to visible light must accordingly be produced under light outside the excitation wavelength of the photoinitiators or sensitizers.
- Component (A) Cationically polymerizable constituents
- OXT-221 bis [1-ethyl (3-oxetanyl)] methyl ether; available from Toagosei (A3) vinyl ether
- Rapicure CHVE 1,4-Cyclohexane dimethanol divinyl ether, available from BASF SE
- Irgacure PAG 290 tris (4 - ((4-acetylphenyl) thio) phenyl) sulfonium tetrakis (perfluorophenyl) borate, available from BASF
- Component (D) Compounds (d1-1) that cannot be cured by free radicals:
- Sartomer SR833S Tricyclodecanedimethanol Diacrylate, available from Sartomer
- Component (G) additives
- compositions of Examples 1 to 8 according to the invention all cure within less than 5 days.
- Examples 4 to 6 show the properties of compositions according to the invention according to the second embodiment.
- the masses can also be light-fixed within a few seconds. If necessary, dual curing of the masses can be carried out accordingly.
- compositions of Examples 7 and 8 are likewise light-fixable, the light fixability being achieved by adding a free-radical radiation-curable compound (D) and a photoinitiator for free-radical polymerization (E).
- Example 7 corresponds to inventive compositions of the third embodiment of the invention and example 8 corresponds to inventive compositions of the fourth embodiment.
- a tackifier By adding a tackifier (Example 8), the mass can be converted into a pressure-sensitive adhesive state (B-stage) by irradiation.
- Comparative Example 9 which contains a moisture-latent initiator, the hydrolysis product of which has a pKa greater than 0, does not harden even after more than 14 days.
- Comparative example 10 contains as cationically polymerizable component (A) exclusively an aromatic glycidyl ether and no cycloaliphatic epoxy resin. Precipitation occurred during production, so that it cannot be used in a process for gluing, potting, molding or coating substrates. It follows from this that no compositions according to the invention can be formulated solely on the basis of the aromatic epoxy compounds used.
- Comparative Example 11 also shows that a proportion of 5% by weight of an aliphatic epoxy compound is not sufficient to formulate a homogeneous mass in the presence of a high proportion of an aromatic glycidyl ether. A precipitate also formed during the production of the composition according to Comparative Example 11, so that it was not possible to use it in a method for gluing, casting, molding or coating substrates.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
Abstract
Description
Claims
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DE102019129517.3A DE102019129517A1 (de) | 2019-10-31 | 2019-10-31 | Kationisch feuchteinduziert härtbare Masse, Verwendung der Masse sowie Verfahren zum Fügen, Vergießen und Beschichten von Substraten |
PCT/EP2020/078262 WO2021083632A1 (de) | 2019-10-31 | 2020-10-08 | KATIONISCH FEUCHTEINDUZIERT HÄRTBARE MASSE, VERWENDUNG DER MASSE SOWIE VERFAHREN ZUM FÜGEN, VERGIEßEN UND BESCHICHTEN VON SUBSTRATEN |
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EP4051720A1 true EP4051720A1 (de) | 2022-09-07 |
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EP20789573.1A Pending EP4051720A1 (de) | 2019-10-31 | 2020-10-08 | KATIONISCH FEUCHTEINDUZIERT HÄRTBARE MASSE, VERWENDUNG DER MASSE SOWIE VERFAHREN ZUM FÜGEN, VERGIEßEN UND BESCHICHTEN VON SUBSTRATEN |
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EP (1) | EP4051720A1 (de) |
DE (1) | DE102019129517A1 (de) |
WO (1) | WO2021083632A1 (de) |
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US4393185A (en) | 1981-06-02 | 1983-07-12 | Ciba-Geigy Corporation | Thermally polymerizable mixtures and processes for the thermally-initiated polymerization of cationically polymerizable compounds |
US5089536A (en) | 1982-11-22 | 1992-02-18 | Minnesota Mining And Manufacturing Company | Energy polmerizable compositions containing organometallic initiators |
US5070161A (en) | 1988-05-27 | 1991-12-03 | Nippon Paint Co., Ltd. | Heat-latent, cationic polymerization initiator and resin compositions containing same |
DE19581345C2 (de) | 1994-02-21 | 2000-05-18 | Asahi Chemical Ind | Oxymethylen-Copolymer-Harzzusammensetzung |
US6180200B1 (en) | 1998-06-01 | 2001-01-30 | Dsm N. V. | Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs |
US20050215713A1 (en) | 2004-03-26 | 2005-09-29 | Hessell Edward T | Method of producing a crosslinked coating in the manufacture of integrated circuits |
JP5190055B2 (ja) | 2006-05-22 | 2013-04-24 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 低収縮性エポキシ−カチオン硬化性組成物 |
JP4135119B2 (ja) | 2006-09-29 | 2008-08-20 | Dic株式会社 | 多分岐ポリエーテルポリオール含有のカチオン重合性樹脂組成物、それを含む接着剤、ならびにそれを用いた積層体及び偏光板 |
EP2948506B1 (de) | 2013-01-23 | 2019-08-14 | Henkel IP & Holding GmbH | Unterfüllungszusammensetzung und verpackungsverfahren damit |
EP3088465B1 (de) | 2013-12-26 | 2019-02-13 | Daicel Corporation | Härtbare zusammensetzung für linse sowie linse und optische vorrichtung |
WO2015200706A1 (en) | 2014-06-25 | 2015-12-30 | Rensselaer Polytechnic Institute | Oxetane polymers and methods of preparation thereof |
AT517640A2 (de) | 2015-09-02 | 2017-03-15 | Technische Universität Wien | Verfahren zur Frontalpolymerisation |
EP3184569B1 (de) | 2015-12-23 | 2018-09-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Härtungsinitiatoren für die kationische polymerisation |
EP3421567B1 (de) | 2017-06-28 | 2024-09-18 | Henkel AG & Co. KGaA | Uv vorhärtbare epoxid-zusammensetzung für zweistufigen montageprozess |
US11667748B2 (en) | 2017-08-29 | 2023-06-06 | Mitsubishi Heavy Industries, Ltd. | Curable composition, curable paste material, curable sheet material, curable modeling material, curing method, and cured product |
CN107828359A (zh) * | 2017-11-13 | 2018-03-23 | 深圳市华星光电技术有限公司 | 框胶组合物与显示装置 |
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- 2019-10-31 DE DE102019129517.3A patent/DE102019129517A1/de active Pending
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- 2020-10-08 EP EP20789573.1A patent/EP4051720A1/de active Pending
- 2020-10-08 WO PCT/EP2020/078262 patent/WO2021083632A1/de unknown
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