EP4012856A1 - Agencement d'électrode pour un dispositif d'ionisation - Google Patents

Agencement d'électrode pour un dispositif d'ionisation Download PDF

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Publication number
EP4012856A1
EP4012856A1 EP21211121.5A EP21211121A EP4012856A1 EP 4012856 A1 EP4012856 A1 EP 4012856A1 EP 21211121 A EP21211121 A EP 21211121A EP 4012856 A1 EP4012856 A1 EP 4012856A1
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EP
European Patent Office
Prior art keywords
base support
electrode arrangement
electrode
electrodes
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21211121.5A
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German (de)
English (en)
Inventor
Alexander Hupp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metallux AG
Original Assignee
Metallux AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metallux AG filed Critical Metallux AG
Publication of EP4012856A1 publication Critical patent/EP4012856A1/fr
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T19/00—Devices providing for corona discharge
    • H01T19/04—Devices providing for corona discharge having pointed electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T23/00—Apparatus for generating ions to be introduced into non-enclosed gases, e.g. into the atmosphere

Definitions

  • the present invention relates to an electrode arrangement for an ionization device, in particular for an antistatic device, a method for producing an electrode arrangement and an ionization device with such an electrode arrangement.
  • An ionization device is used to generate ions and can also be referred to as an ionizer or ionizer.
  • the ionization device can be used in particular to change an electrostatic charge.
  • an electrostatic charge can be generated, increased or reduced on an object and/or in an environment with the aid of the ionization device.
  • an undesirable static charge can form, which should be reduced in order to avoid spontaneous spark discharge with an arc.
  • an ionization device working as an antistatic device is used.
  • it can be advantageous e.g. when painting large metal components, to specifically charge the respective component statically in order to achieve better adhesion and more even distribution of a spray paint.
  • an ionization device designed as a static device can be used.
  • the DE 10 2011 007 138 B4 describes a generic electrode arrangement for an antistatic device for reducing electrostatic charges on a moving web of material.
  • the electrode arrangement has at least one high-voltage resistor arrangement, which comprises a carrier material made of plastic, onto which a plurality of resistance tracks made of a polymer paste are printed and arranged next to one another in a longitudinal direction of the carrier material, the resistance tracks having high-voltage resistors in the range from form 100 k ⁇ to 100 G ⁇ .
  • the electrode arrangement comprises a plurality of electrodes, each having an electrode tip, which are each electrically contacted with a resistance track of the high-voltage resistance arrangement.
  • the permissible operating temperature is limited to values below 80 C°. If higher operating temperatures are reached, the printed resistance track begins to constantly change or decrease its resistance value.
  • the present invention is therefore concerned with the problem of specifying an improved or at least an alternative embodiment of an electrode arrangement for an ionization device and an ionization device equipped therewith, which is improved in particular with regard to production costs and/or with regard to the area of use.
  • the present invention is based on the general idea of specifying an electrode arrangement with a hybrid resistance carrier which has a plastic base carrier and a ceramic carrier which are connected to one another, in particular in a materially bonded, form-fitting, non-positive manner and/or are glued, with electrodes of the electrode arrangement being fixed to the plastic base support, while resistors of the resistance arrangement are located on the ceramic support.
  • the electrode arrangement can be used in the high-voltage range (approx. 1 kV to 150 kV) to generate electric fields for ionizing and/or discharging objects and/or spaces and can therefore form an ionization and/or discharging electrode arrangement.
  • the electrode arrangement according to the invention for an ionization device in particular for an antistatic device, for generating ions and/or for changing electrostatic charges, has at least one base carrier designed as a plastic component.
  • the base support can be designed as a rigid plastic component or as a flexible plastic component, in particular as a film.
  • the electrode arrangement can be used in an ionization device, e.g. as an antistatic device, to reduce electrostatic charges on a moving web of material or also to reduce electrostatic charges on a stationary body or component.
  • the electrode arrangement can also be used in an ionization device, e.g. as a static device, for charging a body, e.g. in a painting process.
  • the electrode arrangement comprises at least one high-voltage resistor arrangement, which has a ceramic carrier on which a number of resistor tracks made of a resistor paste are printed, preferably by means of screen printing.
  • the ceramic carrier can be formed from a ceramic material and/or from a ceramic-based carrier material.
  • the ceramic carrier can be designed as a rigid ceramic component.
  • the ceramic carrier has due The ceramic material has a high temperature resistance and can be produced comparatively easily and inexpensively with a high-quality flat surface that can be printed evenly in a particularly simple manner.
  • the base carrier designed as a plastic component can be designed and/or manufactured separately from the ceramic carrier.
  • the resistor paste can be a conventional resistor paste and/or conventional screen printing paste that is used to produce high-impedance resistors.
  • the conventional resistor paste or screen printing paste can be a polymer-free resistor paste and/or a glass ceramic-based resistor paste and/or a cermet-based resistor paste and/or a thick-film resistor paste.
  • conventional resistor pastes or screen printing pastes have a lower and/or weaker and/or negligible temperature dependence of the electrical resistance for the electrode arrangement, so that no irreversible decrease in resistance relevant to the operation of the electrode arrangement occurs, particularly when the temperature increases.
  • Such a conventional resistance paste and/or conventional screen printing paste can be printed onto a surface of the ceramic carrier and then processed at at least 800° C., in particular at 850° C., in particular dried and/or hardened and/or baked on the ceramic carrier.
  • the electrode arrangement in particular the high-voltage resistor arrangement, can be used at voltages of approximately 1 kV to 150 kV.
  • each resistance track printed on the ceramic carrier can have ohmic resistance values of 100 k ⁇ to 100 G ⁇ .
  • Several resistance tracks made of the resistance paste can be printed on the ceramic carrier, which is particularly one-piece and/or one-part, and/or arranged next to one another, in particular next to one another and at a distance from one another, in a longitudinal direction of the electrode arrangement and/or the ceramic carrier.
  • the resistance tracks can be printed on a surface of the ceramic carrier that faces away from the base carrier, on the printing surface.
  • the resistance tracks can be designed as meandering resistance tracks.
  • the electrode arrangement has a plurality of electrodes which are fixed to the base support and which each have an electrode tip which is spaced apart from the base support.
  • the plurality of electrodes can be formed separately from each other.
  • the expression "fixed to the base support” can be understood here to mean that the electrodes are at least partially fixed in contact with the base support and/or that the electrodes are at least partially fixed in contact in the base support, with the position fixing and/or alignment of the electrodes within the electrode arrangement is defined by the base support.
  • the electrodes can be spaced apart from the ceramic carrier.
  • the electrodes can be fastened to the base support and/or in the base support in a form-fitting and/or material-to-material and/or non-positive manner.
  • the base support can be injection molded onto the electrodes. Accordingly, during the injection molding of the base body, the electrodes can form so-called inlays in the injection mold of the base body.
  • the base support designed as a plastic component and the ceramic support are connected to one another, in particular connected in a materially, form-fitting and/or non-positive manner.
  • the base support, which is designed as a plastic component, and the ceramic support can be connected to one another by means of a non-detachable connection which does not allow the base support and the ceramic support to be separated without being destroyed.
  • the base carrier designed as a plastic component and the ceramic carrier can be glued together.
  • the connection between the base carrier designed as a plastic component and the ceramic carrier can be designed as a permanent or permanent connection.
  • the base carrier and the ceramic carrier can be referred to as a hybrid resistance carrier.
  • the base support and the ceramic support can be bonded using an adhesive or glue which forms an adhesive layer between the base support and the ceramic support when it hardens or dries.
  • the ceramic carrier can have an adhesive surface on the ceramic carrier side, which can be opposite a pressure surface of the ceramic carrier and/or can face the base carrier.
  • the electrodes are each electrically contacted with a resistance path of the high-voltage resistance arrangement.
  • the electrical contact can be formed, for example, via an electrically conductive adhesive and/or soldered connection. It can be provided that the number of electrodes corresponds to the number of resistance tracks, so that exactly one electrode can be electrically contacted with exactly one resistance track of the high-voltage resistor arrangement.
  • the ceramic carrier can be manufactured with less technical effort than a plastic component produce within the required flatness tolerances, in particular without additional production steps. Fixing the electrodes on the base support designed as a plastic component can be implemented cost-effectively, and any unevenness in the base support that is present when the base support is bonded to the ceramic support can also be compensated for, so that the production requirements for the base support can be reduced. Overall, the proportion of rejects from the electrode arrangement and/or the components of the electrode arrangement within a production order can therefore be significantly reduced, resulting in low production costs.
  • a further advantage results from the fact that a conventional resistance paste or screen printing paste can be used with the ceramic carrier, so that the resistance tracks do not develop any significant reduction in resistance when the temperature increases and consequently the electrode arrangement in applications in potentially explosive environments (e.g. environments in which the ATEX regulation applies) can be used.
  • An embodiment is preferred in which the resistance tracks of the high-voltage resistor arrangement are arranged on a side of the ceramic carrier which faces away from the base carrier. This simplifies the fixing of the ceramic carrier on the base carrier. Heat that can arise at the high-voltage resistors during operation of the electrode arrangement can also be dissipated or radiated better in this way.
  • the base support is glued to the ceramic support.
  • an adhesive layer is arranged between the base support and the ceramic support, which adhesive layer connects the base support to the ceramic support. This simplifies the series production of the electrode arrangement.
  • the base support is designed as an injection molded component, in particular as a duromer injection molded component, and/or that the base support is injection molded onto the electrodes.
  • the design of the base support as an injection molded component, in particular as a duromer injection molded component, enables more cost-effective production, with the entire structure of the electrode arrangement being independent of the injection molding process and the associated process fluctuations with regard to the flatness of the surfaces, since the base support is not directly printed with the resistor paste , but is glued to the ceramic carrier, which has a comparatively higher surface evenness.
  • the electrodes can be fixed to the base support in a material-to-material and/or non-positive and/or form-fitting manner, with the assembly step taking place after the formation of the injection-molded component base support by means of an injection molding process.
  • the base support is molded onto at least one, several or all electrodes during the injection molding process.
  • the number of assembly steps can be reduced in order to further reduce manufacturing costs.
  • the electrode arrangement has an air flow guidance system which is designed to guide an air flow in such a way that an air flow is led to the electrode tips. Provision can be made for the air flow guidance system to be formed by the base support with fixed electrodes.
  • the air flow guidance system can be designed in such a way that at least one or more components of the electrode arrangement can be flowed through at least partially and/or in sections by the guided air flow.
  • the air flow guidance system can be designed in such a way that one or more air flows are guided to the electrode tips along an air flow direction which is aligned transversely and/or perpendicularly to a longitudinal direction of the electrode arrangement.
  • the guided air flow can be used by the air flow guidance system in order to bring about an increase in the discharge range of the electrode tip and/or in order to cool the electrode tips and/or to clean the electrode tips.
  • the base support has a plurality of airflow ducts for forming the airflow control system, which are each formed to guide an air flow and which are each formed at least partially in the base support, and/or that the electrodes each have an electrode body with a Have through-flow channel for forming the air flow management system, wherein the respective through-flow channel is designed for guiding an air flow.
  • the base support can have a plurality of air flow ducts which are formed separately from one another, in particular which are fluidically separated from one another.
  • the separately Air flow channels formed from one another can also be arranged at a distance from one another and/or parallel to one another with respect to a longitudinal direction of the electrode arrangement. These air flow channels can completely penetrate the base support.
  • the electrode body can be designed as a hollow cylinder to form a flow channel.
  • the electrode body can be arranged between the electrode tip and the base support with respect to an air flow direction, which is aligned transversely and/or perpendicularly to a longitudinal direction of the electrode arrangement.
  • an air flow duct system can be formed without requiring additional components, so that the number of components required and the associated manufacturing steps are reduced.
  • the through-flow channel is fluidically connected to an air-flow guide channel of the base support. It can be provided here that the through-flow channel of each electrode body is fluidically connected to a separate air flow guide channel of the base support.
  • One, several or all electrode bodies can be arranged at least partially in an air flow duct of the base support, in particular arranged coaxially, in order to form a fluidic connection of the respective flow duct to the respective air flow duct.
  • One, several or all of the electrode bodies can be connected at least partially in a force-fitting and/or form-fitting and/or cohesive manner to a wall of the Be connected to the base support, which forms the respective airflow duct of the base support.
  • the air flow ducts can form a multiple function, the first function being a configuration of the air flow duct system and the second function being a fixing of the electrodes to the base support.
  • the overall structure of the electrode arrangement can be simplified.
  • the air flow ducts of the base support have a circular cross-section transverse to the air flow direction, and/or that the electrodes are each formed from a wire, with the respective electrode body being wound up in a helical shape, so that a hollow electrode interior is formed , which forms the respective flow channel.
  • the air flow ducts of the base support can be designed, for example, as bores or as injection-molded recesses.
  • the circular cross section transverse to the air flow direction can have a substantially constant diameter along the air flow direction.
  • the circular cross section can vary transversely to the air flow direction along the air flow direction, in particular vary continuously or step by step.
  • the electrode body wound up in a helical manner can have a circular-cylindrical outer contour or enveloping outer jacket boundary surface. Adjacent windings of the electrode body can be formed in contact with one another.
  • the circular-cylindrical outer contour or enveloping outer casing boundary surface can be adapted to the circular cross-section of the air flow ducts of the base support.
  • the separate conductor tracks can form a number of separate contact zones and/or a contact track.
  • the conductive paste can have smaller resistance values than the resistor paste.
  • the conductive paste can be formed from conductive silver.
  • Each contact zone can be printed on the ceramic carrier at a distance from the contact track with respect to a direction transverse to the longitudinal direction of the electrode arrangement.
  • the separate contact zones can be printed on the ceramic carrier at a distance from one another with respect to a longitudinal direction of the electrode arrangement.
  • the contact zones can be designed for electrical contacting of an electrically conductive adhesive and/or soldered connection.
  • At least one or more, in particular all, resistance tracks can be electrically contacted at one of their ends with a contact zone that is printed on the ceramic carrier.
  • At least two or more, in particular all, resistance tracks can be electrically contacted at one of their ends with a common electrical contact track that is printed on the ceramic carrier.
  • the base carrier has a contacting recess for each electrode and that the ceramic carrier has contacting openings that correspond to the contacting recesses.
  • the contact breakthroughs are at least partially delimited by a printed conductor track, in particular contact zones, with each conductor track making electrical contact with a resistance track.
  • an electrically conductive adhesive and/or an electrically conductive solder is introduced into the contacting recess in such a way that the adhesive and/or the solder forms an electrically conductive connection between the respective electrode and an associated conductor track.
  • a plurality of electrodes are arranged at a distance from one another and/or parallel to one another with respect to a longitudinal direction of the electrode arrangement.
  • the plurality of resistance tracks on the ceramic carrier are arranged at a distance from one another with respect to a longitudinal direction of the electrode arrangement.
  • An ionization device is used for electrostatically charging and/or discharging a substrate and is equipped with at least one electrode arrangement of the type described above.
  • the ionization device can have at least one electrode holder for holding the respective Have electrode arrangement.
  • the ionization device can also be equipped with an electrical energy supply device, such as a control unit, which is electrically connected to the respective electrode arrangement.
  • the electrodes can be fixed to the base support in an assembly step in a material-to-material and/or force-fitting and/or form-fitting manner, with the assembly step being able to take place after the formation of the base support of the injection-molded component, in particular a duromer injection-molded component, by means of an injection-molding process.
  • the base support is molded onto at least one, several or all electrodes during the injection molding process.
  • the base support can be connected to the ceramic support by means of a materially bonded, form-fitting and/or non-positive connection.
  • the base support can be connected to the ceramic support by means of a non-detachable connection that does not allow non-destructive separation of the base support and the ceramic support.
  • the base support can be glued to the ceramic support.
  • the connection between the base carrier designed as a plastic component and the ceramic carrier can be designed as a permanent or permanent connection.
  • the base support can be permanently connected, e.g. glued, to the ceramic support.
  • the invention relates to the use of the method according to the invention for producing the electrode arrangement according to the invention.
  • the invention also relates to a base support for an electrode arrangement according to the invention, the base support being designed as a plastic component, in particular as a duromer component and/or as an injection molded component and/or as a duromer injection molded component.
  • the base support for an electrode arrangement according to the invention can have the above-mentioned and the following features with regard to the base support in the respectively specified combination, in other combinations or on their own.
  • the invention relates to the use of the base support according to the invention in an electrode arrangement according to the invention.
  • the base support has a plurality of air flow ducts for forming an air flow duct system, which are each formed for guiding an air flow.
  • the invention relates to a high-voltage resistor arrangement for an electrode arrangement according to the invention with a ceramic carrier on which a plurality of resistance paths made of a resistance paste are printed.
  • the high-voltage resistor arrangement for an electrode arrangement according to the invention can have the above-mentioned and the following features with regard to the high-voltage resistor arrangement in the respectively specified combination, in other combinations or on their own.
  • the invention relates to the use of the high-voltage resistor arrangement according to the invention in an electrode arrangement according to the invention.
  • the invention relates to an electrode for an electrode arrangement according to the invention, having an electrode body which has a throughflow channel for forming an airflow guiding system, the throughflow channel being designed for guiding an airflow.
  • the electrode for an electrode arrangement according to the invention can have the features mentioned above and the features below with regard to the electrode in the combination specified in each case, in other combinations or on their own.
  • the invention relates to the use of an electrode according to the invention in the electrode arrangement according to the invention.
  • the 1 shows a perspective exploded view of an electrode arrangement 1 according to the invention, which has a base carrier 2 made of plastic and a high-voltage resistor arrangement 3 comprising a ceramic-based ceramic carrier 4 .
  • the base support 2 has a base support-side adhesive surface 18 which is arranged opposite and/or facing a ceramic support-side adhesive surface 19 of the ceramic support 4 with respect to a transverse direction 17 of the electrode arrangement.
  • the adhesive surface 18 on the base carrier and the adhesive surface 19 on the ceramic carrier are wetted with an adhesive, in particular wetted over the entire surface, so that the adhesive forms a bond in the form of an adhesive layer 22 between the base carrier 2 and the ceramic carrier 4 after curing.
  • the base support 2 is in the form of a rigid injection molded plastic component, in particular as a rigid injection molded duromer component, to which a plurality of electrodes 6 are fixed and which each have an electrode tip 7 spaced apart from the base support 2 .
  • the electrodes 6 are arranged equidistant from one another with respect to a longitudinal direction 16 of the electrode arrangement 1 and are aligned parallel to one another.
  • the longitudinal direction 16 of the electrode arrangement 1 is aligned transversely to the transverse direction 16 of the electrode arrangement 1 .
  • the base support 2 has a longitudinal extent along a longitudinal direction 16 of the electrode arrangement 1 and a transverse extent along the transverse direction 17 of the electrode arrangement 1, the longitudinal extent of the base support 2 being greater than the transverse extent or thickness of the base support 2. Accordingly, the base support is designed flat and elongated.
  • All the electrodes 6 shown are aligned parallel to an air flow direction 12 which is aligned transversely to the longitudinal direction 16 of the electrode arrangement 1 and transversely to the transverse direction 17 of the electrode arrangement 1 .
  • the ceramic carrier 4 has a longitudinal extent along the longitudinal direction 16 of the electrode arrangement 1 and a transverse extent along the transverse direction 17 of the electrode arrangement 1, the longitudinal extent of the ceramic carrier 4 being greater than the transverse extent or thickness of the ceramic carrier 4. Accordingly, the ceramic carrier is also flat and elongated.
  • the transverse extent or thickness of the ceramic support 4 is smaller than the transverse extent or thickness of the base support 2.
  • a plurality of resistance paths 5 made of a resistance paste are printed on this printing surface of the ceramic carrier 4 .
  • the resistance tracks 5 can be in the form of meandering resistance tracks.
  • the plurality of resistance tracks are arranged next to one another and at a distance from one another with respect to the longitudinal direction 16 of the electrode arrangement 1 . In the finished state of the electrode arrangement 1, the resistance tracks 5 are thus located on a side of the ceramic carrier 4 facing away from the base carrier 2, namely on the pressure surface 20.
  • the base carrier 2 has a contacting recess 13 for each electrode 6 , the ceramic carrier 4 having contacting openings 14 corresponding to the contacting recesses 13 .
  • the contacting recesses 13 of the base support 2 only partially or not completely penetrate the base support 2 with respect to the transverse direction 17, starting from the adhesive surface 18 on the base support, the corresponding contacting openings 14 of the ceramic support completely penetrate the ceramic support 4 with respect to the transverse direction 17.
  • the contact openings 14 are each at least partially delimited or bordered by a printed conductor track 15, 15a. These printed circuit traces 15, 15a form a number of separate contact zones.
  • the resistance tracks 5 are each electrically contacted at one of their ends with a contact zone 15, 15a.
  • At least one printed conductor track 15, 15b forms a contact track, all resistance tracks 5 being electrically contacted at one of their ends with a common electrical contact track 15, 15b.
  • an electrically conductive adhesive and/or an electrically conductive solder is introduced into the contacting recess 13 in such a way that the adhesive and/or the solder creates an electrically conductive connection between the respective electrode 6 and an associated Forms conductor track 15.15 a or contact zone.
  • the number of resistance tracks 5 corresponds to the number of electrodes 6 , each electrode 6 being electrically contacted with a resistance track 5 of the high-voltage resistor arrangement 3 .
  • the electrode arrangement 1 has an air flow guidance system 8 which is designed to guide an air flow in such a way that an air flow is guided to the electrode tips 7 .
  • an air flow guidance system 8 which is designed to guide an air flow in such a way that an air flow is guided to the electrode tips 7 .
  • the base support 2 has a plurality of air flow ducts 9 which are formed separately from one another and are in particular fluidically separate from one another 2 and 3 are indicated with broken lines.
  • the air flow channels 9 formed separately from one another are spaced apart from one another with respect to a longitudinal direction 16 of the electrode arrangement 1 and aligned parallel to one another.
  • These air flow ducts 16 completely penetrate the base support with respect to the air flow direction 12, with an inflow opening 21 being arranged at one end of the air flow ducts 16, while an electrode 6 is arranged at an end of the respective air flow duct opposite the inflow opening 21.
  • the electrodes 6 each have an electrode body 10 with a flow channel 11 for forming the air flow guidance system 8, with the respective flow channel 11 being formed for guiding an air flow.
  • a flow channel 11 of an electrode 6 is in the enlarged section 23, which is in the 3 shown enlarged, indicated with broken lines.
  • the Electrodes 6 can, for example, each be formed from a wire, with the respective electrode body 10 being wound up in a helical manner in such a way that a hollow electrode interior space is created, which forms the respective through-flow channel 11 .
  • the through-flow channel 11 is fluidically connected to an air flow guide channel 9 of the base support 2 .
  • An air flow that enters the base support 2 through the flow opening 16 flows through both the air flow channel 9 and the through-flow channel 11 so that the air flow is guided along the air flow direction 12 to the electrode tip 7 .
  • the required air flow can be provided by an air conveying system, not shown.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Elimination Of Static Electricity (AREA)
  • Electrostatic Spraying Apparatus (AREA)
EP21211121.5A 2020-12-09 2021-11-29 Agencement d'électrode pour un dispositif d'ionisation Pending EP4012856A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102020215523.2A DE102020215523B4 (de) 2020-12-09 2020-12-09 Elektrodenanordnung, Ionisationsvorrichtung und Verfahren zur Herstellung einer Elektrodenanordnung

Publications (1)

Publication Number Publication Date
EP4012856A1 true EP4012856A1 (fr) 2022-06-15

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Application Number Title Priority Date Filing Date
EP21211121.5A Pending EP4012856A1 (fr) 2020-12-09 2021-11-29 Agencement d'électrode pour un dispositif d'ionisation

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EP (1) EP4012856A1 (fr)
DE (1) DE102020215523B4 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115360564A (zh) * 2022-08-17 2022-11-18 深圳市禹龙通电子股份有限公司 一种大功率射频电阻用的单引线及其防折断焊接装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115591669B (zh) * 2022-10-27 2024-07-02 东莞市南柏电子科技有限公司 一种空气电离装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3905799A1 (de) * 1989-02-24 1990-09-13 Eltex Elektrostatik Gmbh Hochspannungselektrode
DE202005012290U1 (de) * 2005-08-02 2005-10-13 Metallux Ag Hochspannungselektrodenanordnung
DE102015000800B3 (de) * 2015-01-22 2016-06-30 Franz Knopf Emissionsspitzen-Anordnung und Verfahren zu deren Betrieb
DE102011007138B4 (de) 2010-12-17 2018-04-05 Metallux Ag Elektrodenanordnung, Herstellungsverfahren

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59800829D1 (de) 1997-04-08 2001-07-19 Klaus Domschat Hochspannungselektroden-Anordnung
JP4345060B2 (ja) 2004-11-30 2009-10-14 Ｓｍｃ株式会社 イオナイザー

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3905799A1 (de) * 1989-02-24 1990-09-13 Eltex Elektrostatik Gmbh Hochspannungselektrode
DE202005012290U1 (de) * 2005-08-02 2005-10-13 Metallux Ag Hochspannungselektrodenanordnung
DE102011007138B4 (de) 2010-12-17 2018-04-05 Metallux Ag Elektrodenanordnung, Herstellungsverfahren
DE102015000800B3 (de) * 2015-01-22 2016-06-30 Franz Knopf Emissionsspitzen-Anordnung und Verfahren zu deren Betrieb

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115360564A (zh) * 2022-08-17 2022-11-18 深圳市禹龙通电子股份有限公司 一种大功率射频电阻用的单引线及其防折断焊接装置

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DE102020215523B4 (de) 2023-12-21
DE102020215523A1 (de) 2022-06-09

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