Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/38—Removing material by boring or cutting
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23C—MILLING
  • B23C3/00—Milling particular work; Special milling operations; Machines therefor
  • B23C3/002—Milling elongated workpieces
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
  • B23P13/00—Making metal objects by operations essentially involving machining but not covered by a single other subclass
  • B23P13/04—Making metal objects by operations essentially involving machining but not covered by a single other subclass involving slicing of profiled material
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
  • B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
  • B23P23/04—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass for both machining and other metal-working operations
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23C—MILLING
  • B23C2220/00—Details of milling processes
  • B23C2220/56—Plunge milling

Definitions

• the invention relates to a method for cutting
• the invention further relates to a corresponding processing V orraum.
• Processing device for cutting processing of a tubular workpiece by means of a
• Processing device a feed device for feeding of the workpiece to be cut.
• the feed device guides the tubular workpiece to be cut one
• Laser processing device of the processing device for laser cutting In the course of
• Laser cutting process in particular gradually cut pipe parts from the tubular workpieces.
• tubular workpieces can be cut into tubular parts.
• no workpieces can be cut that, in addition to a wall, also include internal workpiece sections, for example
• Laser processing device can not be cut, so that it is not possible to separate individual workpiece parts.
• Laser processing device can not be cut, so that it is not possible to separate individual workpiece parts.
• the invention is therefore based on the object to remedy the disadvantages of the prior art mentioned.
• hollow chamber profile-shaped workpiece with a wall and at least one lying within the wall
• Inner workpiece section in particular a separator.
• the processing is done using a
• Processing device the processing device being a laser processing device and an additional separating device, in particular a mechanical one
• the process includes the following steps:
• the workpiece to be machined can in particular
• the workpiece be rod-shaped and therefore have an elongated shape. Furthermore, the workpiece
• the workpiece inner section can thus in particular be at least one Separator can be formed, the at least a first
• the wall can be designed to run all the way round.
• At least one workpiece part can be separated from the workpiece by means of the method. It is conceivable that a large number, in particular of the same type,
• the separation area is the area of the workpiece in which the steps a. and b. be carried out, in particular to separate a workpiece part from the workpiece.
• step a. can according to the invention by means of
• Workpiece inner section of the workpiece are severed in the separation area.
• This inner workpiece section is in particular with the laser cutting head
• Laser processing device is not accessible and can therefore not be cut by laser cutting.
• Laser processing device to cut the processing device by the of the
• Laser processing device severable sections of the workpiece during the cutting process by means of
• Laser processing device are cut and the inaccessible parts are cut by means of the cutting device. There is consequently a combination of the laser cutting process with a further cutting process, carried out by means of the cutting device.
• all inner workpiece sections are in particular
• step b. before step a. is carried out.
• step a. before step b. is carried out.
• the inner part of the workpiece in the separating area is first cut in particular by means of the separating device.
• the further ones that can be cut by the laser processing device are first cut in particular by means of the separating device.
• Workpiece sections are severed in the separation area, in particular to cut off a workpiece part from the workpiece.
• a wall area in the separation area In order to reach the inner part of the workpiece, it is conceivable, in particular in the case of peripheral walls, that a wall area in the
• Workpiece inner section is severed. Thereupon, a workpiece part can be completely removed by laser cutting
• the separating device is designed as a mechanical separating device.
• Separating device have a radial milling tool, in particular with comparatively less
• the mechanical separating device comprises a saw, for example a circular saw, a band saw and / or a jigsaw, in order to cut through the inner part of the workpiece in the separating area.
• the separating device is designed and configured to carry out a flame cutting process and / or a water jet cutting process in order to use the flame cutting process and / or the
• Separating device comprises a plunge cutter in order to step a. to cut the inner part of the workpiece in the cutting area by means of a plunge milling process. This enables a comparatively low-power severing of the
• Plunge milling for example, compared to radial milling, has the advantages of a low reaction force on the workpiece and a comparatively low one
• plunge milling is particularly suitable with low workpiece stability and / or with long tool overhangs due to the comparatively low machining forces that occur.
• the workpiece it is conceivable for the workpiece to be fed to the laser processing device and the mechanical separating device by means of a slide-through chuck with a comparatively low clamping force, so that, for example, milling away the inner part of the workpiece by means of a radial milling movement is comparatively expensive and difficult to accomplish.
• the machining spindle in step a is operated at a speed of at least 4000 rpm, in particular at least 6000 rpm.
• a processing speed in particular enables a comparatively economical cutting of the
• the plunge cutter in step a. is operated with a feed rate of at least 0.5 m / min, in particular at least 1.2 m / min.
• feed can enable a sufficiently high and therefore economical processing speed.
• the plunge milling cutter in step a. is operated at a peripheral speed of at least 100 m / min. Such a high one too
• Machining device has a chuck with at least one clamping jaw for clamping and moving the workpiece, the clamping force of the clamping jaw being a maximum of 2.5 kN, in particular a maximum of 2.0 kN.
• the clamping force of the clamping jaw being a maximum of 2.5 kN, in particular a maximum of 2.0 kN.
• a plunge milling process can be carried out in particular. Plunge milling enables in particular low-power machining of the workpiece. This is particularly due to the comparatively low reaction force on the workpiece and one
• processing device can perform any combination of the processing device. Furthermore, the processing device can perform any combination of the processing device.
• the workpiece advantageously consists of aluminum or comprises aluminum. Consequently, in particular
• the workpieces to be machined in accordance with the method consist of other common materials or comprise other common materials.
• common materials can also be structural steel, stainless steel, copper and / or brass. Additionally or alternatively, common materials of this type can also be used
• the object set is also achieved by a processing device for performing the
• Processing device has a laser processing device and an additional separation device, in particular a mechanical separation device.
• Hollow chamber profiles can be separated into individual pieces.
• the separating device preferably comprises one
• Plunge cutters Such a plunge cutter enables
• Plunge milling can be used to separate internal workpiece sections
• Vibrations are excited on the workpiece. Internal geometries can also be severed when the clamping force in a chuck
• Processing device are comparatively small and are, for example, at a maximum of about 2 kN per chuck of the chuck.
• the separating device comprises a machining spindle on which the plunge milling cutter can be arranged or
• Figure 1 is a schematic perspective view of a
• FIG. 2 shows a schematic perspective illustration of a workpiece to be machined by means of the machining device according to FIG. 1;
• FIG. 1 schematic representation of a separation process by means of the laser processing device according to Figure 1; and 5 shows a perspective view of a part of the workpiece of the workpiece shown in FIG. 2, separated by means of the separating processes shown in FIGS. 3 and 4.
• FIG. 1 shows schematically simplified a processing device generally designated by the reference numeral 10. This includes a laser processing device 12. Furthermore, this includes an additional cutting device 14.
• the laser processing device 12 comprises one
• Laser cutting head 18 leads.
• the separator 14 is next to or below the
• Laser cutting head 18 arranged. This comprises a shaft, shown in FIG. 3, which is rotatable about an axis of rotation 22
• a plunge cutter 26 is detachably arranged on the spindle 24.
• the processing device 10 further includes a
• Feeding device 28 for the lateral feeding of a workpiece 30 to be cut by the machining device 10. The process of separating a workpiece part from the
• the feed device 28 comprises one
• the feed device 28 further comprises a holding device 34 for holding and Displacement of the workpiece 30.
• the holding device 34 is driven by a motor and can be displaced back and forth in a feed direction (X direction) 36.
• Feed device 28 further comprises a machine bed 38 with guide rails 40 on which the holding device 34 is arranged such that it can be displaced.
• the holding device 34 also has a chuck 42 with four clamping jaws 44.
• the chuck 42 serves to hold the workpiece 30.
• the workpieces 30 are each clamped with a clamping force up to a maximum of approximately 2 to 2.5 kN per clamping jaw 44.
• the chuck 42 is rotatable, as indicated by the double arrow 46, in order to rotate a clamped workpiece 30.
• the feed device 28 further comprises a workpiece support 48 arranged on the machine bed 38 for supporting the workpiece 30.
• the feed device comprises
• Feed device 28 a push-through chuck 50, through which the workpiece 30 is fed to the laser processing device 12 or the separating device 14.
• Push-through chuck 50 likewise has clamping jaws, the workpiece 30 being carried through being clamped with a clamping force of up to a maximum of approximately 2 to 2.5 kN per clamping jaw.
• the processing device 10 further includes a
• Unloading device 51 for removing a cut workpiece Unloading device 51 for removing a cut workpiece.
• This magazine 53 can, for example, as
• drills, flow drills, thread cutting tools or thread forming tools can be arranged. Consequently, instead of a plunge milling cutter 26, for example, another tool can also be arranged on the spindle 24, for example in order to cut a thread in one
• processing device 10 is designed to carry out the following method:
• the workpiece 30 is designed as a hollow chamber profile and is shown schematically in perspective in FIG.
• the workpiece 30 can be designed in particular as an aluminum hollow chamber profile. Hence, that points
• Workpiece 30 in particular a rectangular or
• the workpiece 30 comprises a peripheral wall 52. Inside the wall is a
• Workpiece inner section 54 is arranged, which is designed as a separating web and consequently the workpiece 30 in two
• the separation area 62 is consequently the area of the workpiece 30 at which the workpiece part 60 is to be separated from the remaining workpiece 30. Then a plunge cutter 26 is used first
• Separator 54 is severed in the separation area 62. This continues until the inside of the opposite wall 52 is reached (cf. FIG. 3b). Overall, the
• the plunge milling process consequently introduced a circular cylindrical bore into the workpiece 30 with comparatively little force.
• the plunge milling process can be carried out with a plunge cutter with a diameter of 6 mm at a speed of 6000 revolutions per minute, which is one
• Circumferential speed of 113 per minute corresponds.
• the feed can be, for example, 1.2 m / min.
• Laser processing device 12 a laser cut 66 along the circumference 65 of the workpiece 30 in the separation area 62
• Wall 52 in the separation area 62 is cut over the entire circumference 65.
• the workpiece part 60 is consequently separated by a combination of a plunge milling process and a laser cutting process.
• the separating web 54 located in the interior of the wall 52 is first
• This interior area of the hollow chamber-shaped workpiece 30 is with
• Laser cutting head 18 cannot be severed. The entire remaining part of the workpiece 30 that can be cut by the laser radiation 18 is then cut in a particularly efficient and rapid manner by laser cutting. Overall, processing of hollow-chamber profile-like workpieces can thus be made possible by means of a laser processing device 12, by the process of the
• Laser processing device 12 not severable
• hollow chamber profile-like workpieces 30 are carried out.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Plasma & Fusion (AREA)
• Laser Beam Processing (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=68531537

Family Applications (1)

Country Status (4)

Family Cites Families (11)

• 2018
  • 2018-12-06 DE DE102018131186.9A patent/DE102018131186B4/de active Active
• 2019
  • 2019-11-07 CN CN201980070760.0A patent/CN112912203B/zh active Active
  • 2019-11-07 EP EP19801530.7A patent/EP3890918A1/de active Pending
  • 2019-11-07 WO PCT/EP2019/080502 patent/WO2020114705A1/de unknown

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