EP3885155B1 - Verfahren zur veredlung einer grossformatig bereitgestellten bauplatte - Google Patents

Verfahren zur veredlung einer grossformatig bereitgestellten bauplatte Download PDF

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Publication number
EP3885155B1
EP3885155B1 EP21174458.6A EP21174458A EP3885155B1 EP 3885155 B1 EP3885155 B1 EP 3885155B1 EP 21174458 A EP21174458 A EP 21174458A EP 3885155 B1 EP3885155 B1 EP 3885155B1
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EP
European Patent Office
Prior art keywords
building panel
embossing
embossed
depressions
upper side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP21174458.6A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3885155C0 (de
EP3885155A1 (de
Inventor
Frank Oldorff
Ingo Lehnhoff
Norbert Kalwa
Rüdiger KLUPSCH
Thomas Lehmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flooring Technologies Ltd
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Flooring Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Flooring Technologies Ltd filed Critical Flooring Technologies Ltd
Priority to PL21174458.6T priority Critical patent/PL3885155T3/pl
Priority to ES21174458T priority patent/ES2971683T3/es
Priority to EP21174458.6A priority patent/EP3885155B1/de
Publication of EP3885155A1 publication Critical patent/EP3885155A1/de
Application granted granted Critical
Publication of EP3885155B1 publication Critical patent/EP3885155B1/de
Publication of EP3885155C0 publication Critical patent/EP3885155C0/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/02005—Construction of joints, e.g. dividing strips
    • E04F15/02033—Joints with beveled or recessed upper edges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00—Processes for producing special ornamental bodies
    • B44C5/04—Ornamental plaques, e.g. decorative panels, decorative veneers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/24—Pressing or stamping ornamental designs on surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00—Processes for producing special ornamental bodies
    • B44C5/04—Ornamental plaques, e.g. decorative panels, decorative veneers
    • B44C5/043—Ornamental plaques, e.g. decorative panels, decorative veneers containing wooden elements
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
    • E04F15/102—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials of fibrous or chipped materials, e.g. bonded with synthetic resins

Definitions

  • the invention relates to a method for refining a provided building board made of HDF with a top and a bottom, with a relief being embossed at least into the top, and then a decor being printed onto the embossed top of the building board and the decor then being applied by applying a liquid overlay is sealed as an abrasion-resistant layer, the relief being embossed in a first embossing step as at least one strip-shaped depression with two opposite side walls, a bottom wall connecting them and a depth, the building board having a maximum bulk density in the cover layers of 950 to 1000 kg /m 3 was pressed.
  • a similar procedure is from the EP 1 820 640 B1 known.
  • an abrasion-resistant layer of electron beam-curable paint or a melamine resin coating with or without abrasion-resistant particles is applied. Thanks to the final coating, the refined building board has a very homogeneous and closed surface.
  • building panels are divided into individual panels and used, for example, as floor or wall and ceiling panels and are often provided with a wood, stone or fantasy decor with a superimposed, three-dimensional surface.
  • the divided panels have connecting means (tongue and groove) and are usually equipped with locking means for locking adjacent ones Panels equipped in horizontal and vertical directions (so-called click panels).
  • the overlay of decor and three-dimensional surface creates a realistic visual and tactile impression of the imitated material.
  • a structure that is adapted to the decor is referred to as a decor-synchronous structure (embossed register).
  • the decor is present either as a paper layer laminated onto the carrier plate or as a color layer printed directly on the carrier plate.
  • the decor also has a wear-resistant layer.
  • abrasion-resistant paper layers, so-called overlays, or abrasion-resistant lacquer or resin layers are used after curing.
  • the decor-synchronous structure is present as a three-dimensional surface structure and is embossed into the plate surface using a correspondingly three-dimensionally structured pressed sheet.
  • the thermal components of the coating that can be activated under pressure melt and run and fill the three-dimensional structural embossing as it hardens.
  • the structure usually has a height of up to 500 ⁇ m.
  • the number and depth of the structures are limited, on the one hand, by the available amount of components that can be activated and, on the other hand, by the pressing force.
  • the WO 2017/164806 A1 discloses a method for refining a building board, in which a recess embossed into the top is printed using a digital printer.
  • the EP 3 059 020 A1 discloses a method for producing a wood-based panel, the surface of which is moistened in sections with water-containing steam and then sanded in this section before a decorative layer is applied.
  • the building board is provided in a press-finished manner and its upper side is also provided with a press skin, further depressions running at an angle transversely to the first recesses are embossed, and the large-format building board provided is divided into individual panels by making a saw cut in and along the recesses and either mixing or sprinkling corundum into the liquid overlay.
  • the press skin preferably has a thickness of 0.3 to 0.5 mm.
  • the large-format panel is later divided into individual panels along the embossed recesses.
  • the embossed recesses then lower the top at the side edges.
  • the abutting edges of adjacent panels are therefore lower than the top.
  • a height offset cannot cause shadows that are visually noticeable because all butt joints are lowered.
  • a firm connection between adjacent panels can be achieved, which effectively prevents liquid from penetrating too quickly into the butt joint.
  • At least one further depression is preferably embossed at an angle transversely to the at least one depression.
  • a plurality of transverse depressions are preferably embossed, along which the panels can then be divided in the transverse direction.
  • the bulk density profile (the course of the density over the cross section of the plate) is compared to a usual bulk density profile, such as that from EP 3 023 261 B1 is known, is lowered.
  • a usual bulk density profile such as that from EP 3 023 261 B1 is known
  • the greatest bulk density results in the area of the top and bottom of the board.
  • Due to the heat input during pressing a pressed skin forms on the top and bottom, which is also called the “rotting layer”.
  • the plate is provided in a press-finished state, which means that the press skin is not removed.
  • a tempering agent can be applied to the top, which is preferably an aqueous melamine resin.
  • the remuneration agent ensures that the previously reduced bulk density on the top (in the top layer) is increased again in order to achieve sufficient strength properties on the later panels.
  • the building board is heated to 40 to 80 ° C, preferably 60 ° C, and when embossing the at least one depression, a surface temperature of up to 220 ° C is achieved.
  • the building board can be heated using steam.
  • the top of the build plate can be primed with a white paint before embossing the recess.
  • At least the depression can be printed with a single-color or multi-color decoration using a digital printer.
  • white paint any other color can be used if necessary.
  • the first embossing step can be carried out using at least one calender roll. This has the advantage that the embossing step is integrated into the production line can be.
  • the embossing can then immediately follow the pressing of the wood-based panel in a continuous press, in which the previously spread fiber cake was pressed into a panel of the desired thickness, or can be carried out before the printing of the top in a printing system. This optimizes production.
  • the building board After completion of the structure, which consists of at least a primer, the decoration and an abrasion-resistant layer, the building board is laminated in a short-cycle press under high pressure and high temperature and in a second embossing step it is embossed again into the at least one strip-shaped recess in order to create the To achieve the formation of the side walls without changing the depth of the position of the bottom wall.
  • the side walls formed in the first embossing step are "rounded" so that these roundings are converted back into a flat surface in the second embossing step.
  • the melamine resin hardens during the first embossing step and increases the raw density. If the tempering agent is applied after the first embossing step, it hardens in the short-cycle press. The same also applies if a sufficiently high temperature is not achieved in the first embossing step.
  • the depth of the at least one depression is preferably up to 0.7 mm and can in particular be stepped, so that the bottom wall is designed in a step-shaped manner. In such a case, several first pressing steps are carried out with different pressing depths.
  • markings can be printed on the bottom walls of the at least one recess, which can consist of lines, circles, dots, crosses or other graphic symbols. Lines are preferred. Using these markings, the building board can be aligned for the second embossing step and further subsequent processing steps using a camera system.
  • the repeated embossing into the recess in the second embossing step is preferably carried out in a short-cycle press in which strip-shaped elevations are applied to the press plate.
  • a structure can be embossed into the top, which runs at least partially synchronously with the decor, which is known in technical language as an “embossed register”.
  • the starting point is a large-format HDF board with a length of 2,800 or 1,860 mm, a width of 2,070 mm and a thickness of 7 to 14 mm.
  • the raw density is reduced compared to a usual HDF board as a comparison Figure 7 with the Figures 8 and 9 shows.
  • the top layer tips were lowered by at least 40 kg/m 3 compared to the standard. Good results were achieved with a reduction of up to 60 kg/m 3 .
  • the bulk density is in the range from 950 to 1000 kg/m 3 .
  • An example of the bulk density profile of a conventional HDF board is in Figure 7 shown.
  • Figures 8 and 9 show examples of bulk density profiles of building boards used according to the invention.
  • aqueous melamine resin In order to be able to emboss depressions 5, 6 in the top 2 of the building board 1, it is first heated to a temperature between 30 and 50 ° C using steam. Then 10 to 50 g/m 3 , preferably 30 g/m 3 , of aqueous melamine resin are applied as a modifier.
  • This can be a standard impregnation resin with a solids content of 50 to 65% by weight, preferably 60% by weight.
  • other additives such as hardeners, wetting agents and the like can be present in the solution.
  • UF resin or a mixture of UF and melamine resin can be used as a connecting agent.
  • flexibilizing agents e.g. 1,4-butanediol, caprolactam, polyglycol, etc.
  • a subsequent addition of the elasticizing agent should be in the order of approximately 3 to 7% by weight.
  • the building board 1 pretreated in this way is passed under one or more calender rolls 20 arranged one behind the other with embossing rings 21 arranged parallel to one another.
  • embossing rings 21 arranged parallel to one another.
  • depressions 5, 6 with a depth T of up to 0.7 mm are embossed into the top side 2 via the at least two embossing rings 21 in the longitudinal direction L and transverse direction Q.
  • the line pressure of the embossing rings 21 is up to 300 N/mm and the surface temperature is up to 220 ° C.
  • the tempering agent is at least partially implemented on the top side 2, i.e. it hardens at least partially and thereby increases the raw density.
  • the depressions 5, 6 can be formed in steps, for example by using several calender rolls 20 with different embossing rings 21 and, for example, first embossing 0.3 mm and then a further depth T of up to 0.7 mm. Between the embossing rings 21, a structure can be engraved into the jacket 22 of the calender roll 20, which is then embossed into the top 3 next to the depressions 5, 6 in the first embossing step.
  • the top 2 is primed with a white base color.
  • a decor 3 is printed onto the primer 11 using digital printing, with the color dots from the digital printer not only on the flat top 2, but also on the side walls 5.1, 5.2 and the bottom wall 5.3 of the strip-shaped depressions 5, 6 are depicted, so that the depressions 5, 6 are completely decorated.
  • the decor 3 can be single-colored or multi-colored and is applied in such a way that it is at least partially synchronous with the previously embossed structure.
  • markings 7 are printed on the bottom wall 5.3.
  • the markings 7 can be circles 7.1, crosses 7.2, lines 7.3 and dashes 7.4 or other geometric figures. Using these markings 7, the building board 2 can be aligned using a camera system to carry out further processing steps.
  • a counterweight 8 is placed on the underside 9 of the building board 1 and an overlay paper 4 is placed on the decor 3.
  • an overlay paper 4 is placed on the decor 3.
  • a liquid overlay can also be applied by roller application, into which corundum is mixed or sprinkled.
  • the countermove 8 can also be applied in liquid form.
  • This structure is then fed to a short-cycle press 30, the upper press plate 31 of which is provided with strip-shaped elevations 32.
  • the building board 1 is aligned using the markings 7 and a camera system, so that the elevations 32 are immersed again in the embossed recesses 5, 6 during the subsequent pressing of the structure and the side walls 5.1, 5.2 of the recesses 5, 6, which are rounded when the top side 2 is coated, are embossed again in order to adjust parallel and flat side walls 5.1, 5.2 in a second embossing step without changing the depth T of the recesses 5, 6 or the position of the bottom walls 5.3.
  • the elevations 32 in the transition area from the side walls 5.1, 5.2 to the bottom wall 5.3 are designed to be larger than the width of the recesses 5, 6 in order to reliably form the lower edges of the recesses 5, 6.
  • the pressing time in the second embossing step is between 10 and 30 seconds, preferably 12 to 15 seconds, during which the resins melt and bond to the building board 1.
  • the temperature of the pressing sheets 31, 33 is increased during pressing, so that a surface temperature on the compact increases from 120° to 180° C. during the pressing process.
  • the pressure progression takes place starting from a pressure build-up phase, transitioning into a holding phase and a pressure reduction phase.
  • the embossing depth T will be in the sense of a path control.
  • the at least one calender roller 20 is integrated into the printing system or is located immediately upstream of it. For a sensible design, first of all, Embossing step at least two in the longitudinal direction L and two in the transverse direction Q depressions 5, 6 are embossed so that the side edges of the divided panels are all lowered.

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Finishing Walls (AREA)
EP21174458.6A 2018-06-08 2018-06-08 Verfahren zur veredlung einer grossformatig bereitgestellten bauplatte Active EP3885155B1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PL21174458.6T PL3885155T3 (pl) 2018-06-08 2018-06-08 Sposób uszlachetniania dostarczonej wielkoformatowej płyty budowlanej
ES21174458T ES2971683T3 (es) 2018-06-08 2018-06-08 Procedimiento para el acabado de un panel de construcción de gran formato
EP21174458.6A EP3885155B1 (de) 2018-06-08 2018-06-08 Verfahren zur veredlung einer grossformatig bereitgestellten bauplatte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18176816.9A EP3578385B1 (de) 2018-06-08 2018-06-08 Verfahren zur veredelung einer grossformatig bereitgestellten bauplatte
EP21174458.6A EP3885155B1 (de) 2018-06-08 2018-06-08 Verfahren zur veredlung einer grossformatig bereitgestellten bauplatte

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
EP18176816.9A Division EP3578385B1 (de) 2018-06-08 2018-06-08 Verfahren zur veredelung einer grossformatig bereitgestellten bauplatte

Publications (3)

Publication Number Publication Date
EP3885155A1 EP3885155A1 (de) 2021-09-29
EP3885155B1 true EP3885155B1 (de) 2023-11-22
EP3885155C0 EP3885155C0 (de) 2023-11-22

Family

ID=62712757

Family Applications (2)

Application Number Title Priority Date Filing Date
EP18176816.9A Active EP3578385B1 (de) 2018-06-08 2018-06-08 Verfahren zur veredelung einer grossformatig bereitgestellten bauplatte
EP21174458.6A Active EP3885155B1 (de) 2018-06-08 2018-06-08 Verfahren zur veredlung einer grossformatig bereitgestellten bauplatte

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP18176816.9A Active EP3578385B1 (de) 2018-06-08 2018-06-08 Verfahren zur veredelung einer grossformatig bereitgestellten bauplatte

Country Status (8)

Country Link
US (1) US11156004B2 (zh)
EP (2) EP3578385B1 (zh)
CN (1) CN112423995B (zh)
ES (2) ES2882709T3 (zh)
PL (2) PL3578385T3 (zh)
PT (1) PT3578385T (zh)
RU (1) RU2757241C1 (zh)
WO (1) WO2019233652A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4579767A (en) * 1983-08-30 1986-04-01 Abitibi-Price Corporation Simulated ceramic tile
SE516696C2 (sv) * 1999-12-23 2002-02-12 Perstorp Flooring Ab Förfarande för framställning av ytelement vilka innefattar ett övre dekorativt skikt samt ytelement framställda enlit förfarandet
DE10362218B4 (de) * 2003-09-06 2010-09-16 Kronotec Ag Verfahren zum Versiegeln einer Bauplatte
DE102006007976B4 (de) 2006-02-21 2007-11-08 Flooring Technologies Ltd. Verfahren zur Veredelung einer Bauplatte
DE102008012220A1 (de) * 2008-03-03 2009-09-17 Flooring Technologies Ltd. Verfahren und Vorrichtung zum Herstellen einer Holzwerkstoffplatte
CN101998896B (zh) * 2008-04-07 2014-12-10 瓦林格创新股份有限公司 具有薄的表面层的基于木质纤维的镶板
ES2524143T3 (es) * 2012-11-12 2014-12-04 Flooring Technologies Ltd. Procedimiento para tratar una placa de compuesto de madera y placa de construcción con un núcleo de compuesto de madera
EP2905135A3 (de) * 2014-02-05 2015-12-02 Dirk Dammers Verfahren zur Herstellung eines Paneels
DE102014010747B4 (de) * 2014-07-23 2017-01-19 Flooring Technologies Ltd. Verfahren zur Herstellung von Bauplatten, insbesondere Fußbodenpaneelen
PT3181372T (pt) 2014-11-20 2021-03-31 Flooring Technologies Ltd Processo de acabamento de um painel de aglomerado de madeira
CN204435729U (zh) * 2014-12-24 2015-07-01 上海伊兆实业有限公司 一种装饰板
PL3059020T3 (pl) * 2015-02-23 2017-10-31 Flooring Technologies Ltd Sposób wytwarzania płyty z tworzywa drzewnego, zwłaszcza płyty z tworzywa drzewnego z warstwą wzoru
DE102015005864A1 (de) * 2015-05-11 2016-11-17 Fritz Egger Gmbh & Co. Og Verfahren zur Herstellung von Vertiefungen aufweisenden Paneelen
WO2017164806A1 (en) * 2016-03-24 2017-09-28 Välinge Innovation AB A method for forming a décor on a substrate

Also Published As

Publication number Publication date
ES2971683T3 (es) 2024-06-06
ES2882709T3 (es) 2021-12-02
PL3885155T3 (pl) 2024-04-15
CN112423995A (zh) 2021-02-26
US11156004B2 (en) 2021-10-26
EP3578385B1 (de) 2021-05-26
RU2757241C1 (ru) 2021-10-12
EP3885155C0 (de) 2023-11-22
PT3578385T (pt) 2021-08-19
PL3578385T3 (pl) 2021-12-27
WO2019233652A1 (de) 2019-12-12
CN112423995B (zh) 2021-12-07
EP3885155A1 (de) 2021-09-29
EP3578385A1 (de) 2019-12-11
US20210230880A1 (en) 2021-07-29

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