Classifications

• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
  • C25D17/06—Suspending or supporting devices for articles to be coated

Definitions

• the invention relates to plating hangers used for plating (electroplating) parts in Galvano industry.
• the invention relates to a plating hanger which provides a homogeneous plating with the equalization of the high current and low current zones by changing the distances of the part connections holding the part thereon to the anode.
• Boettper made the first nickel plating, the bath composition being nickel sulfate and ammonium sulfate.
• nickel plating commenced in the commercial sense for the first time (Berk, 2004).
• metals such as zinc, nickel, tin and brass began to spread.
• the applications made to the parts used in the electronics industry were manifested by the chemistry of the plating solution and the developments in the material.
• gold plating for electronic components.
• Less harmful plating solutions have begun to be used. This trend continued with the increase in the control of materials harmful to the environment.
• plastic plating is widely applied in almost every sector (automotive, white goods, sanitary ware, armature, cosmetics, textile, furniture, etc.).
• the plastic has become indispensable for plating as it can be processed easily, as compared to the high costs of its rivals, i.e. the metals such as zamak, yellow casting, and aluminium.
• chrome plating on plastic comes to the forefront.
• the chrome plating process on plastic adds an additional visuality to the plated product, but the longevity of the plated material is one of the main reasons for this plating process.
• Electrolytic plating is a process of depositing metal from a chemical medium to a material surface with the help of electrical energy.
• the plating bath is a solution containing dissolved metal salt or compound.
• the anode is the coating material, ie the wearing side, and the electrode connected to the positive (+) pole of the energy source.
• the cathode is the coated side, ie the coated material, and is connected to the negative (-) pole of the energy source.
• the distance to the anode and the current density are two important variables for the homogeneity of the plating. Knowing the current density is very important because it affects the amount and property of the plating taking place at the cathode. What is important in the plating is the ampere size applied per decimeter square (A / dm 2 ). The division of the amperage into the surface area is expressed as the current density. In the plating, the calculations are made with the surface area. Assuming that the current value applied to one of the two equal parts having the same surface area is twice the current applied to the other, a double metal is plated on the surface of the part, on which the high current value is applied, compared to the other.
• the greatest factor in the emergence of the plating hanger according to the invention is the need to provide a homogeneous plating by eliminating the excess current density formed on the materials to be coated.
• current maps were prepared by using analysis programs, and after these programmatic experiments and applications, the necessity of redesigning the plating hanger emerged.
• the plating hangers used in the present art are generally designed in such a way that their parts are at equal distances to the anode in the flat frame. Therefore, the parts in the central region of the hanger are less coated because they remain in the low current zone, while the edge regions have more plating thickness because they remain in the high current zone. Also in the present art, the current connection points of the hanger cause the parts in the hanger corner/edge regions to be coated more because the current prefer the shortest path in the current distribution. However, since the skeletons of the prior art hangers are designed in the bridge structure, low and high current zones are formed because the current prefers the shortest path.
• the object of the invention is to provide a plating hanger for obtaining a homogeneous plating.
• Another object of the invention is to produce the parts coated having more homogeneous thickness on the hanger.
• the design of the hanger connection body (hanger head) was changed in the first stage.
• the outer frame of the hanger constitutes the high current zone, and since the upper left part is the first part where the current enters, it is coated considerably thicker than the other zone parts. With these changes in the hanger head, a significant difference was observed in plating thickness measurements.
• Another object of the invention is to provide a curved hanger structure instead of the prior art flat hanger application. Thickness differences were observed after simulating the flat suspension in the plating analysis program and two curved surfaces were designed to eliminate these differences. With this design, the distances of the parts to the anode were modified. In this way, parts can be coated more homogeneously than flat hangers.
• Another object of the invention is to provide less anode consumption.
• Another object of the invention is to provide energy saving by achieving desired thickness in a shorter period of time.
• a plating hanger which is used to ensure homogeneous plating of the materials to be coated by the immersion method and which has at least one hanger frame, and hanger body having part connections holding the materials to be coated thereon, characterized in that the lenghts of the part connections on which the material to be coated in low current zones of said plating hanger are attached, are kept long and thereby approximated to the anode, and the lengths of the part connections on which the material to be coated in high current zones are attached are kept short and kept away from the anode.
• Figure 1 shows the figurative representation of the plating density in use of the old-type hanger head.
• Figure 2 shows the output of the simulation program of the plating density in use of the hanger head according to the invention.
• Figure 3 shows a perspective view of the plating hanger according to the invention.
• Figure 4 shows a front view of the plating hanger according to the invention.
• Figure 5 shows a side view of the plating hanger according to the invention.
• FIGS 3, 4 and 5 show views of the plating hanger (10) according to the invention.
• the materials to be coated (15) in the central region of the plating hanger (10) are less coated because they remain in the low current zone, whereas the edge regions have more plating thickness because they remain in the high current zone.
• the high current and low current zones are equalized by changing the distances of the part connections (17), which hold the materials to be coated (15) on the plating hanger (10), to the anode. Accordingly, the distance and angle of the part connecting ends (17), which hold the materials to be coated (15), to the hanger body (1 1 ) are changed whereby the distances of the materials to be coated (15) to the anode are changed. In this way, the materials to be coated (15) in the low current zones of the plating hanger (10) are brought closer to the anode, and the materials to be coated (15) in the high current zones thereof are kept away from the anode whereby it is obtained a more homogeneous plating . This is achieved by changing the length of the part connections (17).
• the distances of the part connecting terminals (16) to said hanger body (1 1 ) is changed by which part connections (17) on the sides are selected shorter and those on the middle part are selected longer such as to form a convex form.
• the homogeneous plating is obtained by changing the distance of the material to be coated (15) to the anode according to the current density of said material to be coated (15).
• the views of Figures 3 and 5 illustrate the selected lengths of said part connections (17).
• the homogeneous plating obtained by said curved (convex) form made on both surfaces of the plating hanger (10) according to the invention is fixed by all experimental data.
• the hanger body (1 1 ) within the hanger frame (12), on which the materials to be coated (15) are hanged is monolithic and filled with conductive plate.
• the current flowing to the materials to be coated (15) on the plating hanger (10) is distributed homogeneously and the plating thickness on the materials to be coated (15) is homogeneous.
• the hanger head (14) which provides the current passage by attaching the plating hanger (10) to the busbar (13) is designed differently from the prior art applications.
• the result obtained by said hanger head (14) will be more clearly understood by examining the views of Figures 1 and 2.
• Figure 1 shows the output of the simulation program of the plating density in use of the old-type hanger head.
• Figure 2 shows the output of the simulation program of the plating density in use of the hanger head (14) pertaining to the plating hanger (10) according to the invention.
• the outer frame of the hanger constitutes the high current zone, even further since the upper left part is the first part that the current enters, it is coated considerably thicker than the parts in the other zone.
• the hanger head busbar connecting terminal (14.1 ) is designed in U shape and determines the direction of current.
• the hunger head frame connecting body (14.2) has two long edges (14.2.1 ) extending at a certain angle towards the right and left upper corners of said hanger frame (12) and short edges (14.2.2) extending towards said hanger frame (12) such as to be in a parallel from the middle of both long edges (14.2.1 ) to the other edge (14.2.1 ) in order to distribute the current to the hanger frame (12) at equal density.
• the materials to be coated (15) in the hanger corner/edge region is prevented to take excessive current and thereby to be coated thin and burned.
• the plating hanger (10) according to the invention may have different dimensions in alternative areas of application. Therefore, dimensional changes have not been emphasized in the narratives.

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Electrochemistry (AREA)
• Materials Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Electroplating Methods And Accessories (AREA)

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• 2019
  • 2019-10-16 CN CN201980076691.4A patent/CN113166967A/zh active Pending
  • 2019-10-16 US US17/290,280 patent/US20210371999A1/en not_active Abandoned
  • 2019-10-16 EP EP19887346.5A patent/EP3884084A4/de not_active Withdrawn
  • 2019-10-16 WO PCT/TR2019/050874 patent/WO2020106253A2/en not_active Ceased
  • 2019-10-16 MX MX2021005524A patent/MX2021005524A/es unknown

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