EP3826803A4 - Dommage souterrain induit par un rayonnement incident pour propagation de fissure contrôlée dans le clivage de matériau - Google Patents
Dommage souterrain induit par un rayonnement incident pour propagation de fissure contrôlée dans le clivage de matériau Download PDFInfo
- Publication number
- EP3826803A4 EP3826803A4 EP19840951.8A EP19840951A EP3826803A4 EP 3826803 A4 EP3826803 A4 EP 3826803A4 EP 19840951 A EP19840951 A EP 19840951A EP 3826803 A4 EP3826803 A4 EP 3826803A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- incident radiation
- crack propagation
- radiation induced
- subsurface damage
- controlled crack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862703642P | 2018-07-26 | 2018-07-26 | |
PCT/US2019/043774 WO2020023929A1 (fr) | 2018-07-26 | 2019-07-26 | Dommage souterrain induit par un rayonnement incident pour propagation de fissure contrôlée dans le clivage de matériau |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3826803A1 EP3826803A1 (fr) | 2021-06-02 |
EP3826803A4 true EP3826803A4 (fr) | 2022-04-20 |
Family
ID=69180718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19840951.8A Pending EP3826803A4 (fr) | 2018-07-26 | 2019-07-26 | Dommage souterrain induit par un rayonnement incident pour propagation de fissure contrôlée dans le clivage de matériau |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3826803A4 (fr) |
JP (1) | JP7174850B2 (fr) |
KR (1) | KR102487262B1 (fr) |
CN (1) | CN112601633A (fr) |
TW (1) | TWI735924B (fr) |
WO (1) | WO2020023929A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022099659A (ja) * | 2020-12-23 | 2022-07-05 | Dgshape株式会社 | 歯冠補綴物の製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1570941A2 (fr) * | 2004-02-19 | 2005-09-07 | Canon Kabushiki Kaisha | Méthode de séparation par laser d'un substrat en silicium et composant semiconducteur obtenu par ce procédé |
US20160303764A1 (en) * | 2015-04-15 | 2016-10-20 | Halo Industries, Inc. | Capacitive Clamping Process for Cleaving Work Pieces Using Crack Propagation |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0839500A (ja) * | 1994-07-29 | 1996-02-13 | Hitachi Ltd | 基板製造法 |
JP2002075914A (ja) * | 2000-08-29 | 2002-03-15 | Sony Corp | 材料基板のへき開方法及びへき開装置 |
JP3626442B2 (ja) * | 2000-09-13 | 2005-03-09 | 浜松ホトニクス株式会社 | レーザ加工方法 |
KR100375173B1 (ko) * | 2000-10-20 | 2003-03-08 | 주식회사 실트론 | 단결정 잉곳의 제조 방법 및 이 단결정 잉곳을 이용한웨이퍼 제조방법 |
JP4728534B2 (ja) * | 2001-09-11 | 2011-07-20 | テイコクテーピングシステム株式会社 | シリコンウエハ保護フィルムのトリミング方法及びトリミング装置 |
JP3887394B2 (ja) * | 2004-10-08 | 2007-02-28 | 芝浦メカトロニクス株式会社 | 脆性材料の割断加工システム及びその方法 |
US7871899B2 (en) * | 2006-01-11 | 2011-01-18 | Amkor Technology, Inc. | Methods of forming back side layers for thinned wafers |
US8835802B2 (en) * | 2006-01-24 | 2014-09-16 | Stephen C. Baer | Cleaving wafers from silicon crystals |
KR101223470B1 (ko) * | 2008-04-14 | 2013-01-17 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료 기판의 가공 방법 |
US8623137B1 (en) * | 2008-05-07 | 2014-01-07 | Silicon Genesis Corporation | Method and device for slicing a shaped silicon ingot using layer transfer |
KR20110059366A (ko) * | 2009-11-27 | 2011-06-02 | 네오세미테크 주식회사 | 분리 영역이 형성된 단결정 반도체 기판과 이를 이용한 태양전지 및 그 제조방법 |
JP2012109341A (ja) * | 2010-11-16 | 2012-06-07 | Shibuya Kogyo Co Ltd | 半導体材料の切断方法と切断装置 |
AU2014311321A1 (en) * | 2013-08-29 | 2016-03-10 | The Board Of Trustees Of The Leland Stanford Junior University | Method of controlled crack propagation for material cleavage using electromagnetic forces |
JP6506520B2 (ja) * | 2014-09-16 | 2019-04-24 | 株式会社ディスコ | SiCのスライス方法 |
CN105436710B (zh) * | 2015-12-30 | 2019-03-05 | 大族激光科技产业集团股份有限公司 | 一种硅晶圆的激光剥离方法 |
JP6128666B2 (ja) * | 2016-03-02 | 2017-05-17 | 株式会社東京精密 | 半導体基板の割断方法及び割断装置 |
-
2019
- 2019-07-26 TW TW108126645A patent/TWI735924B/zh active
- 2019-07-26 CN CN201980049501.XA patent/CN112601633A/zh active Pending
- 2019-07-26 JP JP2021527028A patent/JP7174850B2/ja active Active
- 2019-07-26 EP EP19840951.8A patent/EP3826803A4/fr active Pending
- 2019-07-26 KR KR1020217006093A patent/KR102487262B1/ko active IP Right Grant
- 2019-07-26 WO PCT/US2019/043774 patent/WO2020023929A1/fr active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1570941A2 (fr) * | 2004-02-19 | 2005-09-07 | Canon Kabushiki Kaisha | Méthode de séparation par laser d'un substrat en silicium et composant semiconducteur obtenu par ce procédé |
US20160303764A1 (en) * | 2015-04-15 | 2016-10-20 | Halo Industries, Inc. | Capacitive Clamping Process for Cleaving Work Pieces Using Crack Propagation |
Non-Patent Citations (1)
Title |
---|
See also references of WO2020023929A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP7174850B2 (ja) | 2022-11-17 |
KR102487262B1 (ko) | 2023-01-10 |
JP2021531982A (ja) | 2021-11-25 |
KR20210038657A (ko) | 2021-04-07 |
TWI735924B (zh) | 2021-08-11 |
TW202019601A (zh) | 2020-06-01 |
EP3826803A1 (fr) | 2021-06-02 |
WO2020023929A1 (fr) | 2020-01-30 |
CN112601633A (zh) | 2021-04-02 |
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Legal Events
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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17P | Request for examination filed |
Effective date: 20210120 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
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DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20220322 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: C03B 33/033 20060101ALI20220316BHEP Ipc: C03B 33/02 20060101ALI20220316BHEP Ipc: H01S 5/02 20060101ALI20220316BHEP Ipc: B23K 26/53 20140101AFI20220316BHEP |