EP3817529A4 - Power supply device - Google Patents
Power supply device Download PDFInfo
- Publication number
- EP3817529A4 EP3817529A4 EP18924944.4A EP18924944A EP3817529A4 EP 3817529 A4 EP3817529 A4 EP 3817529A4 EP 18924944 A EP18924944 A EP 18924944A EP 3817529 A4 EP3817529 A4 EP 3817529A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- power supply
- supply device
- power
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/42—Arrangements or adaptations of power supply systems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/42—Arrangements or adaptations of power supply systems
- B64G1/428—Power distribution and management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/52—Protection, safety or emergency devices; Survival aids
- B64G1/58—Thermal protection, e.g. heat shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Aviation & Aerospace Engineering (AREA)
- Remote Sensing (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2018/024445 WO2020003423A1 (en) | 2018-06-27 | 2018-06-27 | Power supply device |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3817529A1 EP3817529A1 (en) | 2021-05-05 |
EP3817529A4 true EP3817529A4 (en) | 2021-07-28 |
EP3817529B1 EP3817529B1 (en) | 2023-10-04 |
Family
ID=68986722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP18924944.4A Active EP3817529B1 (en) | 2018-06-27 | 2018-06-27 | Power supply device |
Country Status (4)
Country | Link |
---|---|
US (1) | US11772829B2 (en) |
EP (1) | EP3817529B1 (en) |
JP (1) | JP7278278B2 (en) |
WO (1) | WO2020003423A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018127075B4 (en) * | 2018-10-30 | 2021-12-30 | Auto-Kabel Management Gmbh | High current circuit |
DE102022102408A1 (en) * | 2022-02-02 | 2023-08-03 | Schaeffler Technologies AG & Co. KG | Electrical System and Electric Drive Unit |
WO2024034578A1 (en) * | 2022-08-08 | 2024-02-15 | 株式会社Ihi | Substrate fixing structure |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4460917A (en) * | 1982-06-03 | 1984-07-17 | Motorola, Inc. | Molded-in isolation bushing for semiconductor devices |
JPH09283949A (en) * | 1996-04-10 | 1997-10-31 | Nemic Lambda Kk | Substrate mounting structure for electronic part |
US20030184969A1 (en) * | 2002-03-28 | 2003-10-02 | Toru Itabashi | Electronic control unit |
JP2011187729A (en) * | 2010-03-09 | 2011-09-22 | Sumitomo Heavy Ind Ltd | Electric field radiation-reducing structure |
WO2015076050A1 (en) * | 2013-11-20 | 2015-05-28 | 日立オートモティブシステムズ株式会社 | Electronic control apparatus mounting structure |
Family Cites Families (50)
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US4396936A (en) | 1980-12-29 | 1983-08-02 | Honeywell Information Systems, Inc. | Integrated circuit chip package with improved cooling means |
JPH0316291Y2 (en) * | 1985-04-27 | 1991-04-08 | ||
JPS62190356U (en) * | 1986-05-26 | 1987-12-03 | ||
JPH02220495A (en) * | 1989-02-22 | 1990-09-03 | Oki Electric Ind Co Ltd | Fixation of regulator and power transistor to board |
JPH04111493A (en) | 1990-08-31 | 1992-04-13 | Tanaka Kikinzoku Kogyo Kk | Solder leveler treatment method in manufacturing process of printed wiring method |
JPH04113695A (en) * | 1990-09-03 | 1992-04-15 | Fujitsu Ltd | Heat dissipating structure for electronic device |
JPH05160289A (en) | 1991-12-10 | 1993-06-25 | Fujitsu Ltd | Mounting structure of semiconductor chip |
JPH05259669A (en) | 1992-03-16 | 1993-10-08 | Fujitsu Ltd | Heat radiating structure of printed wiring board |
JPH07162177A (en) | 1993-12-09 | 1995-06-23 | Toshiba Electron Eng Corp | Radiator |
JPH0955459A (en) | 1995-06-06 | 1997-02-25 | Seiko Epson Corp | Semiconductor device |
JPH09130049A (en) | 1995-11-01 | 1997-05-16 | Cmk Corp | Method of forming via hole by build-up method of multilayer printed wiring board, and multilayer printed wiring board manufactured by it |
JP2861981B2 (en) | 1997-04-11 | 1999-02-24 | 日本電気株式会社 | Cooling structure of semiconductor device |
JPH1140966A (en) * | 1997-07-15 | 1999-02-12 | Alps Electric Co Ltd | Electronic device |
JP2000299564A (en) * | 1999-04-15 | 2000-10-24 | Fujitsu Ten Ltd | Heat-radiation structure for multi-layer substrate |
JP3733783B2 (en) | 1999-05-20 | 2006-01-11 | 株式会社村田製作所 | Module having heat dissipation structure of heating element |
FR2798814B1 (en) | 1999-09-22 | 2001-11-16 | Valeo Vision | IMPROVEMENTS IN ELECTRONIC THERMAL DRAIN ASSEMBLIES, IN PARTICULAR FOR A MOTOR VEHICLE PROJECTOR DISCHARGE LAMP CONTROL MODULE |
US6707671B2 (en) | 2001-05-31 | 2004-03-16 | Matsushita Electric Industrial Co., Ltd. | Power module and method of manufacturing the same |
US6493233B1 (en) * | 2001-08-21 | 2002-12-10 | Intel Corporation | PCB-to-chassis mounting schemes |
JP4113695B2 (en) | 2001-08-31 | 2008-07-09 | 本田技研工業株式会社 | Rear fender structure |
JP4071026B2 (en) | 2002-04-01 | 2008-04-02 | 三菱電機株式会社 | Artificial satellite structure |
ITTO20020416A1 (en) | 2002-05-16 | 2003-11-17 | Negesat Di Boer Fabrizio E C S | CONTAINMENT AND THERMAL DISSIPATION STRUCTURE FOR ELECTRONIC EQUIPMENT. |
JP3804861B2 (en) | 2002-08-29 | 2006-08-02 | 株式会社デンソー | Electrical device and wiring board |
JP2004158545A (en) | 2002-11-05 | 2004-06-03 | Denso Corp | Multilayer substrate and its manufacturing method |
DE10300175B4 (en) | 2003-01-08 | 2016-12-29 | Hella Kgaa Hueck & Co. | Electronic assembly with heat-dissipating housing part |
JP4280200B2 (en) | 2003-05-19 | 2009-06-17 | 株式会社日本触媒 | Resin composition for heat dissipation material |
WO2004101678A1 (en) | 2003-05-19 | 2004-11-25 | Nippon Shokubai Co., Ltd. | Resin composition for thermally conductive material and thermally conductive material |
JP4053478B2 (en) | 2003-08-11 | 2008-02-27 | 電気化学工業株式会社 | Method for manufacturing metal-based circuit board |
US7345350B2 (en) | 2003-09-23 | 2008-03-18 | Micron Technology, Inc. | Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias |
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JP2007019125A (en) | 2005-07-06 | 2007-01-25 | Yaskawa Electric Corp | Electric power conversion device |
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JP2013089683A (en) * | 2011-10-14 | 2013-05-13 | Sony Corp | Heat dissipation structure and electronic device |
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JP2013258330A (en) | 2012-06-13 | 2013-12-26 | Renesas Electronics Corp | Electronic apparatus and manufacturing method of the same |
JP2014036033A (en) | 2012-08-07 | 2014-02-24 | Hitachi Automotive Systems Ltd | Semiconductor device |
JP2015021118A (en) | 2013-07-23 | 2015-02-02 | スリーエム イノベイティブ プロパティズ カンパニー | Two-component potting composition |
JP2015207729A (en) | 2014-04-23 | 2015-11-19 | 三菱電機株式会社 | Printed wiring board |
JP2016171288A (en) | 2015-03-16 | 2016-09-23 | 日本精工株式会社 | Control unit, motor, electric power steering device, vehicle, conveying device, and industrial machine |
JP6693706B2 (en) | 2015-04-06 | 2020-05-13 | 株式会社デンソー | Electronic control unit |
-
2018
- 2018-06-27 WO PCT/JP2018/024445 patent/WO2020003423A1/en unknown
- 2018-06-27 US US17/254,313 patent/US11772829B2/en active Active
- 2018-06-27 EP EP18924944.4A patent/EP3817529B1/en active Active
- 2018-06-27 JP JP2020526793A patent/JP7278278B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4460917A (en) * | 1982-06-03 | 1984-07-17 | Motorola, Inc. | Molded-in isolation bushing for semiconductor devices |
JPH09283949A (en) * | 1996-04-10 | 1997-10-31 | Nemic Lambda Kk | Substrate mounting structure for electronic part |
US20030184969A1 (en) * | 2002-03-28 | 2003-10-02 | Toru Itabashi | Electronic control unit |
JP2011187729A (en) * | 2010-03-09 | 2011-09-22 | Sumitomo Heavy Ind Ltd | Electric field radiation-reducing structure |
WO2015076050A1 (en) * | 2013-11-20 | 2015-05-28 | 日立オートモティブシステムズ株式会社 | Electronic control apparatus mounting structure |
Also Published As
Publication number | Publication date |
---|---|
JP7278278B2 (en) | 2023-05-19 |
EP3817529B1 (en) | 2023-10-04 |
JPWO2020003423A1 (en) | 2021-04-22 |
WO2020003423A1 (en) | 2020-01-02 |
US11772829B2 (en) | 2023-10-03 |
EP3817529A1 (en) | 2021-05-05 |
US20210114751A1 (en) | 2021-04-22 |
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