EP3812684B1 - Dispositif de transfert de chaleur planaire, utilisation du dispositif et son procédé de fabrication - Google Patents
Dispositif de transfert de chaleur planaire, utilisation du dispositif et son procédé de fabrication Download PDFInfo
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- EP3812684B1 EP3812684B1 EP19205010.2A EP19205010A EP3812684B1 EP 3812684 B1 EP3812684 B1 EP 3812684B1 EP 19205010 A EP19205010 A EP 19205010A EP 3812684 B1 EP3812684 B1 EP 3812684B1
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- wall
- working fluid
- support structure
- capillary
- transfer device
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2225/00—Reinforcing means
- F28F2225/04—Reinforcing means for conduits
Definitions
- the present invention relates to a planar heat transfer device and a method for its production and in particular to large-area planar heat transfer devices (area-shaped design of the heat pipes, so-called heat pipes) with a folded capillary structure.
- Planar heat pipes are heat transfer devices that provide efficient heat equalization or areal heat transfer capability in a surface. Due to their design-related isothermal properties, they compensate for temperature peaks and ensure an even temperature distribution. At the same time, very large heat flows can be transferred, for example to a heat sink in a peripheral area.
- Planar heat pipes are already frequently used today for the surface cooling of electronic components. These are usually manufactured by layered sintering and are only a few cm 2 in size.
- a support structure is introduced into the heat pipes in order to be able to absorb the pressure forces.
- a planar heat pipe usually comprises two metal sheets (or walls in general) that are sealed at a certain distance from one another. The resulting cavity contains a working fluid which constantly condenses and evaporates during operation. This phase transition makes it possible to transfer large amounts of heat at a constant temperature level.
- the support structures used are, for example, nubs which must also be introduced.
- a planar heat transfer device according to the preamble of claim 1 is known from document U.S. 2013/312939 A1 .
- figure 5 12 shows an example of such a conventional planar heat transfer device having a first wall 410 and an opposing second wall 420.
- the first wall 410 and the second wall 420 extend in parallel, for example, in a plane (plane) in a predetermined
- a working fluid 450 is introduced, which collects vertically below in the liquid phase and fills the cavity 400 in the gas phase above.
- a capillary structure 470 is formed along the first wall 410, resulting in liquid working fluid 450 being carried vertically upward by capillary action.
- the liquid working fluid 450 successively evaporates along the first wall 410 (due to a heat source acting there).
- the gaseous working fluid condenses and flows vertically downward in the liquid phase.
- the entire cavity 400 forms a thermal circuit for the working fluid.
- the working fluid condensing on the second (condenser) side 420 runs by gravity to the lowest point of the heat pipe. From there, it must now be pumped along the evaporation surfaces with the help of capillary forces. Proper operation of the heat pipe is only guaranteed if the entire surface of the evaporator is supplied with working fluid. The required height of rise is therefore dependent on the length L of the heat pipe and its angle of inclination ⁇ . The capillary effect can only be implemented over a limited height. In order to achieve complete wetting of the first wall, the liquid working fluid would have to have an overall height L ⁇ sin a are transported, where ⁇ is the angle of inclination of the conventional heat transfer device relative to the horizontal.
- the rigidity of the construction also limits the maximum dimensions.
- the distance between the metal sheets 410, 420 must be kept more or less constant over the entire surface, since the vapor space should not be impaired by the metal sheets sagging.
- the present invention relates to a planar heat transfer device for dissipating and removing heat from a planar heat source.
- the device includes: a lumen and a capillary support structure.
- the cavity is bounded by a first wall for coupling to the planar heat source and an opposing second wall and includes a working fluid (eg, a phase change material).
- the capillary support structure extends folded in at least one direction between the first wall and the second wall to provide support and capillary action for condensed working fluid. This allows condensed working fluid to be transported through the capillary support structure from the second wall to the first wall.
- the capillary support structure thus performs two functions: providing capillary action to transport condensed working fluid and supporting the first against the second wall.
- the walls can in particular be planar or flat and extend, for example, in the form of a plate in one plane.
- the folded capillary support structure forms a wavy cross-section along the folding direction.
- the capillary support structure is formed from a wire mesh (mesh), which on the one hand offers sufficient mechanical stability and on the other hand provides pore structures for capillary transport. It can be advantageous here if the first and the second wall provide a certain pretension in order to compress the capillary support structure in order to keep the pore structure in the wire mesh correspondingly small and to increase the capillary effect.
- the material of the capillary support structure can be selected (e.g. made of a metal) in such a way that no additional spacers are required.
- the capillary support structure can completely fill the cavity so that it cannot be pushed sideways by the applied force.
- cavity is not intended to be limited to a vacuum in this space. Rather, at least the working fluid will be present there in the liquid or gaseous phase or a mixture of both. Substances can also be present (e.g. air).
- the capillary support structure is formed to the first wall and the to keep the second wall parallel to each other at a predetermined distance.
- the heat transfer device may include one or more additional spacers to ensure the predetermined spacing.
- the capillary support structure can be formed in such a way that it provides sufficient support.
- it is advantageously formed with sufficient strength and also folded in such a way that the desired mechanical stability is achieved.
- the sections that extend between the first and the second wall can be formed obliquely or almost perpendicularly to the first and the second wall.
- triangular cavities can be formed (in a cross-section along the fold) so as to achieve the desired mechanical stability. The cavity is sealed in a vacuum-tight manner to form a vapor space for the working fluid (in liquid and/or gaseous phase), the vapor space being divided by folding the capillary support structure.
- the capillary support structure thus forms a multiplicity of partition walls in the cavity due to the folds.
- the capillary support structure is folded in at least one direction, so that in the direction perpendicular thereto, the capillary support structure presents a linear pattern.
- the lines are formed by the folds.
- the capillary support structure it is also possible for the capillary support structure to also be folded along this horizontal direction, so that the capillary support structure can also extend there in a wavy or fold-like manner.
- the pressure in the cavity can also be adjusted accordingly in order to adjust a phase transition temperature accordingly.
- This adaptation depends, for example, on the area of application (e.g. whether it is used for photovoltaic systems, for cooling buildings, for cooling electronic components, etc.).
- the spacing between adjacent pleats can be chosen to be approximately the same as the predetermined spacing between the first wall and the second wall.
- the capillary support structure optionally has openings in order to achieve permeability of the capillary support structure for the gaseous working fluid. These openings can be in addition to the existing capillary-acting pores (or openings in the mesh) and made larger so that they do not become clogged with liquid working fluid. This allows the working fluid in the gas phase to spread throughout the cavity and thus bring about efficient heat equalization. In particular, it can easily flow vertically upwards (against gravity) and thermally connect multiple fold interstices.
- the capillary support structure is formed as a homogeneous structure (e.g., as a homogeneous lattice or wire mesh).
- the capillary support structure extends at least partially parallel along the second wall to transport condensed working fluid against gravity along the second wall, the first wall forming an evaporating surface and the second wall forming a condensing surface for the working fluid.
- a further capillary structure can optionally be formed along the second wall in order to enable a transport of condensed working fluid counter to gravity from one fold interspace to an adjacent fold interspace along the second wall.
- a continuous further capillary structure offers the advantage that the working fluid in the liquid phase can be transported vertically, specifically along the second wall, where condensation of the liquid phase of the working fluid occurs.
- the sections formed parallel to the second wall have the same effect.
- the heat transfer device comprises (at least) a heat sink in an edge area of the cavity, the edge area for example in the direction of the folds (perpendicular to the direction of the folds).
- the heat sink can, for example, allow cooling via water or air (via a fan or cooling fins).
- the introduction of the working fluid is independent of the production of the cavity between the first and second walls and the pleated capillary support structure disposed therein.
- the working fluid can be introduced later, depending on the area of application, via an existing opening (for example, the air can escape via a further opening).
- the air can be evacuated beforehand.
- the working fluid can also be introduced first and the air present is later removed from the cavity.
- the cavity is also optionally possible for the cavity to be completely filled with working fluid in the gaseous phase, for example in the gaseous phase at a correspondingly high temperature, so that the air located therein is automatically displaced.
- this introduction of the gaseous working fluid can take place in such a way that the opening is located vertically above the cavity or below it, as a result of which effective introduction is possible.
- the heat transfer device After closing the opening, the heat transfer device can be cooled, which leads to a condensation of the working fluid, so that the resulting heat transfer device can then be used.
- the heat transfer device includes a cavity 100 bounded by a first wall 110 for coupling to the planar heat source and an opposing second wall 120 .
- the apparatus further includes a capillary support structure 200 having pleats 210 in at least one direction R (or opposite thereto) extending between the first wall 110 and the second wall 120 to provide support and capillary action for condensed working fluid.
- the working fluid has not yet been introduced into the cavity 100 .
- the capillary support structure 200 is formed folded in the cavity 100 . It can extend in sections along the second wall 120 and is folded periodically (wavy) towards the first wall 110 . No edges or corners need to be formed. The rounded folds shown facilitate liquid transport. According to exemplary embodiments, there are no attachments to the first and second walls 110, 120 (the walls 110, 120 are only supported), but can optionally be present.
- the first wall 110 and / or the second wall 120 may be formed as metal sheets to a to achieve thermal coupling to the environment.
- the capillary support structure 200 can be formed as a homogeneous structure along the folds 210 . In particular, no further openings are required, but they can be formed optionally.
- the folds 210 enclose triangular areas, for example, which ensure high mechanical stability. This is advantageous since there are generally no further spacers.
- the capillary support structure 200 has sufficient mechanical stability to keep the first and second walls at a predetermined distance t from one another, even when the cavity 100 is evacuated and/or thermal stresses/negative pressure exert a force perpendicular to the first and second wall 110,120.
- the capillary support structure 200 is formed, for example, in the form of a wire mesh (mesh, e.g. made of metal) and not as a continuous metal foil or sheet. In order to achieve a sufficient support effect, the capillary support structure 200 can extend over the entire cavity 100 and abut the ends of the cavity 100 . The capillary support structure 200 cannot then be pushed out to the side.
- a wire mesh mesh, e.g. made of metal
- FIG. 5 shows a planar heat transfer device according to another embodiment configured for heat distribution and removal of heat from a planar heat source 50.
- the working fluid 150 is introduced into the cavity 100 .
- the planar heat source 50 is shown only schematically via the generated heat Q, which leads to a heat input into the first wall 110, as a result of which the working fluid 150 at least partially evaporates.
- This first wall 110 thus acts as an evaporation wall.
- the second wall 120 is formed in the heat transfer device, on which the working fluid 150 at least partially condenses. This second wall 120 thus acts as a condensation wall.
- the working fluid 150 changes its state of aggregation continuously liquid to vapor or gas.
- the embodiments overcome the three problems of conventional planar heat pipes.
- the inserted wire mesh 200 provides the capillarity and the formed folds 210 (or beads) provide the support function since they absorb the axial forces between the two walls 110, 120. This not only increases the rigidity, but also ensures that the required distance t between the walls 110, 120 (steam space) is maintained.
- the previously required additional support structure can be omitted.
- the capillary structure which is required for the capillary effect, takes on this task and thus replaces an additional component.
- the folds 210 divide the cavity 100 into partitioned areas where the working fluid 150 circulates.
- H t ⁇ t mesh ⁇ cos a
- t is the predetermined distance between the first and second walls 110, 120
- t mesh is the thickness of the capillary support structure 200 (eg, the mesh)
- ⁇ is the angle of inclination.
- FIGS 3A, 3B show enlarged views of the heat transfer device according to embodiments, wherein in FIG Figure 3A see an example inclined application and in the Figure 3B a horizontal application example is shown.
- the first wall 110 is again shown vertically above the second wall 120 between which the pleated capillary support structure 200 extends.
- the folds 210 of the capillary support structure 200 thus form partition walls between adjacent vapor spaces 155, 156 for the working fluid 150 and connect the first wall 110 to the second wall 120.
- the connection represents at least a thermal connection that is ensured by the transport of the working fluid 150. No further mechanical connection or coupling needs to exist - but can optionally be present.
- the first wall 110 is again, for example, the wall that couples to the heat source 50 (not shown) and forms an evaporation surface for the working fluid 150 there.
- the second wall 120 again represents, for example, a condensation surface in the vicinity of which the working fluid 150 condenses.
- the working fluid 150 is thus present in the liquid phase 151 and in the gas phase 152, with the liquid working fluid 151 being transported via the capillary action of the capillary support structure 200 parallel to the second wall 120 on the one hand and in the direction of the first wall 110 on the other hand.
- the first wall 110 In the vicinity of the first wall 110, the first wall 110 is wetted by the liquid working fluid 151. Since the heat input takes place there via the heat source, the working fluid 150 changes there into the gaseous phase 152, which then develops within the respective vapor space section 155 spreads. Condensation again occurs on the second wall 120 and the process continues, so that there is a thermal circuit 160 within each vapor space section 155, 156.
- the wetting of the first wall 110 can take place in both directions, so that a vertical or horizontal heat transport is also achieved. Likewise, not all pores of the capillary support structure 200 will be filled with liquid working fluid 151 in general. The capillary support structure 200 will thus still be permeable to the gas phase 152 of the working fluid 150 . Vertical heat transport can also take place in this way.
- the capillary support structure 200 should not only provide a capillary effect for the liquid working fluid 151 but should also have a sufficient support function to provide the predetermined distance t between the first surface 110 and the second surface 120 .
- the capillary support structure 200 is advantageously folded in such a way that triangular sections 240 are formed, which ensure sufficient mechanical stability so that the first wall 120 cannot come into direct contact with the second wall 120 .
- the heat should not only be distributed horizontally along the planar surface, but should also be dissipated upwards as far as possible, counter to gravity.
- the heat can be transported counter to gravity, for example via the capillary effect of the capillary support structure 200 or another capillary support structure parallel to the second wall 120 .
- this vertical heat transport can also take place through the gas phase 152 of the working fluid 150 via openings in the capillary support structure 200 . Due to these mechanisms, the heat transfer device comes to have a homogeneous and isotropic heat distribution along the planar surface, since local overheating leads to heat equalization with the neighboring regions.
- a lower pressure can be present within the cavity 100 compared to the environment.
- the pressure can be selected, for example, in order to set the evaporation or condensation temperature of the working fluid 150, so that the most efficient possible heat transport can be ensured for the respective application.
- the first wall 110 exerts a force in the direction of the opposite second wall 120.
- This pressure means that the folded capillary support structure 200 has to support a vertically acting force. This can have the positive side effect that the existing pores in the capillary support structure 200 become correspondingly smaller and the capillary effect is thus further increased.
- the capillary support structure 200 can be formed from a stable wire mesh, with the wire thickness being selected in such a way that an adequate support function is achieved for the respective application.
- the wire mesh 200 can be formed homogeneously (translationally symmetrical) and isotropically (rotationally symmetrical, at least for 90° rotations). It does not need to have any further, additional openings or additional surface structures.
- the predetermined distance t between two adjacent folds 210 can in principle be chosen arbitrarily, but generally represents a compromise between wetting the first wall 110 as completely as possible and at the same time an effective thermal circuit 160 by the working fluid 150. If the distances between the individual folds 210, where the capillary support structure 200 comes into contact with the first wall 110 or close to it, are very wide, this wetting can be interrupted, so that local overheating can occur. Therefore, it is advantageous that the pitch of the pleats 210 is not formed too large. On the other hand, if the distance between is formed too small by the pleats, the heat cycle 160 of condensed working fluid 151 and vaporized working fluid 152 (in the gas phase) is not effective. The vapor space 155, 156 is then too small to ensure efficient circulation 160 of the working fluid 150 from the liquid phase 151 to the vapor phase 152 and back to the liquid phase 151.
- a heat sink (not shown) can be formed, for example, at any end point in direction R of the folded structure.
- the thermal circuit 160 within the individual vapor spaces 155, 156 between the adjacent folds 210 ensures that a uniform, homogeneous temperature profile prevails along the planar extent of the heat transfer device, so that the cooling can take place at any desired location.
- the heat sink can include a water bath or air cooling, for example.
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Claims (11)
- Dispositif de transfert de chaleur plan pour la distribution de chaleur et pourl'évacuation de chaleur d'une source de chaleur plane (50),comportant une cavité (100), laquelle est délimitée par une première paroi (110) pour l'accouplement à la source de chaleur plane (50) et une seconde paroi (120) opposée et présente un fluide de travail (150), la cavité (100) étant fermée de manière étanche au vide pour former un espace de vapeur pour le fluide de travail (150),caractérisé par unestructure de support capillaire (200) constituée d'un treillis métallique à action capillaire, la structure de support capillaire (200) s'étendant de manière à être pliée dans au moins une direction (R) entre la première paroi (110) et la seconde paroi (120) pour fournir une action de support et une action capillaire pour du fluide de travail condensé (151), de sorte qu'un transport de fluide de travail condensé à travers la structure de support capillaire (200) de la seconde paroi (120) vers la première paroi (110) est permis, et des plis (210) de la structure de support capillaire (200) séparant la cavité (100) en plusieurs sections (155, 156), etla structure de support capillaire (200) présentant une stabilité mécanique pour maintenir la première paroi (110) et la seconde paroi (120) à une distance prédéterminée l'une de l'autre.
- Dispositif de transfert de chaleur selon la revendication 1, une distance entre des plis (210) adjacents de la structure de support capillaire (200), au niveau desquels la structure de support capillaire (200) entre en contact avec la première paroi (110), étant adaptée pour- obtenir un mouillage aussi complet que possible de la première paroi (110), et- former entre les plis (210) adjacents une section de l'espace de vapeur dans laquelle du fluide de travail en circulation peut former un circuit de chaleur (160) de fluide de travail gazeux et du fluide de travail condensé (152, 151).
- Dispositif de transfert de chaleur selon l'une des revendications précédentes, la structure de support capillaire (200) étant conçue pour maintenir la première paroi (110) et la seconde paroi (120) de manière parallèle à une distance prédéterminée l'une de l'autre.
- Dispositif de transfert de chaleur selon la revendication 3, présentant en outre une ou plusieurs entretoises supplémentaires pour assurer la distance prédéterminée.
- Dispositif de transfert de chaleur selon l'une des revendications précédentes, pour le fluide de travail (150), la première paroi (110) formant une surface d'évaporation et la seconde paroi (120) formant une surface de condensation, et
la structure de support capillaire (200) s'étendant au moins partiellement parallèlement le long de la seconde paroi (120) pour transporter du fluide de travail condensé (151) le long de la seconde paroi (120) à l'encontre de la gravité. - Dispositif de transfert de chaleur selon l'une des revendications précédentes, la structure de support capillaire (200) présentant des ouvertures agrandies de manière individuelle pour obtenir une perméabilité de la structure de support capillaire (200) au fluide de travail gazeux (152) sans perdre l'action capillaire pour le fluide de travail liquide (151).
- Dispositif de transfert de chaleur selon l'une des revendications précédentes, une autre structure capillaire étant conçue le long de la seconde paroi (120) pour permettre un transport du fluide de travail condensé (151) à l'encontre de la gravité d'un espace intermédiaire de plis (155) vers un espace intermédiaire de plis adjacent (156) le long de la seconde paroi (120).
- Dispositif de transfert de chaleur selon l'une des revendications précédentes, présentant en outre des ailettes de refroidissement dans une zone de bord de la cavité (100) pour former un puits de chaleur dans la zone de bord, la zone de bord se trouvant dans la direction (R) du pli.
- Utilisation du dispositif de transfert de chaleur selon l'une des revendications précédentes dans au moins l'une des applications suivantes :- pour le refroidissement d'installations photovoltaïques ;- pour le refroidissement de parois de bâtiments ;- pour l'évacuation de chaleur d'espaces intérieurs ;- pour le refroidissement de composants électroniques.
- Procédé de fabrication d'un dispositif de transfert de chaleur plan prévu pour la distribution de chaleur et pour l'évacuation de chaleur d'une source de chaleur plane (50),
caractérisé par :la fourniture (S310) d'une structure de support capillaire (200) constituée d'un treillis métallique à action capillaire, la structure de support capillaire (200) fournissant une action de support et une action capillaire pour du fluide de travail condensé (151) ; etla formation (S320) d'une cavité (100) comportant une première paroi (110) pour l'accouplement à la source de chaleur plane et une seconde paroi (120) opposée, dans au moins une direction (R), la structure de support capillaire (200) s'étendant de manière à être pliée entre la première paroi (110) et la seconde paroi (120) pour permettre un transport du fluide de travail condensé (151) à travers la structure de support capillaire (200) de la seconde paroi (120) vers la première paroi (110), la cavité (100) étant fermée de manière étanche au vide pour former un espace de vapeur pour le fluide de travail (150), et des plis (210) de la structure de support capillaire (200) séparant la cavité (100) en plusieurs sections (155, 156),et la structure de support capillaire (200) présentant une stabilité mécanique pour maintenir la première paroi (110) et la seconde paroi (120) à une distance prédéterminée l'une de l'autre. - Procédé selon la revendication 10, la cavité (100) formée présentant une ouverture et le procédé comprenant en outre au moins l'une des étapes suivantes :- élimination d'air de la cavité (100) par l'intermédiaire de l'ouverture ;- introduction de fluide de travail dans la cavité (100) à travers l'ouverture ;- fermeture étanche au vide de l'ouverture.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP19205010.2A EP3812684B1 (fr) | 2019-10-24 | 2019-10-24 | Dispositif de transfert de chaleur planaire, utilisation du dispositif et son procédé de fabrication |
PCT/EP2020/079931 WO2021078957A1 (fr) | 2019-10-24 | 2020-10-23 | Appareil plat de transfert de chaleur et son procédé de production |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP19205010.2A EP3812684B1 (fr) | 2019-10-24 | 2019-10-24 | Dispositif de transfert de chaleur planaire, utilisation du dispositif et son procédé de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3812684A1 EP3812684A1 (fr) | 2021-04-28 |
EP3812684B1 true EP3812684B1 (fr) | 2023-06-07 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP19205010.2A Active EP3812684B1 (fr) | 2019-10-24 | 2019-10-24 | Dispositif de transfert de chaleur planaire, utilisation du dispositif et son procédé de fabrication |
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EP (1) | EP3812684B1 (fr) |
WO (1) | WO2021078957A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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DE202023000665U1 (de) | 2023-03-24 | 2023-04-28 | Martin Marling | Planare Heat Pipe für Batterieakku |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI275765B (en) * | 2005-01-28 | 2007-03-11 | Foxconn Tech Co Ltd | Wick structure, method of manufacturing the wick structure, and heat pipe |
TWI259895B (en) * | 2005-03-18 | 2006-08-11 | Foxconn Tech Co Ltd | Heat pipe |
TWM336673U (en) * | 2008-02-04 | 2008-07-11 | Celsia Technologies Taiwan Inc | Vapor chamber and supporting structure thereof |
US20090260785A1 (en) * | 2008-04-17 | 2009-10-22 | Wang Cheng-Tu | Heat plate with capillary supporting structure and manufacturing method thereof |
TW201024648A (en) * | 2008-12-26 | 2010-07-01 | Ji-De Jin | Flat loop heat pipe |
JP6191137B2 (ja) * | 2012-05-14 | 2017-09-06 | 富士通株式会社 | 冷却装置 |
JP6233125B2 (ja) * | 2014-03-20 | 2017-11-22 | 富士通株式会社 | ループ型ヒートパイプとその製造方法、及び電子機器 |
JP6291000B2 (ja) * | 2016-09-01 | 2018-03-07 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
-
2019
- 2019-10-24 EP EP19205010.2A patent/EP3812684B1/fr active Active
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2020
- 2020-10-23 WO PCT/EP2020/079931 patent/WO2021078957A1/fr active Application Filing
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Publication number | Publication date |
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EP3812684A1 (fr) | 2021-04-28 |
WO2021078957A1 (fr) | 2021-04-29 |
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