EP3794635A1 - Dispositif de réduction de point d'utilisation de flux séparés de gaz - Google Patents

Dispositif de réduction de point d'utilisation de flux séparés de gaz

Info

Publication number
EP3794635A1
EP3794635A1 EP19802999.3A EP19802999A EP3794635A1 EP 3794635 A1 EP3794635 A1 EP 3794635A1 EP 19802999 A EP19802999 A EP 19802999A EP 3794635 A1 EP3794635 A1 EP 3794635A1
Authority
EP
European Patent Office
Prior art keywords
independent
wet scrubber
abatement device
pou
flow path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19802999.3A
Other languages
German (de)
English (en)
Other versions
EP3794635A4 (fr
Inventor
Philip J. CATALANO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Highvac Corp
Original Assignee
Highvac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Highvac Corp filed Critical Highvac Corp
Publication of EP3794635A1 publication Critical patent/EP3794635A1/fr
Publication of EP3794635A4 publication Critical patent/EP3794635A4/fr
Pending legal-status Critical Current

Links

Classifications

    • H10P72/0604—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/75—Multi-step processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/005—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/14—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by absorption
    • B01D53/1406—Multiple stage absorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/14—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by absorption
    • B01D53/18—Absorbing units; Liquid distributors therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/38—Removing components of undefined structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/46—Removing components of defined structure
    • B01D53/68—Halogens or halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/77—Liquid phase processes
    • B01D53/78—Liquid phase processes with gas-liquid contact
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • H10P72/0402—
    • H10P72/0612—
    • H10P95/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2252/00—Absorbents, i.e. solvents and liquid materials for gas absorption
    • B01D2252/10—Inorganic absorbents
    • B01D2252/103—Water
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2257/00—Components to be removed
    • B01D2257/20—Halogens or halogen compounds
    • B01D2257/204—Inorganic halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2257/00—Components to be removed
    • B01D2257/40—Nitrogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2258/00—Sources of waste gases
    • B01D2258/02—Other waste gases
    • B01D2258/0216—Other waste gases from CVD treatment or semi-conductor manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2259/00—Type of treatment
    • B01D2259/80—Employing electric, magnetic, electromagnetic or wave energy, or particle radiation
    • B01D2259/818—Employing electrical discharges or the generation of a plasma

Definitions

  • Embodiments of the present disclosure generally relate to abatement devices used in connection with thin film fabrication processes.
  • NF 3 nitrogen trifluoride
  • RPC remote plasma clean
  • silane (SiH 4 ) and ammonia (NH 3 ) are flowed during deposition step at the same time to form silicon nitride (Si 3 N 4 ) layers on wafers.
  • ammonium compounds include ammonium fluoride (NFI 4 F) and ammonium hexafluorosilicate ((NFI ⁇ SiFe). These compounds can be formed in voluminous amounts causing significant maintenance requirements for cleaning of the exhaust line or abatement device, ultimately resulting in loss of production time to the cluster tool and significant losses of potential revenue to the manufacturing line.
  • NFI 4 F ammonium fluoride
  • NFI ⁇ SiFe ammonium hexafluorosilicate
  • Existing POU abatement devices utilize a common oxidation chamber and downstream wet scrubber section (if equipped) wherein all exhaust streams emitting from each process chamber’s vacuum pump are joined together. These devices can allow creation of such ammonium compounds when the gases from process chambers running a deposition process and gases running a clean step are commingled. The creation of such ammonium compounds could occur in the oxidation chamber or in the wet scrubber section, or both.
  • a compact POU abatement device includes a plurality of inlets respectively coupled to a plurality of process chambers in which each of the process chamber gas streams is isolated from the other chamber gas streams.
  • the compact POU abatement device can include a plurality of oxidation devices and a corresponding plurality of isolated wet scrubber columns each directly coupled to a respective one of the plurality of inlets to receive a gas stream from a corresponding process chamber.
  • a point of use (POU) abatement device includes: a housing having a plurality of independent flow paths, each independent flow path defined by a corresponding inlet, flow path, and outlet within the housing and configured to facilitate flowing separated gas streams through the respective independent flow paths; and a one or more completely separated destruction or removal devices disposed within each flow path within the housing; wherein the plurality of independent flow paths are configured to maintain complete separation of respective gas streams flowing through the POU abatement device.
  • a compact POU abatement device can include a plurality of primary co-current flow (i.e. , flow in same direction) wet scrubber columns directly connected to a plurality of oxidation devices and a corresponding plurality of downstream isolated wet scrubber columns each directly coupled to a respective one of the plurality of inlets to receive a gas stream from a corresponding process chamber.
  • a plurality of primary co-current flow i.e. , flow in same direction
  • a compact POU abatement device can include a plurality of primary counter-current flow (i.e., flow in opposite directions) wet scrubber columns directly connected to a plurality of oxidation devices and a corresponding plurality of downstream isolated wet scrubber columns each directly coupled to a respective one of the plurality of inlets to receive a gas stream from a corresponding process chamber.
  • a plurality of primary counter-current flow i.e., flow in opposite directions
  • Any of the above embodiments can include a plurality of primary inlets in a primary flow path and a bypass or diverter valve to divert the gas stream to a corresponding secondary inlet of a redundant flow path.
  • a method of abating a plurality of gas streams from a corresponding plurality of processing chambers includes: flowing a plurality of independent gas streams from a plurality of processing chambers into a plurality of independent flow paths of a housing of a point of use (POU) abatement device; at least partially abating compounds within each independent gas stream by flowing each of the plurality of independent gas streams through respective destruction or removal devices disposed within each flow path while maintaining each of the plurality of independent gas streams completely separated; and exhausting each of the abated independent gas streams from the housing of the POU abatement device.
  • POU point of use
  • Figure 1 through Figure 6 are schematic side views of embodiments of a point of use abatement device in accordance with at least some embodiments of the present disclosure.
  • Embodiments of point of use (POU) abatement devices are provided herein.
  • Embodiments of the disclosed POU abatement devices advantageously maintain total separation of effluent streams from different process chambers, such as semiconductor process chambers, until the effluent streams are sufficiently abated, thereby reducing and/or eliminating the development of unwanted byproducts.
  • Production uptime can be significantly increased by reducing the mean time between POU abatement device and exhaust duct cleaning due to unwanted byproducts.
  • FIG. 1 through Figure 6 are schematic side views of a point of use abatement device in accordance with at least some embodiments of the present disclosure.
  • the point of use (POU) abatement device generally includes a housing having a plurality of independent flow paths. Each independent flow path is defined by a corresponding inlet, flow path, and outlet within the housing. Each independent flow path is configured to facilitate flowing separated gas streams through the respective independent flow paths. One or more completely separated destruction or removal devices is disposed within each flow path within the housing. The plurality of independent flow paths are configured to maintain complete separation of respective gas streams flowing through the POU abatement device.
  • FIG. 1 An exemplary POU abatement device is illustrated in FIG. 1 that incorporates two or more independent flow paths having inlets (four inlets 101a to 101 d shown) whereas the plurality of independent flow paths maintain a total separation of gas streams from each other.
  • Each of the plurality of inlets 101 a to 101 d and respective gas stream incorporates one or more abatement devices, such as oxidation and wet scrubbing devices, while maintaining total separation of the gas streams from other process chambers 102a to 102d and inlets 101 a to 101 d.
  • abatement devices such as oxidation and wet scrubbing devices
  • gases exhausted from the respective process chambers 102a to 102d via dedicated vacuum pumps 103a to 103d respectively connected to each of the process chambers 102a to 102d are provided independently to each inlets 101 a to 101d of the POU gas abatement device.
  • the system can be utilized for the effective abatement of gases as exhausted from process chambers 102a to 102d, such as but not limited to PECVD (Plasma Enhanced Chemical Vapor Deposition) where unwanted byproducts, such as ammonium compounds, are potentially created as a result of mixing of the process chemistries and the process chambers clean chemistries and with the byproducts that are created during the function of cleaning the process chambers 102a to 102d with the clean gas chemistries.
  • PECVD Plasma Enhanced Chemical Vapor Deposition
  • the system will be most effective in semiconductor processing apparatus that employs a plurality of process chambers 102a to 102d (often grouped together in a configuration commonly known as’’cluster tools” ) that may be processing different gas chemistries at any given time. In many cases these different chemistries can react when mixed and create unwanted byproducts. Therefore it is advantageous to treat them separately prior to mixing the gas streams in the exhaust ducting.
  • An advantage of embodiments of the present disclosure, as illustrated in Figure 1 is reduction and or elimination of the development of unwanted byproducts, by maintaining total separation of the individual gas streams from the separate process chambers 102a to 102d. This is accomplished by incorporating a plurality of isolated gas streams encompassed in a POU abatement device having a common enclosure or housing 104 in which each isolated gas stream has a dedicated oxidizer 105a to 105d (e.g., a pyrolytic oxidizer, or burner) for each of the plurality of inlets 101a to 101 d.
  • a dedicated oxidizer 105a to 105d e.g., a pyrolytic oxidizer, or burner
  • the oxidizers 105a to 105d are directly connected to corresponding dedicated and separate wet scrubber columns 106a to 106d.
  • the wet scrubber columns 106a to 106d are directly connected to a common wet scrubber solution recirculation sump, or reservoir (common recirculation sump, or common reservoir 107).
  • the common reservoir 107 incorporates dividing walls 108a to 108c that extend from the top of the common reservoir 107 to a point below the scrubber solution fluid level 109 as to maintain a complete separation of the individual gas streams.
  • the wet scrubber solution may be any process compatible neutralizing agent, such as water or the like.
  • the plurality of wet scrubber columns 106a to 106d incorporate a plurality of primary wet scrubber sections 110a to 110d that is of a packed bed counter-current flow type, supported via a common recirculation pump 111 that delivers recirculated scrubber solution to each of the plurality of primary wet scrubber sections 110a to 110d via a plurality of spray nozzles 112a to 112d for the purpose of primary wet scrubber of the exhaust gas stream.
  • an alternative to the common reservoir 107, and common recirculation pump 111 as depicted in Figure 1 is to incorporate dividing walls 208a to 208c that extend to the bottom of the reservoir to maintain gas and recirculation solution separation.
  • This configuration creates independent recirculation sumps, or reservoirs 207a to 207d and utilizes dedicated recirculation pumps 211 a to 211 d.
  • the wet scrubber columns 106a to 106d can also incorporate a plurality of secondary wet scrubber sections 113a to 113d directly connected to and downstream of the primary wet scrubber sections 110a to 110d
  • the secondary wet scrubber sections 113a to 113d are supported by a flow of fresh water supply 114 (or supply of other suitable neutralizer) that can be utilized to scrub acids from the effluent flow, and as make-up water ( or other suitable neutralizer solution) to replenish the scrubber solution from the common reservoir 107 or individual reservoirs 207a to 207d as it constantly drains to -maintain the pH level of the scrubber solution.
  • the fresh water supply 114 can be controlled via a plurality of flow control valves 115a to 115d and input from the HMI (Human / Machine Interface) controls (e.g., a controller) to reduce the flow at times that pH control is not required on the plurality of wet scrubber columns 106a to 106d.
  • Flow control valves 115a to 115d can include a restrictive flow metering device to optimize fresh water flow in each isolated independent flow path.
  • the plurality of oxidizers 105a to 105d can be directly connected to a plurality of wet scrubber columns 106a to 106d as outlined above serve to create a plurality of isolated gas streams for the effective abatement of process gas and remote plasma clean (RPC) clean gas effluents.
  • the individual, dedicated, and totally separated gas stream abatement devices are housed in a common enclosure (e.g., housing 104) and share common controls and HMI, and as mentioned above, share a common reservoir 107 or individual reservoirs 207a to 207d that is utilized for the recirculation of a wet scrubber solution.
  • the abated gas stream from each wet scrubber column 106a to 106d has its own individual connection 117a to 117d at exit of housing 104, which are connected to facility exhaust duct 118 through individual ducts 119a to 119d.
  • the oxidizers 105a to 105d which in the present form are of pyrolytic type, can be substituted by other such oxidizing device such as dynamic oxidation chambers or plasma reaction chamber of either RF or microwave power source.
  • the oxidizers 105a to 105d fuel source can be either hydrogen, methane, or other gaseous fossil fuel.
  • the plurality of individual and isolated gas streams can incorporate an upstream co-current flow or counter-current flow type wet scrubber section as depicted in Figure 3 and Figure 4 respectively, to provide for a plurality of isolated gas streams that provide for a wet/burn/wet POU abatement device that maintains total separation of a plurality of gas streams from multiple process chambers 102a to 102d.
  • one or more of the independent flow paths can include a pair of flow paths configured as a primary flow path and a redundant flow path.
  • Figure 5 depicts the disclosed embodiment of Figure 1 with the added ability to utilize subsequent inlets 501 b and 501 d as redundant backups to primary inlets (e.g., inlets 101 a and 101 c). This is accomplished with bypass, or diverter valves 516a and 516b configured to selectively bypass the primary flow path and divert the gas stream to the redundant flow path.
  • bypass, or diverter valves 516a and 516b configured to selectively bypass the primary flow path and divert the gas stream to the redundant flow path.
  • gas streams are depicted as well as two POU abatement device inlets 101 a and 101 c.
  • Figure 5 can also be expanded beyond the two inlets 101 a and 101 c as depicted.
  • a first gas stream of a plurality of independent gas streams flowing through the POU abatement device can be diverted from the primary flow path to a redundant flow path using the diverter valve (e.g., diverter valve 516a).
  • the redundant flow path is disposed within the housing and includes one or more destruction or removal devices to at least partially abate compounds within the independent gas stream flowing through the redundant flow path.
  • the embodiment depicted in Figure 6 comprises an internal exhaust manifold 620 utilized to connect all wet scrubber outlets 617a to 617d to a common outlet 621 , at exit of housing 104, by way of a common duct 619 that connects the POU abatement exhaust to a single connection to facility exhaust duct 118 .
  • the internal exhaust manifold 620 can be incorporated in all of the outlined embodiments as depicted in Figure 1 through Figure 5.
  • the POU abatement device as described above effectively maintains complete separation of the gases from the process chambers 102a to 102d until such a time that the gases have been effectively abated through an oxidation device (e.g., oxidizers 105a to 105d) and a wet scrubber device (e.g., wet scrubber columns 106a to 106d).
  • an oxidation device e.g., oxidizers 105a to 105d
  • a wet scrubber device e.g., wet scrubber columns 106a to 106d.
  • a compact POU abatement device with a plurality of inlets 101 a to 101 d for multiple process chambers 102a to 102d in which each of the process chambers gas streams is isolated from the other gas streams.
  • the process chambers 102a to 102d can be semiconductor process chambers configured to perform processes, such as deposition processes, on semiconductor wafers or the like.
  • a compact POU abatement device in which each of the plurality of inlets 101a to 101 d of the abatement device and the plurality of isolated gas streams incorporates a plurality of oxidizers 105a to 105d combined with a dedicated wet scrubber column 106a to 106d to create an isolated and dedicated gas stream for each of the plurality of process chambers 102a to 102d that are exhausting into the plurality of inlets 101 a to 101 d.
  • a compact POU abatement device in which the plurality of gas streams are totally separated from each other until they have been treated through a plurality of oxidizers 105a to 105d and a plurality of primary wet scrubber sections 110a to 110d and a plurality of secondary wet scrubber sections 113a to 113d.
  • a compact POU abatement device in which the plurality of individual gas stream(s) are housed in a common housing 104, of which there can be a plurality of inlets 101 a to 101 d supporting a plurality of individual and dedicated gas streams.
  • a compact POU abatement device in which the plurality of inlets 101a to 101 d and isolated gas streams share a common recirculation pump 111.
  • a compact POU abatement device in which the plurality of inlets 101a to 101 d and plurality of isolated gas streams share a common reservoir 107.
  • a compact POU abatement device in which the plurality of inlets 101a to 101 d and plurality of isolated and individual gas streams share a common control panel / HMI.
  • a compact POU abatement device in which the plurality of inlets 101a to 101 d receive gas streams from a plurality of process chambers 102a to 102d in which a plurality of wet scrubber columns 106a to 106d are directly joined to the common reservoir 107 at the top of common reservoir 107.
  • a compact POU abatement device in which the plurality of inlets 101a to 101 d and individual gas streams share a common reservoir 107 and the common reservoir 107 incorporates dividing walls 108a to 108c between each individual and isolated gas stream column inlets 101 a to 101 d and the dividing walls 108a to 108c extend below the wet scrubber solution fluid level 109 to point below the expected static pressure of the wet scrubber columns 106a to 106d to effect a complete separation of the plurality of isolated and individual gas streams.
  • the dividing walls 108a to 108c terminate above the base of the common reservoir 107 to enable flow of the wet scrubber fluid solution (from each of the plurality of individual and isolated gas stream’s plurality of primary wet scrubber sections 110a to 110d and plurality of secondary wet scrubber sections 113a to 113d) throughout the common reservoir 107 and allows for a central drain of the wet scrubber solution either via gravity drain or pumped drain.
  • a compact POU abatement device in which the plurality of individual and isolated gas streams plurality of wet scrubber columns 106a to 106d incorporate a plurality of secondary wet scrubber sections 113a to 113d that utilizes fresh water supply 114 to support the plurality of secondary wet scrubber sections 113a to 113d and the fresh water supply 114 is independently controlled on each of the plurality of secondary wet scrubber sections 113a to 113d with a plurality of flow control valves 115a to 115d via input from the common HMI controls to reduce fresh water consumption during reduced needs of acidic abatement of each of the plurality of individual gas streams.
  • Flow control valves 115a to 115d can include a restrictive flow metering device to optimize fresh water flow in each isolated independent flow path.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Environmental & Geological Engineering (AREA)
  • Biomedical Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Thermal Sciences (AREA)
  • Treating Waste Gases (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Gas Separation By Absorption (AREA)
  • Incineration Of Waste (AREA)

Abstract

L'invention concerne des modes de réalisation d'un dispositif de réduction de point d'utilisation (POU) et des procédés de réduction d'une pluralité de flux de gaz à partir d'une pluralité correspondante de chambres de traitement. Dans certains modes de réalisation, un dispositif de réduction de POU compact comprend une pluralité d'entrées couplées respectivement à une pluralité de chambres de traitement, dans lesquelles chacun des flux de gaz des chambres de traitement est isolé des autres flux de gaz. Dans certains modes de réalisation, le dispositif de réduction de POU compact peut comprendre une pluralité de dispositifs d'oxydation et une pluralité correspondante de colonnes d'épurateur par voie humide, chacune étant directement accouplée à des entrées de la pluralité d'entrées pour recevoir un flux de gaz provenant d'une chambre de traitement correspondante.
EP19802999.3A 2018-05-16 2019-05-16 Dispositif de réduction de point d'utilisation de flux séparés de gaz Pending EP3794635A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862672249P 2018-05-16 2018-05-16
US16/412,384 US11077401B2 (en) 2018-05-16 2019-05-14 Separated gas stream point of use abatement device
PCT/US2019/032563 WO2019222443A1 (fr) 2018-05-16 2019-05-16 Dispositif de réduction de point d'utilisation de flux séparés de gaz

Publications (2)

Publication Number Publication Date
EP3794635A1 true EP3794635A1 (fr) 2021-03-24
EP3794635A4 EP3794635A4 (fr) 2022-01-19

Family

ID=68534108

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19802999.3A Pending EP3794635A4 (fr) 2018-05-16 2019-05-16 Dispositif de réduction de point d'utilisation de flux séparés de gaz

Country Status (9)

Country Link
US (1) US11077401B2 (fr)
EP (1) EP3794635A4 (fr)
JP (1) JP7485655B2 (fr)
KR (1) KR20210010913A (fr)
CN (1) CN112514041B (fr)
IL (1) IL278578B2 (fr)
SG (1) SG11202011235RA (fr)
TW (1) TWI828692B (fr)
WO (1) WO2019222443A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2564399A (en) * 2017-07-06 2019-01-16 Edwards Ltd Improvements in or relating to pumping line arrangements
US12546015B2 (en) * 2023-04-26 2026-02-10 Ge Infrastructure Technology Llc Fluoride ion cleaning systems and methods including post-retort fluid stream processing
KR102796559B1 (ko) * 2023-10-16 2025-04-21 주식회사 케이씨이노베이션 반도체 폐가스 처리용 습식 스크러버
CN117443142A (zh) * 2023-12-13 2024-01-26 广东天瑞德新能源科技有限公司 一种吸收塔及废气回收系统

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3215081B2 (ja) * 1997-12-02 2001-10-02 カンケンテクノ株式会社 半導体製造排ガスの除害装置及び除害方法
US20030049182A1 (en) * 2000-05-01 2003-03-13 Christopher Hertzler System and method for abatement of dangerous substances from a waste gas stream
US6602323B2 (en) * 2001-03-21 2003-08-05 Samsung Electronics Co., Ltd. Method and apparatus for reducing PFC emission during semiconductor manufacture
JP4149166B2 (ja) * 2002-01-08 2008-09-10 東京エレクトロン株式会社 処理システム及び処理方法
KR100479627B1 (ko) * 2002-05-25 2005-04-06 유니셈 주식회사 폐가스 처리용 습식 전처리 장치 및 그 전처리 방법
US20040185661A1 (en) * 2003-03-17 2004-09-23 Sherer John Michael Scrubber system for pretreatment of an effluent waste stream containing arsenic
US6843830B2 (en) * 2003-04-15 2005-01-18 Advanced Technology Materials, Inc. Abatement system targeting a by-pass effluent stream of a semiconductor process tool
KR100545696B1 (ko) * 2003-09-19 2006-01-26 (주)파이런텍 진공펌프 일체형 폐기가스 처리장치
US7021903B2 (en) * 2003-12-31 2006-04-04 The Boc Group, Inc. Fore-line preconditioning for vacuum pumps
US7278831B2 (en) 2003-12-31 2007-10-09 The Boc Group, Inc. Apparatus and method for control, pumping and abatement for vacuum process chambers
US20050196330A1 (en) * 2004-03-05 2005-09-08 Ronald Garnett Abatement device
US7708859B2 (en) 2004-04-30 2010-05-04 Lam Research Corporation Gas distribution system having fast gas switching capabilities
JP4342427B2 (ja) * 2004-11-30 2009-10-14 カンケンテクノ株式会社 半導体製造装置の排ガス除害装置
US20060156980A1 (en) 2005-01-19 2006-07-20 Samsung Electronics Co., Ltd. Apparatus including 4-way valve for fabricating semiconductor device, method of controlling valve, and method of fabricating semiconductor device using the apparatus
TW200738322A (en) 2005-06-13 2007-10-16 Applied Materials Inc Methods and apparatus for process abatement
JP4966521B2 (ja) * 2005-07-22 2012-07-04 昭和電工株式会社 過弗化物含有排ガスの処理方法及び処理装置
JP5307556B2 (ja) * 2007-01-30 2013-10-02 カンケンテクノ株式会社 ガス処理装置
KR100809852B1 (ko) * 2007-05-17 2008-03-04 (주)엘오티베큠 일체형 진공발생장치
KR101205845B1 (ko) 2010-01-11 2012-11-28 엘아이지에이디피 주식회사 다중 챔버로 구성된 금속 유기물 화학기상증착장치 및 증착방법
US20110289751A1 (en) * 2010-05-25 2011-12-01 Mark Ammons Field Erectable Abatement System Methods
US8597602B2 (en) * 2011-08-05 2013-12-03 Global Vapor Control, Inc. Vacuum truck scrubber system
JP6472653B2 (ja) * 2014-03-17 2019-02-20 株式会社荏原製作所 除害機能付真空ポンプ
TW201601957A (zh) * 2014-07-03 2016-01-16 Yun-Yue Chen 移動式空氣清淨裝置
EP3012011A1 (fr) * 2014-10-21 2016-04-27 Linde Aktiengesellschaft Procédé et appareil pour éliminer partiellement des contaminants à partir d'un gaz par addition d'ozone
DE102015106718A1 (de) * 2015-04-30 2016-11-03 Das Environmental Expert Gmbh Vorrichtung zur Behandlung von schädlichen Abgasen aus einer Vakuum-Prozessanlage
CN108026809B (zh) * 2015-09-10 2020-11-27 三星重工业株式会社 污染物质减少装置
US10730002B2 (en) * 2016-05-09 2020-08-04 Stamicarbon B.V. Submicron particle removal from gas streams
KR101809626B1 (ko) * 2017-03-02 2017-12-15 (주)엔노피아 복합오염물질 처리 시스템

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WO2019222443A1 (fr) 2019-11-21
IL278578A (fr) 2021-01-31
CN112514041B (zh) 2024-06-04
IL278578B2 (en) 2025-07-01
US20190351369A1 (en) 2019-11-21
JP2021524807A (ja) 2021-09-16
IL278578B1 (en) 2025-03-01
US11077401B2 (en) 2021-08-03
TW202005704A (zh) 2020-02-01
JP7485655B2 (ja) 2024-05-16
EP3794635A4 (fr) 2022-01-19
CN112514041A (zh) 2021-03-16
SG11202011235RA (en) 2020-12-30

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