EP3793023A1 - Carte de circuit imprimé multicouche comprenant un élément d'antenne et procédé de fabrication d'un élément d'antenne de carte de circuit imprimé multicouche - Google Patents

Carte de circuit imprimé multicouche comprenant un élément d'antenne et procédé de fabrication d'un élément d'antenne de carte de circuit imprimé multicouche Download PDF

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Publication number
EP3793023A1
EP3793023A1 EP19196697.7A EP19196697A EP3793023A1 EP 3793023 A1 EP3793023 A1 EP 3793023A1 EP 19196697 A EP19196697 A EP 19196697A EP 3793023 A1 EP3793023 A1 EP 3793023A1
Authority
EP
European Patent Office
Prior art keywords
antenna element
pcb
edge
layers
stacking direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19196697.7A
Other languages
German (de)
English (en)
Inventor
Dr. Marta Martínez Vázquez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IMST GmbH
Original Assignee
IMST GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IMST GmbH filed Critical IMST GmbH
Priority to EP19196697.7A priority Critical patent/EP3793023A1/fr
Publication of EP3793023A1 publication Critical patent/EP3793023A1/fr
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Definitions

  • the present disclosure relates to a multilayer printed circuit board, PCB, having an antenna element, and to a manufacturing method of a multilayer PCB antenna element.
  • PCBs Printed circuit boards having multiple layers and including one or more antenna elements for transmitting and receiving an RF signal are known in the art.
  • a PCB having RF functions for example a PCB of a mobile device such as a mobile phone, smartphone etc., typically has severe space constrictions due to a high demand for miniaturization. That is, a typical PCB with RF functions is already crowded.
  • the PCB components such as surface mounted device components (SMD) and the like are typically arranged on a planar surface, i.e. on the topmost layer or in between the layers. Providing an antenna element at such a location reduces the space available for the other PCB components.
  • SMD surface mounted device components
  • Document WO 2017/194096 A1 describes an antenna formed on a multilayer PCB edge, the antenna comprising an antenna patch and a feeding patch.
  • the antenna patch is formed of multiple conductive strips each arranged on a different layer of the multilayer PCB, which requires a high amount of work for obtaining this conventional structure and is prone to undesired variations of the radiation properties due to the multi-element configuration.
  • document WO 2017/194096 A1 also describes a dipole structure formed on an edge of the multilayer PCB.
  • a dipole needs to be fed through a matching network such as a balun, which requires additional space.
  • Document EP 3 051 628 A1 describes a multilayer circuit board having a plurality of vertical interconnect access (VIA) holes formed in the multiple layers and arranged in a horizontal direction.
  • the VIA holes line up with a plurality of VIA holes in another layer, whereby a grid-type radiation member is formed.
  • the VIA hole antenna elements that form the resulting grid-type radiation member are disposed as a grid-array that, as a whole, act as an RF patch. That is, a plurality of VIA hole antenna elements act together in transmitting or receiving an electromagnetic wave by means of the grid-array. Due to the fact that this conventional technique uses a plurality of VIA holes, a large amount of space is required.
  • a multilayer printed circuit board according to claim 1 is provided.
  • the PCB comprises a plurality of layers.
  • the plurality of layers are stacked in a stacking direction and extending in a planar direction up to an edge of the PCB.
  • the PCB further comprises an antenna element formed along the edge.
  • the PCB further comprises an RF feeding structure electrically connected to the antenna element.
  • the PCB further comprises a metallic ground structure, wherein the antenna element is electrically connected to the ground structure.
  • the antenna element is formed as a resonant structure.
  • the antenna element is formed as a single resonant structure.
  • the antenna element is formed as a multi-element resonant structure.
  • feeding is made by a galvanic connection between the RF feeding structure and the antenna element.
  • feeding is made by capacitive coupling between the RF feeding structure and the antenna element.
  • a manufacturing method of an antenna element of or for a multilayer printed circuit board (PCB) according to claim 10 comprises providing a PCB having a plurality of layers, the plurality of layers being stacked in a stacking direction and extending in a planar direction up to an edge of the PCB, wherein the layers comprise an RF feeding structure extending up to the edge and a short-circuit conductor extending up to the edge.
  • the method further comprises metallizing at least a part of the edge to obtain a metallization.
  • the method further comprises removing parts of the metallization to obtain the antenna element such that the antenna element is connected to the RF feeding line and such that the antenna element is connected, via the short-circuit conductor, to a metallic ground structure to affect an RF input impedance of the antenna element.
  • the antenna element is obtained as a single resonant structure.
  • the PCB as described herein, is used in a fixed, or stationary, RF communications device.
  • a fixed RF communications device include, without limitation, a computer such as a personal computer, an industrial robot etc.
  • the PCB, as described herein is used in a mobile RF communications device.
  • a mobile RF communications device include, without limitation, a mobile phone or smartphone, an automotive control unit (car ICU) etc.
  • a single resonant structure is considered a structure that is different from e.g. an antenna array.
  • an antenna array comprises a plurality of emitting elements whose emitted electromagnetic waves interact with each other, e.g. in a way that a constructive or destructive interference occurs.
  • a single resonant structure is considered to emit an electromagnetic wave substantially without any electromagnetic interaction such as constructive interference or destructive interference with neighboring like structures.
  • a single resonant structure is, as to its RF usage or configuration, a non-periodical structure or a non-array structure.
  • a single-resonant structure may prove advantageous in that it occupies a comparatively small amount of space, even in the edge area of the PCB. As the single-resonant structure is comparatively narrow, a reasonable amount of space is available on the edge, e.g. for a shielding metallization or the like on the edge in areas other than that of the antenna element.
  • a multi-element resonant structure may be formed of a plurality of such single-resonant structures.
  • the single resonant structure may be replicated, in or on the PCB, to create an array of antenna elements. Further motivation for replication of the single resonant structure may be to implement antenna diversity structures and/or MIMO structures.
  • the antenna element of the multilayer PCB extends substantially over the entirety of layers in the stacking direction of the layers.
  • the antenna element may extend from substantially the topmost layer to substantially the bottommost layer in a uniform manner, i.e. one-piece configuration, or - in other words - without any interruptions in the stacking direction.
  • the antenna element is a monopole sheet element, or monopole patch element.
  • the monopole sheet element is formed in a substantially uniform manner.
  • the monopole sheet element has a uniform one-piece configuration, i.e. it extends substantially devoid of any interruptions or variations in the stacking direction.
  • the antenna element is a monopole vertical interconnect access (VIA).
  • the VIA antenna element is electromagnetically exposed on the edge, i.e. it is free from any shielding material such as metal, at least in an intended, or predetermined, direction of radiation.
  • the VIA antenna element is obtained by providing a VIA through the plurality of layers, preferably through the entirety of layers, and cutting the PCB along the stacking direction and penetrating the VIA. In this way, the VIA is given a semitubular shape that extends substantially in the stacking direction. In other words: According to this embodiment, the VIA is cut open such that the inner structure of the resultant semitube is exposed on the edge.
  • the antenna element further comprises a tuning structure.
  • the tuning structure is electrically connected to the antenna element.
  • the tuning structure is part of the antenna element.
  • the tuning structure is effective when used with a VIA serving as the antenna element, as described herein.
  • the tuning structure has a width in a width variation direction.
  • the width variation direction is substantially perpendicular to the stacking direction, and the width variation direction is substantially perpendicular to the planar direction.
  • the width of the tuning structure is different from the width of the antenna element, particularly the VIA.
  • the tuning structure is broader than the semitubular via such as to allow for an impedance matching and/or frequency tuning of the antenna element.
  • the tuning structure may be formed as a tuning ring.
  • the antenna element is electrically connected to the ground structure via a short-circuit conductor.
  • the short-circuit conductor and the ground structure are configured such that they affect an RF input impedance of the antenna element.
  • the RF input impedance of the antenna element can be tuned, or affected, by proper dimensioning of the short-circuit conductor and the ground structure.
  • the ground structure is at least partially arranged on the same edge as the antenna element, yet sufficiently spaced apart from the antenna element to allow for an appropriate radiation of electromagnetic waves by the antenna element.
  • the method further comprises a tuning of the antenna element to a desired resonance frequency.
  • the parts of the metallization to be removed may be chosen such that the resulting (remaining) antenna element has predetermined dimensions depending on the desired operating frequency or resonance frequency, e.g. dimensions in the width direction.
  • the method further comprises an adaption of an RF input impedance of the antenna element.
  • the parts of the metallization to be removed may be chosen such that a resulting short-circuit conductor or parts thereof, connecting the antenna element to the ground structure, has predetermined dimensions depending on the RF input impedance.
  • the method in the removing of parts of the metallization, further comprises a shaping of a monopole sheet element that extends in a substantially uniform manner in the stacking direction.
  • the method further comprises exposing a VIA at the edge.
  • Exposing the VIA relates to electromagnetically exposing the VIA, such that it is substantially free from any shielding material such as metal, at least in an intended, or predetermined, direction of radiation.
  • the method further comprises cutting the VIA open such that it has a substantially semitubular shape in the stacking direction.
  • Fig. 1 is a schematic perspective illustration of a multilayer printed circuit board, PCB, according to an embodiment.
  • the PCB of the first embodiment is designated with reference numeral 100.
  • Fig. 2 is a partial schematic perspective illustration of the PCB 100 that is shown in a cut-open manner for illustration and the ease of explanation.
  • Fig. 3 shows a part of the PCB 100 in a perspective illustration. It is noted that throughout Figs. 1-3 , single particular elements may be disposed at different locations, such as a feeding structure 155 (to be described later in detail) being disposed in an intermediate layer in Fig. 2 , and disposed on a top layer in Fig. 3 . Yet, the views of Figs. 1-3 are comparable in principle, and thus, the first embodiment is described in the following with common reference to Figs. 1-3 .
  • the PCB 100 comprises a plurality of metallic layers, or sheets, 101, 102, 103, 104 that are stacked in a stacking direction S and separated by layers of non-conducting (dielectric) material. It is noted that the number of layers is not limited to four as in the present example, and that it may be a number different from four.
  • the layers 101, 102, 103, 104 are substantially planar sheets that extend in a planar direction P.
  • the PCB 100 further comprises an antenna element 150 that is formed along an edge 110 of the PCB 100, i.e. an edge - or front surface - that is formed by some or all of the layers 101, 102, 103, 104.
  • the edge or front surface is typically a real surface or virtual surface that is formed on a narrow side of the PCB 100, i.e. substantially perpendicular to the planes that are formed by each of the layers 101, 102, 103, 104.
  • the antenna element 150 can be fed with an electromagnetic signal to be emitted via an RF feeding structure 155.
  • the RF feeding structure 155 is electrically connected to the antenna element.
  • a resonating circuit such as a transmitting circuit (not shown) is mounted in or on the PCB 100 and has an RF output thereof connected to the RF feeding structure 155.
  • An electromagnetically effective dimension of the antenna element 150 is configured such that the antenna element 150 resonates at or in the range of a predetermined frequency, or operating frequency.
  • the operating frequency is for example a frequency above 15 GHz, typically above 20 GHz and preferably at about 30 GHz.
  • the PCB 100 further comprises a metallic ground structure 160.
  • the metallic ground structure 160 is electrically connected to the antenna element 150 via a short-circuit conductor 165.
  • the short-circuit conductor 165, and the metallic ground structure 160 help to tune an RF impedance of the antenna element 150 to a desired value.
  • the short-circuit conductor has a length less than an effective wavelength of the antenna element 150, such as a length shorter than a quarter wavelength of the operating frequency.
  • the antenna element 150 is configured as a single resonant structure, i.e. a non-periodical structure.
  • the PCB is devoid of another antenna element that is to be fed with an RF signal related to an RF signal used on the RF feeding structure 155 such that the another antenna element and the antenna element 150 act together such that a constructive or destructive interference occurs.
  • the antenna element 150 is not necessarily part of any antenna array.
  • multiple antenna elements 150 along the (same) edge 110 can be connected with one another to form different RF structures such as an array.
  • multiple antenna elements 150 along the same edge 110 or on the edge 110 and on edges different from the edge 110 can be connected with one another to form a diversity structure and/or a MIMO structure.
  • the antenna element 150 is a sheet-like element formed of a single physical structure, such as a single metallization.
  • the antenna element 150 is typically formed as one piece, unlike a mesh arrangement of antenna parts.
  • a multilayer PCB 100 is provided that has an arbitrary number of dielectric and/or metallic layers 101, 102, 103, 104.
  • a side surface on the edge 101, typically the whole contour, of the PCB 100 is metallized.
  • a conducting patch is milled out of the side metallization, the conducting patch to become the antenna element 150.
  • the patch size is tuned, at least in width and preferably in width and length, to resonate at a predetermined frequency, or operating frequency.
  • the operating frequency is for example a frequency above 15 GHz, typically above 20 GHz and preferably at about 30 GHz.
  • the patch is tuned to become a millimeter-wave antenna.
  • the RF feeding structure 155 is present in or on any of the layers 101, 102, 103, 104.
  • the RF feeding structure 155 is printed in layer 102 of the PCB 100.
  • the RF feeding structure 155 extends up to the edge 110 to be electrically connected to a region of the antenna element 150 (a feeding region), e.g. by means of the contour metallization process and the subsequent partial removal of the metallization.
  • the short-circuit conductor 165 is present in or on any of the layers 101, 102, 103, 104.
  • the short-circuit conductor 165 is printed on layer 101 of the PCB 100.
  • the short-circuit conductor 165 extends up to the edge 110 to be electrically connected to a region of the antenna element 150 (a tuning region), e.g. by means of the contour metallization process and the subsequent partial removal of the metallization.
  • the short-circuit conductor 165, or shorting strip, and the RF feeding structure 155, or feeding line, are provided for electrically coupling the antenna element 150, or antenna patch, to components of the PCB 100.
  • the antenna element 150 itself is electromagnetically exposed from the edge 110, i.e. the PCB 100 is configured and the antenna element 150 is arranged such that a transmission or a reception of an electromagnetic wave from/to the antenna element 150 in a direction away from the edge 110 or towards the edge 110 is possible.
  • the antenna element 150 being electromagnetically exposed from the edge 110 does not exclude the presence of any material that is comparatively uncritical for any such transmission or reception, such as a substrate material 180 disposed on or along the edge 110.
  • the metallic ground structure 160 may e.g. be a groundplane formed on one of the layers, such as, without limitation, a topmost layer 101 or a bottommost layer 104 of the PCB 100.
  • a groundplane is formed on the topmost layer 101 without any limitation intended.
  • a metallic ground structure 160 that may have an electrical connection to the groundplane is formed on the edge 110 side of the PCB, while a clearance or distance is kept from the antenna element 150 in order to suppress a negative impact on the radiation characteristics of the antenna element 150.
  • one or more vertical interconnect access elements 190 may be present that allow for a signal interconnection between the layers 101, 102, 103, 104.
  • VIAs vertical interconnect access elements
  • Fig. 4 is a schematic perspective illustration of a multilayer printed circuit board, PCB, according to another embodiment.
  • the PCB of the second embodiment is designated with reference numeral 200.
  • Fig. 5 is a partial schematic perspective illustration of an alternative configuration of the PCB 200 in the embodiment of Fig.4 .
  • the alternative configuration shown in Fig. 5 differs in that the RF feeding structure 255 and the short-circuit conductor 265 are disposed in a layer of the PCB 200 different from that in Fig. 5.
  • Fig. 6 shows a part of the PCB 200 of Figs. 5 in a different perspective illustration.
  • the second embodiment in the configuration of Fig. 4 and in the alternative configuration of Figs. 5 and 6 is described in the following commonly with reference to Figs. 4-6 .
  • the PCB 200 comprises a plurality of layers, or sheets, 201, 202, 203 that are stacked in a stacking direction S. It is noted that the number of layers is not limited to three as in the present example, and that it may be a number different from three.
  • the layers 201, 202, 203 are substantially planar sheets that extend in a planar direction P, and may be dielectric or metallic sheets, or a combination thereof.
  • the PCB 200 further comprises an antenna element 250 that is formed along an edge 210 of the PCB 200, i.e. an edge - or front surface - that is formed by some or all of the layers 201, 202, 203.
  • the edge 210 or front surface is typically a real surface or virtual surface that is formed on a narrow side of the PCB 200, i.e. substantially perpendicular to the planes that are formed by each of the layers 201, 202, 203.
  • the antenna element 250 can be fed with an electromagnetic signal to be emitted via an RF feeding structure 255.
  • the RF feeding structure 255 is electrically connected to the antenna element 250.
  • a resonating circuit such as a transmitting circuit (not shown) is mounted in or on the PCB 200 and has an RF output thereof connected to the RF feeding structure 255.
  • An electromagnetically effective dimension of the antenna element 250 is configured such that the antenna element 250 resonates at or in the range of a predetermined frequency, or operating frequency.
  • the operating frequency is for example a frequency above 15 GHz, typically above 20 GHz and preferably at about 30 GHz.
  • the PCB 200 further comprises a metallic ground structure 260.
  • the metallic ground structure 260 is electrically connected to the antenna element 250 via a short-circuit conductor 265.
  • the short-circuit conductor 265, and the metallic ground structure 260 help to tune an RF impedance of the antenna element 250 to a desired value.
  • the antenna element 250 is configured as s single resonant structure, i.e. a non-periodical structure.
  • the PCB 200 is devoid of another antenna element that is to be fed with an RF signal related to an RF signal used on the RF feeding structure 255 such that the another antenna element and the antenna element 250 act together such that a constructive or destructive interference occurs.
  • the antenna element 250 is not part of any antenna array.
  • multiple antenna elements 250 along the (same) edge 210 can be connected with one another to form different RF structures such as an array.
  • multiple antenna elements 250 along the same edge 210 or on the edge 210 and on edges different from the edge 210 can be connected with one another to form a diversity structure and/or a MIMO structure.
  • the antenna element 250 is formed of a vertical interconnect access, VIA, that is cut open such that it exhibits a semitubular shape which is electromagnetically exposed on the edge 210.
  • the antenna element 250, or radiating element has the shape of a part of a cylinder on the edge 210 of the PCB 200.
  • a multilayer PCB 200 is provided that has an arbitrary number of dielectric and/or metallic layers 201, 202, 203. A side surface on the edge 201, typically the whole contour, of the PCB 200 is metallized.
  • the VIA for the antenna element 250 is manufactured according to a commonly known process; subsequently, the PCB 200 is cut open crossing the VIA such that the antenna element 250 is obtained.
  • the RF feeding structure 255 is present in or on any of the layers 201, 202, 203.
  • the RF feeding structure 255 is printed in layer 202 of the PCB 200.
  • the RF feeding structure 255 extends up to the edge 210 to be electrically connected to a region of the antenna element 250 (a feeding region), e.g. by means of the contour metallization process and the subsequent partial removal of the metallization.
  • the short-circuit conductor 265 is present in or on any of the layers 201, 202, 203.
  • the short-circuit conductor 265 is printed on layer 201 of the PCB 200.
  • the short-circuit conductor 265 is printed in layer 202 of the PCB 200.
  • the short-circuit conductor 265 is formed as a part of metallic layer 203 of the PCB 200.
  • the short-circuit conductor 265 extends up to the edge 210 to be electrically connected to a region of the antenna element 250 (a tuning region), e.g. by means of the contour metallization process and the subsequent partial removal of the metallization.
  • tuning elements tuning rings 270-1, 270-2 are provided. These tuning elements, or metallic catch pads, may e.g. be added in different layers of the PCB for impedance matching and frequency tuning purposes.
  • the tuning elements 270-1, 270-2 are tuned such that the antenna element 250 resonates at a predetermined frequency, or operating frequency.
  • the operating frequency is for example a frequency above 15 GHz, typically above 20 GHz and preferably at about 30 GHz.
  • the VIA antenna element 250 is tuned to become a millimeter-wave antenna resonating at a predetermined (desired) frequency.
  • the width thereof is typically limited due to restraints in the manufacturing process.
  • the tuning elements 270-1, 270-2 in addition to the VIA antenna element 250, the capacity thereof can be altered to become a desired value.
  • the VIA antenna element 250 is artificially reduced in electrically active length, which allows for an effective tuning of the resonance frequency thereof.
  • the antenna element 250 itself is electromagnetically exposed from the edge 210, i.e. the PCB 200 is configured and the antenna element 250 is arranged such that a transmission or a reception of an electromagnetic wave from/to the antenna element 250 in a direction away from the edge 210 or towards the edge 210 is possible.
  • the antenna element 250 being electromagnetically exposed from the edge 210 does not exclude the presence of any material that is comparatively uncritical for any such transmission or reception, such as a substrate material 280 disposed on or along the edge 210.
  • one or more further vertical interconnect access elements 290 may be present that allow for a signal interconnection between the layers 101, 102, 103, 104.
  • VIAs vertical interconnect access elements
  • none of the VIAs 290 in the embodiment of Figs. 4-6 is specifically designed to participate in a transmission or reception of an electromagnetic wave by the VIA antenna element 250.
  • Signal transmission and/or reception via willfully created electromagnetic radiation is performed by the VIA antenna element 250
  • the further VIAs 290 serve the purpose of a signal interconnection between the layers 201, 202, 203 without any particular involvement in a willful, or intended, radiation process.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)
EP19196697.7A 2019-09-11 2019-09-11 Carte de circuit imprimé multicouche comprenant un élément d'antenne et procédé de fabrication d'un élément d'antenne de carte de circuit imprimé multicouche Pending EP3793023A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP19196697.7A EP3793023A1 (fr) 2019-09-11 2019-09-11 Carte de circuit imprimé multicouche comprenant un élément d'antenne et procédé de fabrication d'un élément d'antenne de carte de circuit imprimé multicouche

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19196697.7A EP3793023A1 (fr) 2019-09-11 2019-09-11 Carte de circuit imprimé multicouche comprenant un élément d'antenne et procédé de fabrication d'un élément d'antenne de carte de circuit imprimé multicouche

Publications (1)

Publication Number Publication Date
EP3793023A1 true EP3793023A1 (fr) 2021-03-17

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Application Number Title Priority Date Filing Date
EP19196697.7A Pending EP3793023A1 (fr) 2019-09-11 2019-09-11 Carte de circuit imprimé multicouche comprenant un élément d'antenne et procédé de fabrication d'un élément d'antenne de carte de circuit imprimé multicouche

Country Status (1)

Country Link
EP (1) EP3793023A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023065068A1 (fr) * 2021-10-18 2023-04-27 宏启胜精密电子(秦皇岛)有限公司 Carte de circuit imprimé et son procédé de fabrication

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103928757A (zh) * 2014-03-26 2014-07-16 深圳市创荣发电子有限公司 一种无线遥控器的pcb板天线
EP3051628A1 (fr) 2013-09-23 2016-08-03 Samsung Electronics Co., Ltd. Appareil d'antenne et dispositif électronique l'ayant
WO2017194096A1 (fr) 2016-05-10 2017-11-16 Sony Mobile Communications Inc. Antenne alimentée en c formée sur le bord d'une carte de circuit imprimé multicouche
DE202018103656U1 (de) * 2018-06-25 2018-08-23 ASTRA Gesellschaft für Asset Management mbH & Co. KG Platinenantenne

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3051628A1 (fr) 2013-09-23 2016-08-03 Samsung Electronics Co., Ltd. Appareil d'antenne et dispositif électronique l'ayant
CN103928757A (zh) * 2014-03-26 2014-07-16 深圳市创荣发电子有限公司 一种无线遥控器的pcb板天线
WO2017194096A1 (fr) 2016-05-10 2017-11-16 Sony Mobile Communications Inc. Antenne alimentée en c formée sur le bord d'une carte de circuit imprimé multicouche
DE202018103656U1 (de) * 2018-06-25 2018-08-23 ASTRA Gesellschaft für Asset Management mbH & Co. KG Platinenantenne

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023065068A1 (fr) * 2021-10-18 2023-04-27 宏启胜精密电子(秦皇岛)有限公司 Carte de circuit imprimé et son procédé de fabrication

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