EP3714330A1 - Porous graphitic pellicle - Google Patents
Porous graphitic pellicleInfo
- Publication number
- EP3714330A1 EP3714330A1 EP18796955.5A EP18796955A EP3714330A1 EP 3714330 A1 EP3714330 A1 EP 3714330A1 EP 18796955 A EP18796955 A EP 18796955A EP 3714330 A1 EP3714330 A1 EP 3714330A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- pellicle
- zeolite
- dimensional template
- around
- radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70575—Wavelength control, e.g. control of bandwidth, multiple wavelength, selection of wavelength or matching of optical components to wavelength
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
Definitions
- the lithographic apparatus in which the pellicle is used may be flushed with a gas. Also, during exposure the pellicle will undergo a substantial heat load from the EUV radiation. Stress variations of the pellicle induced by such factors can result in damage to the pellicle if it is not sufficiently strong. The pellicle may break and contaminate various parts of the lithographic apparatus, which is undesirable.
- Another type of carbonaceous pellicle is based on carbon nanotubes.
- Such pellicles do not have the same dense, parallel layer structure as multi-layer graphene pellicles, but are rather formed of a network of carbon nanotubes in a mesh.
- the boundaries of carbon nanotube-based pellicles are less defined than the boundaries of multi-layer graphene pellicles and the carbon nanotubes can alter the uniformity of the radiation beam passing through the pellicle, for example due to scattering. This is undesirable as the variance in the uniformity of the radiation beam can be reflected in the final product.
- Given the extremely high precision required by a lithography machine even small differences in the uniformity of the radiation beam can result in decreased exposure performance.
- a benefit of pellicles based on carbon nanotubes is that they are strong and so they can meet the strength requirements for use in a lithographic apparatus.
- EUV sources such as those which generate EUV radiation using a plasma
- EUV sources do not only emit desired‘in-band’ EUV radiation, but also undesirable (out-of-band) radiation.
- This out-of- band radiation is most notably in the deep UV (DUV) radiation range (from 100 to 400 nm).
- the radiation emitted from the laser for example at 10.6 microns, may be a source of out-of-band radiation (e.g. IR radiation).
- spectral purity may be desired for several reasons.
- resist is sensitive to out of -band wavelengths of radiation, and thus the image quality of exposure patterns applied to the resist may be deteriorated if the resist is exposed to such out-of-band radiation.
- out-of-band radiation for example infrared radiation in some laser produced plasma sources, leads to unwanted and unnecessary heating of the patterning device, substrate, and optics within the lithographic apparatus. Such heating may lead to damage of these elements, degradation in their lifetime, and/or defects or distortions in patterns projected onto and applied to a resist-coated substrate.
- a spectral purity filter may be used as a pellicle, and vice versa. Therefore, reference in the present application to a‘pellicle’ is also reference to a‘spectral purity filter. Although reference is primarily made to pellicles in the present application, all of the features could equally be applied to spectral purity filters.
- a lithographic apparatus and/or method it is desirable to minimise the losses in intensity of radiation which is being used to apply a pattern to a resist coated substrate.
- One reason for this is that, ideally, as much radiation as possible should be available for applying a pattern to a substrate, for instance to reduce the exposure time and increase throughput.
- a pellicle used in a lithographic method or apparatus has an adequate lifetime, and does not degrade rapidly over time as a consequence of the high heat load to which the pellicle may be exposed, and/or the hydrogen (or the like, such as free radical species including H* and HO*) to which the pellicle may be exposed. It is therefore desirable to provide an improved (or alternative) pellicle, and for example a pellicle suitable for use in a lithographic apparatus and/or method.
- the zeolite may be any suitable zeolite.
- the zeolite may be Zeolite A, Zeolite Beta, mordenite, Zeolite Y, or chabazite. These are the most commonly used and most readily available zeolites, although it will be appreciated that other zeolites are also considered to be suitable for the present invention.
- the zeolite may be a modified zeolite.
- the modified zeolite may comprise zeolite which has been doped with a suitable material. Suitable materials include one or more of lanthanum, zinc, molybdenum, yttrium, calcium, tungsten, vanadium, titanium, niobium, chromium, tantalum, and hafnium. It has been surprisingly found that by doping the zeolite with one or more of these elements decreases the temperature at which carbonization is able to occur within the pores of the zeolite.
- the doping can be carried out by any suitable means, such as ion exchange. For example, sodium ions in the zeolite may be exchanged with lanthanum ions.
- the carbon source may be a saturated or unsaturated Cl to C4 hydrocarbon. It is possible to use hydrocarbons having more than four carbon atoms, but the absorption process is slower since these are liquid at ambient temperatures. Of course, if the absorption into the three dimensional template took place at temperatures above ambient, longer chain hydrocarbons may be used.
- the hydrocarbons are preferably linear.
- suitable carbon sources include methane, ethane, ethane, ethyne, propane, propene, propadiene, propyne, butane, butene, butadiene, butatriene, and butyne. Since the carbon source is intended to be primarily for the provision of carbon, it is preferable to use unsaturated hydrocarbons as these have advantageous carbon to hydrogen ratios and are more reactive that saturated hydrocarbons. For example, a preferred carbon source is ethyne as it is most reactive and is also small, so is able to diffuse into the three dimensional template easily.
- the method may comprise heating the three dimensional template material up to a first temperature to carbonise the carbon source. Once the carbon source has been passed into the internal pores of the three dimensional template, heating the material causes it to carbonise.
- the carbonization process is enhanced by the aforementioned doping of the three dimensional material with metal ions.
- the metal ions are selected as they form strong carbide bonds. Without the doping, the temperature required to carbonise the carbon source is much greater and results in carbon only forming on the surface of the three dimensional template and does not form a carbonaceous network which substantially corresponds to the internal pore structure of the three dimensional material in which the carbon source is contained.
- the carbonaceous pellicle is retrieved by dissolving the three dimensional template.
- the zeolite may be dissolved by exposure to a strong acid, such as hydrochloric acid or hydrofluoric acid, and may subsequently be exposed to a hot basic solution, such as sodium hydroxide.
- a strong acid such as hydrochloric acid or hydrofluoric acid
- a hot basic solution such as sodium hydroxide.
- the exact method for dissolving the zeolite is not restricted to the examples given, and any suitable method which dissolves the zeolite whilst leaving the carbonaceous pellicle may be used.
- the three dimensional material may be prepared from a silicon wafer by known means.
- the silicon wafer is single crystal silicon. The preparation from a silicon wafer allows the exact thickness and nature of the zeolite to be controlled.
- different zeolites can be prepared depending on the exact nature of the pellicle required, with some having larger pores and others having smaller pores.
- a portion of the surface of the silicon wafer may be converted to a zeolite material, or a zeolite material may be prepared on the surface of a silicon wafer. Both techniques are known in the art.
- the thickness of the zeolite may be from around 50 to around 150 nm, from around 80 nm to around 120 nm, and preferably around 100 nm. If the zeolite is too thin, the resulting pellicle may not be thick enough to have the necessary strength to be used in an EUV lithography apparatus. On the other hand, if the zeolite is too thick, the resulting pellicle may be too thick and have undesirably low EUV transmissivity, such as, for example, less than 90%. The exact thickness of the pellicle can be achieved by removing material from a pellicle until the desired thickness is met.
- the three-dimensional template may be any zeolite described in relation to the first aspect of the present invention.
- the pellicle is a carbonaceous pellicle.
- a pellicle for a lithographic apparatus obtained or obtainable by the method according to the first aspect of the present invention.
- a pellicle manufactured according to a method of the first aspect of the present invention, or according to the fourth or fifth aspects of the present invention in a lithographic apparatus is provided.
- the methods of the present invention allow for the manufacture of a pellicle, in particular a carbonaceous pellicle, which is suitable for use in an EUV lithographic apparatus. It has not been previously possible to manufacture such a pellicle.
- the pellicles manufactured according to the methods of the present invention are able to resist the high temperatures achieved when the pellicle is in use and also withstand mechanical forces on the pellicle during use of the lithographic apparatus which would damage known pellicles.
- having a pellicle with a regular three-dimensional structure means that the uniformity of the radiation beam is not adversely affected when passing through the pellicle. It is believe that the three dimensional structure which substantially corresponds to the internal pore structure of a zeolite provides the pellicle with sufficient strength to be used in a lithographic apparatus, but also enough flexibility to withstand any temperature and/or pressure changes during use.
- the present invention will now be described with reference to a carbonaceous pellicle which is formed within the pore structure of a zeolite.
- the present invention is not limited to pellicles and is equally applicable to spectral purity filters.
- charge storage devices such as batteries or capacitors.
- the methods, uses, and products are described in the context of pellicles and lithography, it will be appreciated that such methods, uses, and products could also be used in the manufacture of components for batteries and capacitors.
- FIG. 1 shows a lithographic system including a pellicle 15 according to the fourth and fifth aspects of the present invention or manufactured according to the methods of the first aspect of the present invention according to one embodiment of the invention.
- the lithographic system comprises a radiation source SO and a lithographic apparatus LA.
- the radiation source SO is configured to generate an extreme ultraviolet (EUV) radiation beam B.
- the lithographic apparatus LA comprises an illumination system IL, a support structure MT configured to support a patterning device MA (e.g. a mask), a projection system PS and a substrate table WT configured to support a substrate W.
- the illumination system IL is configured to condition the radiation beam B before it is incident upon the patterning device MA.
- the projection system is configured to project the radiation beam B (now patterned by the mask MA) onto the substrate W.
- the substrate W may include previously formed patterns. Where this is the case, the lithographic apparatus aligns the patterned radiation beam B with a pattern previously formed on the substrate W.
- the pellicle 15 is depicted in the path of the radiation and protecting the patterning device MA. It will be appreciated that the pellicle 15 may be located in any required position and may be used to protect any of the mirrors in the lithographic apparatus.
- the radiation source SO, illumination system IL, and projection system PS may all be constructed and arranged such that they can be isolated from the external environment.
- a gas at a pressure below atmospheric pressure e.g. hydrogen
- a vacuum may be provided in illumination system IL and/or the projection system PS.
- a small amount of gas (e.g. hydrogen) at a pressure well below atmospheric pressure may be provided in the illumination system IL and/or the projection system PS.
- the radiation source SO shown in Figure 1 is of a type which may
- a laser 1 which may for example be a CO 2 laser, is arranged to deposit energy via a laser beam 2 into a fuel, such as tin (Sn) which is provided from a fuel emitter 3.
- a fuel such as tin (Sn) which is provided from a fuel emitter 3.
- tin is referred to in the following description, any suitable fuel may be used.
- the fuel may for example be in liquid form, and may for example be a metal or alloy.
- the fuel emitter 3 may comprise a nozzle configured to direct tin, e.g. in the form of droplets, along a trajectory towards a plasma formation region 4.
- the laser beam 2 is incident upon the tin at the plasma formation region 4.
- the deposition of laser energy into the tin creates a plasma 7 at the plasma formation region 4. Radiation, including EUV radiation, is emitted from the plasma 7 during de-excitation and recombination of ions of the plasma.
- the EUV radiation is collected and focused by a near normal incidence radiation collector 5 (sometimes referred to more generally as a normal incidence radiation collector).
- the collector 5 may have a multilayer structure which is arranged to reflect EUV radiation (e.g. EUV radiation having a desired wavelength such as 13.5 nm).
- EUV radiation e.g. EUV radiation having a desired wavelength such as 13.5 nm.
- the collector 5 may have an elliptical configuration, having two ellipse focal points. A first focal point may be at the plasma formation region 4, and a second focal point may be at an intermediate focus 6, as discussed below.
- the laser 1 may be separated from the radiation source SO. Where this is the case, the laser beam 2 may be passed from the laser 1 to the radiation source SO with the aid of a beam delivery system (not shown) comprising, for example, suitable directing mirrors and/or a beam expander, and/or other optics.
- a beam delivery system (not shown) comprising, for example, suitable directing mirrors and/or a beam expander, and/or other optics.
- the laser 1 and the radiation source SO may together be considered to be a radiation system.
- the radiation beam B is focused at point 6 to form an image of the plasma formation region 4, which acts as a virtual radiation source for the illumination system IL.
- the point 6 at which the radiation beam B is focused may be referred to as the intermediate focus.
- the radiation source SO is arranged such that the intermediate focus 6 is located at or near to an opening 8 in an enclosing structure 9 of the radiation source.
- the radiation beam B passes from the radiation source SO into the illumination system IL, which is configured to condition the radiation beam.
- the illumination system IL may include a facetted field mirror device 10 and a facetted pupil mirror device 11.
- the faceted field mirror device 10 and faceted pupil mirror device 11 together provide the radiation beam B with a desired cross-sectional shape and a desired angular distribution.
- the radiation beam B passes from the illumination system IL and is incident upon the patterning device MA held by the support structure MT.
- the patterning device MA reflects and patterns the radiation beam B.
- the illumination system IL may include other mirrors or devices in addition to or instead of the faceted field mirror device 10 and faceted pupil mirror device 11.
- the projection system PS comprises a plurality of mirrors 13, 14 which are configured to project the radiation beam B onto a substrate W held by the substrate table WT.
- the projection system PS may apply a reduction factor to the radiation beam, forming an image with features that are smaller than corresponding features on the patterning device MA. A reduction factor of 4 may for example be applied.
- the projection system PS has two mirrors 13, 14 in Figure 1, the projection system may include any number of mirrors (e.g. six mirrors).
- the radiation sources SO shown in Figure 1 may include components which are not illustrated.
- a spectral filter may be provided in the radiation source.
- the spectral filter may be substantially transmissive for EUV radiation but substantially blocking for other wavelengths of radiation such as infrared radiation.
- a three dimensional template in the form of a zeolite is provided. This may have been formed based on a silicon wafer or by any other suitable means.
- the exemplary zeolite is Zeolite-Y in which at least a portion of the sodium ions has been exchanged with lanthanum ions via ion exchange.
- a carbon source comprising ethyne gas is passed over the zeolite and the ethyne gas is allowed to diffuse into the internal pores of the zeolite.
- the zeolite is heated to around 650C in order to carbonise the ethyne gas and form a carbon structure inside of the zeolite which substantially corresponds to the internal structure of the zeolite. Following this, the zeolite is heated to around 850C in order to provide a more highly ordered carbonaceous pellicle. The zeolite is then dissolved by dissolution in hydrofluoric acid in order to recover the pellicle.
- the resulting pellicle has EUV transmissivity of greater than 90% and is strong enough for use in a lithographic apparatus.
- EUV radiation may be considered to encompass electromagnetic radiation having a wavelength within the range of 4-20 nm, for example within the range of 13-14 nm. EUV radiation may have a wavelength of less than 10 nm, for example within the range of 4-10 nm such as 6.7 nm or 6.8 nm.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP17202767 | 2017-11-21 | ||
PCT/EP2018/080415 WO2019101517A1 (en) | 2017-11-21 | 2018-11-07 | Porous graphitic pellicle |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3714330A1 true EP3714330A1 (en) | 2020-09-30 |
Family
ID=60421653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP18796955.5A Pending EP3714330A1 (en) | 2017-11-21 | 2018-11-07 | Porous graphitic pellicle |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP3714330A1 (en) |
JP (1) | JP7252950B2 (en) |
KR (1) | KR20200087774A (en) |
CN (1) | CN111373328B (en) |
NL (2) | NL2021947B9 (en) |
TW (1) | TWI840338B (en) |
WO (1) | WO2019101517A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11314169B2 (en) * | 2019-10-30 | 2022-04-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Robust, high transmission pellicle for extreme ultraviolet lithography systems |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04196117A (en) * | 1990-11-26 | 1992-07-15 | Seiko Epson Corp | Semiconductor manufacturing device |
JP3448670B2 (en) * | 1993-09-02 | 2003-09-22 | 株式会社ニコン | Exposure apparatus and element manufacturing method |
WO2002054463A1 (en) * | 2000-12-28 | 2002-07-11 | Nikon Corporation | Exposure device |
JP4296328B2 (en) | 2001-11-28 | 2009-07-15 | 東レ株式会社 | Hollow nanofiber-containing composition and method for producing hollow nanofiber |
US7504192B2 (en) * | 2003-12-19 | 2009-03-17 | Sematech Inc. | Soft pellicle for 157 and 193 nm and method of making same |
JP5145496B2 (en) | 2006-06-07 | 2013-02-20 | 住友金属鉱山株式会社 | Method for producing carbon nanostructure |
US7767985B2 (en) * | 2006-12-26 | 2010-08-03 | Globalfoundries Inc. | EUV pellicle and method for fabricating semiconductor dies using same |
JP2009023871A (en) | 2007-07-19 | 2009-02-05 | Kuraray Co Ltd | Method for manufacturing carbon nanotube |
JP4861963B2 (en) * | 2007-10-18 | 2012-01-25 | 信越化学工業株式会社 | Pellicle and method for manufacturing pellicle |
JP5744879B2 (en) * | 2009-09-18 | 2015-07-08 | コーニンクレッカ フィリップス エヌ ヴェ | Foil trap device with improved heat resistance |
JP5552834B2 (en) | 2010-02-23 | 2014-07-16 | 学校法人 東洋大学 | Method for producing carbon nanotube |
JP5093288B2 (en) | 2010-04-13 | 2012-12-12 | トヨタ自動車株式会社 | Manufacturing method of fuel cell |
KR102093441B1 (en) | 2013-03-11 | 2020-03-25 | 삼성전자주식회사 | A method for preparing grapheme |
TWI658321B (en) * | 2013-12-05 | 2019-05-01 | 荷蘭商Asml荷蘭公司 | Apparatus and method for manufacturing a pellicle, and a pellicle |
US9958770B2 (en) * | 2014-04-17 | 2018-05-01 | Industry-University Cooperation Foundation Hanyang University | Pellicle for EUV lithography |
US9256123B2 (en) * | 2014-04-23 | 2016-02-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of making an extreme ultraviolet pellicle |
US9604194B2 (en) | 2014-10-14 | 2017-03-28 | Saudi Arabian Oil Company | Synthesis of ordered microporous carbons by chemical vapor deposition |
JP6520041B2 (en) | 2014-10-21 | 2019-05-29 | 凸版印刷株式会社 | Pellicle |
JP6837433B2 (en) | 2014-11-17 | 2021-03-03 | エーエスエムエル ネザーランズ ビー.ブイ. | Pellicle mounting device and pellicle mounting method |
CA3002702C (en) * | 2015-10-22 | 2022-12-13 | Asml Netherlands B.V. | A method of manufacturing a pellicle for a lithographic apparatus, a pellicle for a lithographic apparatus, a lithographic apparatus, a device manufacturing method, an apparatus for processing a pellicle, and a method for processing a pellicle |
JP2017083791A (en) | 2015-10-30 | 2017-05-18 | 三井化学株式会社 | Pellicle, method for producing pellicle and exposure method using the pellicle |
-
2018
- 2018-11-07 WO PCT/EP2018/080415 patent/WO2019101517A1/en unknown
- 2018-11-07 CN CN201880075083.7A patent/CN111373328B/en active Active
- 2018-11-07 NL NL2021947A patent/NL2021947B9/en active
- 2018-11-07 JP JP2020521289A patent/JP7252950B2/en active Active
- 2018-11-07 KR KR1020207014407A patent/KR20200087774A/en not_active Application Discontinuation
- 2018-11-07 EP EP18796955.5A patent/EP3714330A1/en active Pending
- 2018-11-19 TW TW107140960A patent/TWI840338B/en active
-
2019
- 2019-08-16 NL NL2023649A patent/NL2023649B1/en active
Also Published As
Publication number | Publication date |
---|---|
NL2021947B9 (en) | 2019-09-30 |
CN111373328A (en) | 2020-07-03 |
NL2021947A (en) | 2019-05-24 |
CN111373328B (en) | 2023-06-09 |
NL2023649B1 (en) | 2020-05-06 |
JP7252950B2 (en) | 2023-04-05 |
KR20200087774A (en) | 2020-07-21 |
NL2021947B1 (en) | 2019-09-06 |
TW201932988A (en) | 2019-08-16 |
WO2019101517A1 (en) | 2019-05-31 |
TWI840338B (en) | 2024-05-01 |
NL2023649A (en) | 2019-09-10 |
JP2021504731A (en) | 2021-02-15 |
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