EP3703120A4 - Method for manufacturing semiconductor device - Google Patents
Method for manufacturing semiconductor device Download PDFInfo
- Publication number
- EP3703120A4 EP3703120A4 EP17930123.9A EP17930123A EP3703120A4 EP 3703120 A4 EP3703120 A4 EP 3703120A4 EP 17930123 A EP17930123 A EP 17930123A EP 3703120 A4 EP3703120 A4 EP 3703120A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- semiconductor device
- manufacturing semiconductor
- manufacturing
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Applications Claiming Priority (1)
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JP2015026791A (en) * | 2013-07-29 | 2015-02-05 | 新電元工業株式会社 | Semiconductor device and lead frame |
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US5391439A (en) * | 1990-09-27 | 1995-02-21 | Dai Nippon Printing Co., Ltd. | Leadframe adapted to support semiconductor elements |
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US7821111B2 (en) * | 2007-10-05 | 2010-10-26 | Texas Instruments Incorporated | Semiconductor device having grooved leads to confine solder wicking |
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