EP3682474B1 - Arrangement of several adapter elements and method for producing such a composite - Google Patents

Description

The present invention relates to a composite made up of a plurality of adapter elements and a method for producing such a composite.

For cooling electrical components that generate heat during operation, such as laser diodes, the prior art knows heat sinks that are connected to the laser diode via an adapter element. An example of this is in the JP 2004 186 527 A to find. The adapter elements arranged between the laser diode and the heat sink are usually used to adapt different expansion coefficients of the materials from which the heat sinks and the electrical components such as OP amplifiers, coils or laser diodes are made. The background to this is that otherwise the different expansion coefficients during operation can lead to thermomechanically induced stresses in the connection area. The consequence of these thermomechanical stresses can be deformation of the laser diode, which in turn can lead to a change in the emission wavelength of the laser diode, or even crack formation.

To produce the connection between the heat sink and the laser diode, the laser diode is therefore joined to the heat sink via the adapter element, in particular soldered using AuSn solder material. For this purpose, the adapter elements must be coated with the AuSn solder material, typically using a sputtering process.

In addition, from the DE 10 2006 009 159 A1 a composite substrate with a carrier is known which consists of a metallic material, for example copper and / or aluminum, on at least one surface side.

1. a) Bereitstellen eines Kühlelements mit einem elektrisch isolierenden, plattenförmigen Träger mit einer ersten Hauptfläche und einer zweiten Hauptfläche, wobei die erste Hauptfläche mit einer Metallschicht bedeckt ist,
2. b) Strukturieren der Metallschicht in eine Mehrzahl von metallischen Flächen derart, dass die metallischen Flächen eine Montageplattform für eine Mehrzahl von Halbleiterlaserdioden bilden,
3. c) Aufbringen einer Mehrzahl von Laserdioden-Halbleiterkörpern und einer Mehrzahl von optischen Elementen, die den Laserdioden-Halbleiterkörpern zugeordnet sind, wobei jeweils ein Laserdioden-Halbleiterkörper auf einer metallischen Fläche angeordnet ist, und
4. d) Zerteilen des Kühlelements in die Mehrzahl von Halbleiterlaserbauelementen hergestellt ist.

In the US 2003 21 1 708 a method for producing a semiconductor component is described, which comprises the following steps:

1. a) providing a cooling element with an electrically insulating, plate-shaped carrier with a first main surface and a second main surface, the first main surface being covered with a metal layer,
2. b) structuring the metal layer into a plurality of metallic surfaces in such a way that the metallic surfaces form a mounting platform for a plurality of semiconductor laser diodes,
3. c) applying a plurality of laser diode semiconductor bodies and a plurality of optical elements which are assigned to the laser diode semiconductor bodies, a laser diode semiconductor body in each case being arranged on a metallic surface, and
4. d) the cooling element is divided into the plurality of semiconductor laser components.

In the DE 10 2005 061 049 A1 a metal-ceramic substrate is provided with at least one metallization structured by etching on at least one surface side of a plate-shaped ceramic material, which consists of a base substrate made of an aluminum nitride or silicon nitride ceramic and to which the metallization is applied by active soldering prior to structuring.

Based on this background, the present invention aims to provide adapter elements that can withstand high temperature loads during operation, allow optimal adaptation of the expansion coefficients in the system of components such as laser diode, adapter element and heat sink, and can be produced comparatively easily and quickly.

This object is achieved by a composite of several adapter elements according to claim 1 and a method for producing a composite according to claim 9. Further advantages and features of the invention emerge from the dependent claims as well as the description and the accompanying figures.

• -- eine erste Metallschicht, die im montierten Zustand dem Bauelement zugewandt ist, und eine zweite Metallschicht, die im montierten Zustand dem Kühlkörper zugewandt ist, und weiter gekennzeichnet durch
• -- eine zwischen der ersten Metallschicht und der zweiten Metallschicht angeordnete, Keramik umfassende Zwischenschicht,

wobei die ersten Metallschicht und/oder die zweite Metallschicht dicker als 40 µm, bevorzugt dicker als 70 µm und besonders bevorzugt dicker als 100 µm ist, wobei die Adapterelemente durch eine Sollbruchstelle von einem Träger trennbar sind, und die Adapterelemente einen elektrisch leitenden Kontakt zum Träger des Verbunds aufweisen.According to the invention, a composite of several adapter elements is provided, which are suitable for connecting a component such as a laser diode to a heat sink, comprising:

• - A first metal layer, which faces the component in the assembled state, and a second metal layer, which faces the heat sink in the assembled state, and further characterized by
• an intermediate layer comprising ceramic and arranged between the first metal layer and the second metal layer,

the first metal layer and / or the second metal layer being thicker than 40 µm, preferably thicker than 70 µm and particularly preferably thicker than 100 µm, the adapter elements being separable from a carrier by a predetermined breaking point, and the adapter elements providing an electrically conductive contact to the carrier of the network.

Compared to the prior art, a comparatively thick first and / or second metal layer is provided according to the invention, the thickness of which advantageously supports heat spreading during heat transport through the adapter element. This spread of heat in turn leads to the most homogeneous possible heat distribution in an interface area between the heat sink and the adapter element. This can advantageously counteract thermomechanical stresses that are caused by different thermal expansion coefficients of the individual components. I. E. An adapter element can be provided with which a stress-reduced interface between the adapter element and the heat sink can be implemented in the assembled state, which advantageously causes cracks to form in the system of z. B. laser diode, adapter element and heat sink or a z. B. the wavelength changing deformation of the laser diode can be suppressed. In addition, the thickness of the first metal layer and / or the second metal layer according to the claims can advantageously be achieved simply by means of a DCB method or an active soldering method realize quickly. Furthermore, the use of an intermediate layer comprising the ceramic allows the coefficients of thermal expansion to be adapted, as a result of which the development of thermomechanical stresses during operation can be further counteracted.

The first metal layer and / or the second metal layer preferably comprises copper, in particular with a degree of purity of 99.98% or higher. It is also provided that the intermediate _{layer Al 2} O ₃ , Si ₃ N ₄ , or an HPSX ceramic (ie a ceramic with an Al ₂ O ₃ matrix that includes an x percent share of ZrO ₂ , for example Al ₂ O ₃ with 9% ZrO ₂ = HPS9 or Al ₂ O ₃ with 25% ZrO ₂ = HPS25). It is particularly preferred if it is a ceramic comprising AlN, in particular with a thermal conductivity of more than 150 W / mK, preferably more than 175 W / mK and particularly preferably more than 225 W / mK. As a result, the adaptation to the expansion coefficients can advantageously be further improved.

According to a further embodiment of the present invention, it is provided that the intermediate layer is thinner than 400 μm, preferably thinner than 200 μm and particularly preferably thinner than 100 μm, in order to adapt the expansion coefficients. In particular, it is provided that the intermediate layer has a secondary thickness that is designed for the most optimal possible adaptation of the expansion coefficients. This further supports the suppression of thermomechanical stresses. A ratio between a total thickness of a primary layer thickness of the first metal layer and a primary layer thickness of the second metal layer to the secondary layer thickness of the intermediate layer preferably has a value between 0.7 and 2, preferably between 0.8 and 1.5 and particularly preferably between 0.95 and 1 , 2 at.

The secondary layer preferably assumes a thickness between 0.05 mm and 0.5 mm, preferably between 0.1 mm and 0.4 mm and particularly preferably between 0.2 and 0.38 mm. Furthermore, the primary layer thickness of the individual first metal layer or the second metal layer is between 0.01 mm and 0.15 mm, preferably between 0.02 and 0.13 mm and particularly preferably between 0.025 and 0.11 mm conceivable. In particular, a ratio of the total primary layer thickness of the first and second metal layer to the secondary layer thickness of the intermediate layer assumes a value between 0.2 and 0.8, preferably between 0.25 and 0.65 and particularly preferably between 0.3 and 0.55. It is preferably provided that the adapter element is formed to an extent of at least 20% from the first metal layer and the second metal layer.

In a further embodiment of the present invention it is provided that several adapter elements are provided in a composite, the adapter elements being separable from the carrier by a predetermined breaking point. This advantageously allows a number of adapter elements to be handled jointly. I. E. the individual adapter elements do not have to be transported individually or prepared for the connection of the laser diodes. For example, the multiple adapter elements can be coated together, which advantageously simplifies the manufacture of the individual adapter elements. The adapter elements are preferably arranged next to one another on a common carrier and the adjacent adapter elements are separated from one another by corresponding predetermined breaking points.

It is expediently provided that the adapter element or the adapter elements have an electrically conductive contact, in particular with a carrier of the assembly. The connection via an electrical contact proves to be particularly advantageous because the adapter element can be kept at a desired potential for a sputtering process by means of the electrical contact. In other words: the integration of the electrical contact advantageously makes it possible to dispense with individual contacting when the adapter element is required to be coated, in particular with a solder material. This further simplifies the connection of the laser diode to the heat sink.

It is particularly preferably provided that the first metal layer and / or the second metal layer has a thickness between 75 μm and 120 μm.

It is preferably provided that the electrically conductive contact is designed in such a way that it tears off when the predetermined breaking point is broken. In particular, the electrically conductive contact is made so thin that it tears off when a force required for breaking off the adapter element along the predetermined breaking point is applied. It is also conceivable that the electrically conductive contact is perforated or has a local material thinning. The corresponding configuration of the electrically conductive contact can advantageously dispense with an additional work step in which the electrically conductive contact has to be removed.

According to a further embodiment of the present invention, it is provided that the intermediate layer has an electrically conductive through-hole contact, i. H. has or can have a via. By means of a through-contact through the otherwise insulating intermediate layer, it is advantageously possible to use the adapter element also for those applications in which an electrically conductive connection is provided between the laser diode and the heat sink. Alternatively, it is conceivable that the intermediate layer is designed to be insulating for those applications for which no electrical connection is provided between the laser diode and the heat sink.

The present invention relates to a composite of several adapter elements according to the invention, the adapter elements according to the invention being arranged on a common carrier such that they can be separated via a predetermined breaking point. In particular, a common intermediate layer, preferably a ceramic intermediate layer, extends in the composite both over the carrier and over the adapter element, i. h the adapter elements and the carrier are arranged next to one another in a plane running parallel to a main plane of extent (along which the intermediate layer extends). The first metal layer, the intermediate layer and the second metal layer preferably form the carrier and the Adapter elements. The subdivision between the carrier and the adapter element is implemented by structuring the first metal layer and the second metal layer. The structuring also reveals the visible separation between the individual adapter elements arranged next to one another along a row. In particular, the predetermined breaking point is implemented in the ceramic layer, in particular in an area without a first and / or second metal layer. The predetermined breaking point preferably runs both between the individual adapter elements arranged next to one another in a row and between the carrier and the adapter elements arranged in a row. To separate, ie to break off the individual adapter elements, a force or refractive power running essentially perpendicular to the first metal layer or perpendicular to the intermediate layer, ie perpendicular to the main plane of extent of the composite, must preferably be applied. In particular, it is provided that the structuring of the first metal layer or the second metal layer defines the contours or shapes of the carrier and the adapter elements.

Furthermore, it is provided that the carrier extends longitudinally essentially parallel to the direction along which the adapter elements are arranged next to one another in a row, and the adapter elements protrude laterally from the carrier. The adapter elements and the carrier are designed like a comb.

According to the invention it is provided that at least one electrically conductive contact extends between the carrier and the adapter element. A plurality of, in particular two, electrically conductive contacts are preferably provided for a single adapter element, each of which electrically conductively connects subregions of the first metal layer or the second metal layer that are electrically isolated from one another to the carrier. In particular, the electrically conductive contact tears when the respective adapter element is separated from the carrier.

It is preferably provided that in the composite the electrically conductive contact has a predetermined breaking point, in particular a predetermined breaking point between the adapter elements and the carrier, crosses. In particular, the electrically conductive contact crosses the predetermined breaking point, preferably perpendicularly. In this case, the electrically conductive contact is preferably designed in the form of a web and in the first metal layer or the second metal layer, in particular, connects the area of the carrier to the area of the adapter element. When breaking along the predetermined breaking point, the electrically conductive contact is then torn off.

It is preferably provided that in order to avoid an accumulation of material when breaking along a predetermined breaking point, the carrier has a recess, in particular in the form of a groove, on a side opposite the predetermined breaking point. For example, the groove can be made with a saw, in particular a “wafer saw”. As an alternative or in addition, it is also conceivable that the groove is realized by laser ablation or etching. In this case, the groove is preferably arranged below the predetermined breaking point and extends in the lateral direction, i. H. a direction perpendicular to the longitudinal extension of the predetermined breaking point, further than a notch provided for the predetermined breaking point in the intermediate layer. The recess makes it possible in an advantageous manner to avoid an accumulation of material which would otherwise occur on the opposite side when breaking along the predetermined breaking point.

Another object of the present invention is a method for producing a composite according to the invention, the first metal layer and / or the second metal layer being bonded to the intermediate layer by means of a DCB method or an active soldering method. All of the features described for the composite according to the invention and their advantages can also be applied analogously to the method according to the invention and vice versa.

A “DCB process” (direct copper bond technology) is understood by those skilled in the art to be such a process which is used, for example, to connect metallizations or sheets (for example copper sheets or foils) to one another and / or with ceramic or ceramic layers is used, namely using metal or copper sheets or metal or copper foils, which on their surface sides a layer or a coating (melting layer) made of a chemical compound of the metal and a reactive gas, preferably oxygen, exhibit. In this example in the U.S. Patent 3,744,120 or in the DE-PS 23 19 854 described method, this layer or this coating (melting layer) forms a eutectic with a melting temperature below the melting temperature of the metal (e.g. copper), so that by placing the foil on the ceramic and by heating all the layers, these can be connected to one another, and by melting the metal or copper essentially only in the area of the melting layer or oxide layer.

• Oxidieren einer Kupferfolie derart, dass sich eine gleichmäßige Kupferoxidschicht ergibt;
• Auflegen des Kupferfolie auf die Keramikschicht;
• Erhitzen des Verbundes auf eine Prozesstemperatur zwischen etwa 1065°C bis 1083°C, z. B. auf ca. 1071 °C;
• Abkühlen auf Raumtemperatur.

In particular, the DCB method then z. B. on the following process steps:

• Oxidizing a copper foil in such a way that a uniform copper oxide layer results;
• Placing the copper foil on the ceramic layer;
• Heating the composite to a process temperature between about 1065 ° C to 1083 ° C, e.g. B. to about 1071 ° C;
• Cool down to room temperature.

Under an active soldering process, e.g. B. for connecting metallizations or metal foils, in particular also of copper layers or copper foils with ceramic material, a method is to be understood which is also used specifically for the production of metal-ceramic substrates. Here, a connection between a metal foil, for example copper foil, and a ceramic substrate, for example aluminum nitride ceramic, is produced at a temperature between approx Gold also contains an active metal. This active metal, which is, for example, at least one element from the group Hf, Ti, Zr, Nb, Ce, establishes a connection between the solder and the ceramic, while the connection between the solder and the metal is a metallic braze connection.

It is preferably provided that the adapter element is coated by means of a sputtering process. As a result, the adapter element can advantageously be coated with a solder material. This solder material can then be used to connect the laser diode to the adapter element. A plurality of adapter elements arranged in a composite are preferably coated in a common sputtering process. In particular, the sputtering method is a PVD sputter deposition method.

It is expediently provided that the adapter element is broken off from the combination of adapter elements. In particular, it is provided that the adapter element is removed from the assembly after the laser diode has been attached to the adapter element, d. H. after coating the adapter element as well as fitting and soldering the laser diode onto the coated adapter element.

Further advantages and features emerge from the following description of preferred embodiments of the subject matter according to the invention with reference to the attached figures. Individual features of the individual embodiment can be combined with one another within the scope of the invention.

Fig.1:

ein montiertes Adapterelement,

Fig. 2:

mehrere Adapterelemente gemäß einer zweiten bevorzugten Ausführungsform, wobei die Adapterelemente in einem Verband zusammengefasst sind,

Fig.3:

ein Verbund aus mehreren Adapterelementen gemäß einer beispielhaften Ausführungsform der vorliegenden Erfindung in einer Draufsicht und

Fig.4:

zwei Verbunde von mehreren Adapterelement gemäß weiterer beispielhafter Ausführungsform der vorliegenden Erfindung in Seitenansichten.

It shows:

Fig. 1:

a mounted adapter element,

Fig. 2:

several adapter elements according to a second preferred embodiment, wherein the adapter elements are combined in an association,

Fig. 3:

a composite of several adapter elements according to an exemplary embodiment of the present invention in a plan view and

Fig. 4:

two assemblies of several adapter elements according to a further exemplary embodiment of the present invention in side views.

In Figure 1 a mounted adapter element 10 is shown according to a first preferred embodiment. Such an adapter element 10 is intended to serve as a link between a cooling body 7 and an electrical component such as a laser diode 4, the cooling body 7 being provided for cooling the laser diode 4, which generates heat during operation. A composite structure is provided as the adapter element 10, the adapter element 10 having in particular a first metal layer 11, which faces the heat sink 7 in the assembled state, and a second metal layer 12, which faces the laser diode 4 in the assembled state. The first metal layer 11 and / or the second metal layer 12 preferably comprises copper. An intermediate layer 13 is also arranged between the first metal layer 11 and the second metal layer 12, the intermediate layer 13 comprising a ceramic. In order to achieve the most homogeneous heat distribution possible in an interface area between the adapter element 10 and the heat sink 7, it is provided that the first metal layer 11 and / or the second metal layer 12 have a primary thickness P1, the primary thickness P1 being greater than 40 μm, preferably is greater than 70 µm and particularly preferably greater than 100 µm. In particular, it has been found here that such thick metal layers can be implemented comparatively easily and, in particular, quickly by means of a DCB method or an active soldering method.

Such a thick metal layer enables heat to be spread, that is to say an expansion of an otherwise locally concentrated heat development when heat is removed from the laser diode 4 via the adapter element 10. Furthermore is it is particularly preferably provided that the intermediate layer 13 comprising the ceramic has a secondary thickness P2 which is less than 400 μm, less than 200 μm and particularly preferably greater than 200 μm. By means of such a thick intermediate layer 13, a CTE adaptation can advantageously be achieved which, in particular together with the heat spread, leads to a transition between the adapter element 10 and the heat sink 4 that is as stress-free as possible. I. E. During operation of the laser diode 4, which is responsible for the generation of heat, the formation of a thermomechanical stress is suppressed or weakened by the corresponding adaptation of the primary thickness P1 and / or secondary thickness P2. As a result, the probability of crack formation or deformation of the laser diode 4 can be reduced. To further improve the conductivity, an intermediate layer 13 with a thermal conductivity of more than 150 W / mK, preferably more than 175 W / mK and particularly preferably more than 225 W / mK is provided.

Furthermore, it is conceivable that the primary thickness P1 of the first metal layer 11 differs from that of the primary thickness P1 of the second metal layer 12 or is essentially the same size. It is also conceivable that a ratio between an accumulated thickness of the primary thicknesses P1 of the first metal layer 11 and the second metal layer 12 to the secondary thickness P2 is a ratio between 0.7 and 2, preferably between 0.8 and 1.5 and particularly preferably between 0. 95 and 1.2 assumes.

Furthermore, it is preferably provided that the intermediate layer 13 has a via 15. Such a through-connection 15 allows the adapter element 10 to be used in those applications in which a non-insulating connection of the laser diode 4 to the heat sink 7 is desired.

In the Figure 2 a plurality of adapter elements 10 are shown according to a second preferred embodiment, the adapter elements 10 being combined in an association 1. Such a composite 1, ie multiframe, is provided in particular to those who connect the laser diode 4 via the adapter element 1 want to mount on the heat sink 7. Due to the arrangement in the composite 1, several adapter elements 10 can advantageously be prepared simultaneously for the subsequent connection process of the laser diode 4. For example, the adapter elements 10 are coated by means of a sputtering process in preparation for the connection of the laser diode 4 to the adapter element 10. In order to ensure the electrical contacting of the adapter elements 10 required for the sputtering process, electrically conductive contacts 8, ie coating contacts, are provided for each adapter element 10. In particular, these electrically conductive contacts 8 connect the respective adapter element 10 to a carrier 5 on which the adapter elements 10 are arranged. The first metal layer and / or the second metal layer are preferably each connected to the carrier via a conductive contact. Due to the contacts 8 already integrated in the composite 1, individual contacting of the individual adapter elements 10 can advantageously be dispensed with. Furthermore, it is provided that the electrically conductive contacts 8 are dimensioned in such a way that they tear off when the adapter element 10 is removed from the composite 1 or from the carrier 5. As a result, it is possible to dispense with an additional work step during production, with which the electrically conductive contact 8 would have to be removed again. Preferably, predetermined breaking points 18 are provided in the composite, along which the adapter elements 10 are broken off when the coating process, in particular the sputtering process, has ended and the adapter element 10 is separated from the composite 1. The predetermined breaking point 18 is preferably implemented by laser treatment, for example by a laser scratch line in the ceramic of the intermediate layer which crosses the electrically conductive contacts. Furthermore, saw gaps 19 are provided between the adapter elements 10 which extend into the carrier 5. The individual adapter elements 19 can be separated from one another along these sawing gaps 19 in order to then serve to connect the laser diode 4 to the heat sink 7. The ratio of a depth A of the saw gap 19 in the carrier 5 to the thickness B of the carrier 5 in the region of the adapter element 10 is preferably a value between 0.6 and 0.9, preferably between 0.75 and 0.85 and particularly preferably essentially 0.8. This allows a simple separation of the adapter elements Realize 10 and at the same time ensure sufficient stability that holds the adapter elements 10 together during the sputtering process. Furthermore, it is provided that the carrier 5 has a frame element 20 which laterally adjoins the sequence of adapter elements 10 lined up next to one another and ends flush with the adapter elements 10 on one side. As a result, the adapter elements 10 are protected to the side by the frame elements 20.

In Figure 3 shows a composite 1 of a plurality of adapter elements 10 according to an exemplary embodiment of the present invention. In particular, it is a plan view of the composite 1, in which several adapter elements 10 are arranged next to one another along a row. In particular, the view of the composite 1 takes place along a direction which runs parallel to a stacking direction, along which the first metal layer 11, the intermediate layer 13 and the second metal layer 12 are arranged one above the other, ie in FIG. the second metal layer 12 can be seen, the structuring of the first metal layer 11 and the second metal layer 12, among other things, defining the assignment of the respective sections to the adapter element 10 and to the carrier 5. In the areas that are exposed as a result of the structuring of the first metal layer 11 or the second metal layer 12, ie are without metal, the intermediate layer 13 can be seen in the plan view. The predetermined breaking points 18, along which the adapter elements 10 can be separated from one another or from the carrier 5, preferably run in these metal-free areas. Furthermore, it is provided that the adapter element 10, in particular the composite 1, has several electrically conductive contacts 8, which connect the carrier 5 to the adapter element 10 or various parts of the first metal layer 11 or the second metal layer 12 of the adapter element 10, in particular each connects.

Furthermore, it is preferably provided that the first metal layer 11 or the second metal layer 12 is structured on the composite 1 in such a way that an electrically conductive contact 8 is between the first metal layer 11 or the second Metal layer 12 is formed in the area of the carrier 5 and the first metal layer 11 or the second metal layer 12 in the area of the individual adapter element 10. The electrically conductive contact 8 is preferably designed in the shape of a web. The web-shaped, electrically conductive contact 8 preferably runs perpendicular to the course of the predetermined breaking point 18, along which the adapter elements 10 are separated from the carrier 5. In particular, the electrically conductive contact 5 crosses the predetermined breaking point 18. It is also conceivable that the web-shaped, electrically conductive contact 8 is at an angle between 30 ° and 90 °, preferably between 45 ° and 85 ° and particularly preferably between 60 ° and 80 ° is inclined with respect to a longitudinal extension of the predetermined breaking point 18.

Furthermore, it is provided that subregions of the first metal layer 11 or second metal layer 12 that are electrically isolated from one another are each connected to the carrier 5 by a separate electrically conductive contact 8, in particular to the first metal layer 11 or second metal layer 12 of the carrier 5 it is provided that along a direction which is determined by the longitudinal extension of the predetermined breaking point 18 between the adapter elements 10 and the carrier 5, a width of the web-like electrically conductive contact 8 is narrower than 0.1 times, preferably less than 0, 05 times and particularly preferably less than 0.01 times the width of the adapter element 10 measured in the same direction.

In Figure 4 are two sectional views through the composite 1 from Figure 3 shown. In particular, the upper sectional view shows a composite 1 before the adapter elements 10 are separated. When breaking off, a force F acts on the composite 1 here. As a result of the break, on the side of the composite 1 opposite the side experiencing the action of force, there is an accumulation of material below the predetermined breaking point 18. This accumulation of material forms a bead-like projection 25 on the outside of the composite 1. In order to counteract such an undesired accumulation of material with a corresponding projection formation, it is preferably provided that on the predetermined breaking point 18 opposite side, for example by means of a saw, in particular a "wafer saw", by means of etching or by means of a cutting process, in particular milling, to make a groove 26 in the composite 1. In particular, the groove 25 runs below the predetermined breaking point 18 as seen in the stacking direction, the predetermined breaking point particularly preferably being embedded in the intermediate layer 13 in a wedge shape. A lateral extension of the groove 26 is preferably wider than a lateral extension of the gap serving as a predetermined breaking point 18.

List of reference symbols:

1

Composite

4th

Laser diode

5

carrier

7th

Heat sink

8th

Contact

10

Adapter element

11th

first metal layer

12th

second metal layer

13th

Intermediate layer

15th

Via

18th

Predetermined breaking point

19th

Saw gap

20th

Frame element

25th

head Start

26th

Groove

A.

depth

B.

thickness

F.

power

Claims (11)

1. A composite (1) of a plurality of adapter elements (10) suitable for connecting a device such as a laser diode (4) to a heat sink (7), comprising

   - a first metal layer (11), which, in the mounted state, faces the component (4), and a second metal layer (12), which, in the mounted state, faces the heat sink (7), and further characterized by

   - an intermediate layer (13) which is arranged between the first metal layer (11) and the second metal layer (12) and comprises ceramics, the first metal layer (11) and/or the second metal layer (12) being thicker than 40 µm, preferably thicker than 70 µm and particularly preferably thicker than 100 µm, wherein it is possible to separate the adapter elements (10) from a support (5) using a predetermined breaking point (18), and the adapter elements (10) comprising an electrically conductive contact (8) to the support (5) of the composite (1).
2. The composite (1) according to claim 1, wherein the intermediate layer (13) is thinner than 400 µm, preferably thinner than 200 µm and particularly preferably thinner than 100 µm to matching the coefficients of expansion.
3. The composite (1) according to one of the preceding claims, wherein a ratio between an added up thickness of a primary layer thickness of the first metal layer (11) and a primary layer thickness of the second metal layer (12) to the secondary layer thickness of the intermediate layer (13) assumes a value between 0.2 and 0.8, preferably between 0.25 and 0.65 and particularly preferably between 0.3 and 0.55.
4. The composite (1) according to one of the preceding claims, wherein the electrically conductive contact (8) is configured such that it tears off when the predetermined breaking point is broken.
5. The composite (1) according to one of the preceding claims, wherein the intermediate layer (13) may have an electrically conductive via (15).
6. The composite (1) according to claim 5, wherein at least one web-shaped electrically conductive contact (8) extends between the support (5) and the adapter element (10).
7. The composite (1) according to one of the preceding claims, wherein the electrically conductive contact (8) crosses a predetermined breaking point (18), especially a predetermined breaking point (18) between the adapter elements (10) and the support (5).
8. The composite (1) according to one of the preceding claims, wherein the support (5) has a recess, especially in the form of a groove (26), on a side opposite the predetermined breaking point (18) to avoid material accumulation when breaking along a predetermined breaking point (18).
9. A method for the production of a composite according to any one of claims 1 to 8, wherein the first metal layer (11) and/or the second metal layer (12) are attached to the intermediate layer (13) using a DCB process or an active soldering process.
10. The process according to claim 9, wherein the adapter element (10) is coated using a sputtering process.
11. The method according to claim 9 or 10, wherein the adapter element (10) is broken away from the composite (1) of adapter elements (10).

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