EP3671780A4 - Film capacitor and metalized film - Google Patents
Film capacitor and metalized film Download PDFInfo
- Publication number
- EP3671780A4 EP3671780A4 EP18878854.1A EP18878854A EP3671780A4 EP 3671780 A4 EP3671780 A4 EP 3671780A4 EP 18878854 A EP18878854 A EP 18878854A EP 3671780 A4 EP3671780 A4 EP 3671780A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- film
- metalized
- capacitor
- film capacitor
- metalized film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title 1
- 239000010408 film Substances 0.000 title 1
- 239000011104 metalized film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017220110 | 2017-11-15 | ||
PCT/JP2018/022889 WO2019097750A1 (en) | 2017-11-15 | 2018-06-15 | Film capacitor and metalized film |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3671780A1 EP3671780A1 (en) | 2020-06-24 |
EP3671780A4 true EP3671780A4 (en) | 2021-06-02 |
Family
ID=66538546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP18878854.1A Pending EP3671780A4 (en) | 2017-11-15 | 2018-06-15 | Film capacitor and metalized film |
Country Status (5)
Country | Link |
---|---|
US (1) | US11476054B2 (en) |
EP (1) | EP3671780A4 (en) |
JP (1) | JP6677357B2 (en) |
CN (1) | CN111328424B (en) |
WO (1) | WO2019097750A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021005822A1 (en) * | 2019-07-09 | 2021-01-14 | 株式会社村田製作所 | Film capacitor and film for film capacitor |
JP7136369B2 (en) * | 2019-12-27 | 2022-09-13 | 株式会社村田製作所 | Film capacitors and films for film capacitors |
CN112201479B (en) * | 2020-10-29 | 2021-09-21 | 常熟市国瑞科技股份有限公司 | Locating pad for thin film capacitor |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080107833A1 (en) * | 2004-11-10 | 2008-05-08 | Kuraray Co. Ltd. | Metal-Clad Laminate And Method For Production Thereof |
EP2169694A1 (en) * | 2008-09-30 | 2010-03-31 | General Electric Company | Film capacitor |
JP5794380B2 (en) * | 2012-02-29 | 2015-10-14 | 株式会社村田製作所 | Dielectric resin composition for film capacitor |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03241804A (en) * | 1990-02-20 | 1991-10-29 | Matsushita Electric Ind Co Ltd | Chip type metallized film capacitor |
JPH04324921A (en) * | 1991-04-25 | 1992-11-13 | Matsushita Electric Ind Co Ltd | Manufacture of laminated type film capacitor |
US5840402A (en) | 1994-06-24 | 1998-11-24 | Sheldahl, Inc. | Metallized laminate material having ordered distribution of conductive through holes |
JPH11214250A (en) * | 1998-01-28 | 1999-08-06 | Kuraray Co Ltd | Device and circuit board mounted with the device |
JPH11243032A (en) * | 1998-02-25 | 1999-09-07 | Kyocera Corp | Thin-film capacitor |
JP2002252143A (en) * | 2000-12-21 | 2002-09-06 | Alps Electric Co Ltd | Temperature compensating thin-film capacitor and electronic apparatus |
JP2003160727A (en) * | 2001-07-11 | 2003-06-06 | Kuraray Co Ltd | Thermoplastic polymer composition |
WO2007010768A1 (en) * | 2005-07-15 | 2007-01-25 | Murata Manufacturing Co., Ltd. | Capacitor and method for manufacturing same |
JP5274761B2 (en) * | 2006-10-05 | 2013-08-28 | ポリプラスチックス株式会社 | Totally aromatic polyester |
CN101996767B (en) * | 2009-08-10 | 2013-03-13 | 小岛压力加工工业株式会社 | Film capacitor and method of producing the same |
US8461462B2 (en) * | 2009-09-28 | 2013-06-11 | Kyocera Corporation | Circuit substrate, laminated board and laminated sheet |
TW201235411A (en) * | 2011-02-01 | 2012-09-01 | Dainippon Ink & Chemicals | Hot curable polyimide resin composition, cured article thereof and interlayer adhesive film for printed wiring board |
CN102942684B (en) * | 2012-11-08 | 2015-06-17 | 广东生益科技股份有限公司 | Thermosetting cyanate resin composition and application of thermosetting cyanate resin composition |
CN103804753A (en) * | 2013-12-20 | 2014-05-21 | 芜湖金鹰机械科技开发有限公司 | Ultrathin fracture-resistant metallized film for capacitor and preparation method thereof |
JP2017183461A (en) * | 2016-03-30 | 2017-10-05 | 日本電気硝子株式会社 | Lamination type film capacitor |
-
2018
- 2018-06-15 JP JP2019553688A patent/JP6677357B2/en active Active
- 2018-06-15 WO PCT/JP2018/022889 patent/WO2019097750A1/en unknown
- 2018-06-15 EP EP18878854.1A patent/EP3671780A4/en active Pending
- 2018-06-15 CN CN201880072928.7A patent/CN111328424B/en active Active
-
2020
- 2020-03-10 US US16/814,183 patent/US11476054B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080107833A1 (en) * | 2004-11-10 | 2008-05-08 | Kuraray Co. Ltd. | Metal-Clad Laminate And Method For Production Thereof |
EP2169694A1 (en) * | 2008-09-30 | 2010-03-31 | General Electric Company | Film capacitor |
JP5794380B2 (en) * | 2012-02-29 | 2015-10-14 | 株式会社村田製作所 | Dielectric resin composition for film capacitor |
Non-Patent Citations (1)
Title |
---|
See also references of WO2019097750A1 * |
Also Published As
Publication number | Publication date |
---|---|
JPWO2019097750A1 (en) | 2020-05-28 |
US11476054B2 (en) | 2022-10-18 |
US20200211778A1 (en) | 2020-07-02 |
EP3671780A1 (en) | 2020-06-24 |
CN111328424B (en) | 2022-01-11 |
CN111328424A (en) | 2020-06-23 |
JP6677357B2 (en) | 2020-04-08 |
WO2019097750A1 (en) | 2019-05-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20200318 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20210506 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01G 4/32 20060101AFI20210429BHEP Ipc: B32B 7/02 20190101ALI20210429BHEP Ipc: B32B 15/08 20060101ALI20210429BHEP |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R079 Free format text: PREVIOUS MAIN CLASS: H01G0004320000 Ipc: H01G0004008000 |
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GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: GRANT OF PATENT IS INTENDED |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: B32B 15/08 20060101ALI20240412BHEP Ipc: B32B 7/02 20190101ALI20240412BHEP Ipc: H01G 4/32 20060101ALI20240412BHEP Ipc: H01G 4/14 20060101ALI20240412BHEP Ipc: H01G 4/008 20060101AFI20240412BHEP |
|
INTG | Intention to grant announced |
Effective date: 20240502 |