EP3664958A4 - Leadless stack comprising multiple components - Google Patents

Leadless stack comprising multiple components Download PDF

Info

Publication number
EP3664958A4
EP3664958A4 EP18844928.4A EP18844928A EP3664958A4 EP 3664958 A4 EP3664958 A4 EP 3664958A4 EP 18844928 A EP18844928 A EP 18844928A EP 3664958 A4 EP3664958 A4 EP 3664958A4
Authority
EP
European Patent Office
Prior art keywords
multiple components
leadless stack
leadless
stack
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP18844928.4A
Other languages
German (de)
French (fr)
Other versions
EP3664958A1 (en
Inventor
John E. Mcconnell
Garry L. Renner
John Bultitude
Allen R. Hill
Galen W. MILLER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kemet Electronics Corp
Original Assignee
Kemet Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/670,247 external-priority patent/US10381162B2/en
Application filed by Kemet Electronics Corp filed Critical Kemet Electronics Corp
Publication of EP3664958A1 publication Critical patent/EP3664958A1/en
Publication of EP3664958A4 publication Critical patent/EP3664958A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B32B2037/1215—Hot-melt adhesive
EP18844928.4A 2017-08-07 2018-07-25 Leadless stack comprising multiple components Withdrawn EP3664958A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/670,247 US10381162B2 (en) 2010-05-26 2017-08-07 Leadless stack comprising multiple components
PCT/US2018/043649 WO2019032294A1 (en) 2017-08-07 2018-07-25 Leadless stack comprising multiple components

Publications (2)

Publication Number Publication Date
EP3664958A1 EP3664958A1 (en) 2020-06-17
EP3664958A4 true EP3664958A4 (en) 2021-08-25

Family

ID=65271690

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18844928.4A Withdrawn EP3664958A4 (en) 2017-08-07 2018-07-25 Leadless stack comprising multiple components

Country Status (4)

Country Link
EP (1) EP3664958A4 (en)
JP (2) JP2020530656A (en)
CN (1) CN110997223A (en)
WO (1) WO2019032294A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220078887A (en) 2020-12-04 2022-06-13 삼성전기주식회사 Electronic component
US20230241725A1 (en) * 2022-01-19 2023-08-03 Ning-Cheng Lee Solder pastes and methods of using the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5038996A (en) * 1988-10-12 1991-08-13 International Business Machines Corporation Bonding of metallic surfaces
WO2014081666A1 (en) * 2012-11-26 2014-05-30 Kemet Electronics Corporation Leadless multi-layered ceramic capacitor stacks
US20160118190A1 (en) * 2014-10-23 2016-04-28 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component and board having the same
US20170025223A1 (en) * 2010-05-26 2017-01-26 Kemet Electronics Corporation Electronic Component Structures with Reduced Microphonic Noise

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4513350A (en) * 1984-02-02 1985-04-23 Sprague Electric Company Monolithic ceramic capacitor and method for manufacturing to predetermined capacity value
US4571276A (en) * 1984-06-22 1986-02-18 North American Philips Corporation Method for strengthening terminations on reduction fired multilayer capacitors
JPH0590067A (en) * 1991-09-27 1993-04-09 Kyocera Corp Manufacture of laminated ceramic capacitor
JP3514670B2 (en) * 1999-07-29 2004-03-31 松下電器産業株式会社 Soldering method
US20020092895A1 (en) * 2001-01-12 2002-07-18 Edmund Blackshear Formation of a solder joint having a transient liquid phase by annealing and quenching
JP2004186540A (en) * 2002-12-05 2004-07-02 Tdk Corp Laminated electronic parts
US8264816B2 (en) * 2009-08-24 2012-09-11 Kemet Electronics Corporation Externally fused and resistively loaded safety capacitor
US9472342B2 (en) * 2010-05-26 2016-10-18 Kemet Electronics Corporation Leadless multi-layered ceramic capacitor stacks
US8902565B2 (en) * 2010-05-26 2014-12-02 Kemet Electronics Corporation Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes
JP2012043947A (en) * 2010-08-18 2012-03-01 Tdk Corp Package structure of multilayer capacitor
KR101525666B1 (en) * 2013-07-11 2015-06-03 삼성전기주식회사 Multi-layered ceramic capacitor and manufacturing method the same
KR20150118385A (en) * 2014-04-14 2015-10-22 삼성전기주식회사 Multi-layered ceramic capacitor, manufacturing method for the same and board having the same mounted thereon
KR101630037B1 (en) * 2014-05-08 2016-06-13 삼성전기주식회사 Multi-layered ceramic capacitor, array-type multi-layered ceramic capacitor, manufacturing method for the same and board having the same mounted thereon
JP2016072603A (en) * 2014-09-26 2016-05-09 株式会社村田製作所 Electronic component
KR102149786B1 (en) * 2015-03-05 2020-08-31 삼성전기주식회사 Multi-layered ceramic capacitor board having the same mounted thereon
JP6806354B2 (en) * 2015-04-20 2021-01-06 サムソン エレクトロ−メカニックス カンパニーリミテッド． Capacitor components and mounting boards equipped with them
US10224149B2 (en) * 2015-12-09 2019-03-05 Kemet Electronics Corporation Bulk MLCC capacitor module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5038996A (en) * 1988-10-12 1991-08-13 International Business Machines Corporation Bonding of metallic surfaces
US20170025223A1 (en) * 2010-05-26 2017-01-26 Kemet Electronics Corporation Electronic Component Structures with Reduced Microphonic Noise
WO2014081666A1 (en) * 2012-11-26 2014-05-30 Kemet Electronics Corporation Leadless multi-layered ceramic capacitor stacks
US20160118190A1 (en) * 2014-10-23 2016-04-28 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component and board having the same

Also Published As

Publication number Publication date
JP2022068307A (en) 2022-05-09
CN110997223A (en) 2020-04-10
JP2020530656A (en) 2020-10-22
WO2019032294A1 (en) 2019-02-14
JP7334285B2 (en) 2023-08-28
EP3664958A1 (en) 2020-06-17

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