JP2016072603A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount an electronic component in a stable posture while suppressing noise.SOLUTION: An electronic component includes: an electronic element 10 having two external electrodes 12 on a surface thereof; and substrate-type terminal 20 which includes a substrate body 21 having an electrical insulation and two mounting electrodes 22 provided on one principal surface 21a of the substrate body 21 to be electrically connected with two external electrodes 12, respectively, and in which the electronic element 10 is mounted on one principal surface 21a side. Part of two external electrodes 12 is positioned outside a periphery of the substrate-type terminal 20 when viewed from the one principal surface 21a side. In a direction orthogonal to the one principal surface 21a, a dimension Tof a thickness from an end of the two external electrodes 12 opposite to the substrate-type end 20 side to an end of the substrate-type terminal 20 opposite to the electronic element 10 side is no more than a dimension which is larger one of a dimension of a width of the electronic element 10 and a dimension of width of the substrate-type terminal 20 in a direction orthogonal to a direction connecting the two external electrodes 12 to each other in the shortest distance and in a direction along the one principal surface 21a.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component, and more particularly, to an electronic component including an electrostrictive electronic element.

  Japanese Patent Laid-Open No. 2013-65820 (Patent Document 1) is a prior art document that discloses a multilayer capacitor mounting structure that aims to reduce noise called “acoustic noise”. In the multilayer capacitor mounting structure described in Patent Document 1, the land is provided on the substrate body and is connected to each of the external electrodes by solder. The height from the land electrode to the top of the solder is 1.27 times or less the height from the land electrode to the portion where the capacitor conductor located closest to the circuit board is exposed from the end face.

JP2013-65820A

  In the multilayer capacitor mounting structure described in Patent Document 1, the position of the capacitor conductor (conductor layer) located closest to the circuit board is separated from the circuit board, so that the multilayer capacitor is connected to the circuit board through the solder fillet. Propagating vibrations are reduced, and as a result, noise is reduced. In this configuration, when the capacitance of the multilayer capacitor is maintained, the multilayer capacitor becomes thick. When the thickness dimension of an electronic component such as a multilayer capacitor is larger than the width dimension of the electronic component, the posture of the electronic component becomes unstable when mounted on a circuit board.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide an electronic component that can be mounted in a stable posture while suppressing noise.

  An electronic component according to the present invention includes an electronic element having two external electrodes on the surface, a substrate body having electrical insulation, and two external electrodes provided on one main surface of the substrate body. A board-type terminal including two mounting electrodes connected and an electronic element mounted on one main surface side is provided. When viewed from the one main surface side, a part of the two external electrodes is located outside the outer edge of the board-type terminal. In the direction orthogonal to the one main surface, the dimension of the thickness from the end of the two external electrodes opposite to the substrate-type terminal side to the end of the substrate-type terminal opposite to the electronic element side is Less than or equal to the larger dimension of the width of the electronic element and the width of the substrate-type terminal in the direction perpendicular to the direction connecting the two external electrodes and in the direction along the one main surface. is there.

  In one embodiment of the present invention, the electronic device includes a stacked body formed by stacking a plurality of dielectric layers and a plurality of conductor layers. The two external electrodes are electrically connected to at least some of the plurality of conductor layers. The laminated body has an effective region in which the conductor layers respectively connected to different ones of the two external electrodes in the at least some of the conductor layers are stacked with the dielectric layers sandwiched between each other. And a non-effective area surrounding the effective area. In the direction orthogonal to the one main surface, the thickness dimension of the substrate body is the thickness of the ineffective region at the portion located between the surface facing the substrate-type terminal and the effective region in the laminate. Greater than the size.

  In one embodiment of the present invention, the width dimension of the substrate-type terminal is smaller than the width dimension of the electronic element.

  In one embodiment of the present invention, the length dimension of the substrate type terminal is smaller than the length dimension of the electronic element in the direction connecting the two external electrodes in the shortest distance.

  In one embodiment of the present invention, the entire two mounting electrodes overlap the effective region as seen from the direction orthogonal to the one main surface.

  In one embodiment of the present invention, the shortest distance between two mounting electrodes is equal to or shorter than the shortest distance between two external electrodes.

  In one embodiment of the present invention, the thickness dimension of the electronic element is smaller than the width dimension of the electronic element.

  In one embodiment of the present invention, at least a part of each of the pair of side surfaces of each of the two mounting electrodes is covered with a conductive film that joins the two external electrodes and the two mounting electrodes.

  According to the present invention, it is possible to mount an electronic component in a stable posture while suppressing noise.

It is a front view which shows the structure of the electronic component which concerns on Embodiment 1 of this invention. It is the top view which looked at the electronic component of FIG. 1 from the arrow II direction. It is the side view which looked at the electronic component of Drawing 1 from the direction of arrow III. It is a perspective view which shows the external appearance of the capacitor | condenser element contained in the electronic component which concerns on Embodiment 1 of this invention. It is sectional drawing which looked at the capacitor | condenser element of FIG. 4 from the VV arrow direction. FIG. 5 is a cross-sectional view of the capacitor element of FIG. 4 as viewed from the direction of arrows VI-VI. It is the perspective view which looked at the board | substrate type terminal contained in the electronic component which concerns on Embodiment 1 of this invention from the one main surface side. It is the perspective view which looked at the board-type terminal contained in the electronic component which concerns on Embodiment 1 of this invention from the other main surface side. It is a perspective view which shows the external appearance of the capacitor | condenser element contained in the electronic component which concerns on the modification of Embodiment 1 of this invention. It is sectional drawing which looked at the capacitor | condenser element of FIG. 9 from the XX line arrow direction. It is sectional drawing which looked at the capacitor | condenser element of FIG. 9 from the XI-XI line arrow direction. It is a front view which shows the structure of the electronic component which concerns on Embodiment 2 of this invention. It is the top view which looked at the electronic component of FIG. 12 from the arrow XIII direction. It is the side view which looked at the electronic component of FIG. 12 from the arrow XIV direction. It is the schematic which shows the measuring method of the sound pressure of the noise in an experiment example.

  Hereinafter, an electronic component according to each embodiment of the present invention will be described with reference to the drawings. In the following description of the embodiments, the same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated. In the following description of the embodiments, an electronic component including a capacitor element as an electronic element will be described. However, the electronic element is not limited to a capacitor element, and may be an inductor element, a thermistor element, a piezoelectric element, or a semiconductor element.

(Embodiment 1)
FIG. 1 is a front view showing a configuration of an electronic component according to Embodiment 1 of the present invention. FIG. 2 is a plan view of the electronic component of FIG. 1 viewed from the direction of arrow II. FIG. 3 is a side view of the electronic component of FIG. 1 viewed from the direction of arrow III. FIG. 4 is a perspective view showing the appearance of the capacitor element included in the electronic component according to Embodiment 1 of the present invention. FIG. 5 is a cross-sectional view of the capacitor element of FIG. 4 as viewed from the direction of arrows VV. FIG. 6 is a cross-sectional view of the capacitor element of FIG. 4 as seen from the direction of arrows VI-VI. FIG. 7 is a perspective view of a board-type terminal included in the electronic component according to Embodiment 1 of the present invention as viewed from one main surface side. FIG. 8 is a perspective view of a board-type terminal included in the electronic component according to Embodiment 1 of the present invention as viewed from the other main surface side.

  1 to 6, the length direction L of the capacitor element 10, the width direction W of the capacitor element 10, and the thickness direction T of the capacitor element 10 are illustrated. In FIG. 2, a center line C of the capacitor element 10 passing through the center of the capacitor element 10 in the width direction W of the capacitor element 10 and extending in the length direction L of the capacitor element 10 is illustrated.

  As shown in FIGS. 1 to 8, an electronic component 100 according to Embodiment 1 of the present invention includes a capacitor element 10 that is an electronic element having at least two external electrodes 12 on the surface, and the capacitor element 10 includes a first main surface 21a. And a board-type terminal 20 mounted on the side. In the present embodiment, the capacitor element 10 has two external electrodes 12.

  As shown in FIGS. 5 and 6, the capacitor element 10 included in the electronic component according to Embodiment 1 of the present invention includes a plurality of dielectric layers 13 and a plurality of flat conductor layers 14 that are alternately stacked. The laminated body 11 constituted and two external electrodes 12 provided on the laminated body 11 and positioned on the surfaces of both end portions in the length direction L of the capacitor element 10 are included.

  In the conductor layers 14 adjacent to each other and facing each other, one conductor layer 14 is electrically connected to the external electrode 12 positioned at one end in the length direction L of the capacitor element 10a, and the other conductor layer 14 is connected. Is electrically connected to the external electrode 12 located at the other end in the length direction L of the capacitor element 10.

  In the present embodiment, all the conductor layers 14 are electrically connected to the two external electrodes 12, but the present invention is not limited to this, and at least some of the conductor layers 14 among the plurality of conductor layers 14. 14 only needs to be electrically connected to the two external electrodes 12. That is, the conductor layers 14 that are not electrically connected to the two external electrodes 12 may be included in the plurality of conductor layers 14.

  In the capacitor element 10 according to the present embodiment, the stacking direction of the dielectric layer 13 and the conductor layer 14 is orthogonal to the length direction L of the capacitor element 10 and the width direction W of the capacitor element 10. That is, the stacking direction of the dielectric layer 13 and the conductor layer 14 is parallel to the thickness direction T of the capacitor element 10.

  The stacked body 11 has a first main surface 111 and a second main surface 112 that are positioned on opposite sides in the stacking direction. The stacked body 11 connects the first main surface 111 and the second main surface 112, and the first end surface 113 and the second end surface 114, which are located on the opposite sides of the stacked body 11, and the first main surface 111 and the second main surface 112. In addition, the first end surface 113 and the second end surface 114 are connected to each other, and the first side surface 115 and the second side surface 116 are further located on the opposite sides of the stacked body 11. The stacked body 11 has a rectangular parallelepiped outer shape, but may have roundness in at least one of the corner portion and the ridge line portion.

As shown in FIGS. 1 and 2, the width dimension of the multilayer body 11 in the width direction W of the capacitor element 10 is W ₁₁ , and the thickness dimension of the multilayer body 11 in the thickness direction T of the capacitor element 10 is T _11. It is.

  As shown in FIGS. 1 to 3, 5, and 6, the multilayer body 11 includes a conductor layer 14 that is connected to a different external electrode 12 of the two external electrodes 12. It consists of an effective region 11e that is stacked and overlapped with each other and a non-effective region 11n that surrounds the effective region 11e.

  Specifically, the effective region 11 e of the multilayer body 11 includes a conductor layer 14 electrically connected to the external electrode 12 positioned at one end in the length direction L of the capacitor element 10, and the length direction of the capacitor element 10. A portion functioning as a capacitor constituted by a conductor layer 14 electrically connected to the external electrode 12 positioned at the other end of L and a dielectric layer 13 sandwiched between the two conductor layers 14 Is a region where is stacked.

  In the present embodiment, the effective region 11 e of the multilayer body 11 is formed from the first conductor layer 14 a located closest to the first main surface 111 among the plurality of conductor layers 14 to the middle of the plurality of conductor layers 14. In the range up to the second conductor layer 14b located closest to the second main surface 112, all the conductor layers 14 overlap each other when viewed in the thickness direction T of the capacitor element 10.

As shown in FIGS. 1, 2, 5, and 6, the length dimension of the effective region 11 e of the multilayer body 11 in the length direction L of the capacitor element 10 is L _11e , and the multilayer body in the width direction W of the capacitor element 10. 11, the width dimension of the effective area 11e is W _11e , and the thickness dimension of the effective area 11e of the multilayer body 11 in the thickness direction T of the capacitor element 10 is T _11e .

  The non-effective region 11n of the stacked body 11 is a portion located outside the effective region 11e in the stacked body 11, and is a region not functioning as a capacitor.

As shown in FIG. 1, 2, 5, 6, in the longitudinal direction L of the capacitor element 10, the dimensions of the length of the first end surface 113 side of the non-active area 11n is L _a, the non-active area 11n first the dimensions of the length of the second end face 114 side is L _b. In the width direction W of the capacitor element 10, the width dimension of the non-effective area 11n on the first side face 115 side is W _a , and the width dimension of the non-effective area 11n on the second side face 116 side is W _b . In the thickness direction T of the capacitor element 10, the dimensions of the first main surface 111 side of the thickness of the non-active area 11n is T _b, the size of the second major surface 112 side of the thickness of the non-active area 11n is T _a .

The direction connecting the two external electrodes 12 at the shortest is parallel to the length direction L of the capacitor element 10. Two external electrodes 12 the shortest distance between the portion located on the second major surface 112 at the laminate 11 which is a surface facing the terminal 20 of the substrate type is L _12.

As a material constituting each of the plurality of dielectric layers 13, dielectric ceramics mainly composed of BaTiO ₃ , CaTiO ₃ , SrTiO _3, CaZrO ₃ or the like can be used. In addition, dielectric ceramics in which Mn compounds, Mg compounds, Si compounds, Co compounds, Ni compounds, rare earth compounds, or the like are added to these main components as subcomponents, are used as materials constituting the dielectric layer 13. Also good.

  Examples of the material constituting each of the plurality of conductor layers 14 include metals such as Ni, Cu, Ag, Pd, and Au, or alloys containing at least one of these metals, such as alloys of Ag and Pd. Can be used.

  Each of the two external electrodes 12 includes a base layer provided so as to cover both end portions of the multilayer body 11 and a plating layer provided so as to cover the base layer. As a material constituting the underlayer, a metal such as Ni, Cu, Ag, Pd, or Au, or an alloy containing at least one of these metals, for example, an alloy of Ag and Pd can be used.

  As a method for forming the base layer, the conductive paste applied to both ends of the fired laminate 11 is baked, or the conductive paste applied to both ends of the laminate 11 before firing is simultaneously applied to the conductor layer 14. You may bake. In addition to this, as a method for forming the base layer, plating may be performed on both ends of the laminate 11 or a conductive resin including a thermosetting resin applied to both ends of the laminate 11 may be cured.

  As a material constituting the plating layer, a metal such as Sn, Ni, Cu, Ag, Pd, Au, or an alloy containing at least one of these metals, for example, an alloy of Ag and Pd can be used. .

  The plating layer may be composed of a plurality of layers. In this case, the plating layer preferably has a two-layer structure in which a Sn plating layer is formed on a Ni plating layer. The Ni plating layer functions as a solder barrier layer. The Sn plating layer has good wettability with solder.

  As shown in FIGS. 7 and 8, the board-type terminal 20 included in the electronic component 100 according to the present embodiment includes a board body 21 having electrical insulation. In the present embodiment, the substrate body 21 has a rectangular outer shape in plan view. However, the outer shape of the substrate body 21 is not limited to a rectangular shape, and may be an elliptical shape, for example. In the substrate body 21, corners and ridge lines may be chamfered.

  The substrate body 21 includes a first main surface 21a on the side where the capacitor element 10 is mounted, a second main surface 21b opposite to the first main surface 21a, and the first main surface 21a and the second main surface. 21b. The peripheral surface of the substrate body 21 includes a pair of side surfaces 21c positioned on the opposite sides and a pair of end surfaces 21d positioned on the opposite sides of the pair of side surfaces 21c.

As shown in FIGS. 1 to 3 and 7, the board-type terminal 20 includes two mounting electrodes 22 provided on the first main surface 21 a and electrically connected to the two external electrodes 12 of the capacitor element 10. . Specifically, the two mounting electrodes 22 are arranged at a distance from each other in the length direction of the substrate body 21 that connects the pair of end faces 21d in the shortest distance. Each of the two mounting electrodes 22 has a rectangular outer shape in plan view and is separated from the peripheral surface of the substrate body 21. In the length direction of the substrate main body 21, the shortest distance between the two mounting electrodes 22 is L _22.

  As shown in FIGS. 1 to 3 and 8, the board-type terminal 20 includes two connection electrodes 23 provided on the second main surface 21b and electrically connected to a land of a circuit board (not shown). Specifically, two connection electrodes 23 are arranged at intervals in the length direction of the substrate body 21. Each of the two connection electrodes 23 has a rectangular outer shape in plan view and is separated from the peripheral surface of the substrate body 21. Note that the two connection electrodes 23 may not be provided on the second main surface 21b. In this case, instead of the two connection electrodes 23, two external electrodes 12 of the capacitor element 10, two mounting electrodes 22 of the substrate type terminal 20, or two through electrodes 24 of the substrate type terminal 20 described later, The land of the circuit board may be electrically connected.

  The board-type terminal 20 includes two through electrodes 24 that electrically connect the two mounting electrodes 22 and the two connection electrodes 23 respectively. Each of the two mounting electrodes 22, the two connection electrodes 23, and the two through electrodes 24 is made of a conductive material such as Cu.

  As the material of the substrate body 21, a resin material such as an epoxy resin or a ceramic material such as alumina can be used. In addition, a filler or a woven fabric made of an inorganic material or an organic material may be added to the material of the substrate body 21. In the present embodiment, the substrate body 21 is formed of an epoxy resin to which a glass woven fabric is added.

  As shown in FIGS. 1 to 3, in the electronic component 100, the two external electrodes 12 of the capacitor element 10 and the two mounting electrodes 22 of the board-type terminal 20 are electrically connected by the conductive film 30. ing. In the present embodiment, the conductive film 30 is made of solder. However, the conductive film 30 is not limited to solder, and may be a conductive adhesive.

As shown in FIG. 1, in a direction perpendicular to the first major surface 21a of the substrate type terminal 20, the dimensions of thickness of the main body 21 is T _21. As shown in FIG. 2, the length dimension of the board-type terminal 20 in the length direction L of the capacitor element 10 is a dimension L ₂₁ of the length of the board body 21.

As shown in FIGS. 2 and 3, the first main surface 21 a of the substrate-type terminal 20 is perpendicular to the direction connecting the two external electrodes 12 in the shortest direction (the direction parallel to the length direction L of the capacitor element 10). The width dimension of the board-type terminal 20 in the direction along the line (the direction parallel to the width direction W of the capacitor element 10) is the width dimension W ₂₁ of the board body 21. The width dimension of each of the two mounting electrodes 22 in the direction parallel to the width direction W of the capacitor element 10 is W ₂₂ .

As shown in FIGS. 1 to 3, the length dimension of the capacitor element 10 in the length direction L of the capacitor element 10 is L ₁₀ . The direction orthogonal to the direction connecting the two external electrodes 12 in the shortest direction (the direction parallel to the length direction L of the capacitor element 10) and the direction along the first main surface 21a of the substrate-type terminal 20 (the width of the capacitor element 10) in a direction W parallel to the direction), the dimension of the width of the capacitor element 10 is W _10. The dimension of the thickness of the capacitor element 10 in the thickness direction T of the capacitor element 10 is T ₁₀ .

The thickness dimension T ₁₀ of the capacitor element 10 is smaller than the width dimension W ₁₀ of the capacitor element 10. As will be described later, the thickness dimension T ₁₀ of the capacitor element 10 is preferably 80% or less of the width dimension W ₁₀ of the capacitor element 10.

In the present embodiment, the width dimension W ₂₁ of the board-type terminal 20 is smaller than the width dimension W ₁₀ of the capacitor element 10. The length dimension L ₂₁ of the board-type terminal 20 is smaller than the length dimension L ₁₀ of the capacitor element 10. Therefore, as shown in FIG. 2, when viewed from the first main surface 21 a side of the board-type terminal 20, a part of the two external electrodes 12 is located outside the outer edge of the board-type terminal 20.

  In the present embodiment, two external electrodes are provided at both ends of the substrate-type terminal 20 in the length direction L of the capacitor element 10 and on both sides of the substrate-type terminal 20 in the width direction W of the capacitor element 10. 12 is located outside the outer edge of the board-type terminal 20.

In the direction orthogonal to the first main surface 21 a of the board-type terminal 20, the opposite ends of the two external electrodes 12 to the board-type terminal 20 side are opposite to the capacitor element 10 side of the board-type terminal 20. The thickness dimension to the end on the side is T ₀ . In the present embodiment, the thickness dimension T ₀ from the upper ends of the two external electrodes 12 to the lower ends of the two connection electrodes 23 is the thickness dimension of the electronic component 100.

In the direction orthogonal to the first main surface 21 a of the board-type terminal 20, the opposite ends of the two external electrodes 12 to the board-type terminal 20 side are opposite to the capacitor element 10 side of the board-type terminal 20. (thickness dimension of the electronic component 100) T ₀ thickness dimension to the end side _is perpendicular to the direction connecting the _two external electrodes 12 to each other at the shortest (the length direction L parallel to the direction of the capacitor element 10) And the width dimension W ₁₀ of the capacitor element 10 and the width of the substrate terminal 20 in the direction along the first main surface 21a of the substrate type terminal 20 (a direction parallel to the width direction W of the capacitor element 10). large (the width dimension of the electronic component 100) dimension of the person or less of the dimension W _21.

In the present embodiment, as described above, since the width dimension W ₂₁ of the board-type terminal 20 is smaller than the width dimension W ₁₀ of the capacitor element 10, the thickness dimension T ₀ of _the electronic component 100 is equal to the electronic component 100. The width 100 of the component 100 is not more than W ₁₀ . In order to achieve both improvement in the mounting density and stabilization of the mounting posture, the width W ₂₁ of the board-type terminal 20 is 0.03 mm or more and 0.06 mm or less than the width W ₁₀ of the capacitor element 10. It is preferable that the range is small.

In the present embodiment, as shown in FIG. 2, the length dimension L ₂₁ of the board-type terminal 20 is larger than the length dimension L _11e of the effective region 11 e of the stacked body 11. The width dimension W ₂₁ of the board-type terminal 20 is larger than the width dimension W _11e of the effective region 11 e of the laminate 11. In order to achieve both improvement in the mounting density and stabilization of the mounting posture, the length dimension L ₂₁ of the board-type terminal 20 is 0.04 mm from the length dimension L _11e of the effective region 11 e of the laminate 11. The width W ₂₁ of the board-type terminal 20 is preferably 0.04 mm or more and 0.08 mm or less than the width W _11e of the effective region 11 e of the laminate 11. It is preferable that the range is large.

  When viewed in a direction perpendicular to the first main surface 21 a of the board-type terminal 20, the entire effective area 11 e of the stacked body 11 overlaps the board-type terminal 20. When viewed in a direction perpendicular to the first main surface 21 a of the board-type terminal 20, the entire two mounting electrodes 22 overlap the effective region 11 e of the stacked body 11.

As shown in FIGS. 1, 5, and 6, the thickness T ₂₁ of the substrate body 21 in the direction orthogonal to the first main surface 21 a of the substrate type terminal 20 is equal to the substrate type terminal 20 in the laminate 11. larger dimension T _a of the thickness of the non-active area 11n of the portion located between the second major surface 112 that faces the active region 11e and.

As shown in FIG. 2, the shortest distance L ₂₂ between the two mounting electrodes ₂₂ is smaller than the shortest distance L ₁₂ between the two external electrodes 12.

As described above, in the electronic component 100 according to the present embodiment, the thickness dimension T ₀ of _the electronic component 100 is equal to or less than the width dimension W ₁₀ of _the electronic component 100. Thereby, when mounting the electronic component 100 on the circuit board, the posture of the electronic component 100 can be stabilized.

  When the electronic component 100 is mounted on the circuit board, the solder joining the two connection electrodes 23 of the board-type terminal 20 and the land of the circuit board gets wet and reaches the capacitor element 10. Solder fillets may be formed. This is not preferable because vibration propagates from the capacitor element 10 to the circuit board through the fillet.

  In the electronic component 100 according to the present embodiment, a part of the two external electrodes 12 is located outside the outer edge of the board-type terminal 20 when viewed from the first main surface 21a side of the board-type terminal 20. Yes.

  As a result, when the electronic component 100 is mounted on the circuit board, if the solder that joins the two connection electrodes 23 of the electronic component 100 and the land of the circuit board gets wet, the solder becomes the second main component of the capacitor element 10. After contacting the portion of the external electrode 12 positioned on the surface 112 side, the portion of the external electrode 12 positioned on the peripheral surface of the capacitor element 10 can be wetted. As a result, the height of the solder fillet formed on the peripheral surface of the capacitor element 10 can be reduced. By reducing the height of the solder fillet, the propagation path of vibration from the capacitor element 10 to the circuit board can be reduced, so that noise can be reduced. Further, the swelling of the solder fillet can be suppressed, and as a result, an increase in the mounting space of the electronic component 100 can be suppressed, and the mounting density can be improved.

  Therefore, the electronic component 100 according to the present embodiment can be mounted with a stable posture while suppressing squealing.

  Although confirmed by an experimental example to be described later, the present inventors have found that the effect of noise reduction by the non-effective area 11n in the portion of the laminate 11 located between the second main surface 112 and the effective area 11e. It has been found that the effect of reducing the squeal by the substrate body 21 of the substrate-type terminal 20 is greater.

In the electronic component 100 according to the present embodiment, the thickness T ₂₁ of the substrate body 21 in the direction perpendicular to the first main surface 21 a of the substrate type terminal 20 is the substrate type terminal 20 in the laminate 11. larger dimension T _a of the thickness of the non-active area 11n of the portion located between the second major surface 112 that faces the active region 11e and. Thereby, it can suppress that the electronic component 100 becomes thick, reducing a noise effectively.

  In the electronic component 100 according to the present embodiment, the entire two mounting electrodes 22 overlap the effective region 11e of the multilayer body 11 when viewed in a direction orthogonal to the first main surface 21a of the board-type terminal 20. . As a result, the solder that joins the two mounting electrodes 22 of the board-type terminal 20 and the two external electrodes 12 of the capacitor element 10 wets the external electrode 12 in the portion located on the peripheral surface of the capacitor element 10. Can be suppressed.

  Further, since the vibration generated from the capacitor element 10 is attenuated when propagating through the board-type terminal 20, the entire two mounting electrodes 22 overlap the effective region 11 e of the multilayer body 11. Many of the vibrations generated from 10 can be propagated to the board-type terminals 20 to be attenuated, and audible sounds (squeals) generated by the propagation of vibrations to the circuit board can be reduced.

In the electronic component 100 according to the present embodiment, the shortest distance L ₂₂ between the two mounting electrodes 22, the shortest distance L ₁₂ is smaller than the two external electrodes 12 to each other. As a result, the solder that joins the two mounting electrodes 22 of the board-type terminal 20 and the two external electrodes 12 of the capacitor element 10 to the center side in the length direction of the board-type terminal 20 as shown in FIG. It is possible to prevent the solder from being pulled up and wet up the portion of the external electrode 12 located on the first end surface 113 and the second end surface 114.

  In the electronic component 100 according to the present embodiment, each of the two mounting electrodes 22 is separated from the peripheral surface of the substrate body 21 in plan view. As a result, the solder for joining the two mounting electrodes 22 of the board type terminal 20 and the two external electrodes 12 of the capacitor element 10 and the two connection electrodes 23 of the board type terminal 20 and the land of the circuit board are joined. Bonding with the solder to be performed can be suppressed. As a result, the vibration generated from the capacitor element 10 is propagated to the board-type terminal 20 to be attenuated, and the audible sound (squeaking) generated by the propagation of the vibration to the circuit board can be reduced.

In the electronic component 100 according to the present embodiment, the length dimension L ₂₁ of the board-type terminal 20 is larger than the length dimension L _11e of the effective region 11 e of the multilayer body 11. The width dimension W ₂₁ of the board-type terminal 20 is larger than the width dimension W _11e of the effective region 11 e of the laminate 11. When viewed in a direction perpendicular to the first main surface 21 a of the board-type terminal 20, the entire effective area 11 e of the stacked body 11 overlaps the board-type terminal 20.

  As a result, much of the vibration generated from the capacitor element 10 is propagated to the board-type terminal 20 to be attenuated, and audible sound (squeaking) generated by the propagation of vibration to the circuit board can be reduced.

In the electronic component 100 according to this embodiment, the thickness dimension T ₁₀ of the capacitor element 10 is smaller than the width dimension W ₁₀ of the capacitor element 10. The thickness dimension T ₁₀ of the capacitor element 10 is preferably 80% or less of the width dimension W ₁₀ of the capacitor element 10.

  Thereby, the main surface and the side surface of the capacitor element 10 can be easily distinguished from the appearance of the capacitor element 10. As a result, when the capacitor element 10 is mounted on the board-type terminal 20, the direction of the capacitor element 10 can be easily aligned. In the present embodiment, the orientation of the capacitor element 10 can be easily aligned so that the second main surface 112 faces the first main surface 21a of the board-type terminal 20.

  As shown in FIG. 3, at least a part of each of the pair of side surfaces 22 c in each of the two mounting electrodes 22 is covered with a conductive film 30. When the capacitor element 10 is mounted on the substrate-type terminal 20, at least a part of each of the pair of side surfaces 22 c is covered with the conductive film 30 in each of the two mounting electrodes 22, so that the substrate-type terminal 20 is provided by the self-alignment effect. The positional deviation of the capacitor element 10 with respect to the terminal 20 can be suppressed. As a result, variations in the mounting position of the electronic component 100 mounted on the circuit board can be suppressed. In order to cover at least a part of each of the pair of side surfaces 22 c of the mounting electrode 22 with the conductive film 30, the coating area of the conductive film 30 on the mounting electrode 22 may be made larger than the area of the upper surface of the mounting electrode 22.

In the present embodiment, the smaller the width W ₁₀ of the width W ₂₁ is a capacitor element 10 of the substrate main body 21 is electrically between the electronic component 100 and the adjacent electronic components mounted on the circuit board In order to prevent a short circuit, the width dimension W ₂₁ of the substrate body 21 may be made larger than the width dimension W ₁₀ of the capacitor element 10. In other words, the capacitor element 10 may be located between the pair of side surfaces 21 c of the substrate body 21 when viewed from the direction orthogonal to the first main surface 21 a of the substrate body 21. According to this configuration, if the position of the electronic component 100 mounted on the circuit board is shifted and the electronic component 100 comes into contact with the adjacent electronic component, the board main body 21 having electrical insulation becomes the adjacent electronic component. Since the capacitor element 10 can be prevented from coming into contact with the adjacent electronic component, it is possible to suppress short circuit between the electronic components adjacent to each other on the circuit board.

  Hereinafter, an electronic component according to a modification of the present embodiment will be described with reference to the drawings. In the electronic component according to the modified example of the present embodiment, the stacking direction of the conductor layers of the capacitor element is mainly different from that of the electronic component according to the present embodiment, and thus the description of the other components will not be repeated.

  FIG. 9 is a perspective view illustrating an appearance of a capacitor element included in an electronic component according to a modification of the present embodiment. FIG. 10 is a cross-sectional view of the capacitor element of FIG. 9 as viewed from the direction of the arrows XX. FIG. 11 is a cross-sectional view of the capacitor element of FIG. 9 as viewed from the direction of the arrow XI-XI.

  As shown in FIGS. 9 to 11, in the capacitor element 10a according to the modification of the present embodiment, the stacking direction of the dielectric layer 13 and the conductor layer 14 is the length direction L of the capacitor element 10a and the capacitor element 10a. It is orthogonal to the thickness direction T. That is, the stacking direction of the dielectric layer 13 and the conductor layer 14 is parallel to the width direction W of the capacitor element 10a.

  In the modified example of the present embodiment, the effective region 11e of the multilayer body 11 includes the plurality of conductor layers 14 from the first conductor layer 14a positioned closest to the first side surface 115 among the plurality of conductor layers 14. In the range up to the second conductor layer 14b positioned closest to the second side surface 116, all the conductor layers 14 overlap each other when viewed in the width direction W of the capacitor element 10.

  Also in the electronic component according to the modified example of the present embodiment, the electronic component can be mounted in a stable posture while suppressing squealing, similarly to the electronic component 100 according to the present embodiment.

  Hereinafter, an electronic component according to Embodiment 2 of the present invention will be described with reference to the drawings. The electronic component 100a according to the second embodiment of the present invention is different from the electronic component 100 according to the first embodiment only in that a notch is provided in the board body 21 of the board-type terminal 20, and therefore other configurations will be described. Do not repeat.

(Embodiment 2)
FIG. 12 is a front view showing a configuration of an electronic component according to Embodiment 2 of the present invention. FIG. 13 is a plan view of the electronic component of FIG. 12 viewed from the direction of arrow XIII. FIG. 14 is a side view of the electronic component of FIG. 12 viewed from the direction of arrow XIV.

  As shown in FIGS. 12 to 14, in the board-type terminal 20 provided in the electronic component 100 a according to Embodiment 2 of the present invention, semi-elliptical cutouts in plan view are provided at both ends in the length direction of the board body 21. 21s is provided. However, the shape of the cutout 21s in plan view is not limited to a semi-elliptical shape, and may be a polygonal shape or the like. In the present embodiment, the through electrode 24 is provided on the wall surface of the notch 21s.

  By providing the notches 21s, it is possible to store the solder that joins the electronic component 100a and the land of the circuit board in the space formed by the notches 21s.

  Thus, when the electronic component 100a is mounted on the circuit board, when the solder that joins the two connection electrodes 23 of the electronic component 100a and the land of the circuit board gets wet, the solder becomes the second main component of the capacitor element 10. After contacting the portion of the external electrode 12 positioned on the surface 112 side, the portion of the external electrode 12 positioned on the peripheral surface of the capacitor element 10 can be wetted. As a result, the height of the solder fillet formed on the peripheral surface of the capacitor element 10 can be reduced. By reducing the height of the solder fillet, the propagation path of vibration from the capacitor element 10 to the circuit board can be reduced, so that noise can be reduced. Further, the swelling of the solder fillet can be suppressed, and as a result, an increase in the mounting space of the electronic component 100a can be suppressed.

  Also in the electronic component 100a according to the present embodiment, the electronic component 100a can be mounted in a stable posture while suppressing noise. Note that the electronic component 100a according to the present embodiment may include the capacitor element 10a according to a modification of the first embodiment.

  In the following, the effect of noise reduction by the ineffective area in the portion located between the second main surface and the effective area in the laminate of capacitor elements was compared with the effect of noise reduction by the board body of the board type terminal. An experimental example will be described.

(Experimental example)
First, a method for measuring the sound pressure of noise generated from a circuit board on which electronic components are mounted in the following experimental example will be described. FIG. 15 is a schematic diagram illustrating a method for measuring the sound pressure of noise in an experimental example.

  As shown in FIG. 15, when actually measuring the sound pressure of noise, the electronic component mounting body 100β is installed in the anechoic box 900, and in this state, the capacitor element of the electronic component 100α mounted on the circuit board 1 is used. A DC voltage of 3.7 V and an AC voltage of 1.0 Vpp in a frequency band of 1.5 kHz to 20 kHz were applied, and the total sound pressure level of noise generated at that time was measured.

  In the measurement of the total sound pressure level of noise, the sound collecting microphone 910 is disposed in the anechoic box 900 so as to be opposed to a position 3 mm above the capacitor element included in the electronic component mounting body 100β. The sound generated from the electronic component mounting body 100β was collected by a total of 920, and the collected sound was analyzed using an FFT (Fast Fourier Transform) analyzer 930 (CF-5220, manufactured by Ono Sokki Co., Ltd.). .

  Further, the analysis value of the sound pressure of noise in the electronic component mounting bodies according to the following comparative examples and examples shows the difference with reference to the analysis value of the sound pressure of noise in the electronic component mounting body of comparative example 1 described later. ing.

  In this experimental example, three types of electronic component mounting bodies of Comparative Examples 1 and 2 and Example 1 were produced. First, conditions (design values) common to the three types of electronic component mounting bodies will be described.

  The dimension of the width of the multilayer body in the width direction W of the capacitor element was 0.63 mm. Further, the length dimension of the multilayer body in the length direction L of the capacitor element, the outer dimension of the effective area, and the stacking direction of the conductor layer are respectively the three types of electrons of Comparative Examples 1 and 2 and Example 1. The same was set for each of the component mounting bodies. The stacking direction of the conductor layers was made parallel to the thickness direction of the capacitor element.

  The electronic component mounting bodies according to Comparative Examples 1 and 2 do not include board-type terminals. That is, the capacitor element is directly mounted on the circuit board 1.

  The electronic component mounting body according to Comparative Example 1 and the electronic component mounting body according to Example 1 include capacitor elements having the same configuration. In each capacitor element of the electronic component mounting body according to Comparative Example 1 and Example 1, the dimension of the thickness of the laminated body in the thickness direction T of the capacitor element is 0.327 mm, and the laminated body The thickness dimension of the non-effective area in the portion located between the main surface and the effective area was 0.032 mm.

  In the capacitor element of the electronic component mounting body according to Comparative Example 2, the dimension of the thickness of the multilayer body in the thickness direction T of the capacitor element is 0.653 mm. The thickness dimension of the non-effective area in the portion located between the two was 0.334 mm.

  In the board-type terminal of the electronic component mounting body according to the first embodiment, the board body thickness dimension is 0.15 mm, the mounting electrode thickness dimension is 0.035 mm, and the connection electrode thickness dimension is 0. 0.035 mm.

  The sound pressure of the noise generated from the electronic component mounting body was −12 dB in Comparative Example 2 and −29 dB in Example 1 with respect to Comparative Example 1. Although the dimension of the thickness of the electronic component mounting body according to Example 1 is smaller than the thickness of the electronic component mounting body according to Comparative Example 2, the noise generated from the electronic component mounting body The sound pressure of the electronic component mounting body according to Example 1 was smaller than that of the electronic component mounting body according to Comparative Example 2.

  From this result, the effect of noise reduction by the board body of the board-type terminal is greater than the effect of noise reduction by the ineffective area of the portion located between the second main surface and the effective area in the laminate. Was confirmed.

  In measuring various dimensions, the polished cross section of the electronic component is observed with an optical microscope, for example, 10 times larger, and the dimension on a straight line passing through the center of the polished cross section is measured. If it is difficult to measure the dimensions clearly with an optical microscope, the polished cross section may be observed with a scanning electron microscope instead of the optical microscope.

For example, when measuring the thickness dimension T _a of the non-active area 11n of the portion located between the second major surface 112 and the effective area 11e in the laminate 11, an optical microscope cross section of the capacitor element 10 in the observation was enlarged image, a straight line is drawn L _c passing through the center of the extending and laminate 11 in the stacking direction of the stacked body 11, to measure the thickness dimension T _a of the non-active area 11n on the straight line L _c. Subsequently, when measuring the thickness dimension T ₂₁ of the substrate main body 21 of the substrate type terminal 20, to measure the thickness dimension T ₂₁ of the substrate main body 21 on the straight line L _c.

  The effective area 11e of the laminate 11 can be confirmed by observing the polished cross section with an optical microscope in the same manner as described above. Alternatively, the effective region 11e of the stacked body 11 can be confirmed by observing a transmission image captured by irradiating the electronic component 100 with X-rays from the first main surface 111 side or the second main surface 112 side. The width of the effective region 11 e of the stacked body 11 is positioned on the outermost side on the other side in the width direction of the stacked body 11 from one end of the conductor layer 14 positioned on the outermost side on the one side in the width direction of the stacked body 11. It is set as the width to the other end of the conductor layer 14 to be performed.

  It should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Circuit board 10, 10a Capacitor element, 11 Laminated body, 11e Effective area | region, 11n Non-effective area | region, 12 External electrode, 13 Dielectric layer, 14 Conductor layer, 14a 1st conductor layer, 14b 2nd conductor layer , 20 substrate type terminal, 21 substrate body, 21a, 111 first main surface, 21b, 112 second main surface, 21c, 22c one pair of side surfaces, 21d one pair of end surfaces, 21s notch, 22 mounting electrode, 23 connection Electrode, 24 through electrode, 30 conductive film, 100, 100a, 100α electronic component, 100β electronic component mounting body, 113 first end surface, 114 second end surface, 115 first side surface, 116 second side surface, 910 sound collecting microphone, 920 Sound collector, 930 FFT analyzer.

Claims (8)

An electronic device having two external electrodes on the surface;
A substrate main body having electrical insulation, and two mounting electrodes provided on one main surface of the substrate main body and electrically connected to the two external electrodes, respectively, and the electronic element is formed on the substrate main body. A board-type terminal mounted on one main surface side,
When viewed from the one main surface side, a part of the two external electrodes is located outside the outer edge of the board-type terminal,
In the direction orthogonal to the one main surface, the thickness from the end of the two external electrodes opposite to the substrate-type terminal side to the end of the substrate-type terminal opposite to the electronic element side is The dimension is larger of the width dimension of the electronic element and the width dimension of the substrate-type terminal in the direction orthogonal to the direction connecting the two external electrodes in the shortest direction and along the one main surface. An electronic component that is smaller than the other dimension. The electronic element includes a laminate formed by laminating a plurality of dielectric layers and a plurality of conductor layers,
The two external electrodes are electrically connected to at least some of the plurality of conductor layers;
In the laminate, conductor layers respectively connected to different ones of the two external electrodes in the at least a part of the conductor layers are laminated with a dielectric layer sandwiched between them. An effective area and a non-effective area surrounding the effective area,
In the direction orthogonal to the one main surface, the thickness dimension of the substrate body is the portion of the laminate that is located between the surface facing the substrate-type terminal and the effective region. The electronic component of claim 1, wherein the electronic component is larger than a thickness dimension of the non-effective area.   The electronic component according to claim 1, wherein a width dimension of the board-type terminal is smaller than a width dimension of the electronic element.   4. The electron according to claim 1, wherein a dimension of a length of the substrate-type terminal is smaller than a dimension of a length of the electronic element in a direction in which the two external electrodes are connected in a shortest distance. 5. parts.   The electronic component according to claim 2, wherein the whole of the two mounting electrodes overlaps the effective region when viewed from a direction orthogonal to the one main surface.   The electronic component according to claim 5, wherein the shortest distance between the two mounting electrodes is equal to or shorter than the shortest distance between the two external electrodes.   The electronic component according to claim 1, wherein a thickness dimension of the electronic element is smaller than a width dimension of the electronic element.   The at least part of each of a pair of side surfaces in each of the two mounting electrodes is covered with a conductive film that joins the two external electrodes and the two mounting electrodes, respectively. The electronic component according to any one of the above items.

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