Classifications

• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
  • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
  • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
  • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
  • G02B26/0858—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by piezoelectric means
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/08—Devices involving relative movement between laser beam and workpiece
  • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/34—Laser welding for purposes other than joining
  • B23K26/342—Build-up welding
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
  • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
  • B29C64/264—Arrangements for irradiation
  • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B33—ADDITIVE MANUFACTURING TECHNOLOGY
  • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
  • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
  • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
  • G02B26/0808—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more diffracting elements
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
  • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
  • G02B27/0938—Using specific optical elements
  • G02B27/095—Refractive optical elements
  • G02B27/0955—Lenses
  • G02B27/0961—Lens arrays
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
  • G02B27/10—Beam splitting or combining systems
  • G02B27/14—Beam splitting or combining systems operating by reflection only
  • G02B27/143—Beam splitting or combining systems operating by reflection only using macroscopically faceted or segmented reflective surfaces
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
  • H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/02—Structural details or components not essential to laser action
  • H01S5/022—Mountings; Housings
  • H01S5/023—Mount members, e.g. sub-mount members
  • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
  • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
  • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
  • H01S5/4031—Edge-emitting structures
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
  • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
  • H01S5/4075—Beam steering
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
  • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms

Definitions

• Laser radiation in particular a plurality of laser beams "
• the present invention relates to a device for deflecting and / or modulating a plurality of laser beams according to the preamble of claim 1.
• In the propagation direction of the laser radiation means propagation direction of the laser radiation, especially if this is not a plane wave or at least partially divergent.
• laser beam, light beam, sub-beam or beam is, unless expressly stated otherwise, not an idealized beam of geometric optics meant, but a real light beam, such as a laser beam, which has no infinitesimal small, but an extended beam cross-section.
• a device of the type mentioned is known.
• the movement means comprise at least one actuator, preferably a plurality of actuators, in particular at least one piezoactuator, which can perform a translatory movement.
• the deflection means can be designed to deflect or modulate high laser powers, as is required, for example, in 3D printing devices.
• an actuator is associated with each of the deflection means, which can move the deflection means associated with it.
• the deflection means can be displaced and / or pivoted about an axis.
• the deflection means are designed as mirror elements.
• Mirror elements which can be pivoted by a piezoactuator can be designed in such a way that even laser beams with very high power can be deflected without destroying the mirror element.
• the deflection means may be formed as a transparent component through which the laser radiation to be deflected, in particular the laser beam to be deflected, can pass.
• the transparent component may be a plane-parallel plate. This can be pivoted so that this results in a variable beam offset.
• the transparent member may be a lens or a
• Be a lens segment By moving a lens or a lens segment, a beam deflection can also be effectively achieved.
• each of the deflection means comprises two opposing transparent components through which the laser radiation to be deflected, in particular the laser beam to be deflected, can pass, wherein the two components can be moved relative to each other, in particular in a direction perpendicular to the propagation direction of the laser radiation, in particular of the laser beam.
• the components may have mutually corresponding contours, which are arranged in particular on opposite sides of the components.
• the deflection means are arranged side by side, in particular in a direction perpendicular to the propagation direction of the laser radiation, in particular the
• Laser radiation in particular the laser beams, from a
• each of the emitters of the laser diode bar emits one of the laser beams.
• the deflection means By arranging the deflection means side by side, for example, in the slow-axis direction, the laser beams of a laser diode bar arranged next to one another can be deflected or modulated simultaneously.
• Smilekompensation a laser diode bar can be used. There is a possibility that the deflection means two
• Mirror elements which are arranged so that in each case a part of a laser beam is reflected at each of the two mirror elements during operation of the device, wherein a second of the
• Mirror elements is movable, so that with a corresponding position of the mirror elements to each other, the intensity of the laser beam is reduced in a working plane by destructive interference.
• the intensity of individual laser beams in a working plane can be reduced significantly or completely from the mirror elements, so that a total of one of a plurality of laser beams
• this embodiment of a device according to the invention is also suitable, for example, for use in a 3D printing device.
• Deflection means of movement means are transferred individually or in groups in such a position and / or position that thereby the smile distortion of the laser diode bar is corrected.
• an apparatus according to the invention can be used to carry out the method.
• the plurality of deflection means are determined after the transfer into the smile-compensating position and / or position, so that the movement means are no longer needed. This way you can with a
• Fig. 1 is a schematic side view of a first
• Fig. 2 is a perspective view of the embodiment according to
• Fig. 3 is a Fig. 2 corresponding view of the embodiment
• FIG. 4 shows a Fig. 2 and Fig. 3 corresponding view of
• Fig. 5 is a Fig. 2 corresponding view of the embodiment
• Fig. 6 is a Fig. 5 corresponding view, in which the
• Fig. 7 is a perspective view of a second
• Fig. 8 is a schematic side view of the embodiment
• Fig. 9 is a schematic side view of a third
• Fig. 10 is a schematic side view of a fourth
• FIG. 11 is a schematic side view of a fifth
• Fig. 12 is a diagram in which the deflection with the fifth
• Fig. 13 is a diagram in which the deflection with the fifth
• Embodiment of a device is plotted against the change in the entrance angle
• Fig. 14 is a perspective view of the embodiment according to
• FIG. 15a is a schematic plan view of a sixth
• Fig. 15b is a schematic plan view of the device according to
• Fig. 15a in a position of the deflection means, in which a laser beam is deflected
• Fig. 16 is a schematic plan view of a seventh
• FIG. 17 is a schematic plan view of an eighth
• Fig. 18 is a schematic plan view of a ninth
• Fig. 19 is a schematic plan view of a tenth
• Fig. 20 is a schematic plan view of an eleventh
• Fig. 21 is a perspective view of a detail of a twelfth
• Fig. 22 is a schematic side view of the embodiment
• Fig. 23 is a perspective view of a thirteenth
• Fig. 24a is a schematic side view of the embodiment
• Fig. 24b is a schematic side view of the embodiment
• Fig. 25 is a perspective view of the embodiment according to
• FIG. 23 after performing the smile compensation and removing the moving means.
• FIG Fig. 26 is a schematic plan view of a fourteenth
• Fig. 27 is a schematic plan view of the device according to
• Fig. 26 in a second position of a deflection means.
• a device which has a plurality of deflection elements formed as mirror elements 1.
• a coming from the left in Fig. 1 laser beam 2 impinges at an angle ⁇ on a reflective surface 3 of the mirror element 1 and is reflected by this.
• the mirror element 1 is about an axis 4th
• a piezoelectric actuator 5 engages at a distance from the axis 4 on a surface 6 opposite the reflective surface 3.
• the mirror element 1 is pivoted about the axis 4.
• FIG. 1 shows that a change in the angle between the laser beam 2 and the surface 6 by an angle ⁇ leads to a deflection by an angle 2 * ⁇ .
• Fig. 2 illustrates how the emitter 7 of a
• Laser diode bar 8 outgoing laser beams 2 at a
• each of the emitter 7 or each of the emanating from one emitter 7 laser beam 2 is assigned exactly one serving as a deflection mirror elements 1. In the position in Fig. 2, all laser beams 2 are reflected in the same direction. In some of the figures are the slow axis and the fast axis of the
• Laser diode bar 8 indicated.
• Reflected direction which differs from the direction in which the other laser beams 2 are reflected.
• a 3D printer equipped with the device in this way can not apply laser radiation to locations where no solidification of a starting material is to take place in this way.
• FIG. 4 two laser beams 2 'are reflected in a direction different from the direction in which the other laser beams 2 are reflected.
• the laser beams 2 ' which do not contribute to the process are deflected to the right, whereas in FIG. 3 they are deflected to the left.
• Fig. 5 shows the use of a device according to the invention for the compensation of a smile distortion which frequently occurs in laser diode bars 8.
• Mirror elements 1 are in such angular positions that the smile distortion is optimally compensated. This can
• Mirror elements 1 are reflected in the same direction.
• Fig. 5 is a fastener 9 in the form of a rod
• a fast-axis collimating lens 10 is arranged behind the laser diode bar 8. Behind this, deflecting means designed as lens segments 11, 12 are arranged. In particular, a plurality of first lens segments 11 arranged next to one another in the slow-axis direction and a plurality of second lens segments 12 arranged next to one another in the direction of the slow axis are provided. The first and the second lens segments 11, 12 are spaced apart in the direction of propagation of the laser beams 2 in such a way that a telescope arrangement is formed.
• Cylindrical lenses formed whose cylinder axes extend in the slow-axis direction.
• Each of the second lens segments 12 is associated with a piezoelectric actuator 5, which can move the corresponding lens segment 12 upwards and / or downwards in FIG. 8 or in the fast-axis direction.
• a piezoelectric actuator 5 can move the corresponding lens segment 12 upwards and / or downwards in FIG. 8 or in the fast-axis direction.
• the fast-axis collimating lens 10 is subdivided into individual segments, wherein the individual segments of the fast-axis collimating lens 10 can likewise be moved upwards and downwards in FIG. 9 by a respective piezoactuator 5.
• a smile compensation can be achieved, whereas by the targeted positioning of the second lens segments 12 a targeted
• Modulation of the laser radiation can be achieved.
• the fast-axis collimating lens 10 is not subdivided into individual segments.
• the connection of each of the first lens segments 11 is used with a piezoelectric actuator 5, which can position each of the first lens segments 11 targeted.
• the targeted positioning of the second lens segments 12 allows a targeted deflection of the individual
• Laser radiation can be achieved.
• a device which has a plurality of formed as transparent components 13 deflection means.
• the components 13 are in particular plane-parallel plates.
• a coming from the left in Fig. 11 laser beam 2 enters at an angle ⁇ through a first surface 14 of the component 13 in this and from the
• the laser beam 2 experiences a beam offset ⁇ .
• the component 13 is pivotable about an axis 4.
• a piezoelectric actuator 5 engages at a distance from the axis 4 on the first surface 14.
• the component 13 is pivoted about the axis 4.
• FIG. 12 shows that the beam offset ⁇ is essentially linear from the angle ⁇ between the laser beam 2 and the first surface 14.
• FIG. 13 illustrates that a change ⁇ in the angle ⁇ between the laser beam 2 and the first surface 14 leads to a change in the beam offset ⁇ .
• FIG. 14 illustrates how laser beams 2 pass through a plurality of components 13.
• each laser beam 2 is assigned exactly one component 13 serving as a deflection means.
• three laser beams 2 ' are displaced differently than the other laser beams 2.
• these three differently offset laser beams 2' can be directed into a beam trap so that they do not contribute to the process to be performed.
• a 3D printer equipped with the device in this way can not apply laser radiation to locations where no solidification of a starting material is to take place in this way.
• a device can be seen which a plurality of transparent components 16, 17 formed
• each of the deflection means comprises two mutually opposite transparent components 16, 17, through which the laser beam 2 to be deflected can pass.
• the components 16, 17 have corresponding contours 18, 19 which
• the two components 16, 17 can be moved relative to each other, in particular in a direction perpendicular to the propagation direction of the laser beam 2. This can be done in each case by means of a piezoelectric actuator, for example, on the left in Fig. 15a and 15b side of the first component 16 attacks.
• Piezoactors may, for example, also be between 1 ⁇ to 10 ⁇ , in particular between 1 ⁇ and 3 ⁇ .
• Fig. 15a shows a position in which the components 16, 17 not
• Fig. 15b shows a position in which the components 16, 17 are shifted from each other. In this position, a wave crest of the contour 18 of the first component 16 is located exactly opposite a crest of the contour 19 of the second component. This ensures that the
• Laser beam 2 deflected by the two components 16, 17 passes and, for example, does not pass through a downstream aperture 43.
• FIGS. 15 a and 15 b show an application example of the device according to FIGS. 15 a and 15 b, in which the components 16, 17 are housed in a housing 20
• the housing 20 has an inlet opening 21 for the laser beam 2 and an outlet opening 22, in front of the
• Aperture 43 is arranged.
• the second component 17 has been moved by a piezoactuator 5 relative to the first component 16 such that a plurality of
• the deflected laser beams 2 'in a dashed line in Fig. 16 indicated beam trap 23 are directed so that they do not contribute to the process to be carried out.
• a 3D printer equipped with the device in this way can not apply laser radiation to locations where no solidification of a starting material is to take place in this way.
• FIG. 17 shows the staggered arrangement of deflection means formed as transparent components 13.
• the components 13 adjacent in the direction of the slow axis are offset in their longitudinal direction by more than one length of the components 13 relative to one another, so that they are arranged offset one behind the other.
• the laser beams 2 arriving from the left in FIG. 17 can be arranged closer to one another.
• the components 13 are on their long sides 24 with a
• FIG. 18 shows the staggered arrangement of deflection means formed as mirror elements 25, 26.
• the mirror elements 25, 26 are like the mirror element 1 shown in FIG. 1 about an axis
• the mirror elements 25, 26 adjacent in the slow-axis direction are offset in their longitudinal direction by more than one length of the mirror elements 25, 26 relative to one another, so that they are arranged offset one behind the other.
• the laser beams 2 arriving from the left in FIG. 18 can be arranged closer to one another.
• the mirror elements 25 arranged on the left side in FIG. 18 are on their upper and lower longitudinal sides 24 in FIG. 18
• Mirror elements 25 have on their left side an entrance surface 27, which is provided with a reflection-reducing coating. On the right in Fig. 18 side of the mirror elements 25, a highly reflective coating 28 is provided. Of this
• Coating the respective laser beam 2 from the plane of FIG. 18 is reflected out.
• the mirror elements 26 arranged on the right-hand side in FIG. 18 have, on their left-hand side in FIG. 18, a highly reflective coating 29, from which the respective laser beam 2 is reflected out of the plane of the drawing in FIG.
• Laser beams 2 are reflected in about the same area (see the dot-dash line 30 shown in Fig. 18).
• Fig. 19 shows an embodiment of the invention in which
• the device comprises a lens array 32, of which the laser radiation 31 in individual
• Partial beams 34 split and a corresponding number of deflection means 33 is supplied.
• These deflection means 33 may be formed, for example, as mirror elements or as transparent components.
• deflection means 33 can thus specifically individual
• Partial beams 34 are deflected differently than others, so that
• the laser radiation 31 can be suitably modulated.
• this embodiment is also suitable
• Device for example, for use in a 3D printing device.
• FIG. 20 also shows an embodiment of the invention in which the input side does not have a plurality of laser beams but a laser radiation 31 with a linear intensity distribution, the line of the linear intensity distribution extending in the vertical direction of FIG.
• a lens array for dividing the laser radiation 31 is not used here.
• the deflection means 33 are arranged offset as in the embodiments according to FIGS. 17 and 18.
• the deflection means 33 arranged on the left side in FIG. 20 the laser radiation 31 is subdivided into a plurality of partial beams 34. This is because a part of the laser radiation passes through the deflection means 33 and another part passes by the deflection means 33.
• FIGS. 21 and 22 show an embodiment in which
• Dividing means 35 alternate side by side each reflecting surfaces 36, of which partial beams 34 of the laser radiation 31 can be reflected upward in Fig. 21, with gaps 37, through the Partial beams 34 'of the laser radiation 31 pass through unhindered.
• FIG. 22 shows that the partial beams 34 deflected upwards from the reflecting surfaces 36 are deflected or modulated by optionally further deflecting means 39 designed as transparent components and deflected by a mirror 44 to the right in FIG. 22.
• deflected deflected means 38 deflected or modulated and deflected by a further mirror 45 upward in Fig. 22. From a dividing means 35
• this embodiment of a device according to the invention is also suitable, for example, for use in an SD printing device.
• FIGS. 23 to 25 show an embodiment in which, as in FIG. 9, a fast-axis collimating lens 10 is subdivided behind a laser diode bar 7 into individual segments.
• the individual segments of the fast-axis collimating lens 10 are each connected to a piezoactuator 5, from which they can be moved up and down in Figs. 23 to 24b.
• the targeted positioning of the individual segments Axis collimation lens 10 Smile compensation can be achieved.
• Piezoactuators 5 arranged on a common bracket 41.
• Fig. 24a shows the passage of a laser beam 2 through
• 24b shows the passage of the laser beam 2 through the segment already shown in FIG. 24a after a corresponding correction by a movement of the piezoactuator 5.
• Fastener 9 befind Anlagen, for example, photosensitive adhesive 42 applied and / or activated. After setting and sticking all the positions of the segments of the fast-axis collimating lens 10 suitable for the smile compensation, the piezoactuators 5 can be removed together with the holder 41 (see FIG. 25).
• Mirror elements 46, 47 has formed deflection means. Between the two mirror elements 46, 47 only a very narrow gap is provided. In this case, the first, left in Fig. 26 left mirror element 46 is not movable or not provided with a piezoelectric actuator 5, whereas the second, in Fig. 26 right mirror element 47 is provided with a piezoelectric actuator 5 and therefore is movable relative to the first mirror element 46.
• the mirror elements 46, 47 can be produced, for example, by sawing or cutting a mirror into two parts.
• a laser beam 2 coming from the left in FIG. 26 impinges on first and second reflecting surfaces 48, 49 of the mirror elements 46, 47 at an angle of, for example, 45 ° and is reflected by these upward in FIG. 26.
• the laser beam 2 has
• a Gaussian profile 50 For example, as indicated in Fig. 26, a Gaussian profile 50.
• the upwardly-reflected laser beam 2 is focused by a lens 51 and has a Gaussian intensity distribution 52 with a central maximum 53 in the focal plane.
• Fig. 27 shows the same device, in which, however, the second
• Mirror element 47 by a distance D with is shifted relative to the first mirror element 46.
• ⁇ is the wavelength of the laser beam 2.
• the second reflecting surface 49 of the second mirror element 47 is set back by D relative to the first surface 48 of the first mirror element 46.
• the part of the laser beam 2 reflected at the second surface 49 thereby undergoes a phase shift by ⁇ relative to the part of the laser beam 2 reflected at the first surface 48.
• the optical path is that part of the laser beam reflected at the second surface 49 2 is larger by ⁇ / 2 than the optical path traveled by the portion of the laser beam 2 reflected at the first surface 48.
• Intensity distribution 52 a central minimum 54 is formed.
• the intensity of individual laser beams 2 in a working plane can therefore be targeted can be significantly reduced to complete, so that a total of a plurality of laser beams 2 existing laser radiation can be suitably modulated. As a result, this is also suitable
• the distance D can be suitably adjusted at 45 ° deviating entrance angles of the laser beam 2, so that a

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• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• General Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Electromagnetism (AREA)
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• Chemical & Material Sciences (AREA)
• Plasma & Fusion (AREA)
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• Manufacturing & Machinery (AREA)
• Health & Medical Sciences (AREA)
• Toxicology (AREA)
• Mechanical Light Control Or Optical Switches (AREA)
• Powder Metallurgy (AREA)
• Laser Beam Processing (AREA)
• Semiconductor Lasers (AREA)

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• 2016
  • 2016-12-14 DE DE102016124408.2A patent/DE102016124408A1/de not_active Withdrawn
• 2017
  • 2017-12-01 EP EP17822560.3A patent/EP3555687A1/de not_active Withdrawn
  • 2017-12-01 CN CN201780076950.4A patent/CN110073270B/zh active Active
  • 2017-12-01 WO PCT/EP2017/081243 patent/WO2018108583A1/de unknown
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• 2019
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