EP3550950A4 - Machine d'opération - Google Patents

Machine d'opération Download PDF

Info

Publication number
EP3550950A4
EP3550950A4 EP16922936.6A EP16922936A EP3550950A4 EP 3550950 A4 EP3550950 A4 EP 3550950A4 EP 16922936 A EP16922936 A EP 16922936A EP 3550950 A4 EP3550950 A4 EP 3550950A4
Authority
EP
European Patent Office
Prior art keywords
operation machine
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP16922936.6A
Other languages
German (de)
English (en)
Other versions
EP3550950A1 (fr
EP3550950B1 (fr
Inventor
Katsunori Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Publication of EP3550950A1 publication Critical patent/EP3550950A1/fr
Publication of EP3550950A4 publication Critical patent/EP3550950A4/fr
Application granted granted Critical
Publication of EP3550950B1 publication Critical patent/EP3550950B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Operations Research (AREA)
  • Quality & Reliability (AREA)
  • Supply And Installment Of Electrical Components (AREA)
EP16922936.6A 2016-12-01 2016-12-01 Machine d'opération Active EP3550950B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/085693 WO2018100706A1 (fr) 2016-12-01 2016-12-01 Machine d'opération

Publications (3)

Publication Number Publication Date
EP3550950A1 EP3550950A1 (fr) 2019-10-09
EP3550950A4 true EP3550950A4 (fr) 2019-12-11
EP3550950B1 EP3550950B1 (fr) 2023-06-21

Family

ID=62242014

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16922936.6A Active EP3550950B1 (fr) 2016-12-01 2016-12-01 Machine d'opération

Country Status (5)

Country Link
US (1) US11064639B2 (fr)
EP (1) EP3550950B1 (fr)
JP (1) JP6754445B2 (fr)
CN (1) CN110024507B (fr)
WO (1) WO2018100706A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3092782B1 (fr) * 2019-02-14 2021-07-09 Mga Tech Procede de prehension de composants electroniques comportant des broches
EP4025031A4 (fr) * 2019-08-30 2022-09-07 Fuji Corporation Machine de travail

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758498A (ja) * 1993-08-16 1995-03-03 Tdk Corp 電子部品の挿入方法及び装置
US20020136443A1 (en) * 2001-03-21 2002-09-26 Fuji Machine Mfg. Co., Ltd. Method and apparatus for detecting position of lead of electric component, and electric-component mounting method
US20150128411A1 (en) * 2013-11-13 2015-05-14 Panasonic Intellectual Property Management Co., Ltd. Apparatus and method for mounting electronic component
EP3032932A1 (fr) * 2013-08-07 2016-06-15 Fuji Machine Mfg. Co., Ltd. Appareil de détection de position de fil et machine d'insertion de composant

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH055296A (ja) * 1991-06-21 1993-01-14 Oji Paper Co Ltd 含浸用原紙の製造方法
JP2682292B2 (ja) * 1991-09-12 1997-11-26 松下電器産業株式会社 部品挿入装置
JP4145615B2 (ja) 2002-07-19 2008-09-03 松下電器産業株式会社 部品挿入装置
US9374935B2 (en) * 2010-04-29 2016-06-21 Fuji Machine Mfg. Co., Ltd. Manufacture work machine
JP6019409B2 (ja) * 2013-11-13 2016-11-02 パナソニックＩｐマネジメント株式会社 電子部品実装装置及び電子部品実装方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758498A (ja) * 1993-08-16 1995-03-03 Tdk Corp 電子部品の挿入方法及び装置
US20020136443A1 (en) * 2001-03-21 2002-09-26 Fuji Machine Mfg. Co., Ltd. Method and apparatus for detecting position of lead of electric component, and electric-component mounting method
EP3032932A1 (fr) * 2013-08-07 2016-06-15 Fuji Machine Mfg. Co., Ltd. Appareil de détection de position de fil et machine d'insertion de composant
US20150128411A1 (en) * 2013-11-13 2015-05-14 Panasonic Intellectual Property Management Co., Ltd. Apparatus and method for mounting electronic component

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2018100706A1 *

Also Published As

Publication number Publication date
EP3550950A1 (fr) 2019-10-09
US11064639B2 (en) 2021-07-13
US20200068755A1 (en) 2020-02-27
CN110024507A (zh) 2019-07-16
EP3550950B1 (fr) 2023-06-21
JPWO2018100706A1 (ja) 2019-07-25
JP6754445B2 (ja) 2020-09-09
CN110024507B (zh) 2021-08-17
WO2018100706A1 (fr) 2018-06-07

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