EP3495894B1 - Procédé de fabrication d'un composant horloger - Google Patents

Procédé de fabrication d'un composant horloger Download PDF

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Publication number
EP3495894B1
EP3495894B1 EP17205320.9A EP17205320A EP3495894B1 EP 3495894 B1 EP3495894 B1 EP 3495894B1 EP 17205320 A EP17205320 A EP 17205320A EP 3495894 B1 EP3495894 B1 EP 3495894B1
Authority
EP
European Patent Office
Prior art keywords
wafer
component
manufacturing
slice
timepiece component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP17205320.9A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3495894A1 (fr
Inventor
Richard Bossart
Nima Merk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rolex SA
Original Assignee
Rolex SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rolex SA filed Critical Rolex SA
Priority to EP17205320.9A priority Critical patent/EP3495894B1/fr
Priority to US16/202,284 priority patent/US11429065B2/en
Priority to JP2018224857A priority patent/JP7393120B2/ja
Priority to CN201811474412.3A priority patent/CN109870891B/zh
Publication of EP3495894A1 publication Critical patent/EP3495894A1/fr
Application granted granted Critical
Publication of EP3495894B1 publication Critical patent/EP3495894B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B19/00—Indicating the time by visual means
    • G04B19/04—Hands; Discs with a single mark or the like
    • G04B19/042—Construction and manufacture of the hands; arrangements for increasing reading accuracy
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B13/00—Gearwork
    • G04B13/02—Wheels; Pinions; Spindles; Pivots
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B15/00—Escapements
    • G04B15/14—Component parts or constructional details, e.g. construction of the lever or the escape wheel
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B17/00—Mechanisms for stabilising frequency
    • G04B17/04—Oscillators acting by spring tension
    • G04B17/06—Oscillators with hairsprings, e.g. balance
    • G04B17/066—Manufacture of the spiral spring

Definitions

  • the present invention relates to a method for manufacturing a watch component made from a micro-machinable material.
  • Such a prior art manufacturing process comprises a first step E1 ( picture 1a ) consisting in providing a plate 1 which is called by its English name "wafer", consisting of a first plate 2 of micro-machinable material, for example silicon, the thickness of which corresponds to that of the final component, of the order of 10 to 200 microns, and intended to be worked to form the component.
  • This first wafer 2 is assembled with a second wafer 4, with a thickness of the order of 0.5 mm, intended to serve as a support and being presented for example likewise in silicon, by means of an intermediate layer 3 of silicon oxide.
  • Such a wafer 1 is generally referred to as an “SOI wafer” for “silicon on insulator wafer”.
  • SOI wafer silicon on insulator wafer
  • the manufacturing process then comprises a step consisting in adding a mask to the visible face of the wafer 1, via the deposition (step E2, figure 1b ) of a layer of resin 5, in which free areas 6 are formed (step E3, figure 1c ) by partial removal of the resist using photolithography techniques.
  • a wafer a wafer or an assembly of wafers, and/or optionally comprising additional layers, used in a manufacturing process comprising at least one etching, from a masking step corresponding to step E2.
  • This wafer comprises two faces: the visible face, which we will also call the upper surface by convention, which will be etched, and the lower face.
  • the mask formed in the previous step then allows the formation of at least one watch component, by etching (step E4, figure 1d ) of the first wafer 2 of the wafer 1 in the free zones 6 of resin.
  • the component(s) is/are thus formed according to a geometry determined by the mask formed previously.
  • step E5 the remaining resin is removed (step E5, figure 1e ), then the at least one timepiece component 9, illustrated by the figure 1f , is obtained by separating the first wafer 2 from the second wafer 4 through a release step E6.
  • This release step therefore has the effect of separating the watch component(s), engraved in the first wafer 2, from the intermediate layer 3, but also from the micro-machinable material of which the second wafer 4 is made.
  • This release step E6 is a complex step. It can be achieved by complete dissolution of the material of the intermediate layer 3 from the upper face of the wafer 1, more precisely from the etchings 7 made in the first wafer 2 of the wafer 1, which has the disadvantage of a very long stage.
  • the release step E6 is long and requires complex manufacturing equipment, which represents a major drawback of the solution of the state of the art.
  • An object of the present invention is to provide a method of manufacturing a watch component which improves the method of the state of the art.
  • the object of the present invention is to propose a simplified method of manufacturing a watch component.
  • the invention is based on a method of manufacturing a watch component, as defined in claim 1.
  • the method of manufacturing a watch component is improved in that it greatly simplifies the end of the method of the state of the art, by simplifying, or even eliminating the step of E6 release described previously.
  • the adjective superior to designate a surface on the side of the face of a wafer which will undergo the first etching, and the adjective inferior for a surface on an opposite side.
  • the picture 2 represents a method of manufacturing a timepiece component according to a first embodiment of the invention.
  • such a manufacturing process comprises a first step E11 ( figure 2a ) consisting in providing a wafer 11 of micro-machinable material, for example silicon.
  • a wafer comprises a single wafer 12 intended to be worked to form the timepiece component.
  • This single wafer 12 preferably has a thickness greater than or equal to 100 microns, or even greater than or equal to 120 microns. This thickness may in particular be between 100 or 120 microns and 300 microns, or even up to 500 microns.
  • the manufacturing process then comprises a step consisting in adding a mask to the upper surface of the wafer 11, via the deposition (step E12, figure 2b ) of a layer of resin 15, in which free areas 16 are formed (step E13, figure 2c ) by partial removal of the resist using photolithography techniques.
  • the mask formed in the previous step then allows the formation of at least one watch component, by etching (step E14, 2d figure ) of the wafer 11 through the free areas 16 of the resin mask.
  • the component(s) is/are thus formed according to a geometry determined by the mask formed previously.
  • clips are provided to hold the component(s) attached to the wafer 11.
  • step E15, figure 2f the remaining resin is removed by dissolving, in a revealing step (step E15, figure 2f ) which makes it possible to directly obtain the machined wafer 12 comprising the watchmaker component(s) 19.
  • Steps E12 to E15 substantially correspond to steps E2 to E5 of the prior art solution, and are therefore not described in detail.
  • the etching is carried out in a conventional manner, by photolithography and DRIE.
  • the great advantage of this first embodiment of the invention is to have eliminated the second support wafer of the wafer, which makes it possible to eliminate the tedious step of release E6 of the state of the art by dissolving the layer intermediate 3.
  • the wafer 11 made of micro-machinable material could come in several superimposed layers, and/or in several materials.
  • the important characteristic of the embodiment is that the wafer does not include any layer whose function is limited to forming a support and that it is etched in its entire thickness.
  • the watch component obtained has a maximum final thickness substantially equal to the thickness of the wafer 11 used, that is to say the thickness of the wafer 12.
  • the embodiment described above makes it possible to greatly simplify the method of manufacturing a timepiece component. It is mainly based on the elimination of any support in a wafer 11 of micro-machinable material, and on the unexpected finding that it is possible to manufacture a watch component from a wafer that does not include a support.
  • the picture 3 represents a method of manufacturing a timepiece component according to a second embodiment of the invention.
  • Such a manufacturing method comprises a first step E21 ( picture 3a ) consisting in providing a wafer 21 comprising a micro-machinable material, for example silicon.
  • a wafer 21 comprises a wafer 22 of micro-machinable material, which corresponds to the material of the watch component, with a thickness greater than or equal to 100 microns, or even greater than or equal to 120 microns, intended to be worked to form the watch component.
  • the wafer 21 further comprises a lower layer 24, preferably metallic.
  • this second embodiment comprises a preliminary step, not shown, consisting in depositing or assembling a lower metal layer 24 to a wafer 22 of micro-machinable material, to form the wafer 21.
  • this preliminary step consists in coating a surface of a wafer in micro-machinable material with a layer of metal deposited by a technique of physical vapor deposition, also called by its acronym PVD (for “Physical Vapor Deposition”).
  • PVD Physical Vapor Deposition
  • a metallic lower layer can be a layer of pure aluminum of 2 microns.
  • such a lower layer can have any other thickness, preferably between 0.5 and 5 microns inclusive.
  • any technique for depositing a pure metal and/or an alloy can be used to coat the lower surface of the wafer in micro-machinable material with a metal layer.
  • the metal deposited is aluminum, gold or platinum.
  • any other technique for depositing or assembling a metallic lower layer forming a coating on the surface of the wafer in micro-machinable material can be used (e.g. electrolytic growth, chemical vapor deposition, bonding of a sheet ).
  • the manufacturing process then comprises a step consisting in adding a mask to the upper surface of the wafer 21, via the deposition (step E22, figure 3b ) of a layer of resin 25, in which free areas 26 are formed (step E23, figure 3c ) by partial removal of the resist using photolithography techniques.
  • the mask formed in the previous step then allows the formation of at least one watch component, by etching (step E24, 3d figure ) of the wafer 21 through the free zones 26 of the resin mask.
  • the component(s) is/are thus formed according to a geometry determined by the mask formed previously.
  • Step E25 substantially correspond to steps E2 to E5 and E12 to E15.
  • the method according to this second embodiment then comprises a release step E26 ( figure 3f ), which consists in removing the lower layer 24 of metal.
  • This E26 release step is very simple and quick: it is carried out by dissolving the metal, for example in an aluminum etching acid bath (mixture of HNO3, H3PO4, CH3COOH, H2O).
  • the composition of the bath must be adapted to the metal constituting the lower layer to allow its dissolution, in a manner known to those skilled in the art.
  • the material of the lower layer is completely dissolved.
  • the second lower silicon wafer 4 then separates from the upper wafer carrying the components.
  • this second embodiment also remains very simple, since the final separation of the timepiece component 29, by the elimination of manufacturing residues such as the resin and the lower layer, which is presented as a metal support layer according to a mode of realization, comprises a release step E26 greatly simplified compared to the method of the state of the art which uses a support consisting of two parts, one of which corresponds to the material of the component, and which therefore cannot be dissolved chemically without having previously protected the components etched in the first wafer by an additional layer.
  • the second embodiment described above makes it possible to greatly simplify the method of manufacturing a timepiece component. It is based on the use of a metal support for a wafer made of a micro-machinable material, and on the unexpected observation that it is possible to manufacture a watch component from a wafer comprising a single wafer of material micro-machinable and a thin metal bottom layer, much more thin than the support of the state of the art also made of micro-machinable material.
  • the person skilled in the art would have had a negative prejudice on such a solution, considering in particular that the metal would diffuse within the micro-machinable material by modifying its properties.
  • a person skilled in the art would also have a negative prejudice on the feasibility of this manufacturing process, since processing equipment is generally designed for wafers of a certain rigidity to ensure precision and robustness.
  • This second embodiment has been described on the basis of a lower metal layer.
  • a layer of silicon oxide SiO 2 or of polymer for example a polymer film of poly-p-xylylene better known under the name of parylene, on the lower face of the wafer of micro-machinable material, which in particular performs the same stiffening function as a metal layer.
  • the release step E26 will simply consist of a dissolution of the layer of SiO 2 or polymer by means of acids such as mixtures based on hydrofluoric acid or by oxygen plasma treatment.
  • the concept implemented in the two embodiments of the invention described above consists in proposing a method for manufacturing a watch component which does away with the step of releasing a support made of micro-machinable material. complex and time-consuming, avoiding the use of a micro-machinable material as support.
  • the entire thickness of the micro-machinable material present in the wafer is used to form the watch component, with no support function. It therefore does not include a wafer of micro-machinable material used solely for the support function: the single wafer of micro-machinable material present within the wafer 11, 21 is intended for the formation of at least one watch component by engraving.
  • the method does not include etching of micro-machinable material via the lower face of the wafer to facilitate the release step E6, but only etching via the upper face.
  • the watch component obtained preferably has a maximum thickness corresponding substantially to the thickness of the whole of the micro-machinable material (corresponding to the sum of the thickness of all the layers of micro-machinable material in the case of a wafer multilayer) initially present in the wafer used to manufacture it.
  • the process for manufacturing a watch component can also comprise additional processing steps, carried out before or after releasing the component from the resin and/or from the metal support, such as thinning the wafer of micro-material material. machining surface or component, mechanical or laser beam recovery, coating deposition, oxidation heat treatment, cleaning/degreasing, etc.
  • the method of the invention applies to the manufacture of a multitude of watch components.
  • the horological component can be an entity ready to be mounted in a movement (for example a lever, a spring, etc.) or a part intended to be assembled with one or more other parts of the movement (for example a hairspring with the balance shaft, a wheel plate with its shaft, an anchor with the anchor rod (or shaft), a balance wheel to the balance shaft, etc.).
  • the timepiece component can be an exterior component, such as a hand. This process is particularly suited to the manufacture of simple 2.5D (two and a half dimensions) watch components, with a thickness greater than or equal to 100 ⁇ m.
  • the second embodiment will be preferred for the most fragile components, with fine structures, at risk of being damaged, or the most flexible, at risk of deforming during the etching step, such as spiral springs or even the most thin, in particular with a thickness of less than 100 microns.
  • the first embodiment will be preferred for less fragile components, in particular more massive, such as wheels as well as for components with a thickness strictly greater than 100 ⁇ m.
  • the two embodiments remain suitable for the manufacture of all these timepiece components.
  • the deposited layer which serves as a mask for etching is made of a photosensitive resin.
  • This layer of photosensitive resin can be substituted by any other layer which can serve as a mask against a DRIE type attack, for example a layer of silicon oxide, silicon nitride, metal, etc.
  • the person skilled in the art will choose the appropriate layer to suit his needs.
  • micro-machinable material any material suitable for micro-machining, including in particular any material which can be etched directionally through a mask.
  • micro-machining all the techniques making it possible to produce structures of micrometric size in a material through a mask, such as for example chemical attacks or photolithography.
  • the micro-machinable material used in the embodiments described above is silicon, but can be substituted by doped silicon, porous silicon, etc.... Others micro-machinable materials could of course be used, such as diamond, quartz, sapphire and ceramic. It can also be a hybrid material.
  • the micro-machinable material can also be any micro-structurable material, sufficiently rigid to be able to be manipulated.
  • the invention is more generally suitable for the manufacture of a timepiece component consisting of or comprising a material called “component material” which can be cut through a mask.
  • component material will be worked from a wafer with a thickness greater than or equal to 100 ⁇ m, arranged within a wafer, as explained in the embodiments described, or more generally in a wafer comprising a layer comprising one or more material(s) of the component, the entire thickness of which, preferably greater than or equal to 100 ⁇ m, will be etched to form the component.
  • such a wafer may optionally include a support in another material, in particular a metal or a metal alloy, called support material, different from the material of the component and compatible with it, that is to say not being affected during the etching of the material of the component, as implemented in the etching steps E14, E24 described previously.
  • the thickness of any support is very small, less than or equal to 10 ⁇ m, or even less than or equal to 5 ⁇ m, or even less than or equal to 3 ⁇ m.
  • this thickness is preferably greater than or equal to 0.5 ⁇ m. This thickness is therefore considered to be negligible relative to the thickness of the wafer made of component material, of the wafer, and of the manufactured timepiece component.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Metallurgy (AREA)
EP17205320.9A 2017-12-05 2017-12-05 Procédé de fabrication d'un composant horloger Active EP3495894B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP17205320.9A EP3495894B1 (fr) 2017-12-05 2017-12-05 Procédé de fabrication d'un composant horloger
US16/202,284 US11429065B2 (en) 2017-12-05 2018-11-28 Method of manufacturing a clock or watch component
JP2018224857A JP7393120B2 (ja) 2017-12-05 2018-11-30 クロックまたは小型時計部品の製造方法
CN201811474412.3A CN109870891B (zh) 2017-12-05 2018-12-04 制造钟或表的部件的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP17205320.9A EP3495894B1 (fr) 2017-12-05 2017-12-05 Procédé de fabrication d'un composant horloger

Publications (2)

Publication Number Publication Date
EP3495894A1 EP3495894A1 (fr) 2019-06-12
EP3495894B1 true EP3495894B1 (fr) 2023-01-04

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US (1) US11429065B2 (ja)
EP (1) EP3495894B1 (ja)
JP (1) JP7393120B2 (ja)
CN (1) CN109870891B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI774925B (zh) * 2018-03-01 2022-08-21 瑞士商Ｃｓｅｍ瑞士電子及微技術研發公司 製造螺旋彈簧的方法
EP3786721A1 (fr) * 2019-08-29 2021-03-03 ETA SA Manufacture Horlogère Suisse Procédé de collage de composants horlogers
EP3839624B1 (fr) * 2019-12-18 2023-09-13 Nivarox-FAR S.A. Procede de fabrication d'un composant horloger

Citations (1)

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EP2579105A2 (fr) * 2011-10-07 2013-04-10 CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement Procédé de réalisation d'une pièce d'horlogerie

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Also Published As

Publication number Publication date
US20190171164A1 (en) 2019-06-06
EP3495894A1 (fr) 2019-06-12
CN109870891B (zh) 2023-05-30
CN109870891A (zh) 2019-06-11
JP2019132827A (ja) 2019-08-08
US11429065B2 (en) 2022-08-30
JP7393120B2 (ja) 2023-12-06

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