EP3489395A1 - Metallische elektrotauchkathodenplatte und herstellungsverfahren dafür - Google Patents

Metallische elektrotauchkathodenplatte und herstellungsverfahren dafür Download PDF

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Publication number
EP3489395A1
EP3489395A1 EP17830882.1A EP17830882A EP3489395A1 EP 3489395 A1 EP3489395 A1 EP 3489395A1 EP 17830882 A EP17830882 A EP 17830882A EP 3489395 A1 EP3489395 A1 EP 3489395A1
Authority
EP
European Patent Office
Prior art keywords
conductive film
cathode plate
nickel
protrusion
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17830882.1A
Other languages
English (en)
French (fr)
Other versions
EP3489395A4 (de
Inventor
Hiroto Watanabe
Itsumi MATSUOKA
Yusuke SENBA
Hiroshi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Publication of EP3489395A1 publication Critical patent/EP3489395A1/de
Publication of EP3489395A4 publication Critical patent/EP3489395A4/de
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/06—Electrolytic production, recovery or refining of metals by electrolysis of solutions or iron group metals, refractory metals or manganese
    • C25C1/08—Electrolytic production, recovery or refining of metals by electrolysis of solutions or iron group metals, refractory metals or manganese of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • C25C7/02—Electrodes; Connections thereof
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • C25C7/06—Operating or servicing
    • C25C7/08—Separating of deposited metals from the cathode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk

Definitions

  • Fig. 5 is a view illustrating an example of a conventional cathode plate to be used in production of blobby electric nickel.
  • a cathode plate 11 is masked with a non-conductive film 13 on a flat plate-shaped metal plate 12 except the place to be a conductive portion 12a, and the conductive portion 12a is a concave portion and the non-conductive film 13 is a convex portion on this cathode plate 11.
  • Nickel having a proper size is electrodeposited on the conductive portion 12a and blobby electric nickel is thus produced by using such a cathode plate 11.
  • the nickel 14 begins to be electrodeposited and precipitated from the conductive portion 12a, grows not only in the thickness (longitudinal) direction but also in the planar (lateral) direction, and is in the state of being piled on the upper portion of the non-conductive film 13 as well.
  • the non-conductive film (non-conductive portion) to be formed on the cathode plate has a long service life and can be easily maintained even in the case of being lost (deteriorated).
  • the nickel 14 begins to be electrodeposited and precipitated from the conductive portion 12a, grows not only in the longitudinal direction but also in the lateral direction, and thus is in the state of gradually being piled on the non-conductive film 13 as well when blobby electric nickel is produced by using the cathode plate 11 as illustrated in Fig. 5 and Fig. 6 .
  • the part of the thin non-conductive film 13 to be formed in the vicinity of the boundary with the conductive portion 12a is likely to be lost by the stress at the time of electrodeposition of the nickel 14 and the impact at the time of peeling off of the electric nickel as well as the adhesive property of the part with the metal plate 12 is likely to diminish by penetration of the electrolytic solution.
  • an object of the present invention is to provide a metal electrodeposition cathode plate in which a non-conductive film on a metal plate is hardly lost and which can be repeatedly used and a production method therefor.
  • the inventors of the present invention have carried out intensive investigations in order to solve the problems described above. As a result, it has been found out that the non-conductive film is hardly lost as protrusions are provided on a metal plate to form a conductive portion and a non-conductive film is provided on the metal surface except the protrusions, whereby the present invention has been completed.
  • the present invention it is possible to provide a metal electrodeposition cathode plate in which a non-conductive film is hardly lost and which can be repeatedly used and a production method therefor.
  • a cathode plate 1 includes a metal plate 2 on which a plurality of disc-shaped protrusions 2a is disposed and a non-conductive film 3 formed on the surface of the metal plate 2 except the protrusions 2a as illustrated in Fig. 1 .
  • the cathode plate 1 is used, for example, by being hung in an electrolytic cell containing an electrolytic solution containing nickel and an anode by a hanging member 5 and nickel having a desired shape is electrodeposited and precipitated on the surface of the cathode plate as to be described later.
  • the material for the metal plate 2 is not particularly limited as long as it is a metal which is less susceptible to corrosion by the electrolytic solution to be used and forms only loose bonding with an electrodeposit such as nickel, but preferred examples thereof may include titanium and stainless steel.
  • the non-conductive film 3 is formed on the flat area 2b having a concave step formed by the adjacent protrusions 2a and thus the non-conductive film 3 having a predetermined thickness is formed.
  • the minimum film thickness Y of the non-conductive film 3 is the same as or greater than the height X of the protrusion 2a and it is preferably the same as the height X.
  • the impact to be applied to the end portion of the non-conductive film 3 by the nickel 4 is minor and the non-conductive film 3 is hardly lost even when the nickel 4 is peeled off from the cathode plate 1.
  • the non-conductive film 3 is hardly lost and it is thus possible to repeatedly use the non-conductive film 3 in electrodeposition without replacing the non-conductive film 3, to decrease the maintenance cost, and to achieve improvement in the productivity.
  • a plurality of pieces of blobby electric nickel can be obtained from one cathode plate 1 by peeling off the nickel 4 from the cathode plate 1 after the electrodeposition of nickel is terminated.
  • the non-conductive film 3 is hardly lost and it is thus possible to repeatedly use the non-conductive film 3 without replacing the non-conductive film 3, to decrease the maintenance cost, and to achieve improvement in the productivity.
  • a plurality of disc-shaped protrusions 2a is formed on the surface of the metal plate 2.
  • the parts of the flat plate-shaped metal plate 2 except the protrusions 2a are scraped, the protrusions 2a having a height X are left, and flat areas 2b are thus formed.
  • the processing method is not particularly limited, and the formation of flat areas 2b can be conducted by, for example, wet etching processing, end mill processing, and laser processing.
  • the protrusions 2a may be formed only on one surface of the metal plate 2 or on both surfaces of the metal plate 2.
  • the non-conductive film 3 is formed on the flat areas 2b to be the surface of the metal plate 2 except the protrusions 2a.
  • the method for forming the non-conductive film 3 is not particularly limited, and the formation of the non-conductive film 3 can be conducted by screen printing. In a case in which the material for the non-conductive film 3 is a thermosetting resin or a photocurable resin, heat curing or photocuring may be conducted if necessary.
  • a cathode plate was fabricated in the same manner as in Example 1 except that the height X of the protrusion of the metal plate was set to 500 ⁇ m and the non-conductive film was formed on the flat area so as to have a predetermined thickness.
  • the difference between the minimum film thickness of the non-conductive film and the height of the protrusion was measured at arbitrary 10 places by using a laser displacement meter, and the results were in a range of from -200 to -150 ⁇ m and the minimum film thickness Y of the non-conductive film 3 was thus 300 ⁇ m.
  • the minimum film thickness Y of the non-conductive film 3 is thinner than 500 ⁇ m of the height of the protrusion.
  • Nickel electrodeposited at the adjacent protrusions and conductive portions are connected to each other and electric nickel having a desired shape cannot be obtained in some cases when the loss of the non-conductive film expands.
  • the use was stopped and the number of repetitions up to this time point was evaluated in a case in which the non-conductive film was lost from the boundary with the protrusion in the direction of the flat area by 1 mm or more.
  • the use was stopped and the number of repetitions up to this time point was evaluated in a case in which the non-conductive film was lost and the diameter of the conductive portion increased by 1 mm or more as well.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
EP17830882.1A 2016-07-21 2017-07-10 Metallische elektrotauchkathodenplatte und herstellungsverfahren dafür Withdrawn EP3489395A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016143531A JP6724624B2 (ja) 2016-07-21 2016-07-21 金属電着用陰極板及びその製造方法
PCT/JP2017/025093 WO2018016362A1 (ja) 2016-07-21 2017-07-10 金属電着用陰極板及びその製造方法

Publications (2)

Publication Number Publication Date
EP3489395A1 true EP3489395A1 (de) 2019-05-29
EP3489395A4 EP3489395A4 (de) 2020-04-08

Family

ID=60992989

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17830882.1A Withdrawn EP3489395A4 (de) 2016-07-21 2017-07-10 Metallische elektrotauchkathodenplatte und herstellungsverfahren dafür

Country Status (6)

Country Link
US (1) US20190233960A1 (de)
EP (1) EP3489395A4 (de)
JP (1) JP6724624B2 (de)
CN (1) CN109415832A (de)
CA (1) CA3030941C (de)
WO (1) WO2018016362A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6638589B2 (ja) * 2016-07-21 2020-01-29 住友金属鉱山株式会社 金属電着用陰極板及びその製造方法
WO2019146474A1 (ja) 2018-01-29 2019-08-01 コニカミノルタ株式会社 立体造形用樹脂組成物、立体造形物、および立体造形物の製造方法
KR102017567B1 (ko) * 2018-11-27 2019-09-03 주식회사 웨스코일렉트로드 전해 제련용 전극 조립체
JP7188219B2 (ja) * 2019-03-25 2022-12-13 住友金属鉱山株式会社 金属電着用の陰極板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS46919Y1 (de) * 1966-04-04 1971-01-13
US4040915A (en) * 1976-06-15 1977-08-09 The International Nickel Company, Inc. Method for producing regular electronickel or S nickel rounds from electroplating baths giving highly stressed deposits
JPS6038678Y2 (ja) * 1981-05-15 1985-11-19 住友金属鉱山株式会社 金属電着用母板
JPS6288754U (de) * 1985-11-25 1987-06-06
JPH10317197A (ja) * 1997-05-14 1998-12-02 Sumitomo Metal Mining Co Ltd メッキ用電気ニッケル、その製造用陰極板及び製造方法
JP2008106292A (ja) * 2006-10-24 2008-05-08 Sumitomo Metal Mining Co Ltd 特殊形状電気ニッケルの電解採取用カソードの製造方法
WO2010028428A1 (en) * 2008-09-09 2010-03-18 Steelmore Holdings Pty Ltd A cathode and a method of forming a cathode

Also Published As

Publication number Publication date
CA3030941A1 (en) 2018-01-25
JP6724624B2 (ja) 2020-07-15
JP2018012865A (ja) 2018-01-25
EP3489395A4 (de) 2020-04-08
US20190233960A1 (en) 2019-08-01
CN109415832A (zh) 2019-03-01
WO2018016362A1 (ja) 2018-01-25
CA3030941C (en) 2020-12-15

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