EP3473352B1 - Procédé de fabrication d'un profil de cuivre et profil de cuivre - Google Patents
Procédé de fabrication d'un profil de cuivre et profil de cuivre Download PDFInfo
- Publication number
- EP3473352B1 EP3473352B1 EP18200963.9A EP18200963A EP3473352B1 EP 3473352 B1 EP3473352 B1 EP 3473352B1 EP 18200963 A EP18200963 A EP 18200963A EP 3473352 B1 EP3473352 B1 EP 3473352B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper
- matrix element
- profile
- wire
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 172
- 229910052802 copper Inorganic materials 0.000 title claims description 152
- 239000010949 copper Substances 0.000 title claims description 152
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000011159 matrix material Substances 0.000 claims description 73
- 239000007788 liquid Substances 0.000 claims description 57
- 238000000034 method Methods 0.000 claims description 42
- 239000000835 fiber Substances 0.000 claims description 14
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 11
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 11
- 238000005496 tempering Methods 0.000 claims description 5
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 4
- 239000004917 carbon fiber Substances 0.000 claims description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 239000012784 inorganic fiber Substances 0.000 claims description 2
- 230000005499 meniscus Effects 0.000 description 29
- 238000007711 solidification Methods 0.000 description 29
- 230000008023 solidification Effects 0.000 description 29
- 239000011156 metal matrix composite Substances 0.000 description 27
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 238000001816 cooling Methods 0.000 description 10
- 239000002245 particle Substances 0.000 description 9
- 239000000155 melt Substances 0.000 description 7
- 238000005491 wire drawing Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000005266 casting Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000003303 reheating Methods 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 239000002905 metal composite material Substances 0.000 description 3
- 229910052755 nonmetal Inorganic materials 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010310 metallurgical process Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 238000009715 pressure infiltration Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/008—Continuous casting of metals, i.e. casting in indefinite lengths of clad ingots, i.e. the molten metal being cast against a continuous strip forming part of the cast product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
Definitions
- the invention relates to a method for producing a copper profile, in particular a copper wire, from a matrix element, the matrix element having at least one filament. Furthermore, the invention relates to a copper profile.
- Various methods are known for producing a copper wire from a metal matrix composite (MMC).
- MMC metal matrix composite
- fibers or particles are infiltrated by vacuum and / or pressure, particles are stirred into the melt and then further processed by casting and forming processes.
- Powder metallurgical processes can also be used in which powder mixtures are sintered or sintering or forging of ropes made of metal and non-metal fibers.
- Coating from a gas phase (PVD / CVD), electrolytic deposition or plasma spraying can also be used.
- the electrical conductivity is significantly reduced by using alloys and / or by reshaping a copper profile. Furthermore, the processing of higher-strength alloys into wires a diameter of ⁇ 0.3mm is becoming more and more complex due to the low formability.
- a device for the continuous dew molding of a cast rod in which a core wire of, for example, 7.15 mm made of metal is moved upwards by means of pinch rollers through a hole in the bottom of a crucible in such a way that another molten metal in the crucible attaches to the core wire and a Cast rod is molded.
- the deposit occurs with a solidification direction perpendicular to the core wire axis and below the melt level in the crucible.
- a rod is made of a metal / metal composite material but germ MMC.
- the US 2003/0029902 A1 discloses a method in which fiber-reinforced metal matrix wires for reinforcing a casting are inserted into the casting mold and the latter is subsequently filled with molten metal.
- the WO 96/27 456 A1 discloses a method of producing a metal strand in which a metal band is passed through passed the bottom of a container filled with melt and after the crystallization of the melt is drawn off over rollers arranged above the container.
- the opening in the bottom is designed as a slot-shaped channel and the belt speed is selected so that a meniscus with conical radii of curvature forms in the region of the mouth of the channel at the bottom of the container to melt, so that the meniscus extends from a two-phase area Part of liquid metal and solid metallic crystals and is located below the liquid level on the start channel.
- the US 5 736 199 A describes a method for producing a copper profile.
- a disadvantage of the abovementioned processes and the generally known processes for producing fine wires with a diameter of ⁇ 0.3 mm are the large number of necessary process steps, in particular cast wire rod production, up-casting, coarse wire drawing, medium wire drawing and fine wire drawing as well as multiple heat treatment.
- the object of the invention is to improve the prior art.
- a copper matrix composite wire can thus be produced directly in a single process step by passing the matrix element through the copper melt.
- the conventional process steps such as for wire rod, up-casting, coarse wire drawing and / or fine wire drawing, are eliminated.
- the method according to the invention therefore produces copper profiles and in particular copper wires made of MMC, which have optimized material properties with regard to tensile strength, electrical conductivity and fatigue strength as well as density. It is particularly advantageous that a copper wire is produced free from forming processes, which provides an optimized electrical conductivity.
- An essential idea of the invention is based on the fact that a matrix element is guided through the copper melt by means of an opening in a crucible with copper melt in such a way that the solidification of the copper applied to the matrix element is unaffected by liquid copper in the Crucible takes place and thereby the copper profile is formed directly.
- a copper matrix wire is thus produced directly in a single process step.
- a "copper profile” is in particular an elongated component made of copper and the matrix element.
- a copper profile has, in particular, the same cross section and / or the same surface quality over its entire length.
- a copper profile is in particular a wire, in particular fine wire, a strip and / or a rod made of a composite copper matrix element.
- a “copper wire” is understood to mean in particular a thin, long and flexible metal and / or copper alloy.
- a copper wire can in particular have a circular cross-section or another cross-sectional shape.
- a copper wire can in particular also be a flat, square and / or profile wire.
- the copper wire has in particular a diameter of 0.1 mm to 30 mm, preferably 0.2 mm to 0.5 mm.
- the copper wire has in particular a matrix element and thus forms from a copper-non-metal composite material.
- a “matrix element” is in particular an elongated element which is free of copper and / or copper alloys or metal.
- the matrix element has in particular at least one filament.
- a filament means in particular a single fiber of any length.
- a filament has in particular an inorganic or organic substance.
- a filament can be, for example, a textile, glass, carbon and / or ceramic fiber.
- the filament and / or matrix element preferably has a surface property which attracts melt.
- a “copper crucible” is also called a crucible, in particular a container that is open on one side and in particular. Solid copper in particular can be melted in a melting furnace in a copper crucible.
- the copper crucible has, in particular, liquid copper, through which the matrix element is guided through an opening.
- An "opening" is in particular a non-closed point in the bottom of the copper crucible and thus a passage through the bottom of the copper crucible.
- the opening has in particular any cross section.
- the opening is preferably adapted to the matrix element being carried out in such a way that liquid copper cannot pass out of the copper crucible through the opening and / or run out.
- the opening is designed, for example, as a round hole and in the case of a tape as an elongated hole.
- Liquid copper is understood to mean in particular copper and / or copper alloy in the liquid state, so that the liquid copper is flowable.
- Solidification of the applied copper on the matrix element free of the liquid copper in the filled copper crucible means in particular that copper already applied to the matrix element is not or only slightly influenced by the liquid copper in the filled copper crucible when it solidifies. In this way, a defined cooling and solidification of the melt takes place at the upper end of the meniscus. This effect leads in particular to the formation of the solidification front over the melt surface and parallel to it. The direction of solidification takes place in particular against the direction of movement of the filament.
- an endless MMC wire and / or an endless copper profile of any length can be produced.
- the copper profile is continuously manufactured with a high, consistent surface quality.
- a specific diameter of the finished copper profile and in particular a very small MMC wire diameter can be produced via a speed during continuous drawing.
- the method according to the invention can be used in particular to produce a wire with an MMC in which the diameter of which it is manufactured can essentially be freely selected and in particular ⁇ 0.3 mm.
- a quasi-endless wire with any length and at least one filament can be produced.
- an MMC wire is produced directly from a copper melt by pulling a matrix element without further process steps.
- “Pulling” is understood in particular to mean the exertion of a force in the direction of a power source.
- tensile stress is applied to the matrix element and / or the filament during drawing.
- the matrix element and / or filament in particular is pulled through the opening and the molten copper of the filled copper crucible.
- pulling is to be understood in particular in the sense of leading.
- a direction of solidification of the applied copper on the matrix element is aligned along or parallel to a longitudinal axis of the matrix element.
- the applied copper thus solidifies along the longitudinal axis of the matrix element, so that a solidification profile can be formed along the matrix element.
- the direction of solidification is therefore opposite to the direction of pull, as a result of which the extent of the solidification front and the thickness of the solidified copper on the matrix element can be influenced by the speed at which it is carried out and / or pulled.
- the matrix element with the applied copper is brought out of the copper melt above the liquid level of the liquid copper by carrying out and / or pulling, and the solidification takes place outside the liquid copper above the liquid level.
- a "solidification direction” is in particular the direction in which the applied copper solidifies onto the matrix element. If, for example, the matrix element is pulled upwards out of the copper crucible with the filled liquid copper into the surrounding atmosphere, the direction of solidification is in particular opposite to the direction of pull, i.e. towards the melt, and aligned vertically. In particular, a stationary solidification front is established.
- a “longitudinal axis” is in particular the length of the longest dimension of the matrix element.
- a longitudinal axis is thus in particular the axis running in the longitudinal direction of the matrix element.
- the longitudinal axis of the matrix element is aligned vertically, so that a free meniscus made of applied copper forms around the matrix element on and / or above a liquid level of the liquid copper in the filled copper crucible.
- a free meniscus made of applied copper is thus formed around the matrix element, the free meniscus having a self-stabilizing round cross section. This reduces or avoids any post-processing steps.
- the trained meniscus means that small particles, such as scale and / or crucible material, can collect on the lower base of the meniscus and sink into the liquid copper in the filled copper crucible, so that the area of the solidification front remains free of particles.
- a wire surface is basically formed that is smooth and free of particles.
- the solidification of the applied copper on the matrix element can be influenced not only via the drawing speed of the matrix element, but also by deliberately influencing the meniscus.
- the design of the copper crucible filled with liquid copper such as the liquid level of the liquid copper, the design of the opening in the bottom of the crucible, the temperature and viscosity of the liquid copper, the formation and shape of the meniscus, since this is arranged above the liquid level of the liquid copper in the crucible and thus largely in the surrounding atmosphere, by further parameters , such as the ambient temperature, air pressure and the like, as well as influenced by the temperature of the matrix element on the solidification front.
- the crucible design and shape as well as the type of filament have a stabilizing effect on the meniscus.
- the meniscus tapers continuously in the direction of drawing to the thickness of the solidified copper on the matrix element.
- a “meniscus” is understood in particular to mean a curvature on the surface of a liquid.
- the meniscus forms in particular on the liquid surface of the liquid copper in the filled copper crucible due to the passage and / or pulling of the matrix element through the liquid copper and the breakthrough of the matrix element through the liquid surface of the liquid copper.
- the formation of the meniscus is particularly due to the interaction between the liquid level and the surface of the matrix element with the applied copper.
- the meniscus in particular has a convex shape at the top of the solidification front and a concave shape at the bottom to the liquid level. In particular is on the solidification front, the curvature of the meniscus maximally and decreases as the liquid level approaches.
- a "free meniscus” means in particular that the meniscus itself is not within the liquid copper in the filled copper crucible, but largely in the surrounding atmosphere. The free meniscus is in particular only in contact with the liquid copper liquid level in the filled copper crucible at its lower base.
- the “liquid level” is in particular the liquid level of the liquid copper in the filled copper crucible.
- the liquid level also called the liquid surface, represents in particular the interface between the liquid copper and the surrounding atmosphere arranged above it.
- the opening is covered by the liquid copper.
- the matrix element is immediately and immediately surrounded by liquid copper when it is introduced into the opening of the copper crucible. Furthermore, the copper melt cannot escape through the opening from the copper crucible due to utilization of the surface tension of the copper melt.
- the matrix element has further filaments and / or a bundle of filaments.
- the proportion of filaments and / or fibers in the MMC profile and / or wire can thus be increased. Furthermore, multifilaments and tied, twisted, braided and / or otherwise connected filaments in particular can be used in a filament bundle. As a result, the tensile strength and fatigue strength can be increased and the density and weight of the manufactured copper profile and / or wire can be reduced.
- the matrix element has an inorganic fiber, in particular a carbon fiber and / or a silicon carbide fiber.
- carbon fiber (also “carbon fiber”) is an industrially manufactured fiber from carbon-containing starting material, which is converted into graphite-like carbon by adapted chemical reactions.
- a "silicon carbide fiber” is in particular a fiber made of a chemical compound of silicon and carbon belonging to the group of carbides.
- a silicon carbide fiber is, in particular, a ceramic fiber.
- a filament or several filaments have a diameter between 3pm and 30pm, especially between 6pm and 20pm.
- the filament or the filaments and thus the matrix element have a suitable geometry in order in particular to produce fine MMC wires with a final maximum wire diameter of 300 300 ⁇ m.
- the process is carried out under a protective gas atmosphere.
- the air in the surrounding atmosphere and especially the oxygen in the air can be displaced by the protective gas.
- the quality of the copper profile and / or wire produced can be further increased.
- a thickness of the copper profile is set by means of a drawing speed of the matrix element and / or a temperature control, in particular a vertical temperature control.
- the temperature control can support and / or specifically influence a solidification profile in the longitudinal direction of the matrix element and thus in the direction of drawing.
- the thickness of the copper profile can be specifically adjusted via the drawing speed and / or temperature control.
- the temperature control is designed to be vertically variable. This can influence the shape and extent of the meniscus as well as the solidification area.
- a “temperature control” is understood to mean in particular a regulation of the temperature. Temperature control can in particular involve cooling and / or heating. The temperature control can in particular be made uniform and / or variable over the length of the matrix element with the applied copper.
- a “vertical tempering” is understood in particular to mean that the tempering is oriented vertically and thus runs along the longitudinal axis of the matrix element and the direction of solidification.
- the temperature control has in particular individual heating elements and / or cooling elements.
- the heating elements as well as the cooling elements can be configured actively and / or passively. As “active heating elements", for example, heat radiators based on gas or electrical energy are used.
- a “passive Tempering” can take place, for example, by supplying waste heat.
- the cooling elements can be active or passive.
- cooling fins are used, which are arranged in spatial proximity to the matrix element with the applied copper.
- A” Peltier for example, can be used as an” active cooling element " Materials with certain thermal properties, such as heat reflection or heat conduction, can also be used for temperature control.
- the object is achieved by a copper profile, in particular a copper wire, the copper profile being produced using a previously described method.
- a copper profile, in particular copper wire, is thus provided, which is manufactured in a single manufacturing step by means of the method according to the invention. It is particularly advantageous that the method according to the invention is used to produce a copper profile which has a very uniform copper cladding of constant thickness and constant properties over any length. Above all, the surface of the copper profile and / or wire is very smooth and free of particles such as scale. Therefore, post-processing steps of the manufactured copper profile and / or wire can be dispensed with. In particular, thin copper wires with a diameter of less than 0.3 mm can be produced in fewer steps than in the prior art.
- a thickness of the copper profile is ⁇ 0.3 mm.
- a copper profile and / or copper wire made of MMC with a diameter of ⁇ 0.3 mm is thus produced in a single process step.
- fine wires are produced which cannot be manufactured with these small wire diameters and high surface quality by other manufacturing processes, for example a thawing process.
- a crucible 107 has an opening 108 on the bottom.
- a silicon carbide filament 103 with a diameter of 15 pm is passed vertically upward through the opening 108 by means of a unidirectional unwinding and winding unit, not shown.
- the crucible 107 is arranged in a melting furnace, not shown, and has a copper melt 105 in its interior.
- the unidirectional unwinding and winding unit pulls on the silicon carbide filament 103 in the pulling direction 111 and moves it continuously through the opening 108 and the copper melt 105 arranged above it in the crucible 107.
- the opening 108 has a circular profile with a diameter of 0.2 mm. This ensures that the copper melt 105 does not exit vertically downward through the opening 108 via the opening 108.
- the area around the opening 108 has a material with a repellent wetting behavior.
- a meniscus 113 is formed from molten copper, which is continuously applied to the silicon carbide filament 103.
- the continuous pulling in the direction of drawing 111 forms a solidification front (transition from liquid to solid copper) at the transition from the meniscus 113 to the regular cross section of the MMC wire 101.
- a self-stabilizing round cross section of the applied copper is formed on the silicon carbide filament 103.
- any smaller particles such as scale, crucible material and the like, collect on a lower base of the meniscus 113 to the copper melt 105, whereby the area of the solidification front remains free of particles.
- a surface of the manufactured MMC wire 101 is thus achieved which is very uniform and smooth and free of particles.
- a reheating zone 109 follows, through which the MMC wire 101 is pulled further.
- the reheating zone 109 has individual heating and cooling elements, via which a corresponding temperature profile is impressed on the meniscus and the MMC wire 101. As a result, a defined solidification profile is impressed on the MMC wire 101 and the surface quality is further improved.
- the entire manufacturing process of the MMC wire 101 takes place under a protective gas atmosphere, so that in particular no oxygen diffuses into the manufactured MMC wire 101.
- the diameter of the manufactured MMC wire 101 is determined via a drawing speed in the drawing direction 111 and the set temperature profile of the reheating zone 109.
- an MMC wire 101 is continuously manufactured with very high surface qualities and a uniform wire diameter of 130 pm, without further post-treatment steps subsequently being necessary.
- an inexpensive and fast manufacturing method for manufacturing MMC wire 101 is provided.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Continuous Casting (AREA)
Claims (12)
- Procédé de fabrication d'un profilé de cuivre, en particulier d'un fil de cuivre (101), à partir d'un élément de matrice (103), où l'élément de matrice comporte au moins un filament, comportant l'étape suivante consistant à- passer l'élément de matrice à travers une ouverture (108) d'un creuset de cuivre (107) rempli de cuivre liquide (105) de telle manière que du cuivre liquide est appliqué sur l'élément de matrice et le cuivre appliqué se solidifie sur l'élément de matrice sans le cuivre liquide se trouvant dans le creuset de cuivre rempli de telle manière que le profilé de cuivre est directement formé.
- Procédé selon la revendication 1, caractérisé en ce que le passage est réalisé par étirage en continu.
- Procédé selon l'une des revendications précédentes, caractérisé en ce que l'ouverture est recouverte par le cuivre liquide.
- Procédé selon l'une des revendications précédentes, caractérisé en ce que l'élément de matrice comporte d'autres filaments et/ou un faisceau de filaments.
- Procédé selon l'une des revendications précédentes, caractérisé en ce que l'élément de matrice comporte une fibre inorganique, en particulier une fibre de carbone et/ou une fibre de carbure de silicium.
- Procédé selon l'une des revendications précédentes, caractérisé en ce qu'un filament ou plusieurs filaments présente ou présentent un diamètre compris entre 3 µm et 30 µm, de préférence entre 6 µm et 20 µm.
- Procédé selon l'une des revendications précédentes, caractérisé en ce que l'élément de matrice avec une couche exposée sur l'extérieur ou sans couche exposée sur l'extérieur, la couche exposée étant portée par le filament, forme un angle de contact avec le cuivre liquide de 15° à 120°, de préférence supérieur à 30°.
- Procédé selon l'une des revendications précédentes, caractérisé en ce que le procédé est mis en œuvre sous une atmosphère de gaz protecteur.
- Procédé selon l'une des revendications précédentes, caractérisé en ce que plusieurs profilés de cuivre sont étirés simultanément en parallèle à partir du creuset de cuivre.
- Procédé selon l'une des revendications précédentes, caractérisé en ce qu'une épaisseur du profilé de cuivre est ajustée au moyen d'une vitesse d'étirage de l'élément de matrice et/ou d'une thermorégulation (109), en particulier d'une thermorégulation verticale.
- Profilé de cuivre, en particulier fil de cuivre, où le profilé de cuivre est fabriqué au moyen d'un procédé selon l'une quelconque des revendications 1 à 10.
- Profilé de cuivre selon la revendication 11, caractérisé en ce qu'une épaisseur du profilé de cuivre est inférieure à 0,3 mm.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017124144.2A DE102017124144A1 (de) | 2017-10-17 | 2017-10-17 | Verfahren zum Herstellen eines Kupferprofils und Kupferprofil |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3473352A1 EP3473352A1 (fr) | 2019-04-24 |
EP3473352B1 true EP3473352B1 (fr) | 2019-12-25 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP18200963.9A Active EP3473352B1 (fr) | 2017-10-17 | 2018-10-17 | Procédé de fabrication d'un profil de cuivre et profil de cuivre |
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EP (1) | EP3473352B1 (fr) |
DE (1) | DE102017124144A1 (fr) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS62112767A (ja) * | 1985-11-12 | 1987-05-23 | Fujikura Ltd | 浸漬被覆形成装置 |
US5871140A (en) | 1993-08-16 | 1999-02-16 | Mccrink; Edward J. | Hollow shaft and method of making same |
DE19509691C1 (de) * | 1995-03-08 | 1996-05-09 | Mannesmann Ag | Bodendurchführung eines Inversionsgießgefäßes |
US5736194A (en) | 1996-11-05 | 1998-04-07 | Federal-Hoffman, Inc. | Method and apparatus for masking |
US5736199A (en) * | 1996-12-05 | 1998-04-07 | Northeastern University | Gating system for continuous pressure infiltration processes |
US6344270B1 (en) * | 2000-07-14 | 2002-02-05 | 3M Innovative Properties Company | Metal matrix composite wires, cables, and method |
JP3710048B2 (ja) * | 2000-08-29 | 2005-10-26 | 矢崎総業株式会社 | 繊維束内へ金属を含浸させる圧力含浸装置 |
US20030029902A1 (en) * | 2001-07-02 | 2003-02-13 | Northeastern University | Reinforced structural elements incorporating fiber-reinforced metal matrix composite wires and methods of producing the same |
-
2017
- 2017-10-17 DE DE102017124144.2A patent/DE102017124144A1/de not_active Withdrawn
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- 2018-10-17 EP EP18200963.9A patent/EP3473352B1/fr active Active
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Also Published As
Publication number | Publication date |
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EP3473352A1 (fr) | 2019-04-24 |
DE102017124144A1 (de) | 2019-04-18 |
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