EP3456866A1 - Procédé de fabrication d'un interconnecteur, interconnecteur et son utilisation - Google Patents

Procédé de fabrication d'un interconnecteur, interconnecteur et son utilisation Download PDF

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Publication number
EP3456866A1
EP3456866A1 EP18190205.7A EP18190205A EP3456866A1 EP 3456866 A1 EP3456866 A1 EP 3456866A1 EP 18190205 A EP18190205 A EP 18190205A EP 3456866 A1 EP3456866 A1 EP 3456866A1
Authority
EP
European Patent Office
Prior art keywords
electrically conductive
substrate
interconnector
particles
protective layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP18190205.7A
Other languages
German (de)
English (en)
Inventor
Aldo Saul GAGO RODRIGUEZ
Feng Han
Remi Costa
Kaspar Andreas Friedrich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Deutsches Zentrum fuer Luft und Raumfahrt eV
Original Assignee
Deutsches Zentrum fuer Luft und Raumfahrt eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsches Zentrum fuer Luft und Raumfahrt eV filed Critical Deutsches Zentrum fuer Luft und Raumfahrt eV
Publication of EP3456866A1 publication Critical patent/EP3456866A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
    • C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C25B1/01—Products
    • C25B1/02—Hydrogen or oxygen
    • C25B1/04—Hydrogen or oxygen by electrolysis of water
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B9/00—Cells or assemblies of cells; Constructional parts of cells; Assemblies of constructional parts, e.g. electrode-diaphragm assemblies; Process-related cell features
    • C25B9/70—Assemblies comprising two or more cells
    • C25B9/73—Assemblies comprising two or more cells of the filter-press type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/02—Details
    • H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
    • H01M8/0204—Non-porous and characterised by the material
    • H01M8/0206—Metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/02—Details
    • H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
    • H01M8/0204—Non-porous and characterised by the material
    • H01M8/0215—Glass; Ceramic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/02—Details
    • H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
    • H01M8/0204—Non-porous and characterised by the material
    • H01M8/0223—Composites
    • H01M8/0228—Composites in the form of layered or coated products
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M12/00—Hybrid cells; Manufacture thereof
    • H01M12/04—Hybrid cells; Manufacture thereof composed of a half-cell of the fuel-cell type and of a half-cell of the primary-cell type
    • H01M12/06—Hybrid cells; Manufacture thereof composed of a half-cell of the fuel-cell type and of a half-cell of the primary-cell type with one metallic and one gaseous electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M12/00—Hybrid cells; Manufacture thereof
    • H01M12/08—Hybrid cells; Manufacture thereof composed of a half-cell of a fuel-cell type and a half-cell of the secondary-cell type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/10—Fuel cells with solid electrolytes
    • H01M2008/1095—Fuel cells with polymeric electrolytes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/36—Hydrogen production from non-carbon containing sources, e.g. by water electrolysis
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/50—Fuel cells

Definitions

  • the present invention relates to a method for producing an interconnector for an electrochemical cell.
  • the invention further relates to an interconnector and its use in an electrochemical cell, in particular an electrolysis cell, a fuel cell or a metal-air battery.
  • An electrolyzer comprises a plurality of electrolysis cells in a cell stack or stack, wherein the individual cells are connected in series in the form of membrane-electrode units via so-called interconnectors.
  • the interconnector serves to electrically contact the electrodes and on the other hand forms a fluid-tight separator between the adjacent cells.
  • the interconnector comprises a bipolar plate which generally also has suitable structures for the supply of water and the removal of hydrogen or oxygen at its surfaces, for example flow channels which form a so-called flow field.
  • the task of water distribution can be taken over by a porous current collector, the is arranged between the bipolar plate and the catalyst layer of the electrode.
  • the current collector can be designed in particular as a gas diffusion layer (GDL).
  • the interconnector must have very good corrosion resistance at high voltages (greater than 2 V), high current densities (greater than 2 A / cm 2 ) and high temperatures (above 80 ° C.). This is especially true for the anode side of the interconnector, which is exposed to highly corrosive conditions in the strongly acidic medium (pH of about 0) under oxygen saturation.
  • interconnectors for PEM electrolysis cells are mainly made of titanium, which is associated with high costs. In fact, just over half of the total cost of a PEM electrolyzer under these circumstances is accounted for by the interconnector.
  • the invention is therefore based on the object of proposing a production method with which the costs for a corrosion-resistant interconnector can be reduced.
  • the invention is based on the idea of providing the substrate of the interconnector (or of the bipolar plate) with an electrically conductive protective layer, in particular a corrosion protection layer, at least on one side, which is preferably the anode side in an electrolysis cell. Due to this protective layer, lower requirements are placed on the corrosion resistance of the substrate, so that a material which is considerably less expensive than titanium can be used.
  • the flat substrate is preferably made of steel, in particular of stainless steel, of a steel alloy or of copper.
  • a stainless steel sheet can be used as the substrate, with a preferred thickness in the range of 1 to 2 mm.
  • a substrate made of aluminum or titanium can also be used within the scope of the invention.
  • the electrically conductive, inorganic material of the applied particles is preferably a ceramic material, alternatively corrosion-resistant metals such as niobium and tantalum can be used. Because the protective layer on the surface of the substrate is both electrically conductive and corrosion-resistant, a low contact resistance between the interconnector or the bipolar plate and an adjacent current collector can be ensured.
  • the ceramic material is selected from compounds of titanium and tin, in particular titanium suboxide (Ti 4 O 7 ), titanium carbide (TiC), titanium dioxide (TiO 2 ) doped with vanadium, molybdenum or tungsten, and Tin dioxide (SnO 2 ) doped with indium or antimony; or graphite, graphene and graphene oxide.
  • Ti 4 O 7 titanium suboxide
  • TiC titanium carbide
  • TiO 2 titanium dioxide
  • Tin dioxide Tin dioxide
  • graphite, graphene and graphene oxide are under the conditions of use of the interconnector, especially in a PEM electrolysis cell, chemically and electrochemically stable and have a relatively good conductivity.
  • the particles of the electrically conductive material may have a particle size of 1 nm to 30 microns, with particle sizes in the range of 20 to 200 nm are preferred, more preferably in the range of 30 to 50 nm. Accordingly, the protective layer formed on the substrate may be very be thin, wherein the preferred minimum thickness is about twice the particle size, ie theoretically there should be at least two layers of particles of inorganic material. The protective layer can also be formed much thicker.
  • the particles of the electrically conductive material may have different particle shapes.
  • spherical or substantially spherical particles are suitable for the process according to the invention.
  • flakes, fibers, nanotubes, dendrites or aerogels may also be used.
  • the particles are applied wet-chemically in the process according to the invention, wherein the application process is preferably selected from rolling, dipping, spraying, inkjet printing, screen printing, film casting and spin coating.
  • the application process is preferably selected from rolling, dipping, spraying, inkjet printing, screen printing, film casting and spin coating.
  • These wet-chemical processes are not only simple and inexpensive to carry out, but have in particular opposed thermal spray processes such as e.g. Plasma spraying the advantage that no high thermal load of the electrically conductive material takes place.
  • plasma spraying the advantage that no high thermal load of the electrically conductive material takes place.
  • very high temperatures can lead to a change in the stoichiometry, which may deteriorate the properties of the material or at least the reproducibility.
  • a further advantage is that the wet-chemical application methods are easily scalable and are also suitable for the production of interconnectors for large-area cells of 1,000 cm 2 or more. On In this way large electrolyzers can be produced for operation in the megawatt range.
  • the substrate in the context of the invention for example, have an area of 1 cm 2 to 1 m 3 .
  • the particles of the electrically conductive material are usually applied in a suspension to the surface of the substrate.
  • the suspension may have very different viscosities, i. Both a low viscosity slurry and a high viscosity paste are covered by the term.
  • drying is typically performed to remove the suspension medium, again depending on the nature of the application process.
  • the particles of the electrically conductive material are applied to the surface of the substrate together with a binder.
  • the binder on the one hand, the cohesion of the particles with each other and the adhesion to the substrate can be effected.
  • the binder also results in the protective layer being substantially pore-free and fluid-tight, thus providing effective corrosion protection of the substrate.
  • the proportion of particles of the inorganic material in relation to the binder must be sufficiently high in order to ensure the conductivity of the protective layer as a whole by direct contact of the individual particles.
  • a binder is not applied together with the particles of the electrically conductive material, but only after the application of the particles in a further step. Also in this way, the binder can penetrate into spaces between the particles to make the protective layer fluid-tight. However, the surface of the protective layer must not be completely covered by the binder, since this would prevent the electrical contact between the interconnector or the bipolar plate and an adjacent current collector. This can be done by a subsequent mechanisehe if necessary or chemical surface treatment of the protective layer, in which excess binder is removed, be ensured.
  • the binder is preferably an organic polymer, which is preferably selected from epoxy resin, polyvinyl acetate (PVA), polyvinyl butyrate (PVB), polytetrafluoroethylene (PTFE) and polyvinylidene fluoride (PVD).
  • PVA polyvinyl acetate
  • PVB polyvinyl butyrate
  • PTFE polytetrafluoroethylene
  • PVD polyvinylidene fluoride
  • the binder is cured after the application of the particles, in particular by means of UV curing.
  • the particles of the electrically conductive material are treated thermally and / or by elevated pressure after application.
  • the particles can be compacted and fused together at their surface.
  • the particles can be sintered. This reduces the porosity of the protective layer and increases its strength and adhesion to the substrate.
  • the treatment of the particles by temperature and / or pressure can be carried out regardless of whether the particles were applied to the substrate together with a binder.
  • the surface of the substrate is roughened before application of the particles of the electrically conductive material, in particular by means of sandblasting or etching.
  • the adhesion of the protective layer to the substrate can be improved.
  • the first side of the substrate is provided with flow channels, wherein the particles of the electrically conductive material are applied only to the region of the surface between the flow channels. Since only these raised areas of the flowfield are in contact with a current collector, only there is an electrically conductive protective layer required. In this case it is preferable if at least the area of the surface in the flow channels (ie the bottom and the walls of the flow channels) is coated with an organic polymer in order to achieve a corresponding protective effect in this area.
  • the organic polymer in particular, the same binder used in conjunction with the electroconductive particles can be used.
  • the organic polymer can be cured, eg by UV curing.
  • the electrically conductive protective layer is inventively formed on at least one side of the substrate, but it can optionally also be formed on both sides. Accordingly, according to another embodiment, the method further comprises applying particles of an electrically conductive inorganic material to at least a portion of a surface of the second side of the substrate by a wet chemical deposition method to form an electrically conductive protective layer on the surface of the substrate.
  • the invention is also based on the object of proposing a corrosion-resistant interconnector, which is inexpensive to produce.
  • the interconnector comprises a planar substrate of a metallic material having a first side and an opposite second side, wherein at least on a portion of a surface of the first side of the substrate an electrically conductive protective layer is arranged, which comprises an electrically conductive, inorganic material.
  • the electrically conductive, inorganic material is in particular a ceramic material, which is preferably selected from compounds of titanium and tin, in particular of titanium suboxide (Ti 4 O 7 ), titanium carbide (TiC), titanium dioxide (TiO 2 ) doped with vanadium, molybdenum or tungsten, and tin dioxide (SnO 2 ) doped with indium or antimony; or graphite, graphene and graphene oxide.
  • titanium suboxide Ti 4 O 7
  • TiC titanium carbide
  • TiO 2 titanium dioxide
  • SnO 2 tin dioxide
  • graphite, graphene and graphene oxide Alternatively, however, corrosion-resistant metals such as niobium and tantalum can be used.
  • the electrically conductive protective layer preferably has a thickness in the range of 100 nm to 100 ⁇ m.
  • the preferred minimum thickness is approximately twice the particle size of the electrically conductive material used for the production of the protective layer.
  • the protective layer can also be much thicker, as long as their electrical resistance is not too high.
  • the electrically conductive protective layer is preferably fluid-tight. As a result, an effective corrosion protection of the substrate can be effected, in particular with respect to the highly corrosive conditions on the anode side of a PEM electrolysis cell.
  • the interconnector according to the invention is advantageously produced according to the method according to the invention. Further advantages and preferred embodiments of the interconnector therefore result from the above description of the production method according to the invention.
  • the present invention furthermore relates to the use of an interconnector according to the invention in an electrochemical cell, preferably in an electrolysis cell, in particular a PEM electrolysis cell or an alkaline electrolysis cell, in a fuel cell, in particular a high-temperature PEM cell, or in a metal-air cell. Battery.
  • the first side of the interconnector is the anode side and the second side is the cathode side.
  • FIG. 1 shows a schematic cross section through the anode region of an electrochemical cell 10, here a PEM electrolysis cell.
  • the PEM electrolysis cell 10 comprises an interconnector 12 according to the invention, which is provided on its first side, which is the anode side, with flow channels 14 for the supply of water (H 2 O) and the discharge of oxygen (O 2 ).
  • the flow channels 14 form a so-called flow field on the anode side of the interconnector 12, which may also be referred to as a bipolar plate.
  • the second side of the interconnector 12, which is the cathode side, may also be provided with flow channels (not shown in the figure).
  • anodic current collector 16 Connected to the interconnector 12 is an anodic current collector 16 having a porous structure, e.g. made of titanium. This is followed by an anode catalyst 18, a proton exchange membrane 20 and a cathode catalyst 22. An adjoining cathodic current collector and the cathode side of another interconnector are not shown in the figure.
  • water diffuses from the flow channels 14 through the anodic current collector 16 in the direction of Proton exchange membrane 20 and is there electrochemically oxidized on the anode catalyst 18 to form oxygen.
  • the oxygen formed diffuses through the anodic current collector 16 into the flow channels 14 (indicated by the gas bubbles 24).
  • the interconnector 12 comprises a substrate 26 made of a metallic material, for example stainless steel.
  • a protective layer 30 which comprises an electrically conductive, inorganic material, in particular a ceramic material, for example, is arranged on the region of the surface 28 of the substrate 26 between the flow channels 14 Titanium suboxide (Ti 4 O 7 ).
  • the protective layer 30 is both corrosion-resistant and electrically conductive, so that an electrical contact between the substrate 26 and the anodic current collector 16 is ensured.
  • the areas of the surface 28 of the substrate 26 in the flow channels 14 may be provided with an organic polymer as a protective layer (not shown in the figure).
  • the FIG. 2 schematically shows an enlarged view of the protective layer 30 on the surface 28 of the substrate 26.
  • the interconnector 12 is prepared according to the inventive method by particles 32 of the electrically conductive, inorganic material on the corresponding areas of the surface 28 of the substrate 26 by a wet chemical application method together were applied with a binder 34. Subsequently, the particles 32 were sintered by elevated temperature and / pressure, so that the particles 32 are fused together at their contact areas 36. The interstices between the particles 32 are filled up by the binder 34, for example an epoxy resin, so that the protective layer 30 as a whole is non-porous and fluid-tight.
  • the binder 34 for example an epoxy resin
  • the particles 30 of the electrically conductive material typically have a particle size in the range of 20 to 200 nm.
  • the protective layer 30 should comprise at least two layers of the particles 32 for an effective protective effect, as in US Pat FIG. 2 however, it may also be substantially thicker, typically in the range of 100 nm to 100 ⁇ m.
  • FIG. 3 shows a light microscopic cross-section through an interconnector 12 according to the invention, wherein the substrate 26 is formed of stainless steel and the protective layer 30 of particles of titanium suboxide (Ti 4 O 7 ) was prepared by the novel process.
  • the thickness of the protective layer 30 in this case is about 25 ⁇ m.
  • the dark area above the protective layer 30 is an epoxy resin which has been used only to prepare the sample for light microscopic photography.
EP18190205.7A 2017-09-12 2018-08-22 Procédé de fabrication d'un interconnecteur, interconnecteur et son utilisation Withdrawn EP3456866A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102017121016.4A DE102017121016A1 (de) 2017-09-12 2017-09-12 Verfahren zur Herstellung eines Interkonnektors, Interkonnektor und dessen Verwendung

Publications (1)

Publication Number Publication Date
EP3456866A1 true EP3456866A1 (fr) 2019-03-20

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EP18190205.7A Withdrawn EP3456866A1 (fr) 2017-09-12 2018-08-22 Procédé de fabrication d'un interconnecteur, interconnecteur et son utilisation

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DE (1) DE102017121016A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022127984A1 (fr) * 2020-12-15 2022-06-23 Schaeffler Technologies AG & Co. KG Procédé de fabrication d'une plaque bipolaire pour une cellule électrochimique, et plaque bipolaire
EP4113672A1 (fr) * 2021-06-28 2023-01-04 Eisenhuth GmbH & Co. KG Plaque bipolaire destinée à la limitation chimique et à la connexion série électrique des piles à combustible pem ou des électrolyseurs pem empilés les un sur les autres
DE102021208748A1 (de) 2021-08-11 2023-02-16 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Kontaktplatte

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040081893A1 (en) * 2000-11-14 2004-04-29 Hansen Jesper Romer Conductive material comprising at least two phases
DE10342160A1 (de) * 2003-09-08 2005-04-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung von Hochtemperaturbrennstoffzellen mit einer elektrisch leitenden Verbindung zwischen einem Interkonnektor und einer Kathode
EP1990856A1 (fr) * 2007-05-09 2008-11-12 Hexis AG Procédé destiné à la fabrication de contacts entre des disques électrochimiques actifs et des interconnecteurs dans des cellules de combustibles à haute température
US20100297537A1 (en) * 2008-09-12 2010-11-25 Coors W Grover Electrochemical cell comprising ionically conductive membrane and porous multiphase electrode
WO2012110516A1 (fr) * 2011-02-15 2012-08-23 Plansee Se Structure à empilement et son utilisation pour former une structure à empilement en ceramique entre en interconnecteur et une cathode d'une pile a combustible haute temperature

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2484314A1 (fr) * 2002-04-20 2003-10-30 Chemetall Gmbh Melange destine a l'application d'un revetement polymere resistant a la corrosion, pouvant etre faconne sans usure, et procede de fabrication de ce revetement

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040081893A1 (en) * 2000-11-14 2004-04-29 Hansen Jesper Romer Conductive material comprising at least two phases
DE10342160A1 (de) * 2003-09-08 2005-04-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung von Hochtemperaturbrennstoffzellen mit einer elektrisch leitenden Verbindung zwischen einem Interkonnektor und einer Kathode
EP1990856A1 (fr) * 2007-05-09 2008-11-12 Hexis AG Procédé destiné à la fabrication de contacts entre des disques électrochimiques actifs et des interconnecteurs dans des cellules de combustibles à haute température
US20100297537A1 (en) * 2008-09-12 2010-11-25 Coors W Grover Electrochemical cell comprising ionically conductive membrane and porous multiphase electrode
WO2012110516A1 (fr) * 2011-02-15 2012-08-23 Plansee Se Structure à empilement et son utilisation pour former une structure à empilement en ceramique entre en interconnecteur et une cathode d'une pile a combustible haute temperature

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022127984A1 (fr) * 2020-12-15 2022-06-23 Schaeffler Technologies AG & Co. KG Procédé de fabrication d'une plaque bipolaire pour une cellule électrochimique, et plaque bipolaire
EP4113672A1 (fr) * 2021-06-28 2023-01-04 Eisenhuth GmbH & Co. KG Plaque bipolaire destinée à la limitation chimique et à la connexion série électrique des piles à combustible pem ou des électrolyseurs pem empilés les un sur les autres
WO2023274912A1 (fr) 2021-06-28 2023-01-05 Eisenhuth Gmbh & Co. Kg Plaque bipolaire pour la délimitation chimique et le montage en série électrique de piles à combustible pem ou d'électrolyseurs pem empilé(e)s
DE102021208748A1 (de) 2021-08-11 2023-02-16 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Kontaktplatte

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