EP3364428A1 - Induktive vorrichtung - Google Patents

Induktive vorrichtung Download PDF

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Publication number
EP3364428A1
EP3364428A1 EP17305174.9A EP17305174A EP3364428A1 EP 3364428 A1 EP3364428 A1 EP 3364428A1 EP 17305174 A EP17305174 A EP 17305174A EP 3364428 A1 EP3364428 A1 EP 3364428A1
Authority
EP
European Patent Office
Prior art keywords
portions
printed circuit
track
inductive device
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17305174.9A
Other languages
English (en)
French (fr)
Inventor
Nicolas Degrenne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Mitsubishi Electric R&D Centre Europe BV Netherlands
Original Assignee
Mitsubishi Electric Corp
Mitsubishi Electric R&D Centre Europe BV Netherlands
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Mitsubishi Electric R&D Centre Europe BV Netherlands filed Critical Mitsubishi Electric Corp
Priority to EP17305174.9A priority Critical patent/EP3364428A1/de
Priority to PCT/JP2018/005609 priority patent/WO2018151284A1/en
Publication of EP3364428A1 publication Critical patent/EP3364428A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances

Definitions

  • the invention pertains to the technical field of the energy. More specifically, the invention is related to an inductive device and an assembly containing such a device, to convert energy between electric and magnetic forms. The invention is also related to a process to manufacture such an assembly.
  • inductors or transformers for power electronics applications for example to support at least 1 kilowatt, are made of discrete components.
  • Such components can be surface-mounted, through-hole, or connected manually with cables.
  • These components have a low level of integration and are expensive, difficult to cool, and require manual intervention.
  • a large part of integrated inductors or transformers include a planar architecture.
  • the components with a planar architecture generally have the following limitations:
  • PCB printed circuit board
  • the invention improves the situation.
  • the applicant proposes an inductive device comprising at least one printed circuit board, the printed circuit board comprising N pairs of main portions, wherein N is an integer superior or equal to 1, each main portion being connected to the other portions by folding lines, each main portion having a through opening forming a path in a thickness direction of said main portion.
  • the printed circuit board comprises at least one track electrically continuous and extending along the rims of the openings and passing by each one of the main portions.
  • the printed circuit board has an inactive state wherein the printed circuit board has a plate shape, and an operational state wherein:
  • Such a device is adapted to at least kilowatt levels (current of several amperes) with high efficiency (few losses), low magnetic section, low mass, small and adapted size and form, and easy to cool.
  • Such inductive devices are especially adapted to be embedded into an electronic assembly.
  • the inductive device can comprise the following features, separately or in combination one with the others:
  • an inductive assembly comprising:
  • an inductive assembly comprising:
  • the word “annular” is used to geometrically define a form (3D) or a shape (2D) with a through opening (or a closed-loop, a close circle), whatever the outline forms.
  • the word “annular” has not to be strictly interpreted as a circular/cylindrical meaning.
  • Figures 1, 2 and 3 show a part of an inductive device 1 in a planar state.
  • the planar state of the inductive device 1 corresponds to an inactive state of the inductive device 1.
  • the planar state can be considered as transitional state of the inductive device 1 during an assembling process of an inductive assembly including the inductive device 1.
  • the inductive device 1 in the planar state has a general plate shape. In the planar state, the inductive device 1 has:
  • the inductive device 1 comprises a printed circuit board 2 (PCB).
  • the PCB 2 includes at least a support layer 3 and at least one electrical conductive layer.
  • the PCB 2 comprises two electrical conductive layers: a top layer 4 and a bottom layer 6.
  • the top layer 4 and the bottom layer 6 cover respectively each one of the main faces of the single support layer 3.
  • the words "top” and "bottom” are used to distinguish the two layers 4, 6 and according to figures 1, 2 and 3 .
  • a part of the bottom layer 6 can be placed at a higher altitude than the top layer 4.
  • the PCB can comprise multilayers, including more than two electrical conductive layers.
  • the PCB 2 comprises a plurality of main portions 11, 12.
  • the main portions 11, 12 are adjacent one to the other and aligned substantially along the first direction x.
  • the main portions 11, 12 are delimited by folding lines 9, 9'.
  • the folding lines 9, 9' extends in the second direction y perpendicular to the first direction x.
  • the main portions 11, 12 include N pairs 11 x , 12 x of adjacent portions (11 A , 12 A , 11 B , 12 B , ..., 11 N , 12 N ), wherein N is an integer.
  • N 1.
  • N 7.
  • N 3.
  • each pair is framed by a discontinuous line and referenced 8.
  • each main portion 11, 12 has a substantially square outline, a square external rim.
  • the main portions 11, 12 can have other outline shapes, for example rectangular, circular or oblong.
  • each one of two opposite sides of the square shape corresponds to a folding line 9, 9'.
  • Each main portion 11, 12 has a through opening 13 forming a free path along the third direction z.
  • the openings 13 have a square outline, corresponding to a square internal rim of each main portion 11, 12.
  • the openings 13 are substantially centered on each main portion 11, 12.
  • openings 13 can have another shape.
  • the internal edge shape and the external edge shape of the main portions 11, 12 can be similar or different.
  • the openings can be off-centered.
  • Each main portion 11, 12 has an annular shape.
  • the two main portions 11 x , 12 x of each pair are planned to be folded substantially one on the other with respect to the common folding line 9 between them.
  • the shape and size of the both main portions of each pair 11 x , 12 x is selected so that the two openings 13 are at least partially facing each other in said folded state to keep a free passageway in the folded state.
  • the two main portions of each pair 11 x , 12 x are shaped to match in the folded state.
  • Each folding line 9, 9' is physically obtained by forming a gap between the support layer 3 of a main portion 11; 12 and the support layer 3 of the adjacent main portion 12; 11.
  • adjacent main portions 11, 12 are mechanically connected one to the other only by the electrical conductive layers 4 or 6.
  • the support layer 3 is made of a plurality of distant pieces and is discontinuous.
  • the folding lines 9, 9' can be obtained by forming grooves.
  • the support layer 3 includes thin stripes between the main portions 11, 12. Such grooves can be obtained by machining, for example by shrinking material.
  • the support layer 3 is made in an integral piece, at least in the planar state of the inductive device 1.
  • the PCB 2 is preferably arranged to be folded such that the conductive layer is on the inner face of the folding angle.
  • the risk of deterioration of the conductive layer during folding operations is reduced.
  • the electrical continuity from one portion to another portion is preserved after folding operations.
  • the PCB 2 comprises a track 15.
  • the track 15 is electrically continuous and extends from an end portion to an opposite end portion of the main portions 11, 12 in the first direction x.
  • the track 15 includes parts of electrical conductive layer(s) of the PCB 2, corresponding to the top layer 4 and the bottom layer 6 in the example of figures 1 to 4 .
  • the track 15 extends along the rims of the openings 13 on the first main face and/or the second main face of the PCB 2.
  • An example of a track 15 is shown on figures 2 and 3 .
  • the PCB 2 further comprises electrical connections between layers to ensure continuity of the track 15, for example vertical interconnect access 16 (VIA).
  • VIA vertical interconnect access 16
  • the PCB 2 comprises a plurality of tracks 15 in order to obtain a multi-filar inductive device.
  • each pair of two main portions 11, 12 includes substantially M loop(s), or turn(s), of the track 15, M being preferably an integer.
  • M is comprised between 1 and 20.
  • the main portion 11 includes a half-loop on the top main face, included into the top layer 4 ( figure 2 ), and one loop on the bottom face, included into the bottom layer 6 ( figure 3 ), totaling 1,5 loop.
  • the main portion 12 includes one loop on the top main face, included into the top layer 4 ( figure 2 ), and a half-loop on the bottom face, included into the bottom layer 6 ( figure 3 ), totaling 1.5 loop.
  • M is not an integer because the positions of the electrical connections of the track between two portions are not analogous in the PCB.
  • the layout of the track 15 is selected in order to form windings around the openings 13 when the inductive device 1 is in an operational state.
  • the track 15 extends in a constant rotational direction around the openings 13.
  • the portions of the track 15 between two adjacent portions 11, 12 of the PCB 2 can be the single mechanical link between said adjacent portions 11, 12.
  • the track 15, and especially the said portions can be arranged in order to ensure mechanical link in function of the intended conditions of use.
  • the track 15 is arranged to support at least one folding movement from the planar state to an operational state.
  • the said portions of the track 15 can be formed, for example, of a flexible wire or a flexible ribbon cable.
  • additional element can be added to reinforce the strength of the folding lines 9, 9'.
  • the reinforcements can be structurally similar to portions of track 15.
  • the PCB 2 further comprises secondary portions 17, 18.
  • each secondary portion 17, 18 has a shape and a size similar to the shape and size of a main portion 11, 12.
  • the secondary portions 17, 18 are disposed respectively to an end and to an opposite end of the main portions 11, 12 in the first direction x.
  • Each secondary portion 17, 18 is connected to a main portion 11, respectively to a main portion 12 by a folding line 9'.
  • the track 15 extends in the first direction x beyond the main portions 11, 12, up to the secondary portions 17, 18.
  • the PCB 2 further comprises base portions 30, 40.
  • the base portion 30, respectively the base portion 40 is adjacent to the secondary portion 17, respectively to the secondary portion 18.
  • the base portion 30, respectively the base portion 40 is connected to the secondary portion 17, respectively to the secondary portion 18, by a folding line 9'.
  • the base portions 30, 40 are disposed respectively to an end and to an opposite end of the other portions 11, 12, 17, 18 in the first direction x.
  • the track 15 extends in the first direction x beyond the secondary portions 17, 18 and up to the base portions 30, 40.
  • the base portions 30, 40 are arranged to be fixed on a common support in a coplanar arrangement in the operational state (see figure 4 ) and to form claws of the inductive device 1.
  • the track 15 forms a half loop on a single face of each secondary portion 17, 18.
  • the track 15 on the secondary portions 17, 18 is only formed of the top layer 6 on the top main face of the PCB 2.
  • the secondary portions 17, 18 are arranged to be put face to face in operational state (see figure 4 ) and to form a leg of the inductive device 1. Due to the openings 13 and the parts of the track 15 on the secondary portions 17, 18, such a leg forms a supplementary winding, with a single loop, in the embodiments of figures 1 to 4 .
  • Such features are optional.
  • such secondary portions 17, 18 can have only a structural function.
  • the secondary portions 17, 18 can have a shape and/or a size different from the main portions 11, 12.
  • the openings can be absent.
  • the layout of the track 15 can be different from a loop (or a half-loop). Electrical connections with other devices can be provided.
  • the secondary portions 17, 18 and/or the base portions 30, 40 can be used as a support and/or a connection for other electronical elements.
  • the secondary portions 17, 18 and/or the base portions 30, 40 can be used as a classical PCB to plug electronical elements.
  • Other electrical conductive tracks can be provided in function of the application, said tracks can be connected to the track 15.
  • each main portion 11, 12 of each pair forms an angle ⁇ , ⁇ 1 , ⁇ 2 with an adjacent portion of the PCB 2 distinct from said pair.
  • the angle ⁇ corresponds to an angle between two pairs 11, 12 (see figure 6 ).
  • the angles ⁇ 1 , ⁇ 2 correspond to angles between a pair 11, 12 and another part of the PCB 2 (see figures 4 and 6 ).
  • there is a single pair of main portions 11, 12 (N 1).
  • the adjacent portions distinct from said pair corresponds to the secondary portions 17, 18.
  • the said angles ⁇ , ⁇ 1 , ⁇ 2 are strictly greater than zero. In other words, the folding is partial between pairs.
  • the arm formed by the main portions 11, 12 is not superimposed with the leg formed by the secondary portions 17, 18.
  • the openings 13 define together a casing 20 able to accommodate a magnetic piece to be inductively coupled to windings formed by the track 15.
  • the embodiments with a single pair of main portions 11, 12 is a specific case which is sufficient to obtain an inductive coupling with a magnetic piece.
  • two inductive devices 1, each one with a single pair of main portions 11, 12, can be combined with a common magnetic piece. Such an assembly would form an electrical transformer.
  • FIG. 5 the electrical conductive layers 4, 6 are shown but the layout of the track 15 is not represented.
  • the layout of the track 15 can be, for example, similar to the layout described above with respect to figures 2 and 3 .
  • the embodiment of figures 5 to 7 pertains to embodiments with at least two pairs of main portions 11 x , 12 x , where x ⁇ [1 ; N] and N ⁇ 2.
  • there are 7 pairs of main portions 11, 12 (N 7).
  • Said pairs 11 x , 12 x are similar one to another.
  • the inductive device 1 has substantially a symmetry of revolution: geometrically, each arm formed by a pair of main portions (11 x , 12 x ) results from a rotation of another pair of main portions (11 y , 12 y ) with respect to an axis YY parallel to the second direction y.
  • the general tridimensional form of the inductive device 1 in the operational state as it is shown on figures 5 and 6 looks like a flower.
  • N can be different from 7.
  • the sizes of the main portions (11 x ; 12 x ) of each pairs (11 x , 12 x ) can be different from each other (11 y , 12 y ).
  • the size of the pairs can be mutually adapted such that the inductive device in the operational state has a form which is not a symmetry of revolution.
  • the general tridimensional form of the inductive device 1 can be elongated, for example, parallelepiped or oblong.
  • the PCB 2 is equivalent to the PCB 2 of figure 4 wherein each pair 11 x ; 12 x forms a pattern corresponding to the frame 8 on figures 1 to 4 .
  • the pattern is N-replicated along the first direction x, optionally with differences of the layout of the track 1 between the pairs 8.
  • the N pairs 11 x ; 12 x are juxtaposed along the first direction x.
  • the two main portions 11 x , 12 x of a common pair are delimited by a folding line 9 (like on figures 2 and 3 ).
  • the two main portions 12 x , 11 y of respective adjacent pairs 11 x ; 12 x and 11 y ; 12 y are delimited by a folding line 9'.
  • the direction of the rotation is alternated from one folding line 9 to the adjacent folding line 9' along the first direction x.
  • the main portions 11, 12 and the secondary portions 17, 18 are folded in manner of an accordion.
  • the PCB 2 is folded such that each portion 11, 12, 17, 18 is rotated about folding lines 9, 9' with respect to the adjacent portions.
  • the two main portions 11 11 x , 12 x of each pair are superimposed one against the other by a complete folding.
  • the electrical isolation between the parts of the track 15 placed face to face is preserved.
  • each main portion 11 x , 12 x of each pair forms:
  • the said angles ⁇ and ⁇ 1 , ⁇ 2 are strictly greater than zero.
  • the folding is partial, resulting from a rotation of strictly less than 180°, such that the arms formed by each pair of main portions 11 x , 12 x are not superimposed with the other arms or with the leg formed by the secondary portions 17, 18.
  • the openings 13 define together a casing 20 able to accommodate a magnetic piece to be inductively coupled to windings formed by the track 15.
  • the casing 20 has an annular form.
  • a magnetic piece can have a toroidal form.
  • the toroidal form can have a circular or a non-circular section (for example a square section).
  • the magnetic piece is composed at least partly of a material having ferromagnetic properties, for example iron powder or ferrite.
  • a free space 21 is formed in a central part of the inductive device 1 (centered on the axis YY). Such a free space 21 and the space between the arms can be used to enhance the cooling of the inductive device 1 during operation.
  • Figure 7 shows an arm of a pair of main portions 11 x , 12 x .
  • the superimposition of four electrical conductive layers 4, 6 connected by VIA 16 and forming a part of the track 15 can be viewed.
  • the PCB 2 can be manufactured in the inactive and planar state, at least partly by known technics.
  • the support layer 3 is preferably rigid.
  • the word rigid is defined in the meaning that the support layer 3 can be broken rather than to be bent.
  • the support layer 3 can be made of glass-reinforced epoxy.
  • the rigidity of the support layer 3 enhances the good mechanical strength of the tridimensional structure.
  • the support layer 3 can be made of portions delimited by thin lines forming the folding lines 9, 9'. As long as the electrical continuity of the track 15 from one portion to another portion is preserved, two adjacent portions can be at least partially broken along their common folding line 9, 9' during a mounting of the inductive device 1.
  • the electrical conductive layers 4, 6 and the layout of the track 15 can be made by known methods, for example by selective chemical copper etching or by electroplating.
  • the thickness of the track is superior or equal to 105 micrometers.
  • the track 15 of the PCB 2 can also comprise a wire or a plurality of wires embedded in the support layer 3.
  • WO 2006/077163 , WO 2006/077164 and WO 2006/077167 describe methods to form tracks in or on a PCB that are planned to support power level of electricity.
  • Figure 8 shows an embodiment of an inductive device 1.
  • a general structure of the PCB 2 is shown in the inactive and planar state view from the top. Only the general forms and mutual arrangement of the parts of the PCB are shown, without details like the openings 13 or the track 15.
  • the PCB 2 further comprises housing portions 31, 32, 33, 34, 41, 42, 43, 44.
  • the housing portions 31, 32, 33, 34, are arranged to form a part of a container in combination with the base portion 30 in the operational state.
  • the housing portions 41, 42, 43, 44, are arranged to form a part of a container in combination with the base portion 40 in the operational state.
  • the two parts of a container are mutually arranged to form together a container, or housing, in the operational state.
  • Such a container can contain the other parts of the inductive device 1, including the arms and the magnetic piece.
  • the base portion 30 and the housing portions 31, 32, 33, 34 are mutually connected by folding lines 9', 9".
  • the base portion 40 and the housing portions 41, 42, 43, 44 are mutually connected by folding lines 9', 9".
  • the container when the inductive device 1 is in its operational state, the container has substantially a parallelepiped form.
  • the base portions 30, 40 are coplanar and, here, perpendicular to the third direction z.
  • the portions 31 and 32 are placed face to face and perpendicular to the second direction y.
  • the portions 41 and 42 are placed face to face and perpendicular to the second direction y.
  • the portions 31 and 42 are coplanar.
  • the portions 41 and 32 are coplanar.
  • the portions 33 and 43 are placed face to face and perpendicular to the first direction x.
  • the portion 34 and 44 are coplanar and placed facing to respectively the base portion 30 and the base portion 40, and perpendicular to the third direction z.
  • the thermal conductivity of the PCB 2 facilitates the thermal dissipation.
  • the heat can be evacuated from critical parts, especially from the arms formed by the main portions 11, 12 toward the base portions 30, 40 and the housing portions 31, 32, 33, 34, 41, 42, 43, 44.
  • the housing can, for example, receive a thermal conductive material in contact with the magnetic piece.
  • a fluidic or pasty thermal conductive material can be kept in contact with hot parts by the base portions 30, 40 and the housing portions 31, 32, 33, 34, 41, 42, 43, 44.
  • the magnetic material is formed in the housing produced by portions 31, 32, 33, 34, 41, 42, 43, 44, thus the magnetic material is conformal with the housing and the thermal interface between the magnetic piece and the housing is improved.
  • Figures 9 and 10 show in details an example of the base portion 30 and the housing portions 31 and 32. The neighboring portions exist but are not represented on the figures 9 and 10 .
  • the base portion 30 and the housing portions 31 and 32 contain a high portion of thermally conductive material.
  • the portions of the PCB 2 support metallic tracks 50 (here in copper).
  • a main function of the tracks 50 is, in the context, to enhance the conduction of the heat along the PCB portions.
  • the tracks 50 are not used to voluntary carry electricity.
  • the tracks 50 can also have a magnetic shield function, for example to limit the magnetic dispersion.
  • the number, the layout and generally the tracks 50 as shown on figure 9 are only examples.
  • the tracks 50 can have different locations, structures or forms in function of the forms of the inductive device 1 and the intended application.
  • the housing portion 31 supports a thermal conductive member 51.
  • the thermal conductive member 51 is formed of a bar made of a thermal conductive material, for example copper or aluminum.
  • the form, the size and the location of the thermal conductive member 51 on the housing portion 31 are especially arranged in order to be disposed in a central opening of an annular magnetic piece.
  • the central opening in the embodiments described above corresponds to the free space 21 (see figure 5 ).
  • the conductive member 51 forms a thermal drain, which evacuates the heat from the arms toward the housing portion 31.
  • the conductive member 51 also forms a spacer to dispose the pairs 11, 12 easily with respect to the others when the PCB 2 is built from a planar state to an operational state.
  • the conductive member 51 could also forms a part of the mold or a molding core to create the magnetic piece inside the PCB 2 as it will be described hereinafter.
  • the tracks 50 and the thermal conductive member 51 are optional and can be used independently.
  • the combination of the tracks 50 and the thermal conductive member 51 is particularly efficient to evacuate the heat from the inductive device 1.
  • a through hole 52 is formed into the base portion 30.
  • the hole 52 is used to fix the base portion 30, and consequently the inductive device 1, to a support 100.
  • a couple screw-nut is used.
  • the nuts is glued to the base portion 30 or directly molded into the magnetic paste described hereinafter.
  • Other fastening means can be used.
  • the base portion 30 also support a thermal conductive part 53 fixed on the external main face of the base portion 30.
  • the "external main face" means outside from the housing in the operational state (see the arrows representing the folding movements of the housing portions 31, 32 on figure 10 ).
  • the thermal conductive part 53 is disposed substantially around the hole 52 such that to be maintained in tight contact between the inductive device 1 and the support 100 and to evacuate the heat from the inductive device 1 toward the support 100.
  • the thermal conductive part 53 has a mechanical function: it strengthens the base portion 30 and provides a planar and rigid surface.
  • the thermal conductive part 53 has also a thermal function: it enhances the spreading of the heat so that it is more efficiently transferred to the support 100.
  • the thermal conductive part 53 is attached to the base portion 30 by a lamination process.
  • the thermal conductive part 53 can be a metal plate, for example made of copper or aluminum. Such a metal plate can be fixed to the PCB by a thermal conductive pre-preg. Such a combination has preferably a high thermal conductivity and a low electrical conductivity, preferably a thermal conductivity superior to 3 W.m -1 .K -1 and a breakdown voltage superior to 2 kV.
  • the support 100 itself can be a heat sink. Thermal grease can also be added to enhance the thermal conductivity between elements.
  • the heat can be evacuated from the active parts of the inductive device 1 toward outside, for example toward the support 100 and/or a heat sink.
  • portions 30, 31, 32 comprise tracks 50, a thermal conductive member 51, a hole 52 and a thermal conductive part 53.
  • one of the elements or a combination thereof can be adapted to other parts of the inductive device 1, especially to similar portions 40, 41, 42.
  • the inductive device 1 can be used for example to form a transformer or an inductor.
  • the inductive device 1 can be combined with other elements to form an assembly.
  • An inductive assembly can comprise an inductive device 1 in the operational state, and a magnetic piece disposed in the casing 20 of the inductive device 1.
  • the inductive device 1 and the magnetic piece can be inductively coupled.
  • the air enables to convey magnetic field.
  • the inductive device 1 can be deprived from any magnetic piece and operate with air.
  • the inductive device 1 and the magnetic piece can be provided separately or into a kit.
  • a kit can comprise other article, for example electronic component, to be assembled.
  • the inductive device 1 Before to be used, the inductive device 1 can be kept in a planar state, for example during manufacturing, storage and/or transport.
  • Figures 11 , 12 and 13 , and figures 14 , 15 and 16 show two embodiments of the PCB 2.
  • the numerical references identical to that of previous figures correspond to analogous elements.
  • the operational states are similar to the operational state of the embodiment of figures 1 to 4 .
  • the planar states are different.
  • the portions 11, 12, 17, 18, 30 and 40 of the PCB 2 are not aligned in a common direction.
  • the base portion 30, the secondary portion 17 and the main portion 11 are aligned in the first direction x.
  • the base portion 40, the secondary portion 18 and the main portion 12 are also aligned in the first direction x.
  • the base portion 40, the secondary portion 18 and the main portion 12 are disposed parallel to the base portion 30, the secondary portion 17 and the main portion 11.
  • the main portions 11, 12 are aligned substantially along the second direction y in the inactive state of the PCB 2.
  • the folding line 9 between the main portions 11, 12 is oriented into the first direction x perpendicular to the second direction y.
  • the secondary portion 18 and the base portion 40 are on the same side as the secondary portion 17 and the base portion 30 with respect to the pair of main portions 11, 12 (on the left side on figure 11 ).
  • the secondary portions 17, 18 are aligned along the second direction y and the base portions 30, 40 are aligned along the second direction y.
  • the PCB 2 further comprises a cutting line 10, extending in the first direction x, in the extension of the folding line 9 of the pair 11, 12, between the base portion 30 and the base portion 40, and between the secondary portion 17 and the secondary portion 18.
  • the secondary portion 18 and the base portion 40, and the secondary portion 17 and the base portion 30 can be on the opposite side with respect to the pair of main portions 11, 12. In such a case, a cutting line 10 is useless.
  • the cutting line 10 is, in the example, a weakened part of the PCB 2, arranged to be voluntarily broken and to separate the base portions 30, 40 from each other and to separate the secondary portions 17, 18 from each other when the PCB 2 is built in the operational state.
  • the cutting line 10 can be an air gap in the planar state, avoiding a breaking action during the building of the inductive device 1.
  • the track 15 extends continuously and successively from the base portion 30 to the base portion 40 passing by the secondary portion 17, the main portion 11, the main portion 12 and the secondary portion 18.
  • the layout of the track 15 is different from the layout of the previous embodiments.
  • the main portion 11 includes three quarters of a loop on the top main face, included into the top layer 4 ( figure 11 ), rather than a half-loop ( figure 2 ).
  • the main portion 12 includes three quarters of a loop on the top main face, included into the top layer 4 ( figure 11 ), rather than an almost entire loop ( figure 2 ).
  • the main portions 11 1 , 12 1 are aligned substantially along the second direction y in the inactive state of the PCB 2.
  • the main portions 11 N , 12 N are aligned substantially along the second direction y in the inactive state of the PCB 2.
  • Each folding line 9 between the main portions 11 1 , 12 1 is oriented into the first direction x perpendicular to the second direction y.
  • the other folding lines 9, 9' are oriented into the second direction y.
  • the second pair of main portions 11 N , 12 N are on the same side as the secondary portion 17 and the base portion 30 with respect to the first pair of main portions 11 1 , 12 1 (on the left side on figure 11 ).
  • the secondary portion 17 and the second pair of main portions 11 N , 12 N are aligned along the second direction y.
  • the first pair of main portions 11 1 , 12 1 are on the same side as the secondary portion 18 and the base portion 40 with respect to the second pair of main portions 11 N , 12 N (on the right side on figure 11 ).
  • the secondary portion 18 and the first pair of main portions 11 1 , 12 1 are aligned along the second direction y.
  • the PCB 2 comprises two cutting lines 10, extending in the first direction x, each in the extension of one of the folding lines 9 of the pairs 11 1 , 12 1 , 11 N , 12 N , between the secondary portion 17 and the main portion 11 N , and respectively between the secondary portion 18 and the main portion 12 1 .
  • the cutting lines 10 are similar to the cutting line of figures 11 , 12 .
  • the layout of the track 15 is also slightly different from the layout of the previous embodiments.
  • a man skilled in the art would understand that the layout of the track 15 can be arranged in function of the mutual arrangement of the portions of the PCB.
  • the number of pairs can be different, for example by increasing the number of pairs with respect to the example of figures 11 , 12 and 13 (where N is an odd number) and/or the example of figures 14 , 15 and 16 (where N is an even number).
  • the PCB 2 is equivalent to the PCB 2 of figure 4 wherein each pair 11 x ; 12 x is referenced 8.
  • the pairs 8 can be N-replicated with differences of the layout of the track 15.
  • Figure 17 shows schematically a various operational state of a PCB 2.
  • the PCB 2 further comprises intermediate portions 60.
  • the two main portions 11 X , 12 X of each pair 8 are connected one to the other by an intermediate portion 60.
  • An intermediate portion 60 is connected respectively to each one of the main portions 11 X , 12 X of the pair by a respective folding line 9, 9' such that to have an angle between said two main portions 11 X , 12 X in the operational state of the PCB 2.
  • Each intermediate portion 60 further comprises a part of the track 15 such that to ensure electrical continuity of the track 15 from one to the other main portion 11 X , 12 X .
  • the main portions 11 X , 12 X of a pair are not superimposed.
  • Figure 18 shows schematically a various operational state of a PCB 2.
  • the sizes of the main portions of two distinct pairs are different.
  • the main portions of the vertical and horizontal pairs are shorter than the main portions of diagonal pairs. This enables to adapt the general form of the inductive device 1 in the operational state of the PCB 2.
  • Figure 18 shows an example of a device 1 having a parallelepiped form.
  • the form and size of the openings 13 can also be adapted in order to adapt the form of the casing 20.
  • the embodiments of the inductive device 1 described until now are made of a single PCB 2 with a single track 15.
  • the inductive devices 1 are inductors.
  • the inductive device 1 comprises more than one PCB 2, for example two PCB 2.
  • Each one of the two PCB 2 comprises a single track 15 electrically isolated one from the other in the operational state.
  • the two PCB 2 are arranged in order to form, in the operational state, a common casing 20.
  • Each one of the two PCB 2 forms respectively a primary winding and a secondary winding.
  • the two PCB 2 form the inductive device 1, which can be, here, a transformer.
  • the single PCB 2, or at least one among a plurality of PCB 2 can comprise:
  • a split track is a track for which the two ends of the track are neighboring, for example on the same portion of the PCB 2.
  • the track comprises two successive parts, the first part passing by each portion of the PCB 2 on a first side of each opening 13, the second part passing by each portion of the PCB 2 on the opposite side of each opening 13, the two parts being connected one to the other by an U-turn around an opening 13 of a portion of the PCB 2.
  • a track can starts (having a first end connection) on the base portion 30 of the PCB 2 of figures 5 and 6 , to extend from the base portion 30 to the base portion 40 (the first part of the track), to make a U-turn on the base portion 40, to extend from the base portion 40 to the base portion 30 (the second part of the track), and ends (having a second end connection) on the base portion 30.
  • the layout of the track is arranged to form windings around the openings 13 in the operational state of the PCB 2.
  • Such a split track can be provided, for example, on each one of the PCB embodiments shown on figures 1 to 20 .
  • a plurality of independent tracks on the same PCB can have a similar layout, for example being substantially parallel along their path.
  • the ends of each track can be connected two by two such as to be electrically equivalent to a single continuous track.
  • each track In an operational state, the two ends of each track can be connected to a respective circuitry.
  • the tracks are electrically isolated and inductively coupled by the magnetic piece.
  • two tracks electrically independent and substantially parallel along their path can form a primary and a secondary winding on the same PCB.
  • Such a single PCB forms a transformer.
  • the known inductive devices especially thus designed to at least kilowatt levels (current of several amperes) have a large magnetic section, a large volume, a large mass and are also difficult to cool down.
  • the known inductive devices are generally made by assembling a plurality of discrete pieces. Due to the limited number of models for each discrete piece and their availability at each time, each industrial actor has usually to make a compromise between the best technical features (theoretic) in function of each application, and the cost of the unitary pieces (economical reality).
  • the adaptability of the inductive devices is very limited. According to the inductive device 1 with a foldable PCB, the specific features of each inductive device can be easily and precisely selected in function of each application. It will be understood that the precise features are almost unlimited (especially number, sizes and shapes of main sections 11, 12 ; number of loops by arm, section and layout of the track, form and size of the magnetic piece, external form and size of the optional housing, configuration of the various cooling options).
  • the manufacturing of such an inductive device 1, or the manufacturing of an assembly including the inductive device 1, can be highly or totally automated. This enables to reduce the manufacturing cost.
  • An assembly comprising the inductive device 1 can be manufactured by a process as follows:
  • the step a can comprise to form the folding lines 9, 9' as explained above.
  • the step b can comprise to dispose a spacer or a set of spacers in order to temporary maintain the folded PCB 2 in its final position during the molding.
  • the PCB 2 can be maintained in its "flower" form for example.
  • the step c can comprise to fix a mold or a set of mold parts with respect to the folded PCB 2.
  • the housing portions described before can also be used to form a mold.
  • the fluid magnetic material can comprise, for example, a powder or a combination of powder with resin and/or glue.
  • the step c can also comprise a curing, preferably at a temperature less than 200°C.
  • the assembling process can further comprise to remove the molding core from a center of the solid magnetic piece after molding.
EP17305174.9A 2017-02-16 2017-02-16 Induktive vorrichtung Withdrawn EP3364428A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP17305174.9A EP3364428A1 (de) 2017-02-16 2017-02-16 Induktive vorrichtung
PCT/JP2018/005609 WO2018151284A1 (en) 2017-02-16 2018-02-13 Inductive device, inductive assembly and method of manufacturing inductive assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP17305174.9A EP3364428A1 (de) 2017-02-16 2017-02-16 Induktive vorrichtung

Publications (1)

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EP3364428A1 true EP3364428A1 (de) 2018-08-22

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EP (1) EP3364428A1 (de)
WO (1) WO2018151284A1 (de)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2911605A (en) * 1956-10-02 1959-11-03 Monroe Calculating Machine Printed circuitry
JPH04206906A (ja) * 1990-11-30 1992-07-28 Tokin Corp 薄型トランス
US20010043135A1 (en) * 2000-05-16 2001-11-22 Katsuo Yamada Inductor
WO2002039467A1 (en) * 2000-11-04 2002-05-16 Profec Technologies Oy Inductive components
WO2006077163A2 (de) 2005-01-24 2006-07-27 Jumatech Gmbh Drahtbeschriebene leiterplatte oder platine mit leitungsdrähten mit rechteckigem oder quadratischem querschnitt
WO2006077167A2 (de) 2005-01-24 2006-07-27 Jumatech Gmbh Verfahren zur durchgehenden verlegung eines leitungsdrahtes auf einer leiterplatte und vorrichtung zur durchführung des verfahrens
WO2006077164A2 (de) 2005-01-24 2006-07-27 Juma Pcb Gmbh Verfahren zur herstellung einer abwinkelbaren leiterplattenstruktur aus zumindest zwei leiterplattenabschnitten
EP2109120A1 (de) * 2007-01-26 2009-10-14 Panasonic Electric Works Co., Ltd Laminiertes element
US20120029343A1 (en) * 2010-07-30 2012-02-02 Medtronic, Inc. Inductive coil device on flexible substrate

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2911605A (en) * 1956-10-02 1959-11-03 Monroe Calculating Machine Printed circuitry
JPH04206906A (ja) * 1990-11-30 1992-07-28 Tokin Corp 薄型トランス
US20010043135A1 (en) * 2000-05-16 2001-11-22 Katsuo Yamada Inductor
WO2002039467A1 (en) * 2000-11-04 2002-05-16 Profec Technologies Oy Inductive components
WO2006077163A2 (de) 2005-01-24 2006-07-27 Jumatech Gmbh Drahtbeschriebene leiterplatte oder platine mit leitungsdrähten mit rechteckigem oder quadratischem querschnitt
WO2006077167A2 (de) 2005-01-24 2006-07-27 Jumatech Gmbh Verfahren zur durchgehenden verlegung eines leitungsdrahtes auf einer leiterplatte und vorrichtung zur durchführung des verfahrens
WO2006077164A2 (de) 2005-01-24 2006-07-27 Juma Pcb Gmbh Verfahren zur herstellung einer abwinkelbaren leiterplattenstruktur aus zumindest zwei leiterplattenabschnitten
EP2109120A1 (de) * 2007-01-26 2009-10-14 Panasonic Electric Works Co., Ltd Laminiertes element
US20120029343A1 (en) * 2010-07-30 2012-02-02 Medtronic, Inc. Inductive coil device on flexible substrate

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