EP3341831A1 - On the fly automatic wafer centering method and apparatus - Google Patents
On the fly automatic wafer centering method and apparatusInfo
- Publication number
- EP3341831A1 EP3341831A1 EP16825130.4A EP16825130A EP3341831A1 EP 3341831 A1 EP3341831 A1 EP 3341831A1 EP 16825130 A EP16825130 A EP 16825130A EP 3341831 A1 EP3341831 A1 EP 3341831A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- arm
- end effector
- substrate
- transport
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 73
- 239000000758 substrate Substances 0.000 claims abstract description 609
- 239000012636 effector Substances 0.000 claims abstract description 378
- 238000012545 processing Methods 0.000 claims abstract description 216
- 238000001514 detection method Methods 0.000 claims abstract description 148
- 230000000694 effects Effects 0.000 claims abstract description 139
- 230000033001 locomotion Effects 0.000 claims abstract description 96
- 230000003068 static effect Effects 0.000 claims abstract description 64
- 210000000245 forearm Anatomy 0.000 claims description 69
- 230000009021 linear effect Effects 0.000 claims description 45
- 230000001419 dependent effect Effects 0.000 claims description 13
- 238000003672 processing method Methods 0.000 claims description 2
- 230000032258 transport Effects 0.000 description 342
- 235000012431 wafers Nutrition 0.000 description 138
- 230000007704 transition Effects 0.000 description 68
- 230000000875 corresponding effect Effects 0.000 description 53
- 230000008569 process Effects 0.000 description 47
- 238000004422 calculation algorithm Methods 0.000 description 30
- 210000000707 wrist Anatomy 0.000 description 29
- 230000008602 contraction Effects 0.000 description 28
- 238000012546 transfer Methods 0.000 description 28
- 230000008859 change Effects 0.000 description 24
- 230000005540 biological transmission Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 230000009022 nonlinear effect Effects 0.000 description 12
- 230000000153 supplemental effect Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 230000006870 function Effects 0.000 description 6
- 230000004044 response Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000013459 approach Methods 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 241000208296 Datura Species 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 238000012935 Averaging Methods 0.000 description 3
- 238000002940 Newton-Raphson method Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 230000002596 correlated effect Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 210000003857 wrist joint Anatomy 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 101100004969 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CAT2 gene Proteins 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004320 controlled atmosphere Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- -1 datum features Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002277 temperature effect Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- YBJHBAHKTGYVGT-ZKWXMUAHSA-N (+)-Biotin Chemical compound N1C(=O)N[C@@H]2[C@H](CCCCC(=O)O)SC[C@@H]21 YBJHBAHKTGYVGT-ZKWXMUAHSA-N 0.000 description 1
- 244000050403 Iris x germanica Species 0.000 description 1
- 101100463797 Rattus norvegicus Pgrmc1 gene Proteins 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001595 contractor effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 244000145841 kine Species 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- AHLBNYSZXLDEJQ-FWEHEUNISA-N orlistat Chemical compound CCCCCCCCCCC[C@H](OC(=O)[C@H](CC(C)C)NC=O)C[C@@H]1OC(=O)[C@H]1CCCCCC AHLBNYSZXLDEJQ-FWEHEUNISA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562191863P | 2015-07-13 | 2015-07-13 | |
| US201662320142P | 2016-04-08 | 2016-04-08 | |
| PCT/US2016/042142 WO2017011581A1 (en) | 2015-07-13 | 2016-07-13 | On the fly automatic wafer centering method and apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP3341831A1 true EP3341831A1 (en) | 2018-07-04 |
Family
ID=58774474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP16825130.4A Withdrawn EP3341831A1 (en) | 2015-07-13 | 2016-07-13 | On the fly automatic wafer centering method and apparatus |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP3341831A1 (zh) |
| CN (2) | CN114758975A (zh) |
| TW (2) | TWI832130B (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10903107B2 (en) | 2017-07-11 | 2021-01-26 | Brooks Automation, Inc. | Semiconductor process transport apparatus comprising an adapter pendant |
| TWI677774B (zh) * | 2018-12-03 | 2019-11-21 | 鴻勁精密股份有限公司 | 電子元件移料機構及其應用之作業設備 |
| JP2021019145A (ja) * | 2019-07-23 | 2021-02-15 | 川崎重工業株式会社 | ブレード間隔調整装置 |
| CN115295464A (zh) * | 2022-08-08 | 2022-11-04 | 魅杰光电科技(上海)有限公司 | 一种晶圆传片系统 |
| CN116313873B (zh) * | 2023-05-11 | 2023-07-25 | 深圳市森美协尔科技有限公司 | 一种全自动晶圆测试设备及方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2071662A1 (en) * | 1991-06-26 | 1992-12-27 | Jon J. Gulick | Integrated socket-type package for flip-chip semiconductor devices and circuits |
| KR20040010280A (ko) * | 2002-07-22 | 2004-01-31 | 어플라이드 머티어리얼스, 인코포레이티드 | 고온 기판 이송 로봇 |
| US7458763B2 (en) * | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
| JP2009500869A (ja) * | 2005-07-11 | 2009-01-08 | ブルックス オートメーション インコーポレイテッド | オンザフライ（ｏｎｔｈｅｆｌｙ）ワークピースセンタリングを備えた装置 |
| US7479236B2 (en) * | 2006-09-29 | 2009-01-20 | Lam Research Corporation | Offset correction techniques for positioning substrates |
| JP4607848B2 (ja) * | 2006-10-27 | 2011-01-05 | 東京エレクトロン株式会社 | 基板処理装置、基板受け渡し位置の調整方法及び記憶媒体 |
| JP4989398B2 (ja) * | 2007-09-27 | 2012-08-01 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US20090110532A1 (en) * | 2007-10-29 | 2009-04-30 | Sokudo Co., Ltd. | Method and apparatus for providing wafer centering on a track lithography tool |
| CN101640181A (zh) * | 2008-07-31 | 2010-02-03 | 佳能安内华股份有限公司 | 基底对准设备和基底处理设备 |
| CN104271474B (zh) * | 2011-12-16 | 2018-01-09 | 布鲁克斯自动化公司 | 输送设备 |
| US9548231B2 (en) * | 2013-06-05 | 2017-01-17 | Persimmon Technologies, Corp. | Robot and adaptive placement system and method |
-
2016
- 2016-07-13 CN CN202210281765.1A patent/CN114758975A/zh active Pending
- 2016-07-13 TW TW110148501A patent/TWI832130B/zh active
- 2016-07-13 EP EP16825130.4A patent/EP3341831A1/en not_active Withdrawn
- 2016-07-13 CN CN201680053111.6A patent/CN108027718B/zh active Active
- 2016-07-13 TW TW105122083A patent/TWI752910B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201707900A (zh) | 2017-03-01 |
| CN114758975A (zh) | 2022-07-15 |
| TWI832130B (zh) | 2024-02-11 |
| TWI752910B (zh) | 2022-01-21 |
| CN108027718B (zh) | 2022-04-08 |
| TW202224078A (zh) | 2022-06-16 |
| CN108027718A (zh) | 2018-05-11 |
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| 18D | Application deemed to be withdrawn |
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