CN115295464A - 一种晶圆传片系统 - Google Patents
一种晶圆传片系统 Download PDFInfo
- Publication number
- CN115295464A CN115295464A CN202210943455.1A CN202210943455A CN115295464A CN 115295464 A CN115295464 A CN 115295464A CN 202210943455 A CN202210943455 A CN 202210943455A CN 115295464 A CN115295464 A CN 115295464A
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- Prior art keywords
- wafer
- controller
- conveying
- robot
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 268
- 238000012546 transfer Methods 0.000 claims abstract description 58
- 238000012545 processing Methods 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 11
- 238000012937 correction Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210943455.1A CN115295464A (zh) | 2022-08-08 | 2022-08-08 | 一种晶圆传片系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210943455.1A CN115295464A (zh) | 2022-08-08 | 2022-08-08 | 一种晶圆传片系统 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115295464A true CN115295464A (zh) | 2022-11-04 |
Family
ID=83828180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210943455.1A Pending CN115295464A (zh) | 2022-08-08 | 2022-08-08 | 一种晶圆传片系统 |
Country Status (1)
Country | Link |
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CN (1) | CN115295464A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116141379A (zh) * | 2023-02-09 | 2023-05-23 | 上海广川科技有限公司 | 一种晶圆搬运机器人的测试系统 |
CN116277015A (zh) * | 2023-04-07 | 2023-06-23 | 上海感图网络科技有限公司 | 数据处理方法、装置、设备及存储介质 |
CN117116824A (zh) * | 2023-09-15 | 2023-11-24 | 无锡卓海科技股份有限公司 | 一种紧凑型晶圆传输系统及其控制方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009049251A (ja) * | 2007-08-22 | 2009-03-05 | Yaskawa Electric Corp | ウエハ搬送装置 |
CN108027718A (zh) * | 2015-07-13 | 2018-05-11 | 布鲁克斯自动化公司 | 在传输中自动晶圆定中方法及设备 |
CN108695187A (zh) * | 2017-04-07 | 2018-10-23 | 北京华通芯电科技有限公司 | 半导体晶圆清洗设备 |
CN111186701A (zh) * | 2020-02-17 | 2020-05-22 | 天津中环领先材料技术有限公司 | 一种自动寻参读码设备 |
CN113972158A (zh) * | 2021-10-26 | 2022-01-25 | 上海广川科技有限公司 | 一种晶圆传输系统 |
-
2022
- 2022-08-08 CN CN202210943455.1A patent/CN115295464A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009049251A (ja) * | 2007-08-22 | 2009-03-05 | Yaskawa Electric Corp | ウエハ搬送装置 |
CN108027718A (zh) * | 2015-07-13 | 2018-05-11 | 布鲁克斯自动化公司 | 在传输中自动晶圆定中方法及设备 |
CN108695187A (zh) * | 2017-04-07 | 2018-10-23 | 北京华通芯电科技有限公司 | 半导体晶圆清洗设备 |
CN111186701A (zh) * | 2020-02-17 | 2020-05-22 | 天津中环领先材料技术有限公司 | 一种自动寻参读码设备 |
CN113972158A (zh) * | 2021-10-26 | 2022-01-25 | 上海广川科技有限公司 | 一种晶圆传输系统 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116141379A (zh) * | 2023-02-09 | 2023-05-23 | 上海广川科技有限公司 | 一种晶圆搬运机器人的测试系统 |
CN116277015A (zh) * | 2023-04-07 | 2023-06-23 | 上海感图网络科技有限公司 | 数据处理方法、装置、设备及存储介质 |
CN116277015B (zh) * | 2023-04-07 | 2024-01-23 | 上海感图网络科技有限公司 | 数据处理方法、装置、设备及存储介质 |
CN117116824A (zh) * | 2023-09-15 | 2023-11-24 | 无锡卓海科技股份有限公司 | 一种紧凑型晶圆传输系统及其控制方法 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Country or region after: China Address after: 201306 Building 1 and building 2, No. 333, Haiyang 1st Road, Lingang New District, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Applicant after: Meijie photoelectric technology (Shanghai) Co.,Ltd. Address before: 200131 Building 1 and building 2, No. 333, Haiyang 1st Road, Lingang New Area, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Applicant before: Meijie photoelectric technology (Shanghai) Co.,Ltd. Country or region before: China |
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CB02 | Change of applicant information |