EP3307842A1 - Verbindung von fugenbändern - Google Patents
Verbindung von fugenbändernInfo
- Publication number
- EP3307842A1 EP3307842A1 EP16730706.5A EP16730706A EP3307842A1 EP 3307842 A1 EP3307842 A1 EP 3307842A1 EP 16730706 A EP16730706 A EP 16730706A EP 3307842 A1 EP3307842 A1 EP 3307842A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- latent
- acrylate
- meth
- radically curable
- curable adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 119
- 239000000853 adhesive Substances 0.000 claims abstract description 117
- -1 alkyl borane Chemical compound 0.000 claims abstract description 104
- 239000000758 substrate Substances 0.000 claims abstract description 95
- 239000000203 mixture Substances 0.000 claims abstract description 75
- 229910000085 borane Inorganic materials 0.000 claims abstract description 67
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims abstract description 65
- 238000000034 method Methods 0.000 claims abstract description 39
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 20
- 229920002943 EPDM rubber Polymers 0.000 claims abstract description 18
- 239000002131 composite material Substances 0.000 claims abstract description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 98
- 150000001412 amines Chemical class 0.000 claims description 26
- 239000000178 monomer Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 7
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 6
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 238000005304 joining Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims description 2
- 239000008096 xylene Substances 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- 150000003973 alkyl amines Chemical class 0.000 claims 1
- 238000003860 storage Methods 0.000 abstract description 3
- 229920001169 thermoplastic Polymers 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract description 2
- 239000004416 thermosoftening plastic Substances 0.000 abstract description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 29
- 229920005862 polyol Polymers 0.000 description 23
- 150000003077 polyols Chemical class 0.000 description 23
- 150000001875 compounds Chemical class 0.000 description 16
- 239000000945 filler Substances 0.000 description 13
- 150000003254 radicals Chemical class 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 239000004800 polyvinyl chloride Substances 0.000 description 11
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 229910052796 boron Inorganic materials 0.000 description 10
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000004814 polyurethane Substances 0.000 description 9
- 229920002635 polyurethane Polymers 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- 150000004985 diamines Chemical class 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 150000007513 acids Chemical class 0.000 description 6
- 125000003277 amino group Chemical group 0.000 description 6
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- PMMYEEVYMWASQN-DMTCNVIQSA-N Hydroxyproline Chemical compound O[C@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-DMTCNVIQSA-N 0.000 description 5
- 239000012190 activator Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229920001451 polypropylene glycol Polymers 0.000 description 5
- CMHHITPYCHHOGT-UHFFFAOYSA-N tributylborane Chemical compound CCCCB(CCCC)CCCC CMHHITPYCHHOGT-UHFFFAOYSA-N 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 239000002841 Lewis acid Substances 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- 150000007517 lewis acids Chemical class 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 239000012766 organic filler Substances 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- 241000894007 species Species 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 3
- VTDOEFXTVHCAAM-UHFFFAOYSA-N 4-methylpent-3-ene-1,2,3-triol Chemical compound CC(C)=C(O)C(O)CO VTDOEFXTVHCAAM-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 241000579895 Chlorostilbon Species 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 239000004927 clay Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 239000010976 emerald Substances 0.000 description 3
- 229910052876 emerald Inorganic materials 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 3
- 239000013500 performance material Substances 0.000 description 3
- 229920000768 polyamine Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229920000909 polytetrahydrofuran Polymers 0.000 description 3
- 150000003141 primary amines Chemical class 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 150000003335 secondary amines Chemical class 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- XCLBRNYKYSOUHO-UHFFFAOYSA-N 2-dicyclohexylboranyloxy-N-methylethanamine Chemical compound CNCCOB(C1CCCCC1)C1CCCCC1 XCLBRNYKYSOUHO-UHFFFAOYSA-N 0.000 description 2
- IEVADDDOVGMCSI-UHFFFAOYSA-N 2-hydroxybutyl 2-methylprop-2-enoate Chemical compound CCC(O)COC(=O)C(C)=C IEVADDDOVGMCSI-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- IAAASXBHFUJLHW-UHFFFAOYSA-N 3,5-diethyl-1-phenyl-2-propyl-2h-pyridine Chemical compound C1=C(CC)C=C(CC)C(CCC)N1C1=CC=CC=C1 IAAASXBHFUJLHW-UHFFFAOYSA-N 0.000 description 2
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 2
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 2
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 2
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229920002633 Kraton (polymer) Polymers 0.000 description 2
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 2
- 239000004472 Lysine Substances 0.000 description 2
- SAPOTWFOYIWFNU-UHFFFAOYSA-N NC(C)(C)N.C(C)B(CC)CC Chemical compound NC(C)(C)N.C(C)B(CC)CC SAPOTWFOYIWFNU-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 125000004036 acetal group Chemical group 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 150000001642 boronic acid derivatives Chemical class 0.000 description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229940074076 glycerol formal Drugs 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical class OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- ZTKBVWUYLHTIBB-UHFFFAOYSA-N tri(propan-2-yl)borane Chemical compound CC(C)B(C(C)C)C(C)C ZTKBVWUYLHTIBB-UHFFFAOYSA-N 0.000 description 2
- LALRXNPLTWZJIJ-UHFFFAOYSA-N triethylborane Chemical compound CCB(CC)CC LALRXNPLTWZJIJ-UHFFFAOYSA-N 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 description 1
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- MHYXPAGFFCSTCJ-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)naphthalene Chemical compound C1=CC=CC2=C(C(C)(C)N=C=O)C(C(C)(N=C=O)C)=CC=C21 MHYXPAGFFCSTCJ-UHFFFAOYSA-N 0.000 description 1
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- ROHUXHMNZLHBSF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCC(CN=C=O)CC1 ROHUXHMNZLHBSF-UHFFFAOYSA-N 0.000 description 1
- LGLNTUFPPXPHKF-UHFFFAOYSA-N 1,4-diisocyanato-2,3,5,6-tetramethylbenzene Chemical compound CC1=C(C)C(N=C=O)=C(C)C(C)=C1N=C=O LGLNTUFPPXPHKF-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- MZEGJNMYXWIQFF-UHFFFAOYSA-N 2,5-diisocyanato-1,1,3-trimethylcyclohexane Chemical compound CC1CC(N=C=O)CC(C)(C)C1N=C=O MZEGJNMYXWIQFF-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- NHFHIOZDNXRYFF-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]ethanol;prop-1-ene Chemical group CC=C.OCCOCCOCCO NHFHIOZDNXRYFF-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- JUVSRZCUMWZBFK-UHFFFAOYSA-N 2-[n-(2-hydroxyethyl)-4-methylanilino]ethanol Chemical compound CC1=CC=C(N(CCO)CCO)C=C1 JUVSRZCUMWZBFK-UHFFFAOYSA-N 0.000 description 1
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 1
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- WJIOHMVWGVGWJW-UHFFFAOYSA-N 3-methyl-n-[4-[(3-methylpyrazole-1-carbonyl)amino]butyl]pyrazole-1-carboxamide Chemical compound N1=C(C)C=CN1C(=O)NCCCCNC(=O)N1N=C(C)C=C1 WJIOHMVWGVGWJW-UHFFFAOYSA-N 0.000 description 1
- FJSUFIIJYXMJQO-UHFFFAOYSA-N 3-methylpentane-1,5-diamine Chemical compound NCCC(C)CCN FJSUFIIJYXMJQO-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- ZEYHEAKUIGZSGI-UHFFFAOYSA-N 4-methoxybenzoic acid Chemical compound COC1=CC=C(C(O)=O)C=C1 ZEYHEAKUIGZSGI-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- TVUDIIZSZNZJIH-UHFFFAOYSA-N CNCCOB(CC)CC Chemical compound CNCCOB(CC)CC TVUDIIZSZNZJIH-UHFFFAOYSA-N 0.000 description 1
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- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
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- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 1
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- 239000002879 Lewis base Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
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- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
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- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
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- 125000002723 alicyclic group Chemical group 0.000 description 1
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- 239000012670 alkaline solution Substances 0.000 description 1
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- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 1
- 150000001409 amidines Chemical class 0.000 description 1
- AJXBTRZGLDTSST-UHFFFAOYSA-N amino 2-methylprop-2-enoate Chemical class CC(=C)C(=O)ON AJXBTRZGLDTSST-UHFFFAOYSA-N 0.000 description 1
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- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
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- 150000001639 boron compounds Chemical class 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
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- SWFMWXHHVGHUFO-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN.NCCCCCCN SWFMWXHHVGHUFO-UHFFFAOYSA-N 0.000 description 1
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- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
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- 239000002105 nanoparticle Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910000273 nontronite Inorganic materials 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- WDHYRUBXLGOLKR-UHFFFAOYSA-N phosphoric acid;prop-2-enoic acid Chemical compound OC(=O)C=C.OP(O)(O)=O WDHYRUBXLGOLKR-UHFFFAOYSA-N 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
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- 159000000001 potassium salts Chemical class 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- DGYNEKPTRLXGTP-UHFFFAOYSA-N propane-1,3-diamine Chemical compound NCCCN.NCCCN DGYNEKPTRLXGTP-UHFFFAOYSA-N 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
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- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- 229940014800 succinic anhydride Drugs 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical class ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 231100000721 toxic potential Toxicity 0.000 description 1
- 230000002110 toxicologic effect Effects 0.000 description 1
- 231100000027 toxicology Toxicity 0.000 description 1
- IALIDHPAWNTXOK-UHFFFAOYSA-N tricosanal Chemical compound CCCCCCCCCCCCCCCCCCCCCCC=O IALIDHPAWNTXOK-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/66—Sealings
- E04B1/68—Sealings of joints, e.g. expansion joints
- E04B1/6806—Waterstops
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2409/00—Presence of diene rubber
- C09J2409/006—Presence of diene rubber in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2409/00—Presence of diene rubber
- C09J2409/008—Presence of diene rubber in the pretreated surface to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2415/00—Presence of rubber derivatives
- C09J2415/006—Presence of rubber derivatives in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2415/00—Presence of rubber derivatives
- C09J2415/008—Presence of rubber derivatives in the pretreated surface to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/16—Presence of ethen-propene or ethene-propene-diene copolymers
- C09J2423/166—Presence of ethen-propene or ethene-propene-diene copolymers in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/16—Presence of ethen-propene or ethene-propene-diene copolymers
- C09J2423/168—Presence of ethen-propene or ethene-propene-diene copolymers in the pretreated surface to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/008—Presence of halogenated polymer in the pretreated surface to be joined
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2453/00—Presence of block copolymer
- C09J2453/006—Presence of block copolymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2453/00—Presence of block copolymer
- C09J2453/008—Presence of block copolymer in the pretreated surface to be joined
Definitions
- the present invention relates to a method for joining
- Joint tapes comprising a) applying a composition comprising at least one latent alkyl borane and substantially free of decomposers for the latent alkyl borane to a
- Joint tape substrate (1) c) contacting the joint tape substrate (1) of b) with a joint tape substrate (2) such that the free - radically curable adhesive is disposed between the two substrates, and d) the
- the present invention also relates to bonded joint tapes according to the method described above.
- joint tape substrates containing unsaturated moieties such as EPDM or SBR
- a latent alkyl borane By treating joint tape substrates containing unsaturated moieties, such as EPDM or SBR, with a latent alkyl borane, subsequent bonding of a radically curable adhesive to the surface of these substrates is substantially favored, so that the process is particularly useful for bonding joint tape substrates based on Fuganbandmaterialien having unsaturated units, can be used.
- Joint tapes are used in connection with concrete structures for sealing against the ingress of water. To ensure a complete seal, individual joint tape ends must be connected, which is usually a connection by welding means electrically heated heating mirror is used. However, a problem with welding joint tapes is that these processes are relatively time consuming, complicated and have a certain amount of time
- EP 1 176 170 describes a method for bonding
- Sealing sheets using epoxy adhesives in which the sealing sheets are to have a thermoplastic polymer having at least one reactive epoxy function.
- EP 1 029 906 describes organoboranes and organoboraneamine complexes for use as pretreatment agents for substrates with less
- compositions described in EP 1 029 906 may be useful as polyethylene, polypropylene or polytetrafluoroethylene (PTFE).
- PTFE polytetrafluoroethylene
- a first aspect of the present invention relates to a method for
- Connecting joint tapes comprising a) applying a
- a composition comprising at least one latent alkyl borane and substantially free of alkyl latent debranching agents on a joint tape substrate (1), b) applying a radically curable adhesive to that latent alkyl borane pretreated
- Joint tape substrate (1) c) contacting the joint tape substrate (1) from b) with a joint tape substrate (2) such that the free - radically curable adhesive is arranged between the two substrates, d) the
- the composition is substantially free of decomplexers for the latent alkyl borane, it is to be understood that the composition preferably less than 5% by weight, more preferably less than 2% by weight, and most preferably no detectable amounts of
- a “decomplexer”, as that term is used herein, is a compound which upon contact with the latent alkyl borane converts it to an active alkyl borane, for example, by reacting an alkylboranamine complex to release alkyl borane with an adduct of the alkyl borane
- Decomplexing agent forms an alkylborane which is present under polymerization conditions as a free radical or generates such.
- suitable decomplexers reference is made to the following statements.
- a latent alkylborane is to be understood as meaning an alkylborane which is in a form in which the formation of radicals is not favored. This can be the case, for example, in that the fourth coordination site of the boron is not blocked by a substituent but, for example, binds the free electron pair of a nitrogen or oxygen.
- the latent alkyl borane is preferably in
- an active species can form, for example, by dissociation of a ligand, wherein a free coordination site is formed on the boron.
- the joint tape substrate is a PVC, EPDM, NBR or SBR substrate, or a substrate of mixtures of these
- PVC / NBR Materials like PVC / NBR.
- Particularly suitable substrates are EPDM, NBR or SBR substrates.
- EPDM, NBR or SBR substrates When referring to PVC, EPDM, NBR or SBR substrates in the foregoing, it is to be understood that said material forms the thermoplastic or elastic base of the substrate, but in addition to this material, other constituents such as fillers, Plasticizers, etc. may be included.
- the substrate should moreover suitably E modulus, determined according to DIN 53457, of ⁇ 1000 MPa, preferably in the range of 1 to 250 MPa and particularly preferably 5 to 60 MPa.
- joint tape substrate is made of said materials as well as conventional additives for such materials (e.g.
- Plasticizer in PVC or colorants and fillers are examples of plasticizer in PVC or colorants and fillers.
- Composition with the latent alkyl borane before the step c) is also applied to the joint tape substrate (2) in order to improve the connection of the free-radically curable adhesive there.
- the free-radically curable adhesive is, in particular, an adhesive based on acrylates, styrene or alkylstyrenes or unsaturated polyesters.
- the radically curable adhesive is an acrylate-based adhesive, i. an adhesive based on (meth) acrylates. It has been found that commercially available acrylate adhesives, when used in the above-described process, provide a good bond to joint tape substrates
- the composition contains at least one latent alkylborane.
- This latent alkyl borane is capable of forming trivalent alkyl boranes.
- Preferred latent alkylboranes are tetravalent compounds, the four
- bonds to the boron three of which are covalent and one in the form of an electronic association with an electron donor, preferably an amine.
- the complex forms a free-radical-generating species in the form of a trivalent alkyl borane. This reaction is favored when the latent alkyl borane comes in contact with another substance, hereinafter referred to as decomplexer or initiator.
- decomplexer or initiator The free-radical-generating species generates free
- latent alkyl boranes are alkyl borates (e.g., alkyl borate salts) or alkyl borane complexes (e.g., alkylboranamine complexes).
- An alkyl borate is a salt of a positive cation and an anionic tetravalent boron. Any alkyl borate that can be converted to an alkyl borane upon contact with a decomplexer can be used in the present invention.
- alkyl borate is an internally blocked one
- a four-coordinate boron species that is part of an internal ring structure comprising two of the four boron coordination sites.
- the internal blocking includes one Structure with one or more rings, wherein the boron atom is part of structures with one or more rings.
- borates in the context of the present invention are the alkali metal salts, in particular the potassium salts, of tri-N-butylbortertbutylate, tri-sec-butylbortertbutylate and of diethyl isopropyloxybortertbutylate.
- Another preferred borate is lithium tri-sec-butylborohydride, available for example under the trade name Calselect LI ® from BASF.
- latent alkyl boranes are dialkylboron compounds such as diethylmethoxyborane, diethylisopropyloxyborane, the
- the latent alkylborane is in the form of an alkylboranamine complex.
- the free radical generating species is a trialkylborane or an alkylcycloalkylborane (ie, the alkylboranamine complex may contain a trialkylborane or an alkylcycloalkylborane).
- Preferred such boranes correspond to the formula B- (R 1 ) 3 , wherein B is boron and R 1 can independently of one another be a Ci-Ci 0 -alkyl group or a C 3 -Cn-cycloalkyl group or two or more of R 1 in the form a cycloaliphatic ring may be present.
- R 1 is a C 1 -C 6 -alkyl group, more preferably a C 1 -C 4 -alkyl group, and most preferably a C 1 -C 3 -alkyl group.
- Alkylboranes are triethylborane, triisopropylborane and tri-N-butylborane.
- the alkylborane is a trivalent alkylborane while the amine can be any amine that reversibly complexes with the borane.
- usable Alkylboranaminkomplexe have the general formula B (R 1) 3 AM, wherein R 1 -C 3 can independently be a Ci-Cn alkyl or C 0 cycloalkyl group, or wherein a plurality of R 1 is a cycloaliphatic Can form a ring.
- R 1 is a Ci- 6 - Alkyl group, more preferably CiC 4 alkyl group, and most preferably C 2 -C 4 alkyl group.
- Particularly preferred alkylboranes are, for example, triethylborane, triisopropylborane and tri-n-butylborane. Of these, the longer chain alkyl boranes such as tri-n-butylborane are most preferred.
- AM stands for an amine radical.
- the amine bound in the alkylboranamine complex according to the present invention can be any amine or mixture of amines which complex with the alkylborane, which complex can be cleaved. This cleavage can occur spontaneously, but it can also be accelerated by adding a decomplexer or by elevated temperatures.
- the attractiveness of using a particular amine in an alkylboranamine complex may be due to the energy difference between the Lewis acid-base complex and the sum of the energies of the isolated Lewis acids (alkylborane) and bases (amine) known as
- Preferred amines include ammonia, primary or secondary amines, or polyamines containing primary or secondary amine groups, as described in US 5,539,070 in Sp. 5, Z. 41 to 53, US 5,106,928 in Sp. 2, Z. 29 to 58 or in US Pat US 5,686,544 in Sp. 7, Z. 29 to Sp. 10, Z. 36 are described. These include ethanolamine, secondary dialkyldiamines or polyoxyalkylenepolyamines, amine terminated reaction products of diamines and compounds having one or more amine reactive groups. Such compounds are disclosed for example in US 5,883,208 in Sp. 7, Z. 30 to Sp. 8, Z. 56.
- these preferably include diprimary amines such as alkyl diprimary amines, aryl diprimary amines, alkylaryl diprimary amines, and polyoxyalkylene diamines.
- Especially preferred amines include N-octylamine, 1,6-diaminohexane (1,6-hexanediamine), diethylamine, dibutylamine, diethylenetriamine, dipropylenetriamine, 1,3-propylenediamine (1,3-propanediamine), 1,2-propylenediamine, 1,2 -Ethandiamine, 1, 5-pentanediamine, 1, 12-dodecanediamine, 2-methyl-1, 5-pentanediamine, 3-methyl-1, 5-pentanediamine, triethylenetetraamine and diethylenetriamine.
- Preferred polyoxyalkylene polyamines include polyethylene oxide diamine, polypropylene oxide diamine, triethylene glycol propylene diamine, polytetramethylene oxide diamine and polyethylene oxide copolypropylene oxide diamine.
- the amine in the organoboranamine complex is preferably in the form of an alkyldiamine having at least one primary amino group, with it being particularly preferred for the alkyl group to contain from 2 to 6 carbon atoms and especially from 2 to 4 carbon atoms.
- the alkyldiamine having at least one primary amino group
- An alkylboranamine complex is a trialkylborane or an alkylcycloalkylborane, and the amine includes a primary amine, a secondary amine, a polyamine having primary or secondary amino groups, or both, ammonia
- Polyoxyalkyleneamine the reaction product of a diamine and a
- alicyclic compounds having, attached to the alicyclic ring, one or more substituents containing an amine group, conjugated imines or mixtures thereof.
- alkylboranamine complexes are the triethylboranediaminopropane complex, the triethylborane diethylenetriamine complex, the tri-n-butylborane methoxpropylamine complex, the Tri-n-butylborandianninopropylamine complex, the tri-sec-butylboranediaminopropane complex, the methylaminoethoxydiethylborane complex and the methylaminoethoxydicyclohexylborane complex.
- the trinobutylborane methoxpropylamine complex is within the scope of the present invention
- a composition comprising the at least one alkylbenzene latent, having a pH of about 7 or more, preferably a pH of 7 to 12, and most preferably a pH of 7 to 10.
- composition comprising at least one latent alkylborane additionally contains a solvent, this being
- Solvent must have sufficient solubility for the latent alkyl borane, so that it is present in the solvent in solution.
- Particularly suitable solvents in combination with latent alkyl boranes according to the present invention are i.a. Hexane, heptane, xylene, ethyl acetate or mixtures thereof. From a toxicological point of view, most preferred of these ethyl acetate.
- the present invention is not subject to any relevant restrictions. It is only necessary that the latent alkyl borane be present in the composition at a level which will produce a marked improvement in the compound of the substrate with the radically curable substance.
- the latent alkylborane is preferably present in the composition at a level of from about 0.05 to 50% by weight, in particular from 1% to 40% by weight, particularly preferably from about 2.5 to 30% by weight, and more preferably from 2.5 to 20% by weight, and most preferably from 5 to 10% by weight. It has been shown that even at an amount of 2.5 wt .-% of latent
- Alkyl boranes a significant improvement in torsional strength in MPa is achieved, while at levels of 15 to 30 wt .-% results only are marginally better than at lower concentrations of the latent alkyl borane.
- Suitable free-radically curable monomers in this context are in particular (meth) acrylates, as described below for the free-radically curable substance. It is necessary for these (meth) acrylates alone that they have no decomplexing properties, i. have, inter alia, no carboxyl groups,
- methacrylates such as tetrahydrofurfuryl methacrylate
- amino methacrylates such as dimethylaminoethyl methacrylate and benzyl methacrylate.
- mixtures of the stated (meth) acrylates can be used.
- the ratio of the additional free-radically curable monomers to the latent alkylborane is not critical, but is preferably in the range from 100: 1 to 1: 5, in particular 10: 1 to 1: 5, more preferably 5: 1 to 1: 5, more preferably 3: 1 to 1: 3, and most preferably between 2: 1 and 1: 2. Based on the amount of the radically curable monomer in the latent alkyl borane-containing composition, it is further preferred that the
- Total amount of radically curable monomers in the composition not more than 30 wt .-%, in particular not more than 20 wt .-% and particularly preferably not more than 15 wt .-% is.
- an additional amine can react with a peroxide or hydroperoxide used in the radically curable composition to accelerate the cure of the radically curable composition.
- Suitable amines in this context are, for example, aromatic aniline derivatives, in particular ⁇ , ⁇ -diethylaniline, hydroxyethylated anilines, such as N, N-bis (2-hydroxyethyl) -p-toluidine (Bisomer PTE) and halogenated derivatives thereof.
- aromatic aniline derivatives in particular ⁇ , ⁇ -diethylaniline, hydroxyethylated anilines, such as N, N-bis (2-hydroxyethyl) -p-toluidine (Bisomer PTE) and halogenated derivatives thereof.
- Hydroperoxides are amine-aldehyde condensation products such as e.g. 3,5-Diethyl-1,2-dihydro-1-phenyl-2-propylpyridine (DHP).
- DHP 3,5-Diethyl-1,2-dihydro-1-phenyl-2-propylpyridine
- the latent alkyl borane by a
- Decomplexing agents are activated.
- the decomplexer may be contained in the composition comprising the at least one latent alkylborane in a separately applied composition or in the free radical curable adhesive.
- the decomplexer is not included in the composition comprising the at least one latent alkyl borane, as this may lead to premature activation of the latent alkyl borane and thus would be degraded in whole or in part. Therefore, if the decomplexer is co-applied with the latent alkyl borane, it should not be mixed with the latent alkyl borane until just prior to application.
- the decomplexer is in the free radical curable adhesive since activation of the latent alkyl borane then occurs only upon contact with the free radical curable adhesive.
- the decomplexing agent it is also possible to apply the decomplexing agent as a separate component after the application of the latent alkyl borane to the resulting layer, which is a second pretreatment.
- the decomplexer comprises or consists essentially of mineral acids, organic acids, Lewis acids, isocyanates,
- Suitable organic acids as decomplexing agents are, for example, acids according to the general formula R-COOH, where R is hydrogen, an alkyl group having 1 to 20, preferably 1 to 11, and particularly preferably 1 to 4 carbon atoms or an aryl group having 6 to 10, preferably 6 to 8 carbon atoms can be.
- di-functional acids for example maleic acid or itaconic acid.
- the alkyl group may be a straight-chain or branched alkyl. It can be unsaturated or saturated.
- Exemplary acids include acrylic acid, methacrylic acid, acetic acid, benzoic acid and p-methoxybenzoic acid.
- Suitable Lewis acids are, for example, SnCl 4 , TiCl 4 and the like.
- Suitable mineral acids are, for example, HCl, H 2 SO 4 , H 3 PO 4 and the like.
- Other suitable organic acids as decomplexing agents are, for example, acids according to the general formula R-COOH, where R is hydrogen, an alky
- Decomplexing agents are copolymerizable decomplexing agents, such as zinc di (meth) acrylate (available, for example, from the
- Dymalink 705 and Dymalink 708) calcium di (meth) acrylate, or hydroxyethyl (meth) acrylate phosphate (available, for example, under the tradenames Sartomer SR9051, 9050 or 9054).
- bifunctional decomplexers which have both an unsaturated moiety and an acid function has proved particularly expedient.
- acid function such compounds act as decomplexers for the latent alkyl borane, while the unsaturated moiety allows incorporation of the decomplexing agent into the radically curable substance. Thereby, leakage of the decomplexing agent over time from the cured substance can be suppressed.
- decomplexers are in this context unsaturated carboxylic acids such as acrylic or methacrylic acid, itaconic acid, maleic acid or monoadducts of hydroxy-functional (meth) acrylates such as hydroxyethyl methacrylate and dicarboxylic acids or their anhydrides such as succinic anhydride.
- the decomplexer may be present in a concentration high enough for at least a portion of the latent alkyl borane contained in the composition to react with the decomplexer.
- the amount of decomplexing agent contained in the adhesive is usually matched to the amount of latent alkyl borane contained.
- the decomplexing agent may be used, for example, in a concentration of more than 0.05% by weight, preferably more than 0.5% by weight, more preferably more than about 1% by weight, and most preferably more than about 2% by weight. %, based on the total weight of the composition.
- the decomplexer may be present in a concentration of less than about 15% by weight, preferably less than about 10% by weight, more preferably less than about 7% by weight, and most preferably less than about 6% by weight. based on the total weight of the composition. It is also possible to use mixtures of several Use decomplexing agents, wherein the total weight of all decomplexers in the above-mentioned areas.
- acrylates and methacrylates include methyl (meth) acrylate,
- Ethyl (meth) acrylate isobornyl (meth) acrylate, cyclohexyl (meth) acrylate,
- Adhesive properties show as (meth) acrylates with non-aliphatic components such as aromatics or ether groups.
- non-aliphatic components such as aromatics or ether groups.
- the acrylate-based adhesive does not contain exclusively (meth) acrylates with non-aliphatic constituents.
- Especially preferred (meth) acrylates contained in the acrylate-based adhesive are, in particular, tetrahydrofurfuryl (meth) acrylate, benzyl (meth) acrylate and phenoxyethyl (meth) acrylate.
- the composition preferably comprises one, two or more of the aforementioned (meth) acrylates.
- trimethylcyclohexyl (meth) acrylate-based acrylate adhesives show only a relatively slight improvement in adhesion after the application of a latent alkyl borane. In the context of the present invention it is therefore preferred if the acrylate-based adhesive is not on
- Trimethylcyclohexyl (meth) acrylate is based, i. that this (meth) acrylate does not make up the majority (in moles) of the (meth) acrylate components.
- the acrylate-based adhesive contains trimethylcyclohexyl (meth) - acrylate in a maximum amount of 10 wt .-%, preferably 5 wt .-% and in particular 1 wt .-% (based in each case on the total weight of the composition). In a particularly preferred embodiment, the acrylate-based adhesive contains no trimethylcyclohexyl (meth) acrylate.
- the acrylate-based adhesive may have further radically polymerizable constituents.
- these are crosslinking monomers such as allyl (meth) acrylate or crosslinking difunctional or higher functional (meth) acrylates such as oligomeric or polymeric compounds of the formula (I).
- the radical R 3 stands for a hydrogen atom or for a methyl group.
- the subscript m stands for a value of 2 to 5.
- Z is a polyol, in particular a polyester polyol, a polycarbonate polyol or a
- Polyether polyol such as polyethylene or polypropylene glycol, after removal of m hydroxyl groups and Y is O or NR ', where R' is a hydrocarbon radical or a hydrogen atom, preferably a
- the compound of the formula (I) is in particular selected from the group consisting of ethylene glycol di (meth) acrylate, 1,3- and 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, ethoxylated and propoxylated Neopentyl glycol di (meth) acrylate, propoxylated glyceryl tri (meth) acrylate,
- m in the compound of formula (I) is a value of 2 and Z is a polymeric polyol after removal of two OH groups.
- this polymeric polyol is a polyalkylene polyol, a polyoxyalkylene polyol or a polyurethane polyol; a polyhydroxy-functional ethylene-propylene-diene, ethylene-butylene-diene or ethylene-propylene-diene copolymer; a polyhydroxy-functional copolymer of dienes such as 1,3-butadiene or diene mixtures and vinylimonomers such as styrene, acrylonitrile or isobutylene; a polyhydroxy-functional polybutadiene polyol; a polyhydroxy-functional acrylonitrile / butadiene copolymer; or a polysiloxane polyol.
- such di- or trifunctional (meth) acrylates are selected from the group consisting of polyethylene glycol di (meth) acrylate such as
- Z a diphenol, in particular an alkoxylated diphenol, after removal of two OH groups, preferably ethoxylated bisphenol A.
- a difunctional (meth) acrylate is below the
- difunctional (meth) acrylates such as epoxy (meth) acrylates, in particular epoxy (meth) acrylates, which are obtainable from the reaction of bisphenol A diglycidyl ether with (meth) acrylic acid.
- difunctional (meth) acrylate under the trade name Sartomer CN ® 104 commercially available from Sartomer Company, Inc., USA.
- Suitable vinyl-functionalized prepolymers are based, for example, on polyhydroxy-terminated acrylonitrile / butadiene copolymers and are typically cally from carboxyl-terminated acrylonitrile / butadiene copolymers which performance, for example under the name Hypro ® CTBN from Emerald Performance Materials, LLC, United States, commercially available, and epoxides or
- Such suitable vinyl-functionalized prepolymers of formula (I) are for example commercially available from Kraton Polymers, USA, or under the trade names Hypro ® VTB and Hypro ® VTB NX performance by the company Emerald Performance Materials, LLC, USA.
- Another example of vinyl-functionalized prepolymers are acrylate-capped polybutadiene prepolymers (e.g., oligomers) commercially available, for example, from Emerald Performance Materials under the tradename Hypro.
- One such preferred compound is Hypro TM VTB 2000X168.
- the vinyl-functionalized prepolymer may also be a
- Polyurethane (meth) acrylate act. Such compounds are
- Hydroxyalkyl (meth) acrylates such as hydroxypropyl acrylate (HPA), hydroxypropyl methacrylate (HPMA), hydroxybutyl acrylate (HBA) or hydroxybutyl methacrylate (HBMA), preferably hydroxyethyl acrylate (HEA) or hydroxyethyl methacrylate (HEMA), are particularly suitable for the reaction with the isocyanate groups of the polyisocyanate.
- HPA hydroxypropyl acrylate
- HPMA hydroxypropyl methacrylate
- HBA hydroxybutyl acrylate
- HBMA hydroxybutyl methacrylate
- HEMA hydroxyethyl acrylate
- HEMA hydroxyethyl methacrylate
- Polyurethane (meth) acrylates can also be prepared by
- polyurethane (meth) acrylates can be prepared by the reaction of a (meth) acrylic acid ester which has at least one isocyanate group, with a hydroxyl-containing polyurethane polymer or with a polyol, as used for example in the present
- Suitable polyisocyanates are commercially available polyisocyanates, in particular diisocyanates.
- Suitable polyols are in particular polyether polyols, polyester polyols and polycarbonate polyols and mixtures of these polyols.
- the polyol is a diol, in particular polyoxypropylenediol or
- polystyrene resin Most preferably, the polyols are as nonpolar as possible.
- a preferred acrylate capped polyurethane prepolymer is CN 973J75 from Sartomer Company, Inc.
- prepolymers which can be used in the context of the present invention are those which consist of polyols, such as, for example, polypropylene glycol,
- Polyethylene glycol or polytetrahydrofuran are produced. It is also possible to use mixtures of different polyols as the basis of the acrylate-capped prepolymers, for example a mixture of
- the vinyl-functionalized prepolymer is preferably an elastomer, in particular a polyurethane (meth) acrylate and / or a vinyl-terminated acrylonitrile / butadiene copolymer.
- the radically curable adhesive may be one of the aforementioned
- the free-radically curable comprises
- Adhesive but a combination of two, three or more components that can be cured by means of a radical polymerization.
- a radical polymerization e.g. a plurality of acrylates or methacrylates compositions having one or more different advantageous properties, such as
- Adhesive properties or different fracture properties may also be useful, in addition to acrylates and / or methacrylates, to include other free-radically curable components in the free-radically curable adhesive which are not based on acrylates or methacrylates.
- additional components may generally be added in the form of monomers, oligomers or prepolymers.
- Such components include, for example, styrene and alkylated styrene types (eg, methylstyrene), allyl compounds, vinyl compounds, methallyl compounds, etc.
- the amount of such additional monomers be in the radically curable adhesive when substantially acrylates or methacrylates is less than about 40%, more preferably less than about 30%, more preferably less than about 20%, and most preferably less than about 10%, based on the total weight of free-radically curable monomers in the acrylate-based adhesive.
- the amount of radically curable components, ie, monomers and optionally oligomers and / or prepolymers, in the radically curable adhesive is preferably about 10% by weight or more, more preferably about 15% by weight or more, even more preferably about 20 wt% or more, and most preferably about 30 wt% or more based on the total weight of the radically curable adhesive.
- the content of compounds that can be polymerized by free radical polymerization is preferably about 90% by weight or less, based on the total free-radically curable adhesive, more preferably about 85% by weight or less, and most preferably about 80% Wt% or less.
- the monomer content may also be higher, for example in the range from 90 to 95% by weight, based on the total weight of the free-radically curable adhesive.
- the radically curable adhesive may comprise one, two, three or four compounds selected from the group consisting of methyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, lauryl ( meth) acrylate, Benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, an acrylate or methacrylate having an epoxy ring, an acrylate or methacrylate having an acetal group, such as isopropylideneglycerol (meth) acrylate, glycerol formal- (meth) acrylate or (5-ethyl -1, 3-dioxan-5-yl) methyl (meth) acrylate, and an acrylate or
- the free radical curable adhesive may also contain one or more fillers.
- the filler may be contained in the first component or in the second component or in both components. It has been observed that compositions containing multiple fillers have surprisingly good adhesiveness to the substrates.
- the fillers which can be used in the polymerizable composition include talc, mica, wollastonite, calcium carbonate, barium sulfate, magnesium carbonate, clay, alumina, silica, fumed silica, calcium sulfates, carbon fibers, glass fibers, metal fibers, silica sand, activated carbon, titanium dioxide, magnesium hydroxide, Zeolite, molybdenum, kieselguhr, sericite, white sand, calcium hydroxide, calcium sulfite, sodium sulfate, bentonite, graphite, glass particles, glass beads, clay nanoparticles, kaolinite, lllite, smectite, sepiolite, vermitikulite, pyrophyllite, sauconite, saponite, nontronite, montmorillonite, magnesium aluminum silicate , Metal carbonates, feldspar, mica, quartz and mixtures thereof.
- Suitable fillers may be treated or untreated.
- Exemplary fillers include, without limitation, talc, calcium carbonate, calcined silica, clay, or a combination thereof. Several of these fillers can be used.
- the polymerizable composition may contain fumed silica and a treated (or untreated) calcium carbonate.
- organic fillers in the polymerizable composition.
- Suitable organic fillers are, for example, those which have elastomeric or toughening properties Have properties.
- examples of such fillers are core-shell polymers such as MBS and AIM types that are available, for example under the trade names Durastrength ® or Clearstrength ® from Arkema under the trade name Paraloid ® from Dow Chemical, or Blendex ® from KaneAce.
- Other useful organic fillers are elastomers based on SBS block copolymers and the like (available, for example, under the trade name Kraton), as well as chlorosulfonated polyethylenes, available, for example, under the trade name Tosoh CSM.
- the filler may be used in a concentration of about 0 wt% or more, preferably about 5 wt% or more, and more preferably about 10 wt% or more, based on the total weight of the acrylate-based adhesive ,
- the filler may be present at a level of about 50% by weight or less, preferably about 40% or less, more preferably about 30% or less, and most preferably about 25% or less by weight, based on the total weight of the polymerizable composition.
- the filler may be present at a level of from about 0% to about 50%, preferably from about 5% to about 40%, and most preferably from about 10% to about 30%, by weight, based on the total weight of the polymerizable composition.
- Inorganic fillers are preferably included in the polymerizable composition in an amount of about 0-40%, while organic fillers are preferably contained in an amount in the range of 0-50% in the polymerizable composition.
- the free-radically curable adhesive to be included and in particular the acrylate-based adhesive, expediently has an open time in the range from 3 to 45 minutes. Open time is understood to mean the time within which the adhesive has a wetting property for the substrate (s) which is sufficient for bonding.
- Open time is understood to mean the time within which the adhesive has a wetting property for the substrate (s) which is sufficient for bonding.
- the joint tape substrate (1) and preferably also the joint tape substrate (2) are provided with an airtight envelope before the application of the acrylate-based adhesive.
- a sheath is a sleeve having an inlet for the addition of the adhesive and an outlet for the escape of air in the sleeve.
- the radically curable adhesive is then introduced into the airtight envelope so that it can contact the joint tape substrate (1) and the joint tape substrate (2), while air contact of the adhesive, for example, only in the region of the outlet and optionally in the region of the inlet of the sleeve, in the adhesive is introduced, is possible.
- the airtight wrapper can be removed again from the resulting adhesive bond.
- the joint tape ends of the joint tape substrates (1) and (2) are fixed in a holding device before applying the free-radically curable adhesive.
- the aforementioned cuff is expediently designed so that in addition to the provision of an airtight envelope and a fixation of the joint band ends is possible.
- Another aspect of the present invention relates to bonded joint tapes, which are obtainable by a method as explained above.
- the present invention also relates to a joining system consisting of
- composition comprising at least one latent alkyl borane and substantially free of alkyl latent debranching decomplexers as described above and ii) a free radical curable adhesive.
- Another aspect of the present invention relates to the use of a composition containing an alkyl borane latent as described above as an activator for the bonding of joint tapes, preferably EPDM and SBR joint tapes.
- joint tapes preferably EPDM and SBR joint tapes.
- activator in the context of the present invention means that the composition is used for a pretreatment of the substrate and itself essentially free of decomplexing agents is.
- the activator usually has a different composition than an adhesive.
- substantially is to be understood as meaning that the composition contains less than about 5% by weight, preferably less than about 2% by weight, and most preferably no decomplexers.
- the present application also includes a method of joining PVC joint tapes comprising a) applying a free-radically curable adhesive to the PVC joint tape substrate (1), b) contacting the joint tape substrate (1) of a) with a joint tape substrate (2 c) allowing the acrylate adhesive to cure to form a composite without this method comprising applying a composition comprising at least one latent alkylborane and substantially free of decomplexing agents the latent alkyl borane is included on the joint tape substrate (1).
- Particularly preferred free-radically curable adhesives in this context are acrylate-based adhesives and in particular methyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, benzyl (meth) acrylate, isopropylideneglycerol (meth) acrylate, glycerol formal (meth) acrylate or (5-ethyl -1, 3-dioxan-5-yl) methyl (meth) acrylate based adhesives, ie Adhesives containing, based on the total amount of free-radically curable monomers 35 wt .-% or more, preferably 50 wt .-% or more of the specified (meth) acrylates. Most preferred in this context are methyl methacrylate based adhesives.
- the present invention also covers correspondingly bonded joint tapes.
- the above invention provides a simple and inexpensive method with which it is possible to bond joint tapes, in particular those of otherwise difficult to bond materials such as EPDM or SBR.
- this process is associated with the advantages of extended open times, reduced cure times and improved storage stabilities of the adhesives used.
- commercially available adhesives can be used for the bonding, so that the bonding of said materials in a cost effective manner is possible.
- the adhesive bonds obtained by the described method have a very good resistance of the bond even when stored in strongly alkaline solutions such as fresh concrete or concrete pore liquid. This observation is not obvious, especially for acrylate-based adhesives with a significant proportion of acrylate esters, since they saponify at high pH values, resulting in a failure of the bond or at least a marked reduction in the bond strengths, as a result.
- a further aspect of the present invention therefore relates to a method of sealing a structure comprising a) applying to a joint tape substrate (1), b) a composition comprising at least one latent alkyl borane substantially free of decomposers for the latent alkyl borane (C) contacting the joint tape substrate (1) from b) with a joint tape substrate (2) such that the free-radically curable adhesive is interposed between the two substrates, d ) allowing the free-radically curable adhesive to cure to form a composite, and e) contacting the bonded joint tape composite structure with liquid concrete, fresh concrete or concrete pore fluid.
- Example 1 A composition of 90 parts by weight of ethyl acetate and 10 parts by weight of tri-n-butylborane / methoxypropylamine complex (BASF) was applied to various joint tape substrates. For the measurement, the composition was applied with the aid of a brush. After application of the composition and flash-off for a period of 15 to 30 minutes, the alkylboranamine complex remained in a layer thickness of about 2 ⁇ on the substrate. Subsequently, the adhesive (SikaFast 5211 NT) was applied to the treated area in a layer thickness as indicated below. This adhesive contains calcium dimethacrylate as a decomplexer.
- the substrates used were a PVC substrate (AF-600 from Sika), an EPDM substrate (FPK 350 from Sika Tricosal lllertissen) and an SBR substrate (from extrutec Gummi GmbH).
- the T-peel test was carried out in accordance with DIN EN 14173 at a test speed of 100 mm / min.
- the substrates used were strips of the respective material with the following dimensions: length 150 mm, width 40 mm, height 4 mm (PVC), 5 mm (EPDM) or 6 mm (SBR).
- the adhesive was applied in a thickness of 0.3 mm.
- the tensile shear strength was determined on the basis of DIN EN 1465 at a test speed of 10 mm / min.
- the substrates used were strips of the respective material with the following dimensions: length 100 mm, width 25 mm, height 4 mm (PVC), 5 mm (EPDM) or 6 mm (SBR).
- the adhesive was applied in a thickness of 1.5 mm.
- the tensile strength was determined on the basis of DIN EN ISO 527 at a test speed of 100 mm / min.
- the substrates used were strips of the respective material with the following dimensions: length 70 mm, width 25 mm, height 4 mm (PVC), 5 mm (EPDM) or 6 mm (SBR).
- the adhesive was applied in a thickness of 1.0 mm.
- Example 2 compositions having various levels of Organoboranaminkomplexen be with respect to a bonding of NBR and SBR rubbers (with the adhesive Sika Fast ® -5211 NT based on Tetrahydrofurfuryl methacrylate).
- NBR or SBR substrate is treated with a primer composition comprising various amounts of triethyl borane diaminopropane complex (dissolved in heptane).
- the adhesion promoter was applied by means of a brush. After application of the adhesion promoter and flash-off for a period of 15 to 30 minutes, this remained with a layer thickness of about 2 ⁇ on the substrate. Subsequently, the adhesive is applied in a layer thickness of 1 mm on the treated surface.
- the torsional strength of the bond was determined with the following test specification:
- a round aluminum test specimen corona-shaped, outer diameter 25 mm, inner diameter 15 mm
- a round PTFE spacer was then inserted, which extends beyond the test piece and serves to set an adhesive thickness of 1 mm.
- the premixed adhesive was applied to the aluminum mold.
- the aluminum mold was then pressed onto a substrate with the adhesive side so that the adhesive was located in the area of the aluminum mold minus the spacer. With the help of a spatula was excess adhesive that has been pressed out when placing the specimen on the substrate from the joint, removed.
- BO borane complex dissolved in heptane, in percent by weight
- TEB-DAP triethylborane-diaminopropane complex
- ADPrep Sika ® ADPrep (standard primer for 2K acrylic adhesives)
- 5211 NT SikaFast ® -5211 NT
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- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15171397.1A EP3103847A1 (de) | 2015-06-10 | 2015-06-10 | Verbindung von fugenbändern |
| PCT/EP2016/062552 WO2016198319A1 (de) | 2015-06-10 | 2016-06-02 | Verbindung von fugenbändern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP3307842A1 true EP3307842A1 (de) | 2018-04-18 |
Family
ID=53397860
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP15171397.1A Withdrawn EP3103847A1 (de) | 2015-06-10 | 2015-06-10 | Verbindung von fugenbändern |
| EP16730706.5A Withdrawn EP3307842A1 (de) | 2015-06-10 | 2016-06-02 | Verbindung von fugenbändern |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP15171397.1A Withdrawn EP3103847A1 (de) | 2015-06-10 | 2015-06-10 | Verbindung von fugenbändern |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20190010360A1 (de) |
| EP (2) | EP3103847A1 (de) |
| AU (1) | AU2016274431A1 (de) |
| WO (1) | WO2016198319A1 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114292596A (zh) * | 2021-12-08 | 2022-04-08 | 上海复合材料科技有限公司 | 固体发动机中三元乙丙橡胶内隔热的胶接方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1176170A (en) * | 1915-04-29 | 1916-03-21 | Herman A Schatz | Method of assembling the parts composing ball-bearings. |
| US5106928A (en) | 1991-04-29 | 1992-04-21 | National Starch And Chemical Investment Holding Corporation | Acrylic adhesive composition and organoboron initiator system |
| EP1029906B1 (de) * | 1994-02-22 | 2004-12-08 | Minnesota Mining And Manufacturing Company | Verbundmaterial enthaltend polymerisierbare Acrylzusammensetzung mit auf Organoboran-Amin-Komplexen basierenden Initiatorsystemen |
| DE69427411T2 (de) | 1994-02-22 | 2002-06-06 | Adhesive Res And Mfg Co | Polymerisierbare zusammensetzung die polymerisationsinitiatorsysteme auf basis von organoboran-amin-komplexen enthält |
| US5686544A (en) | 1995-08-11 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Organoborane polyamine complex initiator systems and polymerizable compositions made therewith |
| EP0859801B1 (de) | 1995-11-07 | 2001-06-13 | Minnesota Mining And Manufacturing Company | Initiator system und klebstoff zusammensetzung diesen enthaltend |
| DK1176170T3 (da) * | 2000-07-25 | 2006-08-14 | Huber+Suhner Ag | Tætningsbaner til byggeriet samt fremgangsmåde til fremstilling og anvendelse heraf |
| EP1201722A1 (de) | 2000-10-23 | 2002-05-02 | Loctite (R & D) Limited | Polymerisationsinitiatoren, polymerisierbare Zusammensetzungen und deren Verwendungen |
| US6630555B2 (en) | 2001-11-06 | 2003-10-07 | Lord Corporation | Internally blocked organoborate initiators and adhesives therefrom |
| WO2003089536A2 (en) | 2002-04-19 | 2003-10-30 | Loctite (R & D) Limited | Polymerisation initiators based on ammonium tetraalkyl boranes, polymerisable compositions, and uses thereof for bonding low surface energy substrates |
| DE10336565A1 (de) * | 2002-08-15 | 2004-02-26 | Henkel Kgaa | Mehrschichtiges Fugenband |
| WO2006001787A1 (en) | 2003-06-09 | 2006-01-05 | Dow Global Technologies Inc. | Stabilized organoborane polymerization initiators and polymerizable compositions |
| MXPA06001707A (es) * | 2003-08-13 | 2006-05-19 | Dow Global Technologies Inc | Metodo para unir sustratos y objetos. |
| US7524907B2 (en) * | 2006-10-12 | 2009-04-28 | Dow Global Technologies, Inc. | Accelerated organoborane initiated polymerizable compositions |
| US8742050B2 (en) * | 2008-03-28 | 2014-06-03 | Henkel US IP LLC | Two part hybrid adhesive |
| WO2011002687A1 (en) * | 2009-06-29 | 2011-01-06 | Illinois Tool Works Inc. | Low volatile organic compound adhesive for attaching thermoplastic polyolefin roofing membranes |
| EP2650316A1 (de) * | 2012-04-10 | 2013-10-16 | Sika Technology AG | Radikalisch härtbare Zusammensetzungen geeignet für das Verkleben von weichmacherhaltigem PVC |
| US9382452B2 (en) * | 2013-02-07 | 2016-07-05 | Illinois Tool Works, Inc. | Low surface energy bonding adhesive formulation and process for the use thereof |
| US9350635B2 (en) * | 2013-07-18 | 2016-05-24 | Cisco Technology, Inc. | Efficient network probing for deterministic wireless networks |
-
2015
- 2015-06-10 EP EP15171397.1A patent/EP3103847A1/de not_active Withdrawn
-
2016
- 2016-06-02 EP EP16730706.5A patent/EP3307842A1/de not_active Withdrawn
- 2016-06-02 WO PCT/EP2016/062552 patent/WO2016198319A1/de not_active Ceased
- 2016-06-02 US US15/576,748 patent/US20190010360A1/en not_active Abandoned
- 2016-06-02 AU AU2016274431A patent/AU2016274431A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20190010360A1 (en) | 2019-01-10 |
| AU2016274431A1 (en) | 2017-12-21 |
| WO2016198319A1 (de) | 2016-12-15 |
| EP3103847A1 (de) | 2016-12-14 |
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