EP3293453A1 - Beleuchtungsvorrichtung mit wärmeableitungselement - Google Patents

Beleuchtungsvorrichtung mit wärmeableitungselement Download PDF

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Publication number
EP3293453A1
EP3293453A1 EP16382418.8A EP16382418A EP3293453A1 EP 3293453 A1 EP3293453 A1 EP 3293453A1 EP 16382418 A EP16382418 A EP 16382418A EP 3293453 A1 EP3293453 A1 EP 3293453A1
Authority
EP
European Patent Office
Prior art keywords
wire
lighting device
loop
wire loop
loops
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16382418.8A
Other languages
English (en)
French (fr)
Inventor
Carlos Gomez
Gonzalo MADORRAN TIL
Juan Eugenio Valdivielso
Eric Moisy
Juan-Francisco MORENO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Iluminacion SA
Original Assignee
Valeo Iluminacion SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Iluminacion SA filed Critical Valeo Iluminacion SA
Priority to EP16382418.8A priority Critical patent/EP3293453A1/de
Publication of EP3293453A1 publication Critical patent/EP3293453A1/de
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/673—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for intake

Definitions

  • This invention belongs to the field of lighting devices which comprises heat dissipation elements, such as radiators.
  • Light sources such as light-emitting diodes (LEDs) generate heat during its operation. If they overheat, lighting properties may decrease or even fail. These light sources are usually installed on heat sinks, which provide heat dissipation. In some occasions, a heat-dissipating device is required to increase the heat dissipation of the heat sink.
  • LEDs light-emitting diodes
  • radiators with metal layers which are bended to achieve a greater contact surface between air and metal.
  • the invention provides a solution for this problem by means of a heat dissipation element for circuits according to claim 1.
  • Preferred embodiments of the invention are defined in dependent claims.
  • the invention provides a lighting device comprising a light source, a heat sink and a heat dissipation element
  • the wire loops are made of solid wire, i.e., a filiform piece which is made of the same material in its entirety (without any cavity, as in the case of heat pipes).
  • This solid wire may be made of metal, such as copper or aluminium, of a composite material, such as graphite fibres embedded in a plastics matrix, or of any other material which are good heat conductors, thus ensuring proper heat dissipation from the heat sink.
  • a wire loop may be embodied in different ways.
  • the heat dissipation element has a helix shape, and that all wire loops are part of the same continuous solid wire. In this way, a wire loop would be one helix turn, and each wire loop usually has one attachment point where each wire loop is attached to the heat sink.
  • each wire loop is an individual piece of solid wire.
  • each wire loop is closed, such as, for example, a circle or a polygon with rounded vertices.
  • each wire loop is open, and is usually attached to the heat sink in at least two attachment points, the heat sink being the closure of these wire loops.
  • the thermal contact between the light source and the heat sink should be understood in the sense that the lighting device enables heat transfer between the light source and the heat sink, either by direct contact or by means of an intermediate element.
  • This thermal contact may be embodied in some different ways.
  • the lighting device would comprise a plastic substrate with a conductive track directly deposited on it and the light source being placed in direct contact with the heat sink but electrically connected to the conductive track.
  • the lighting device would comprise a printed circuit board comprising the circuit tracks, with the light source also comprised in it, the light source being in thermal contact with the heat sink by means of this printed circuit board.
  • Such a lighting device may be used with high-intensity light sources, as the heat dissipation element with solid wire loops is a cheap, easy-to-manufacture solution (compared to e.g. heat pipes) which, however, achieves proper heat dissipation.
  • the wire of the at least one wire loop comprises metal, such as, for example, copper or aluminium.
  • the wire of at least one wire loop comprises a composite material comprising a plastic material and graphite fibres. These materials are good heat conductors, thus ensuring proper heat dissipation from the heat sink.
  • the wire of at least one of the wire loops comprises a cross section which is circular. In some embodiments, the wire of at least one of the wire loops comprises a cross section which is elliptic. In some embodiments, the wire of at least one of the wire loops comprises a cross section which has a rectangular shape.
  • Circular cross sections are a good solution for heat dissipation from a solid wire.
  • An elliptic cross section and a rectangular cross section are suitable for directing the airflow, depending on the orientation.
  • one or several of these cross sections maybe suitable for the heat dissipation element.
  • the wire of the wire loop which has a circular cross section with an area comprised between 0.8 and 7 mm 2 . This size range is suitable for optimal heat dissipation, considering the standard dimensions of a heat sink in the field of automotive lighting.
  • the light source comprises at least one LED. This kind of light source provides a good lighting power with a very low electric power consumption.
  • the heat dissipation element comprises a first wire loop and a last wire loop in such a way that all the wire loops are located following a tube arrangement between the first wire loop and the last wire loop.
  • This tube arrangement should be understood as a way of placing the wire loops, where adjacent wire loops are placed regularly one after the other, following the silhouette of an open tube.
  • This arrangement comprising wire loops may allow an airflow run from the first wire loop to the last wire loop in a continuous way, most of the airflow exiting through the last wire loop to open space. This leads to an improved cooling performance of the heat dissipation element.
  • the wire loops define an inner volume and the light source is located inside the inner volume.
  • the light source is located inside the airflow.
  • every wire loop is contained in a loop plane
  • the heat sink is contained in a sink plane and each loop plane forms between 40° and 140° with respect to the sink plane.
  • This embodiment relates to the wire loops which are separated pieces of solid wire, each wire loop being contained in a loop plane. At least some of the loop planes of this embodiment may form a non-perpendicular angle with the sink plane for causing a specific airflow pattern.
  • the wire loops are part of the same continuous wire.
  • the manufacture of the wire loops may be easily achieved, by shaping a single wire and attaching it in some attaching points to the heat sink.
  • the lighting device further comprises a fan device, suitable for forcing air to circulate through the inner volume.
  • This fan device such as a mechanical fan or a compressor, improves the cooling performance of the heat dissipation element included in the lighting device. Hence, even higher intensity light sources may be used, as this improved cooling performance is able to greater heat dissipation.
  • This arrangement leads to an intermediate region between the first region and the second region where there are no wire loops.
  • This intermediate region is usually located near the light source, where the cooling requirements are higher.
  • An arrangement with this intermediate region comprising a lower density of wire loops near the light source has proven to be advantageous for the cooling efficiency of the cooling device comprised in this lighting device.
  • the wire loops are arranged in a symmetrical way with respect to a plane which is perpendicular to a sink plane where the heat sink is contained. This arrangement is adapted for different airflow conditions, as air may flow in one direction or in the opposite direction.
  • the lighting device further comprises a circuit board extending on the heat sink, wherein the light source is electrically connected to the circuit board as part of a circuit.
  • This connection may be embodied in some different ways.
  • Figures 1a to 1d show different embodiments of a lighting device 1 according to the invention.
  • the lighting device 1 comprises a light source 2, a heat sink 3 and a heat dissipation element 4.
  • the light source 2 is in thermal contact with the heat sink 3, i.e. in such a way that heat may be evacuated from the light source 2 to the heat sink 3 by thermal conduction.
  • the heat dissipation element 4 comprises a plurality of wire loops 41 made of a solid wire.
  • the heat dissipation element 4 comprises a first wire loop 43 and a last wire loop 44 in such a way that all the wire loops 41 are located following a tube arrangement between the first wire loop 43 and the last wire loop 44.
  • each wire loop 41 comprises an attachment point 42, this attachment point 42 being attached to the heat sink 3. In this way, heat may be evacuated from the heat sink 3 to the wire loops 41 by conduction.
  • the wire loops 41 may contain more than one attachment point 42 to be joined to the heat sink 3.
  • the wire loops 41 are part of the same continuous solid wire, which has the shape of a helix forming the wire loops 41.
  • Each of the wire loops 41 has one attachment point 42 to thermally attach the wire loop 41 to the heat sink 3.
  • Figure 3b shows another example of wire loops 41 wherein the wire loops 41 are separate wire loops, each wire loop being contained in a loop plane.
  • wire loops 41 have the shape of rectangles with rounded vertices. In other embodiments, these wire loops may have different shapes, such as circles or regular polygons with rounded vertices.
  • one or more attachment points may be provided in each wire loop to thermally attach the wire loop to the heat sink.
  • every wire loop is contained in a loop plane and the heat sink 3 is in turn contained in a sink plane 31.
  • each loop plane forms between 40° and 140° with respect to the sink plane.
  • the first wire loop 43 is the wire loop that forms the smallest angle with respect to the sink plane 31 and the last wire loop 44 is the wire loop that forms the greatest angle with respect to the sink plane 31.
  • the lighting device 1 is similar to the device of figure 3c, except in that there are two regions of wire loops:
  • the first region includes the first wire loop 43 and a first border wire loop 45, which is the wire loop of this first region which is closer to the second region.
  • the second region includes the last wire loop 44 and a second border wire loop 46, which is the wire loop of this second region which is closer to the first region.
  • Each wire loop 41 comprises an attachment point 42 and a top point, which is the point of the wire loop 41 which is farthest from the attachment point 42.
  • the first border wire loop 45 comprises a first top point 48
  • the second border wire loop 46 comprises a second top point 49.
  • first distance d1 which is greater than a half of a second distance d2 between the first top point 48 and the attachment point of the first border wire loop 45.
  • the wire loops 41 are arranged in a symmetrical way with respect to a symmetrical plane 47 which is perpendicular to a sink plane 31 where the heat sink 3 is contained. This feature is common to many embodiments, although in this case there is also a space between the wire loops of the first region and the wire loops of the second region.
  • the attachment between the attachment points and the heat sink is carried out by a process which ensures the thermal contact between the heat dissipation element and the heat sink, e.g., by welding, brazing or curing.
  • the lighting devices comprise a circuit board 5.
  • the circuit board 5 extends on the heat sink 3, and the light source 2 is electrically connected to the circuit board 5, because it is part of a circuit.
  • the light source 2 comprises one LED, but may also comprise two or three LEDs.
  • the circuit board extends on two opposite faces of the heat sink 3, in such a way that the heat sink 3 delimits an upper volume and a lower volume of the lighting device, each volume comprising at least one light source.
  • an inner volume may be defined by the wire loops. This inner volume is limited by parallel straight lines which join adjacent wire loops.
  • the light source is arranged inside this inner volume.
  • the lighting device further comprises fan device, suitable for forcing air to circulate through the inner volume.
  • some embodiments comprise a solid wire with a circular cross section, some embodiments incorporate a solid wire with an elliptic cross section and some embodiments incorporate a solid wire with a rectangular cross section.
  • some of the wire loops are made of solid wire with circular cross section, other wire loops are made of solid wire with elliptic cross section and other wire loops are made of solid wire with rectangular cross section.
  • Figures 2a, 2b and 2c show these three examples of cross sections of the solid wire that form the wire loops.
  • the wire of the wire loops 41 has a cross section with an area comprised between 0.8 and 7 mm 2 , which is suitable for their correct operation.
  • the loops were made of metal, such as copper or aluminium.
  • other materials may be used, such as composite materials, e.g., graphite fibres embedded in a plastics matrix.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
EP16382418.8A 2016-09-09 2016-09-09 Beleuchtungsvorrichtung mit wärmeableitungselement Withdrawn EP3293453A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP16382418.8A EP3293453A1 (de) 2016-09-09 2016-09-09 Beleuchtungsvorrichtung mit wärmeableitungselement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP16382418.8A EP3293453A1 (de) 2016-09-09 2016-09-09 Beleuchtungsvorrichtung mit wärmeableitungselement

Publications (1)

Publication Number Publication Date
EP3293453A1 true EP3293453A1 (de) 2018-03-14

Family

ID=56997438

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16382418.8A Withdrawn EP3293453A1 (de) 2016-09-09 2016-09-09 Beleuchtungsvorrichtung mit wärmeableitungselement

Country Status (1)

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EP (1) EP3293453A1 (de)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275746A (ja) * 1993-03-18 1994-09-30 Hitachi Ltd 半導体装置
JPH1154676A (ja) * 1997-08-07 1999-02-26 Ebara Densen Kk 放熱部品
EP1737035A1 (de) * 2004-03-31 2006-12-27 Jisouken Co. Ltd. Kühlkörper-herstellungsverfahren
JP2007165846A (ja) * 2005-11-16 2007-06-28 Usui Kokusai Sangyo Kaisha Ltd ヒートシンク
WO2009005285A2 (en) * 2007-07-05 2009-01-08 Fawoo Technology Co., Ltd. Heat dissipating device having linear heat dissipating unit and fanless led lamp using the device
US20130188317A1 (en) * 2012-01-20 2013-07-25 Hsin-Yin Ho Heat sink and electronic device having the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275746A (ja) * 1993-03-18 1994-09-30 Hitachi Ltd 半導体装置
JPH1154676A (ja) * 1997-08-07 1999-02-26 Ebara Densen Kk 放熱部品
EP1737035A1 (de) * 2004-03-31 2006-12-27 Jisouken Co. Ltd. Kühlkörper-herstellungsverfahren
JP2007165846A (ja) * 2005-11-16 2007-06-28 Usui Kokusai Sangyo Kaisha Ltd ヒートシンク
WO2009005285A2 (en) * 2007-07-05 2009-01-08 Fawoo Technology Co., Ltd. Heat dissipating device having linear heat dissipating unit and fanless led lamp using the device
US20130188317A1 (en) * 2012-01-20 2013-07-25 Hsin-Yin Ho Heat sink and electronic device having the same

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