EP3283671B1 - Procédé de revêtement d'un composant et utilisation du procédé - Google Patents

Procédé de revêtement d'un composant et utilisation du procédé Download PDF

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Publication number
EP3283671B1
EP3283671B1 EP16712213.4A EP16712213A EP3283671B1 EP 3283671 B1 EP3283671 B1 EP 3283671B1 EP 16712213 A EP16712213 A EP 16712213A EP 3283671 B1 EP3283671 B1 EP 3283671B1
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EP
European Patent Office
Prior art keywords
coating
component
press
small
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP16712213.4A
Other languages
German (de)
English (en)
Other versions
EP3283671A1 (fr
Inventor
Johannes Gündel
André Stein
Mario Lukas
Christian Buchholzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diehl Metal Applications GmbH
Original Assignee
Diehl Metal Applications GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diehl Metal Applications GmbH filed Critical Diehl Metal Applications GmbH
Publication of EP3283671A1 publication Critical patent/EP3283671A1/fr
Application granted granted Critical
Publication of EP3283671B1 publication Critical patent/EP3283671B1/fr
Active legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/26—Connectors or connections adapted for particular applications for vehicles

Definitions

  • the invention relates to a method for coating a component and the use of such a method.
  • a contact element made of a base material with at least one conductive layer made of indium or indium with an admixture or alloy of at least one of the elements from the group of elements containing copper, silver, gold, bismuth, nickel, antimony, palladium , Iron, carbon and phosphorus.
  • a method for producing a crimp connection which is formed from a copper-containing metal plate and a tin plating layer.
  • the thickness of the tin plating layer has a smaller thickness in a crimp surface area where the crimp section is to make contact with the end section of a cable than in a contact surface area where the contact section is to make contact with a counter terminal.
  • a tin plating layer is formed on the metal plate and in a subsequent heat treatment step, the tin plating layer is heated only in an area with the crimp surface area in order to bring this part of the tin plating layer into a mixed crystal state with the metal plate, which results in a reduction in thickness of the tin plating layer.
  • the "press-in technology" known in practice in the automotive industry is a very reliable technology for electrically connecting or contacting electrical components, in particular connectors and circuit boards.
  • a transition from lead-containing materials to pure tin materials was carried out in the past.
  • a major problem with pure tin materials is the formation of whiskers, i.e. the formation of tin chips, which can cause short circuits in the electrical system.
  • Indium as a soldering aid has long been known in practice. It is known to apply indium to a component in any form, but usually by galvanizing. The indium coating is then applied above its melting temperature of e.g. Remelted 150 degrees Celsius. A structural transformation or reflow in the indium coating is achieved in this way.
  • the object of the invention is to provide an improved method for coating a component and to provide an improved use of the method.
  • the method serves for coating a component, the component being in particular an electrical contact element.
  • a coating is applied to the component.
  • the coating has a first material structure.
  • a region of the coating is then selected as the conversion region.
  • a structural change is carried out on the coating.
  • the conversion area comprises at least a partial area of the coating or the entire coating.
  • the coating has a second material structure in the transformation region. In the remaining area of the coating, if necessary, it still has the first material structure.
  • the conversion area is divided into small areas.
  • the structural transformation takes place only in one of the small areas and within a short period of time. Outside the respective small area, there is no structural change within the short-term period.
  • the dimensioning of the small area and the short-term period is dependent on one another in such a way that outside of the small area the previous material structure of the coating is retained within the short-term period.
  • the structural transformation in the small area therefore takes place independently of the remaining coating, that is to say the structural transformation there does not affect the remaining coating.
  • the small area can also be a disjointed area, that is, the structural transformation can take place simultaneously at several locations or areas during the short-term period. In their respective surroundings, however, there is no conversion of the coating during the short period.
  • Small areas can also be processed multiple times within the same or different short-term periods.
  • the short-term periods can be selected to be different or of the same length.
  • the small areas can be chosen to be different or the same size.
  • the melting temperature of the coating is exceeded. Due to the coordinated dimensioning of the small area and the short-term period, the melting temperature becomes a structural change compared to one Conventional structural transformation is only exceeded locally in the small area and only briefly during the short-term period, so that this is sufficient for a structural change in the small area.
  • the remaining material i.e. the remaining coating outside the small area and the remaining component itself, are only slightly thermally stressed during the short period.
  • the process provides a locally and temporally selective reflow process, so that reflow within the small areas can be carried out in a system process independently of the remaining coating.
  • the structural conversion or an energy input necessary for this takes place briefly or quickly and specifically or precisely.
  • the remaining material, i.e. the remaining coating, outside the respective small area and outside the conversion area, as well as the component or basic component to be coated itself, are only slightly thermally stressed, which has an advantageous effect with regard to the mechanical properties of the remaining coating and the basic component, since no changes are to be expected here.
  • components can be machined statically or continuously as described.
  • a connector with a press-in zone is used as the component. At least one of the small areas is then selected so that it corresponds to the press-in zone or corresponds to part of the press-in zone.
  • the component is therefore in particular an element or contact element of a connecting device using press-fit technology.
  • the press-in zone comprises one or more punched edges of the component.
  • the press-in zones are or are located on pins, for example. The process enables a precise and precise structural transformation in the press-in zone, so that there in particular a high-quality coating material is made available, which is transformed with regard to its structure without, for example, melting or migrating or significantly changing in shape. Thus, the press-in zone remains completely and high-quality coated even after a structural change.
  • One with an edge is used as the component.
  • At least one of the small areas is selected so that it corresponds to an edge area or part of the edge area.
  • the at least one small area is thus selected such that it covers both the press-in zone or part of the press-in zone and an edge area or corresponds to part of the edge area.
  • this is achieved in particular in the edge area in that there is no migration of coating material and that the edges remain well wetted with coating material even after the structural change.
  • cut edges on components do not wet out or only slightly. This is especially necessary for contact pins in the edge area if the coating serves as a sliding coating for easy insertion and removal of the pins.
  • Stamped components in particular have such edges, so stamped components are used in particular as components.
  • the coating is applied to the component by means of a galvanizing process.
  • the coating material has the first material structure, which - as a rule only in certain areas, namely in the conversion area - is to be converted into a second material structure by structural conversion.
  • the method according to the invention is therefore particularly suitable for a galvanized component, since it can carry out the structural transformation locally in one work step without converting the remaining coating outside the conversion region.
  • the structural transformation is carried out by a heat source which only locally enters heat to the component.
  • the local limitation refers to the small area or part of the small area.
  • the aforementioned method can be carried out particularly well by an appropriate heat source, since the melting temperature of the coating is actually exceeded only in the small area and the structural transformation can only take place there, with the surrounding areas of the small area not being heated up accordingly and the melting point not being exceeded there and therefore also no structural change takes place.
  • a laser arrangement is used as the heat source.
  • the laser arrangement has a pulsed infrared laser.
  • the laser works in such a way that it has an angle of incidence of between 5 degrees and 90 degrees on the small area.
  • a laser arrangement or a laser beam is particularly suitable for the selective or locally limited introduction of heat and for the brief introduction of heat and is therefore particularly suitable for the method.
  • the laser beam can be dimensioned with such a small diameter that it covers the small area or only a part of the small area and still ensures sufficient heat input.
  • the angle at which the laser beam hits the Surface hits can vary between 5 degrees and 90 degrees depending on the application.
  • a laser is therefore used as a very precise heat source with regard to locality and amount of energy, especially in the area of reflow of surfaces or coatings in press-in zones of plug connectors, also in order to avoid dewetting of the functionally important punched edges.
  • a laser source with a deflection scanner is used as the laser arrangement.
  • the deflection scanner sweeps the small area at least once, in particular several times, during the short-term period.
  • the point of impact of the laser or the beam cross-section is, in particular, smaller, in particular significantly smaller, in particular by orders of magnitude smaller than the small area, and is guided over the small area with the aid of the deflection scanner in such a way that it is nevertheless completely covered by the laser beam at least once in succession within the short time span.
  • Such a laser arrangement enables a particularly well localized and temporally limited introduction of heat into the small area during the short period of time without significantly heating surrounding areas.
  • the energy input into a coating takes place so quickly and so precisely that, particularly on stamped parts, the area in which - for the purpose of structural change - the melting temperature of the coating is exceeded can be very precisely limited.
  • an indium or indium-containing coating is used as the coating.
  • indium alloys are used as the coating.
  • Indium alloys are particularly suitable as a coating for press-fit technology or for such components, since indium (containing) coatings hardly tend to form whiskers.
  • these coatings can advantageously be microstructured, as explained above, which reduces whisker formation.
  • the invention enables indium (containing) layers to be melted in the press-in technology of automotive connectors.
  • the method described above can be used for a component of a connecting device in press-fit technology. It is particularly so with press-fit technology It is important to coat components sufficiently, especially at the press-in edges, the coating being carried out in particular by electroplating and subsequent structural transformation.
  • the method can be used for structural transformation by a reflow at a transformation region, the transformation region being a coating or part of a coating of a press-in zone of a connector.
  • the method according to the invention results in a high-quality structural transformation as described above.
  • the method can be used for a structural transformation of an indium or indium-containing layer as a coating in press-in technology for plug connections in the automotive sector.
  • high-quality connectors are required, especially in press-fit technology, which have a microstructured indium (containing) layer as a coating.
  • Fig. 1 shows an indicated component 2, here a component in the form of a connector of a connecting device in press-in technology in the form of a connector in the automotive sector.
  • the component 2 is an electrical contact element in the form of a contact pin.
  • a coating 4 is first applied galvanically to the component 2 with the aid of a galvanizing process, which has a first material structure M1 after the application.
  • the coating 4 is an indium coating, alternatively an indium-containing coating.
  • the coating 4 is a coating 4 in press-fit technology for connectors in the automotive sector.
  • a structural change is then carried out on the coating 4.
  • the structural transformation takes the form of a reflow at the conversion region 6a.
  • the coating 4 has a second material structure M2 in the transformation region 6a.
  • the remaining area 6b of the coating 4 remains untreated, that is to say retains its first material structure M1.
  • the transformation area 6a is divided into parts, namely small areas 8a-h.
  • the structural transformation takes place only in one of the small areas 8a-h at a time.
  • the structural transformation takes place in a respective short period of time Ta - h.
  • the short-term periods Ta-h Within one of the short-term periods Ta-h, only one of the small areas 8a-h is converted.
  • the remaining small areas 8a-h there is no structural transformation at this short-term period.
  • the small area 8a is thus converted in the short-term period Ta.
  • the small area 8b is converted in the short time span Tb different therefrom and so on.
  • the component 2 as a connector has a press-in zone 10, which is used to make electrical contact with a counterpart, not shown, by press-in technology.
  • the small areas 8a-h are selected so that these parts correspond to the press-in zone 10.
  • the conversion area 6a is a coating in the area of the press-in zone 10 of the connector.
  • the component 2 also has an edge 12.
  • An edge area 14 extends in the area of the edge 12.
  • the small areas 8c and 8d are selected such that they each correspond to a part of the edge area 14. When the regions 8c and 8d are converted, only structures in the edge region 14 are therefore converted.
  • Fig. 2 shows a heat source 16 and is shown schematically again, small areas 8a-i of an alternative coating 4 on an alternative component 2, which is also only indicated here.
  • the heat source 16 serves to introduce heat into one of the small areas 8a-h at a time or during one of the short-term periods Ta-i.
  • the heat input takes place locally limited to one of the small areas 8a-i. For example, only the small area 8a is heated by heat input during the short period of time Ta, so that a structural transformation takes place only there.
  • the remaining small areas 8b-i are not significantly heated, so that no structural change takes place in them.
  • the heat source 16 is a laser arrangement 18, in particular with a pulsed infrared laser.
  • An angle of incidence ⁇ of the laser beam 24 generated by the laser arrangement 18 on the coating 4 is 80 degrees in the example and describes the angle which the laser beam 24 encloses with the tangential plane at the coating 4 at the point of impact.
  • the laser arrangement 18 comprises a laser source 20 which generates a laser beam 24 which is always rectified.
  • a deflection scanner 22 The laser arrangement 18 then deflects the laser beam 24 accordingly onto one of the small areas 8a-i and also within the small areas 8a-i. This is in Fig. 2 indicated by a dashed line of the point of impact of the laser beam 24 on the coating 4.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Claims (3)

  1. Procédé de recouvrement d'un composant (2) par un revêtement (4) d'indium ou contenant de l'indium, et dans lequel :
    - le revêtement (4) dont le matériau présente après l'application un réseau (M1) est appliqué sur le composant (2) et ensuite
    - dans une zone de conversion (6a) qui englobe au moins une partie du revêtement (4), une conversion du réseau est réalisée sur le revêtement (4), le matériau du revêtement (4) présentant après la conversion un deuxième réseau (M2),
    - la zone de conversion (6a) est divisée en petites zones (8a-h),
    - la conversion du réseau n'a lieu dans l'une des petites parties (8a-h) que pendant une courte durée (Ta-h), aucune conversion du réseau n'ayant lieu à l'extérieur de chacune des petites parties (8a-h) pendant la courte durée (Ta-h),
    - lorsque la conversion du réseau est terminée dans l'une des petites parties (8a-h), pendant une courte durée (Tb-h) suivante, la conversion du réseau est réalisée dans l'une des autres petites parties (8b-h), jusqu'à ce que soient traitées toutes les petites parties (8a-h), et donc toute la zone de conversion (6a),
    - la conversion du réseau s'effectue par une source thermique (14) qui applique localement de la chaleur sur la petite partie (8a-h) du composant (2),
    - comme source thermique (14), on utilise un ensemble laser (16), en particulier un laser infrarouge pulsé, en particulier à un angle d'incidence (α) sur la petite partie (8a-i) compris entre 5° et 90°,
    - comme ensemble laser (16), on utilise une source laser (18) dotée d'un système (20) de balayage, le système (20) de balayage amenant pendant la courte durée (Ta-i) le faisceau laser de la source laser (18) sur une petite partie (8a-i) de telle sorte que cette dernière soit complètement balayée au moins une fois par le faisceau laser,
    - comme composant (2), on utilise un raccord enfichable doté d'une zone d'enfoncement (10) et d'une tige de contact qui inclut la zone d'enfoncement, la zone d'enfoncement comportant un ou plusieurs chants estampés,
    - au moins l'une des petites parties (8a-h) étant sélectionnée de telle sorte qu'elle corresponde à la zone d'enfoncement (10) ou à une partie de la zone d'enfoncement (10) et
    - au moins l'une des petites parties (8a-h) étant sélectionnée de manière à correspondre à une zone de chant (14) ou une partie de la zone de chant (14).
  2. Procédé selon la revendication 1, dans lequel le revêtement (4) est appliqué sur le composant dans une opération de galvanisation.
  3. Utilisation d'un procédé selon l'une des revendications précédentes sur un composant (2) du secteur automobile.
EP16712213.4A 2015-04-15 2016-03-22 Procédé de revêtement d'un composant et utilisation du procédé Active EP3283671B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015004651.9A DE102015004651B4 (de) 2015-04-15 2015-04-15 Verfahren zum Beschichten eines Bauteils und Verwendung des Verfahrens
PCT/EP2016/000496 WO2016165809A1 (fr) 2015-04-15 2016-03-22 Procédé de revêtement d'un composant et utilisation du procédé

Publications (2)

Publication Number Publication Date
EP3283671A1 EP3283671A1 (fr) 2018-02-21
EP3283671B1 true EP3283671B1 (fr) 2020-05-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP16712213.4A Active EP3283671B1 (fr) 2015-04-15 2016-03-22 Procédé de revêtement d'un composant et utilisation du procédé

Country Status (3)

Country Link
EP (1) EP3283671B1 (fr)
DE (1) DE102015004651B4 (fr)
WO (1) WO2016165809A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115298023A (zh) * 2020-03-18 2022-11-04 思力柯集团 纳米结构的基于钯的合金和相关方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4878735B2 (ja) * 2004-01-22 2012-02-15 住友電気工業株式会社 フラットケーブル
KR100870334B1 (ko) 2004-09-10 2008-11-25 가부시키가이샤 고베 세이코쇼 접속 부품용 도전 재료 및 그의 제조방법
JP5229785B2 (ja) * 2007-12-28 2013-07-03 日本圧着端子製造株式会社 めっき層及びその形成方法
EP2273621A4 (fr) * 2008-03-19 2011-07-13 Furukawa Electric Co Ltd Borne pour connecteur et procédé de production de la borne pour connecteur
WO2009116601A1 (fr) * 2008-03-19 2009-09-24 古河電気工業株式会社 Matériau métallique pour connecteur et procédé de production de matériau métallique pour connecteur
JP5079605B2 (ja) * 2008-06-30 2012-11-21 株式会社オートネットワーク技術研究所 圧着端子及び端子付電線並びにこれらの製造方法
DE102010042526A1 (de) 2010-10-15 2012-04-19 Continental Automotive Gmbh Kontaktelement
DE102011000984A1 (de) 2011-03-01 2012-09-06 Rasselstein Gmbh Verfahren zum Veredeln einer metallischen Beschichtung auf einem Stahlband
DE102012102230B4 (de) * 2012-03-16 2014-07-17 Thyssenkrupp Rasselstein Gmbh Verfahren zum Veredeln einer metallischen Beschichtung auf einem Stahlblech, beschichtetes Stahlblech, sowie Herstellungsverfahren für Dosen aus beschichtetem Stahlblech

Non-Patent Citations (1)

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Title
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Also Published As

Publication number Publication date
DE102015004651B4 (de) 2018-09-27
DE102015004651A1 (de) 2016-10-20
EP3283671A1 (fr) 2018-02-21
WO2016165809A1 (fr) 2016-10-20

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