EP3281742A1

EP3281742A1 - Polishing method

Info

Publication number: EP3281742A1
Application number: EP16776120.4A
Authority: EP
Inventors: Jinghao FENG; Xianjun SONG
Original assignee: Guangdong Eding Industrial Co Ltd
Current assignee: Guangdong Eding Industrial Co Ltd
Priority date: 2015-04-08
Filing date: 2016-04-07
Publication date: 2018-02-14
Anticipated expiration: 2036-04-07
Also published as: BR112017012252B1; ES2877434T3; EP3281742A4; BR112017012252A2; WO2016161945A1; CN104759958B; CN104759958A; EP3281742B1

Abstract

A polishing method comprises: conveying a workpiece by using a transmission mechanism with a to-be-processed surface of the workpiece facing down; and polishing the to-be-processed surface under the to-be-processed surface by using a polishing device. During polishing of a workpiece according to the polishing method, a to-be-processed surface of the workpiece is faced down, and the to-be-processed surface is polished under the to-be-processed surface of the workpiece by using the polishing device, so that abrasive dust generated during polishing can fall down due to self-weight. Therefore, the polishing method can effectively prevent abrasive dust from remaining on the to-be-processed surface of the workpiece, thereby increasing the polishing efficiency and improving the polishing effect.

Description

Technical Field

The present invention relates to a polishing method.

Background

During the polishing of a workpiece, a surface to be processed of the workpiece is oriented upward, and a polishing and grinding device is used to polish and grind the surface to be processed; for example, a polished ceramic tile comprises a rough back face and a smooth surface (the rough back face is a tiling surface, and the smooth surface is a decorative surface), and the polishing process needs to be performed on the decorative surface. Referring to figures 1 and 2, during the polishing of a polished ceramic tile blank 40, the polished ceramic tile blank 40 is firstly placed on a horizontal conveying belt 1 so that a decorative surface 41 of the polished ceramic tile blank 40 faces upward, that is to say, the tiling surface of the polished ceramic tile blank 40 is oriented toward the ground. A plurality of polishing grinders 2 are arranged above the conveying belt 1 along a conveying direction of the conveying belt. The polished ceramic tile blank 40 continuously moves along the conveying belt 1, and each polishing grinder 2 polishes the polished ceramic tile blank 40 from above. (The polished ceramic tile is generally a blank before polishing, and therefore, in the art, the polished ceramic tile before polishing is also referred to as a polished ceramic tile blank.)
During the polishing, the polishing grinders 2 grind the decorative surface 41 of the polished ceramic tile blank 40, which can generate a large number of grinding debris 42 in the shape of micro particles. These debris 42 are left on the decorative surface 41 and are rotated along with the polishing grinder 2 at a high speed, which will scratch the decorative surface 41 and seriously affect the polishing effect. At the same time, since there is a layer of debris 42 between the polishing grinders 2 and the decorative surface 41, the contact rate between the polishing grinders 2 and the decorative surface 41 is reduced, thereby seriously affecting the polishing efficiency. In order to solve the above-mentioned problems, a traditional method is to spray a great amount of water on the surface to be processed so as to wash the debris off. In addition, with regard to some polished ceramic tiles with a higher water absorption rate, since a great amount of water is absorbed during washing with water, a drying oven must be used subsequently to dry the tiles, which increases the complexity of processing the polished ceramic tile. Of course, the above-mentioned problems also exist when the above-mentioned polishing method is applied to the processing of other workpieces.

Summary

In view of the disadvantages in the prior art, an objective of the present invention is to provide a polishing method, which can effectively prevent the debris from being left on a surface to be processed of a workpiece, and simplify the polishing process of the workpiece.
In order to achieve the above-mentioned objective, the present invention adopts the following technical solutions:

a polishing method, in which a conveying mechanism is used to convey a workpiece, a surface to be processed of the workpiece is oriented toward the ground, and a polishing device is used to polish the surface to be processed under the surface to be processed.

During the polishing, a water applying device is used to apply water onto the surface to be processed from below.
The water applying device is a water spraying mechanism which sprays water onto the surface to be processed from below during polishing. When spraying, the mechanism pressurizes and atomizes the water and sprays the atomized water onto the surface to be processed.
The polishing device comprises at least one polishing grinder driven by a first drive mechanism.
Preferably, there is a plurality of polishing grinders. The plurality of polishing grinders is provided below the surface to be processed of the workpiece and are arranged at intervals along a conveying direction of the conveying mechanism.
The conveying mechanism comprises a belt driven by a second driving mechanism and a support roller located below the belt. During polishing, the workpiece is clamped between the belt and the support roller.
A support beam is provided in an annular region of the belt, and the extending direction of the support beam is identical to the conveying direction of the belt.
The beneficial effects of the present invention are as follows:

compared with the prior art, the polishing method of the present invention enables the surface to be processed of the workpiece to be oriented toward the ground when the workpiece is polished and ground, and the polishing device is used to polish the surface to be processed from below the workpiece, so that the grinding debris generated during polishing can drop down by means of its self weight. Therefore, the polishing method of the present invention can effectively prevent the grinding debris from being left on the surface to be processed of the workpiece, thereby improving the polishing efficiency and the polishing effect.

Description of the Drawings

Fig. 1 is a schematic diagram of an existing method for polishing a polished ceramic tile blank;
Fig. 2 is an enlarged view of region A in Fig. 1;
Fig. 3 is a schematic diagram of a polishing method in the present invention; and
Fig. 4 is an enlarged view of B in Fig. 3.

In the drawings: 10. belt; 20. support beam; 30. polishing grinder; 40. polished ceramic tile blank; 41. decorative surface; 50. ground.

Particular Embodiments

The present invention will be further described below in conjunction with the drawings and the particular embodiments:
Figs. 3 and 4 show a polishing method in the present invention, which is used for polishing a polished ceramic tile blank. Specifically, the method uses a conveying mechanism to convey a polished ceramic tile blank along a predetermined track. During the conveying, a decorative surface 41 of the polished ceramic tile blank 40 (the decorative surface 41 being a smoother surface of the polished ceramic tile blank 40, and the decorative surface 41 being a surface to be processed of the polished ceramic tile blank 40) is oriented toward the ground 50. During the movement of the polished ceramic tile blank 40 along the conveying track of the conveying mechanism, the polishing device is used to polish the decorative surface 41 of the polished ceramic tile blank under the polished ceramic tile blank. The above-mentioned method enables the decorative surface 41 of the polished ceramic tile blank 40 to be oriented downward, that is to say, the decorative surface 41 faces toward the ground 50. The grinding debris produced during the polishing process will drop down by means of its self weight so as to effectively prevent the debris from being left on the decorative surface 41 of the polished ceramic tile blank 40, avoid the influence of the grinding on the polishing effect, and at the same time improve the polishing efficiency. The above-mentioned polishing device of the present invention can be a polishing grinder 30 used for polishing a polished ceramic tile blank, which will not be described herein.
In addition, in order to further improve the polishing effect and the polishing efficiency, during the polishing, a spraying mechanism is used to spray water onto the decorative surface 41 of the polished ceramic tile blank from below. When the water spraying mechanism is used to spray water onto the surface to be polished of the polished ceramic tile blank, a high pressure pump is provided in the water spraying mechanism, and at the same time, an atomizing spray nozzle is provided at a water spray port of the water spraying mechanism. With the high pressure pump and the atomizing spray nozzle, the water can be sprayed onto the decorative surface 41 of the polished ceramic tile blank after atomization under a high pressure. There are many specific structures or technical means for realizing the above-mentioned atomization of water under a high pressure, however, these technical means all fall within methods customarily used by a person skilled in the art.
The above-mentioned method can use at least one polishing grinder 30 to polish the polished ceramic tile blank 40, and the polishing grinder 30 is driven by the first driving mechanism.
The first driving mechanism can be driven by an electric motor or another similar driving mechanism other than an electric motor.
Preferably, there are a plurality of polishing grinders 30. The plurality of polishing grinders 30 is all provided below the conveying mechanism, and the plurality of polishing grinders 30 is arranged at intervals along the conveying direction of the conveying mechanism, such that during polishing, a plurality of polished ceramic tile blanks can be conveyed successively by the conveying mechanism, and each of the polished ceramic tile blanks is successively ground by the plurality of polishing grinders 30 so as to reach the polishing level for the surface of polished ceramic tile.
The plurality of polishing grinders 30 can be arranged at either equal or different intervals. In addition, each polishing grinder 30 can be respectively driven by one first driving mechanism, or the plurality of polishing grinders 30 can be driven by one first driving mechanism altogether.
Of course, the position of each of the above-mentioned polishing grinders 30 can be considered as one polishing station in which water can be sprayed onto the decorative surface 41 of the polished ceramic tile blank located at the polishing station. Specifically, the above-mentioned water spraying mechanism can be provided with a plurality of water spray ports. The plurality of water spray ports can share one water supply channel or can be respectively provided with one individual water supply channel. The plurality of water spray ports is provided in the middle of the plurality of polishing grinders 30 in a one-to-one corresponding manner, so that water is supplied for polishing the polished ceramic tile blank in the middle of the polishing grinders 30. The above-mentioned high pressure pump and atomizing spray nozzle can enable the sprayed water to be evenly distributed on the decorative surface 41 of the polished ceramic tile blank and to cover the decorative surface 41 of the polished ceramic tile blank as much as possible.
The above-mentioned method of the present invention enables the decorative surface 41 of the polished ceramic tile blank 40 to be oriented toward the ground 50 when the polished ceramic tile blank 40 is polished and ground, that is to say, the tiling surface of the polished ceramic tile blank 40 which has a higher water absorption is located above the polishing grinders 30 and the water spray port of the water spraying mechanism. In addition, the decorative surface 41 of the polished ceramic tile blank 40 separates the titling surface of the polished ceramic tile blank 40 from the water spray port of the water spraying mechanism. Since the water absorption of the decorative surface 41 is very low, the great amount of water dripping from the periphery of the polished ceramic tile blank after being blocked by the decorative surface 41 will not enter the tiling surface of the polished ceramic tile blank 40. That is to say, the above-mentioned polishing method of the present invention greatly lowers the amount of absorbed water of the polished ceramic tile blank during the polishing. Therefore, for the polished ceramic tiles with a high water absorption, there is no need to perform a subsequent drying steps after the polishing is completed by using the above-mentioned polishing method. It will be noted that the method of the present invention is not limited only to supply water to the surface of the polished ceramic tile blank by spraying as mentioned above. During the polishing, other water supply devices can also be used in place of the above-mentioned water spraying mechanism to supply water to the decorative surface 41 of the polished ceramic tile blank. For example, a roller made of water-absorbing cotton can be provided below the polished ceramic tile blank, and during polishing, the roller is squeezed to apply the water inside the roller onto the decorative surface 41 of the polished ceramic tile blank from below. Of course, in order to guarantee the continuity of water supply, a water supply mechanism can be used to continuously supply water to the inside of the roller for supplementing the water content in the roller.
The conveying mechanism in the above-mentioned method of the present invention comprises the belt 10 driven by the second driving mechanism and the support roller located below the belt 10. The belt 10 is used to drive the movement of the polished ceramic tile blank 40. Specifically, the polished ceramic tile blank 40 is clamped between a lower surface of the belt 10 and top end sides of the polishing grinders 30 when the polished ceramic tile blank is being conveyed. At the same time, the polished ceramic tile blank 40 is also clamped between the lower surface of the belt 10 and the support roller. After the polished ceramic tile blank 40 is tightly clamped, there is a large frictional force between an upper surface of the polished ceramic tile blank 40 which has a certain roughness and the lower surface of the belt 10. The frictional force drives the polished ceramic tile blank 40 to move horizontally. Since the polishing grinders 30 press the polished ceramic tile blank 40 upward and the belt 10 limits the degree of freedom in upward movement of the polished ceramic tile blank 40, a certain pressure is produced between the decorative surface 41 of the polished ceramic tile blank 40 and the polishing grinders 30, so as to guarantee that the polishing can be performed normally. Of course, considering that the belt 10 may deform when the belt is pressed upward by the polished ceramic tile blank 40 so that the polishing effect is affected due to the pressure between the polishing grinders 30 and the polished ceramic tile blank 40 being too small, a support beam 20 can also be provided in an annular region of the belt 10. The extending direction of the support beam 20 is identical to the conveying direction of the beam 10. When the belt 10 is pressed upward and deforms, the support beam 20 supports the belt 10 so as to guarantee that there is a sufficiently high pressure between the polished ceramic tile blank 40 and the polishing grinders 30.
The second driving mechanism can be driven by an electric motor or another similar driving mechanism other than an electric motor.
It should be noted that the present invention can also use a conveying mechanism other than the above-mentioned belt conveying device so as to realize the conveyance of the polished ceramic tile blank, as long as it is ensured that the decorative surface 41 of the polished ceramic tile blank can be oriented downward and a pressure which satisfies a polishing requirement can be provided between the polishing grinders and the polished ceramic tile blank.
It is to be noted that the above-mentioned method for polishing the polished ceramic tile blanks is only an application example of the present invention. The polishing method of the present invention can also be used for polishing the workpiece of other types, for example, ceramic parts and sheet-metal parts other than polished ceramic tile blanks. Of course, the shapes of these workpieces are not limited to a plate-like structure, as long as the decorative surface 41 of the workpiece is oriented toward the ground 50 during polishing.
For a person skilled in the art, a variety of other corresponding modifications and variations can be made according to the above-described technical solutions and concepts, and all the modifications and variations shall fall within the scope of protection of the claims of the present invention.

Claims

A polishing method, characterized in that a conveying mechanism is used to convey a workpiece, a surface to be processed of the workpiece is oriented toward the ground, and a polishing device is used to polish the surface to be processed under the surface to be processed.
The polishing method according to claim 1, characterized in that, during the polishing, a water applying device is used to apply water onto the surface to be processed from below.
The polishing method according to claim 2, characterized in that the water applying device is a water spraying mechanism which sprays water onto the surface to be processed from below during polishing, and during spraying, the water spraying mechanism pressurizes and atomizes the water and sprays the atomized water onto the surface to be processed.
The polishing method according to claim 1, characterized in that the polishing device comprises at least one polishing grinder driven by a first drive mechanism.
The polishing method according to claim 4, characterized in that there is a plurality of polishing grinders, the plurality of polishing grinders is provided below the surface to be processed of the workpiece and are arranged at intervals along a conveying direction of the conveying mechanism.
The polishing method according to claim 1, characterized in that the conveying mechanism comprises a belt driven by a second driving mechanism and a support roller located below the belt, and during the polishing, the workpiece is clamped between the belt and the support roller.
The polishing method according to claim 6, characterized in that a support beam is provided in an annular region of the belt, and the extending direction of the support beam is identical to the conveying direction of the belt.