EP3271650B1 - Semiconductor lamp - Google Patents

Description

The invention relates to a semiconductor lamp, comprising a rectilinear translucent tube, the open end faces are closable by means of respective end caps, and a printed circuit board equipped with at least one semiconductor light source, which is accommodated in the tube and is electrically contacted by at least one end cap. For example, the invention is applicable to retrofit or replacement lamps for conventional elongate lamps, e.g. Fluorescent lamps and tube lamps.

In relevant semiconductor lamps, a plastic tube is often used as a piston. On the open end faces, the end caps are usually placed firmly to prevent peeling and possibly produce airtightness. It is disadvantageous that the plastic tube at a temperature change in the longitudinal direction of the tube in comparison to a glass tube greatly expands (elongated or contracted), so that also changes the length of the semiconductor lamp accordingly.

US 2010/0008085 A1 discloses a method of forming an LED-based light for replacing a conventional fluorescent lamp in a fluorescent lighting fixture, comprising: forming an elongated sheet of a highly thermally conductive material to form a heat sink. The shaping of the heat sink allows the heat sink to be formed to define cap and end cap attachment structures, mounting surfaces for LEDs at various angles, and a high surface to width ratio for heat dissipation.

WO 2014/001474 A1 relates to a lighting device with a housing and with an accommodated in the housing electronic assembly, wherein it further at least one Side of the electronic assembly has at least one adjusting mechanism and the adjusting mechanism is in operative connection with the electronic module and can be actuated from outside the housing, so that the electronic assembly is held taut in the housing.

EP 2 395 278 A2 discloses a lighting device comprising a light source unit having light emitting units arranged in a longitudinal direction. A transparent cover member formed in a substantially straight pipe shape and having openings at both ends is formed to receive the light source unit in the longitudinal direction. The cover member has a higher thermal expansion coefficient than the light source unit. End plate members are fixed to both ends of the light source unit and close the openings at both ends of the cover member.

From the JP 2013-235688 and the JP 2014-63616 are tubular lighting devices are known in which the two end caps are connected to each other via a running along the pipe connecting element. Other tubular lighting devices are from the EP 2 587 115 A1 , the US 2012/0182728 A1 , the EP 2 679 891 A1 , the EP 2 216 859 A1 and the EP 2 843 291 A1 known.

It is the object of the present invention to overcome the disadvantages of the prior art at least partially and in particular to provide a semiconductor lamp of the type in question, which experiences a change in temperature only a small change in length and is particularly easy to produce.

This object is achieved according to the features of the independent claims. Preferred embodiments are in particular the dependent claims.

The object is achieved by a semiconductor lamp, comprising a rectilinear translucent tube, the open end surfaces by means of respective end caps, which are plugged together with the tube, are closable, and equipped with at least one semiconductor light source printed circuit board, which is housed in the tube and of at least one of the two end caps is electrically contacted, the two end caps by means of one in the tube extending connecting element are mechanically connected to each other, at least one of the end caps with respect to the tube with a clearance is arranged longitudinally displaceable and a thermal expansion of the connecting element in a longitudinal direction of the tube is less than a thermal expansion of the tube and wherein the connecting element is locked with at least one of the end caps.

By locking, there is the advantage that the semiconductor lamp can be assembled by simply plugging together or a simple plug movement. On an elaborate screwing can be dispensed with. It is also possible to dispense with the use of an adhesive, since it tends to exude into the tube and possibly damage light-generating or electronic components. In addition, a locking connection can be implemented by comparatively easy to manufacture components.

The attachment of the end caps on the connecting element with simultaneous longitudinal displacement of the tube relative to at least one of the end caps also has the advantage that a thermal change in length of the semiconductor lamp is determined by the change in length of the connecting element and not by the change in length of the tube. Since the thermal expansion of the connecting element in a longitudinal direction of the tube is less than the thermal expansion of the tube, this change in length is less than in a fixedly attached to the end caps tube. The tube may be longitudinally displaceable with respect to both end caps or may be longitudinally displaceable with respect to only one of the end caps.

The translucent tube may be a transparent and / or a diffused tube. The tube may in particular have a hollow cylindrical basic shape with, for example, a circular cross-sectional shape. The tube may also be referred to as a tubular piston, tube piston or piston tube.

The end caps may also be referred to as pedestals, end pieces or plugs or serve. In particular, both end caps serve for fastening the semiconductor lamp in a corresponding socket. In one variant, only one of the end caps can also serve for an electrical contact. Alternatively, both end caps can also serve for electrical contacting. For electrical contacting, for example, electrically conductive contact pins may be provided, e.g. for bipin connections.

A driver for converting electrical signals input via at least one end cap into operating signals for operating the at least one semiconductor source may be accommodated in at least one of the end caps. The driver may only be arranged in an end cap, be split on both end caps and / or be arranged at least partially on the printed circuit board equipped with the at least one semiconductor light source. The driver or a part thereof may have one or more driver components arranged on a separate printed circuit board ("driver board"). If an end cap has the driver or a part of the driver, the part of this end cap having the electrical contacts can also be referred to as an "end cap contact part". The end cap then has, in particular, the end cap contact part and the driver attached thereto.

It is a development that the connecting element is connected directly to the end cap contact part of at least one end cap. It is also a development that the connecting element with the driver (or a part thereof) is connected to at least one end cap, that is, only indirectly via this driver with the end cap contact part.

The fact that the end caps are mated with the tube can mean that the end caps (inwards) are inserted into the tube and / or that the end caps (from the outside) are plugged onto the tube. The mating includes in particular, that the end caps are at least partially inserted into the tube and / or attached to the pipe.

In particular, the at least one semiconductor light source comprises at least one light-emitting diode. If several LEDs are present, they can be lit in the same color or in different colors. A color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). The light emitted by the at least one light-emitting diode can also be an infrared light (IR LED) or an ultraviolet light (UV LED). Several light emitting diodes can produce a mixed light; e.g. a white mixed light. The at least one light-emitting diode may contain at least one wavelength-converting phosphor (conversion LED). The phosphor may alternatively or additionally be arranged remotely from the light-emitting diode ("remote phosphor"). The at least one light-emitting diode can be in the form of at least one individually lighted LED or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount"). The at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens, collimator, and so on. Instead of or in addition to inorganic light emitting diodes, e.g. based on InGaN or AlInGaP, organic LEDs (OLEDs, for example polymer OLEDs) can generally also be used. Alternatively, the at least one semiconductor light source may be e.g. have at least one diode laser.

The printed circuit board equipped with the at least one semiconductor light source can be a flexible or rigid band-shaped printed circuit board. It can then also be referred to as a "light strip". The at least one semiconductor light source can be present, for example, as a row of LEDs aligned in the direction of extent of the printed circuit board, for example of LED chips.

The fact that the printed circuit board is contacted by the two end caps, comprises in particular a mechanical contact, and for at least one of the two end caps also electrical contact. The contacting can be implemented directly or indirectly (for example via a driver or a part thereof).

That at least one of the end caps is second to the pipe with a play longitudinally displaceable, may include that - at least for a predetermined temperature range such as between -20 ° C and + 70 ° C, 0 ° C and 50 ° C, etc. - the tube in Longitudinal game or a possible displacement path relative to at least one of the end caps, in particular with respect to both end caps.

The end cap may also be glued and / or jammed, etc. in addition to being latched to the connector. The locking can basically be solvable or insoluble (without destruction of the semiconductor lamp).

The fact that the connecting element is latched with at least one of the end caps, may include that the end cap has at least one locking projection which engages in at least one latching receptacle of the connecting element, and / or in that the connecting element has at least one latching projection in at least one latching receptacle of the end cap intervenes.

Among them, it is a particularly advantageous embodiment that the connecting element has at least one latching recess which can be brought latching into engagement with at least one latching projection of a respective end cap, since this can usually be implemented more easily than the reverse arrangement. This is especially the case when the connector is flat, e.g. a metal strip is.

According to the invention, the connecting element is a band-shaped metallic connecting element. Such is special easy to manufacture and can be inserted into the tube and robust. Metal has a significantly lower coefficient of thermal expansion α than, for example, plastic, so that a smaller length extension than with a non-movable attachment of the tube to the end caps is made possible. For example, the thermal expansion coefficient for steel is approximately α = 12 × 10 ^-6 / K, for aluminum about 24 × 10 ^-6 / K, for polycarbonate (PC) about 70 × 10 ^-6 / K, for polyamide (PA) at approx. 110 · 10 ^-6 / K, for polyvinyl chloride (PVC) at approx. 80 · 10 ^-6 / K and for polymethyl methacrylate (PMMA) at approx. 80 · 10 ^-6 / K.

The connecting element may e.g. an aluminum strip or a steel strip or an element made of a steel strip. The tape can also be referred to as profile or strip. The latching receptacle of the connecting element can be a continuous latching recess, in particular in this case, because it can be introduced in a particularly simple manner and, in particular with thin strips, provides a sufficient depth for engagement of a latching projection.

It is a non-claiming embodiment that the connecting element for latching with a respective end cap has at least one envelope area or envelope, which has a Raufaufnahme, in particular locking recess has. As a result, a material reinforcement in the region of the Raufaufnahme is provided, which also allows a greater depth of Raufaufnahme for a particularly secure holding the associated locking cap. The envelope area or envelope is located at one or both end portions of the connecting element and is particularly easy to produce. Thus, at least two layers - eg of a metal strip - lie on top of one another at the area of the envelope, wherein the scious image is formed by introducing a recess into at least one layer. When introduced into several layers, the respective recesses are superimposed. According to the invention, the connecting element for latching with a respective end cap has at least one latching recess, which is adjoined in the direction of a proximal open end face by a ramp-like inwardly projecting area (hereinafter referred to as "securing area" without restricting generality). This allows the latching projection to slide over the securing area into the latching recess, which is located behind the securing area in the plugging direction (also referred to without limitation of generality, attachment direction, plugging direction or plug-in direction), and represents an additional latching element for the latched latching projection. Thus, a removal of the end cap from the tube is particularly safe prevented.

It is still an alternative or additional embodiment that does not fall under the claims that the connecting element for latching with a respective end cap has at least one latching recess, from which a material region is turned over in the direction of a proximal open end face. As a result, a material reinforcement of the connecting element is achieved, which makes it difficult to release the latching connection between the associated end cap and the connecting element.

It is a development that the circuit board rests flat on the connecting element. As a result, the connecting element, in particular if it consists of a good thermal conductivity material such as metal, also serve as a heat sink for the printed circuit board and thus for the at least one semiconductor light source located on the printed circuit board.

To produce a particularly low thermal resistance between the printed circuit board and the connecting element, the printed circuit board can be fixedly attached to the connecting element, for example glued to it, for example by means of a double-sided adhesive tape, a thermal paste, etc. Die Printed circuit board may additionally or alternatively be screwed, riveted, clamped, clamped, etc. with the connecting element.

It is yet another embodiment that the circuit board rests loosely on the connecting element. As a result, the circuit board and the connecting element can move against each other, so that a voltage input into the circuit board due to a thermal mismatch can be reduced or even prevented. This embodiment is particularly advantageous if the coefficients of linear expansion of printed circuit board and connecting element differ significantly.

But it is also possible that the circuit board and the connecting element are spaced apart from each other, so do not touch or at least not a large area (but, for example, only selectively). As a result, a mutual mechanical influence can be prevented particularly effectively.

It is still a development that the circuit board is connected directly to the end cap contact part of at least one end cap. It is also a development that the circuit board with the driver (or part thereof) is connected to at least one end cap, so only indirectly via this driver with the end cap contact part.

It is also a development that the circuit board by means of an electrical plug contact with at least one end cap (ie, with the end cap contact part or driver) is connected, wherein the plug contact against its plug contact counter element while maintaining an electrical contact is displaceable. This is particularly advantageous if the linear expansion coefficients of printed circuit board and connecting element differ significantly. For example, the plug contact may be attached to the printed circuit board. The plug contact counter element For example, may be the driver board itself or a plug contact counter element mounted on the driver board. The plug contact counter element may also act as a jamming.

It is also an embodiment that the connecting element is integrated into the circuit board. This allows a particularly compact and easily assembled internal structure of the semiconductor lamp. For example, the connecting element may comprise a metal strip or a metal strip, such as e.g. has been described above, wherein at least one flat side of which at least one semiconductor light source is arranged. For electrical insulation against the - e.g. electrically conductive interconnecting elements, the at least one semiconductor light source itself may already be electrically isolated from underneath (i.e., at its contact surface) and / or there may be an electrical insulating layer between the interconnecting element and the at least one semiconductor light source.

It is also an embodiment that the tube is a plastic tube. A plastic pipe is inexpensive to produce and usually does not splinter. The invention is particularly advantageously applicable to this embodiment, since the plastic pipes commonly used have a problematic high thermal expansion coefficient in the range from typically about 70 · 10 ^-6 / K. The plastic may have, for example, PC, PA, PVC, PMMA, etc. It can be transparent or diffusely scattering.

It is also an embodiment that the tube is formed on the inside as a linear guide for the circuit board and / or for the connecting element. This allows accurate positioning of the circuit board and / or the connector in the tube without preventing easy longitudinal insertion (eg, insertion or insertion). The linear guide prevents in particular a free movement perpendicular to the Longitudinal direction. The linear guide can in particular serve as a stop against a movement perpendicular to the longitudinal direction and thus provide a positive retention in this direction.

It is also an embodiment that the tube has inwardly projecting projections which hold the circuit board perpendicular to the longitudinal direction of the tube. Such a configuration is particularly easy to implement. These projections may be formed, for example, as rails or nubs. They may have been made in one piece with the remainder of the tube, e.g. by means of an injection molding process. They may alternatively have been incorporated retrospectively, e.g. by gluing or by forming the tube.

It is also an embodiment that the connecting element is arranged in a cavity formed between the circuit board and the pipe. As a result, the circuit board can act as a cover of the cavity and hold the circuit board therein. This results in particular the advantage that the circuit board can prevent a bending of the connecting element, since it acts as a stop against it.

It is also an embodiment that the tube is equipped on the inside with a receptacle for the connecting element, which holds the connecting element in a form-fitting manner in a transverse direction. This allows a still further improved positioning accuracy of the connecting element.

It is also an embodiment that the semiconductor lamp is a replacement lamp or retrofit lamp. It has at least approximately the form factor of the conventional tubular lamps to be replaced (eg fluorescent lamps or tube lamps). In particular, it fits into the provided for the conventional lamps sockets. By way of example, the semiconductor lamp may be a retrofit lamp for replacing T-type fluorescent lamps, eg of the T5 or T8 type. The end caps then have in particular the form factor of G5 or G13 sockets, for example by the presence of two contact pins. The tube may then in particular have a diameter as the pistons of the conventional fluorescent lamps.

Fig.1

zeigt als Schnittdarstellung in Seitenansicht einen Ausschnitt aus einer Halbleiterlampe gemäß einem ersten Ausführungsbeispiel;

Fig.2

zeigt als Schnittdarstellung in Schrägansicht einen weiteren Ausschnitt der Halbleiterlampe gemäß dem ersten Ausführungsbeispiel;

Fig.3

zeigt in Schrägansicht einen Ausschnitt aus einem Verbindungselement der Halbleiterlampe gemäß dem ersten Ausführungsbeispiel;

Fig.4

zeigt die Halbleiterlampe gemäß dem ersten Ausführungsbeispiel in Querschnittsansicht;

Fig.5

zeigt in Schrägansicht einen Ausschnitt aus einem Verbindungselement einer Halbleiterlampe gemäß einem zweiten Ausführungsbeispiel;

Fig.6

zeigt als Schnittdarstellung in Schrägansicht einen Ausschnitt der Halbleiterlampe gemäß dem zweiten Ausführungsbeispiel;

Fig.7

zeigt in Schrägansicht einen Ausschnitt aus einem Verbindungselement einer Halbleiterlampe gemäß einem dritten Ausführungsbeispiel;

Fig.8

zeigt als Schnittdarstellung in Schrägansicht einen Ausschnitt der Halbleiterlampe gemäß dem dritten Ausführungsbeispiel;

Fig.9

zeigt als Schnittdarstellung in Schrägansicht eine Halbleiterlampe gemäß einem vierten Ausführungsbeispiel; und

Fig.10

zeigt die Halbleiterlampe gemäß dem vierten Ausführungsbeispiel in Querschnittsansicht.

The above-described characteristics, features, and advantages of this invention, as well as the manner in which they will be achieved, will become clearer and more clearly understood in connection with the following schematic description of exemplary embodiments which will be described in detail in conjunction with the drawings. In this case, the same or equivalent elements may be provided with the same reference numerals for clarity.

Fig.1

shows a section in side view of a section of a semiconductor lamp according to a first embodiment;

Fig.2

shows a sectional view in an oblique view of another section of the semiconductor lamp according to the first embodiment;

Figure 3

shows an oblique view of a section of a connecting element of the semiconductor lamp according to the first embodiment;

Figure 4

shows the semiconductor lamp according to the first embodiment in cross-sectional view;

Figure 5

shows an oblique view of a section of a connecting element of a semiconductor lamp according to a second embodiment;

Figure 6

shows a sectional view in an oblique view of a section of the semiconductor lamp according to the second embodiment;

Figure 7

shows an oblique view of a section of a connecting element of a semiconductor lamp according to a third embodiment;

Figure 8

shows a sectional view in an oblique view of a section of the semiconductor lamp according to the third embodiment;

Figure 9

shows a sectional view in an oblique view of a semiconductor lamp according to a fourth embodiment; and

Figure 10

shows the semiconductor lamp according to the fourth embodiment in cross-sectional view.

The in the Figures 3 and 5 illustrated variants of Verrastmechanismus not subject to the claims.

Fig.1 shows a sectional side view of an end portion of a semiconductor lamp 1 according to a first embodiment. Fig.2 shows the semiconductor lamp 1 in sections as a sectional view in an oblique view.

The retrofit lamp, e.g. to replace a T8 fluorescent lamp, provided semiconductor lamp 1 has a rectilinear translucent tube 2 with a hollow cylindrical basic shape of transparent or opaque plastic. The tube 2 has e.g. open on both sides end surfaces 3, which are closable by means of respective end caps 4.

For this purpose, the end caps 4 have an open in the direction of the tube 2 hollow cylindrical shape, so that they can be inserted into the tube 2 up to a predetermined maximum penetration depth, e.g. in the manner of a plug. The maximum penetration depth is given here by a shell-side, annular outer elevation 5, for which the tube 2 serves as a stop. However, the end caps 4 should not be inserted maximally in the pipe 2 to leave a longitudinal play d in a longitudinal direction L of the pipe 2. The end caps 4 fit radially narrow or with only a small radial clearance in the tube. 2

In the interior of the end cap 4 shown, a driver 6 is housed, which has a driver board 7, which is equipped with a plurality of driver blocks 8. By a tube 2 facing away from the end surface 10 of the end cap 4 lead two electrically conductive pins 11, which are electrically connected to the driver 6 (eg via a contact strip 12) and can be fed via the electrical supply signals. The driver 6 converts the electrical supply signals into electrical operating signals for semiconductor light sources in the form of, for example, LEDs 17.

The driver board 7 is inserted longitudinally displaceable in an electrical plug contact 15 and contacts it electrically. The electrical plug contact 15 is arranged on an upper side of a band-shaped printed circuit board 16, which is also equipped with a plurality of LEDs 17 arranged in series along the longitudinal direction L. The plug contact 15 is displaceable against the driver board 7 while maintaining an electrical contact, which is particularly advantageous for the prevention of voltages in the printed circuit board 16.

The printed circuit board 16 lies with its underside loosely on a band-shaped connecting element in the form of a steel strip 18. The steel strip 18 is locked at one end to the end cap 4, here with an end cap contact part 19 having the contact pins 11. The end cap 4 can therefore also be regarded as a system comprising the end cap contact part 19 and the driver 6.

The latching mechanism comprises a latching projection 20 of the end cap 4 projecting outwards on the shell side, which has a bevel in an insertion direction E of the end cap 4 into the tube 2. At the side facing away from the tube 2 of the latching projection 20, the end cap 4 also has an introduced into the outer surface of the end cap 4 recess 21.

The steel strip 18 has as latching counterpart means a latching recess 22 for engagement with the latching projection 20. The steel strip also has an inward projection in the form of an envelope 23 for placement in the recess 21.

The end cap 4 shown is mechanically firmly connected via the steel band 4 with an end cap (see Fig.) Which closes the other end face of the tube 2. The connection of the two end caps 4 can be play-free in the longitudinal direction L or may have only a slight play. The two end caps 4 can be shaped the same. Due to the mechanically fixed connection of the two end caps 4 with each other via the steel strip 18 and due to the existing game d, the tube 2 in the longitudinal direction L (in and against the insertion direction E) against the end caps 4 (longitudinally) slidably disposed.

A temperature-dependent change in length of the semiconductor lamp 1 as such is essentially determined by the comparatively small change in length of the steel strip 18. Since the coefficient of longitudinal expansion of the steel of the steel strip 18 is considerably lower than that of the plastic of the pipe 2, when heated, the clearance d becomes smaller and becomes larger as it cools. Therefore, a length expansion of the tube 2 is compensated by a change of the game d. The size of the game d can be easily with knowledge of the longitudinal expansion coefficients of the steel strip 18 and the plastic tube 2 and the desired temperature range (eg from -20 ° C to 70 ° C, from 0 ° C to 50 ° C or similar .) establish.

Figure 3 shows an end-side section of the connecting element 18. The connecting element 18 has the end of the envelope area 23, which has been achieved for example by bending a flat steel strip by 180 °. The envelope area 23 has two superimposed layers 23a and 23b into which congruent recesses have been introduced in order to form the latching recess 22 together.

Figure 4 shows the semiconductor lamp 1 in cross-sectional view through the tube 2 at the level of an LED 17. The tube 2 is inside as a linear guide for the circuit board 16th and formed for the steel strip 18. For this purpose, the tube 2 has inwardly projecting projections 24 which hold the printed circuit board 16 perpendicular to the longitudinal direction L on the tube 2. The projections 24 may extend over a greater length or even the full length of the tube 2, or, for example, there may be a plurality of projections 24 spaced longitudinally L.

The circuit board 16 and the tube 2 together form a cavity 25 in which the steel strip 18 is arranged. In this case, the steel strip 18 is located in a groove-like receptacle 26 and is held by the circuit board 16 therein. This has the advantage that the steel strip 18 is prevented by the circuit board 16 from bending and thereby changing, for example, its nominal length.

Figure 5 shows an oblique view of a section of a connecting element serving as steel strip 32 of a semiconductor lamp 31, which also has the end cap 4, the circuit board 16 and the tube 2. The steel strip 32 has in its end region also a latching recess 33 for engagement with the latching projection 20 of the end cap 4, as in Figure 6 shown.

At the latching recess 32 is followed in the direction of the open end face (here: against the insertion direction E of the end cap 4) a ramp-like inwardly raised securing portion 34 at. The securing portion 34 is disposed in the recess 21 of the end cap 4. When the end cap 4 is inserted, the latching projection 20 can slide over the securing region 34, but is then prevented from slipping out by it.

Figure 7 shows an oblique view of a section of a connecting element serving as steel strip 42 of a semiconductor lamp 41. The steel strip 42 has in its end region also has a latching recess 43 for engagement with the latching projection 20 of the end cap 4 of the semiconductor lamp 41st on, like in Figure 8 shown. However, a material region 44 is now turned from the latching recess 43 in the direction of a next open end face of the tube 2 (here: against the insertion direction E of the end cap 4). The material region 44 is arranged in the recess 21 of the end cap 4.

Figure 9 shows a section of an oblique view of a section of a semiconductor lamp 51. The semiconductor lamp 51, in contrast to the semiconductor lamps 1, 31 and 41 on a metallic connecting element which is integrated in a printed circuit board 52 and can serve as a core thereof, for example. For engagement with the latching projection 20, a simple latching recess 53 is now provided.

Figure 10 FIG. 12 shows the semiconductor lamp 51 in cross-sectional view through an LED 17. A tube 54 of the semiconductor lamp 51 is flattened at the rear of the printed circuit board 52 to avoid a gap between a backside of the printed circuit board 52 and the tube 54 for improved heat transfer from the printed circuit board 52 to allow the tube 54.

The semiconductor lamps 1, 31, 41 and 51 shown in the embodiments can be assembled particularly easily by inserting the printed circuit board and the (possibly integrated therein) metal strip in the tube and then at least one end cap is inserted into the tube. By inserting the end cap is advantageously also locked to the metal strip and plugged into the electrical plug contact of the circuit board. The other end cap can be placed analogously or already connected to it before inserting the printed circuit board and the metal strip into the tube.

Although the invention has been illustrated and described in detail by the illustrated embodiments, the invention is not limited thereto and others Variations may be deduced therefrom by those skilled in the art without departing from the scope of the invention.

Thus, in unclaimed variants, instead of the metal strip, for example, a - in particular band-shaped - connecting element made of glass, printed circuit board material (such as FR4, CEM1, etc.) or ceramic can be used. In particular, the connecting element itself may be a printed circuit board main body, in particular without a metallization.
Generally, "on", "an", etc. may be taken to mean a singular or a plurality, in particular in the sense of "at least one" or "one or more", etc., as long as this is not explicitly excluded, eg by the expression "exactly a "etc.
Also, a number may include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded.

reference numeral

1

Semiconductor lamp

2

pipe

3

face

4

endcap

5

Outer elevation

6

driver

7

driver board

8th

driver module

10

face

11

pin

12

Contact strips

15

plug contact

16

circuit board

17

LED

18

steel strip

19

Endcap contact part

20

catch projection

21

return

22

engaging recess

23

handling area

23a

Location of the envelope area 23

23b

Location of the envelope area 23

24

head Start

25

cavity

26

Grooved recording

31

Semiconductor lamp

32

steel strip

33

engaging recess

34

security area

41

Semiconductor lamp

42

steel strip

43

engaging recess

44

material area

51

Semiconductor lamps

52

circuit board

53

engaging recess

54

pipe

d

longitudinal game

e

insertion

L

longitudinal direction

Claims (11)

1. Semiconductor lamp (1; 31; 41; 51), comprising

   - a linear translucent tube (2; 54), the open end faces (3) of which can be closed by means of respective end caps (4), said end caps (4) being fitted together with the tube (2; 54), and

   - a printed circuit board (16; 52) which is provided with at least one semiconductor light source (17), is accommodated in the tube (2), and is contacted by at least one of the end caps (4),

   wherein

   - the two end caps (4) are mechanically connected to one another by means of a connecting element (18; 32; 42; 52) passing through the tube (2; 54),

   - at least one of the end caps (4) is arranged so as to be longitudinally displaceable relative to the tube (2; 54) with a clearance (d), and

   - a thermal expansion of the connecting element (18; 32; 42; 52) in a longitudinal direction (L) of the tube (2; 54) is less than a thermal expansion of the tube (2; 54), and

   wherein

   - the connecting element (18; 32; 42; 52) is latched to at least one of the end caps (4),

   - the connecting element (18; 32; 42; 52) is a metallic connecting element and the connecting element (32) has at least one latching recess (33) for latching with a respective end cap (4),

   characterized in that the connecting element (13; 32; 42, 52) is strip-shaped and in that a securing region (34) projecting inwards in the manner of a ramp adjoins the latching recess (33) in the direction of a nearest open end face.
2. Semiconductor lamp (1; 31; 41; 51) according to claim 1, wherein the connecting element (18; 32; 42; 52) has at least one latching recess (22; 33; 43; 53) which can be brought into latching engagement with a latching projection (20) of a respective end cap (4).
3. Semiconductor lamp (1; 31; 41) according to one of the preceding claims wherein the printed circuit board (16) loosely rests on the connecting element (18; 32; 42).
4. Semiconductor lamp (51) according to any one of claims 1 to 2 wherein the connecting element is integrated into the circuit board (52).
5. Semiconductor lamp (1; 31; 41; 51) according to one of the preceding claims, wherein the tube (2; 54) is a plastic tube.
6. Semiconductor lamp (1; 31; 41; 51) according to one of the preceding claims, wherein the tube (2; 54) is formed on the inside as a linear guide (24, 26; 24) for the printed circuit board (16; 52) and/or for the connecting element (18; 32; 42; 52).
7. Semiconductor lamp (1; 31; 41; 51) according to claim 6, in wherein the tube (2; 54) has inwardly extending projections (24) which hold the printed circuit board (16; 52) perpendicular to the longitudinal direction (L) on the tube (2).
8. Semiconductor lamp (1; 31; 41) according to claim 7, wherein the connecting element (18; 32; 42) is arranged in a cavity (25) formed between the circuit board (16) and the tube (2).
9. Semiconductor lamp (1; 31; 41) according to one of the preceding claims, wherein the tube (2; 54) is equipped on the inside with a receptacle (26) for the connecting element (18; 32; 42) which holds the connecting element (18; 32; 42) in a form-fitting manner in a transverse direction.
10. Semiconductor lamp in accordance with one of the preceding claims, wherein the printed circuit board (16; 52) is electrically connected to at least one end cap (4) by means of an electrical plug-in contact (15), the plug-in contact (15) being displaceable with respect to its plug-in contact mating element (7) while maintaining an electrical contact
11. Semiconductor lamp (1; 31; 41; 51) according to one of the preceding claims wherein the semiconductor lamp (1; 31; 41; 51) is a retrofit lamp.

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