EP3262713A1 - Réflecteur doté d'un circuit électronique et système d'antenne doté d'un réflecteur - Google Patents

Réflecteur doté d'un circuit électronique et système d'antenne doté d'un réflecteur

Info

Publication number
EP3262713A1
EP3262713A1 EP16705555.7A EP16705555A EP3262713A1 EP 3262713 A1 EP3262713 A1 EP 3262713A1 EP 16705555 A EP16705555 A EP 16705555A EP 3262713 A1 EP3262713 A1 EP 3262713A1
Authority
EP
European Patent Office
Prior art keywords
reflector
antenna
electromagnetic wave
substrate
structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP16705555.7A
Other languages
German (de)
English (en)
Other versions
EP3262713B1 (fr
Inventor
Wilhelm Keusgen
Richard Jürgen Weiler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Publication of EP3262713A1 publication Critical patent/EP3262713A1/fr
Application granted granted Critical
Publication of EP3262713B1 publication Critical patent/EP3262713B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/14—Reflecting surfaces; Equivalent structures
    • H01Q15/148—Reflecting surfaces; Equivalent structures with means for varying the reflecting properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/44—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the electric or magnetic characteristics of reflecting, refracting, or diffracting devices associated with the radiating element
    • H01Q3/46—Active lenses or reflecting arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
    • H01Q19/18—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces having two or more spaced reflecting surfaces
    • H01Q19/19—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces having two or more spaced reflecting surfaces comprising one main concave reflecting surface associated with an auxiliary reflecting surface

Definitions

  • Reflector with an electronic circuit and antenna device with a
  • the present invention relates to a reflector with an electronic circuit, which can be used for example for reflecting an incident electromagnetic wave, and to an antenna device.
  • the present invention further relates to a double reflector system with active electronics integrated into the main reflector.
  • directional antenna, data processing, and radio front-end i.e., electronic circuits
  • radio front-end i.e., electronic circuits
  • This is done by means of coaxial connections, tracks from the outputs of the electronic components, e.g. Amplifiers, transitions from tracks to waveguides, bonding wire connections or the like.
  • Disadvantages here are the physical size of the overall system as well as losses in terms of weight and efficiency of the antenna system, such as losses in the transitions from electronics to antenna, adaptation losses, etc.
  • PIFA Planar Inverted-F Antenna - planar frequency-inverted antenna
  • patch antennas PCB-based or on-chip antennas that radiate out of a chip housing, applied.
  • Phased array antennas also use the principle of integrated electronics in combination with radiating antenna elements on a circuit board, but do not make use of reflector components to increase the directivity, but use the combined radiation of many active antenna elements (eg patch antennas on the circuit board) to achieve a directivity.
  • FIG. 14 shows a schematic illustration of a reflector array 102 comprising a substrate 104 and a plurality of scattering elements 106.
  • a feed antenna 108 arranged at a distance from the reflector array 102 can emit a radio signal in the direction of the reflector array 102, the radio signal being reflected by the reflector array 102.
  • the design of the main reflector (Reflectarray 102) and optional subreflectors (other reflectors) can be based on printed circuit boards with reflective individual metal elements on a substrate with underlying metallic ground plane, i. Reflectarrays, done.
  • the reflective elements on the circuit boards serve to impart a desired phase function to the incident radiation, thus simulating the function of a physically domed subreflector.
  • the object of the present invention is therefore to provide a reflector and an antenna device, which enable efficient operation and a compact possibly lighter construction thereof. This object is solved by the subject matter of the independent patent claims.
  • a reflector includes a substrate and a plurality of reflector structures disposed on or in the substrate. The reflector structures are configured to reflect an incident electromagnetic wave.
  • An electronic circuit is disposed on or in the substrate and configured to control an antenna when the antenna is connected to the electronic circuit.
  • An advantage of this embodiment is that power losses between a data processing and a radio front end can be low, for example if the electronic circuit comprises the data processing and the radio front end.
  • the reflector can be compact, ie, having a small installation space, and possibly realized with a low weight.
  • the plurality of reflector structures is configured to reflect the incident electromagnetic wave such that the reflected electromagnetic wave undergoes beam focusing by the reflection at the plurality of reflector structures.
  • the multiplicity of reflector structures are arranged in at least two mutually different substrate planes.
  • the substrate planes are arranged in parallel to a substrate surface facing a direction in which the electromagnetic wave is reflected.
  • tolerance tolerance of the reflector is obtained by means of the two or more substrate planes.
  • Reflector structures arranged on different substrate planes can be positioned relative to one another by means of a relative position of the substrate planes relative to one another.
  • components of the electronic circuit can be positioned relative to the substrate planes, so that a robustness against position shifts is obtained.
  • At least one reflector structure of the plurality of reflector structures comprises a plurality (two or more) of dipole structures.
  • a plurality of transmission channels can be used or implemented, such as a transmission channel per dipole structure, a reception channel per dipole structure and / or a simultaneous transmission and reception operation of the electronic circuit and / or a connected antenna.
  • the reflector comprises a radome structure, which is arranged with respect to the plurality of reflector structures and is designed to at least partially reduce a mechanical or chemical influence of an environment of the plurality of reflector structures on the plurality of reflector structures.
  • the radome structure comprises, at least in regions, an electrically conductive structure which is designed to reflect the electromagnetic wave, the electrically conductive structure being arranged with respect to the plurality of reflector structures such that the electromagnetic wave reflected by the electrically conductive structure is directed in the direction of the plurality of Reflected reflector structures and reflected by these again.
  • the electrically conductive structure can be arranged as a sub-reflector with respect to a reflector used as a main reflector.
  • an antenna is arranged on or in the substrate, which is connected to the electronic circuit and which is designed to generate the electromagnetic wave based on a control of the electronic circuit.
  • an antenna device comprises a previously described reflector, a subreflector, which is designed to at least partially reflect the electromagnetic wave emitted by the antenna in the direction of the plurality of reflector structures, so that the electromagnetic wave reflected by the subreflector is reflected in Directed the direction of the plurality of reflector structures and reflected by these again.
  • the antenna device further comprises an antenna which is connected to the electronic circuit and which is designed to generate the electromagnetic wave based on a control of the electronic circuit and to emit in one direction of the subreflector.
  • the reflector structures and the subreflector have a Cassegrain configuration or a Gregorian configuration.
  • the advantage of this is that a high directivity of the antenna device can be obtained, so that a low transmission power is required and / or a high transmission range is obtained.
  • the antenna is designed as a surface-mounted component (SMD).
  • SMD surface-mounted component
  • an axial relative position of the subreflector with respect to the reflector is variable along an axial direction parallel to a surface normal of the substrate.
  • a lateral relative position of the subreflector with respect to the reflector along a lateral direction perpendicular to a surface normal of the substrate or an inclination of the main reflector or subreflector with respect to a surface of the substrate of the reflector is variable.
  • the antenna comprises a plurality of antenna elements, wherein a first subset of the antenna elements is configured to generate the electromagnetic wave having a first polarization direction and wherein a second subset of the antenna elements is formed to connect the electromagnetic wave to a second one To produce polarization direction.
  • a first subset of the plurality of reflector structures is configured to reflect the electromagnetic wave at a first reflectance when the electromagnetic wave has the first polarization direction and to reflect at a second reflectance when the first electromagnetic wave has the second polarization.
  • a second subset of the plurality of reflector structures is configured to reflect the electromagnetic wave at a third reflectance when the electromagnetic wave has the second polarization direction and reflects at a fourth reflectance when the electromagnetic wave has the first polarization.
  • the first reflectance and the third reflectance have a larger value than the second reflectance and the fourth reflectance.
  • the antenna is designed to conduct an electromagnetic wave emitted in the direction of the antenna device and received by the antenna device to the electrical circuit or to another electrical circuit.
  • the advantage of this is that a transmission function, a reception function and the generation of the electromagnetic wave as a function of a device can be performed integrated.
  • the antenna device comprises a plurality of antennas and a plurality of subreflectors, each subreflector being associated with an antenna.
  • the reflector can be arranged jointly with respect to the plurality of antennas and the plurality of subreflectors, so that a high degree of compactness of a multi-antenna device is obtained.
  • FIG. 1 is a schematic block diagram of a reflector according to an exemplary embodiment
  • FIG. 2 is a schematic side sectional view of a reflector having a substrate comprising a multilayer board according to an embodiment
  • FIG. 3a shows a schematic plan view of a reflector structure, which is designed as a rectangle according to an embodiment
  • 3b is a schematic plan view of a reflector structure, which is designed as an ellipse according to an embodiment
  • FIG. 3c is a schematic plan view of a reflector structure, which is designed as a combination of two dipole structures according to an embodiment
  • Fig. 3d is a schematic plan view of a reflector structure, the three each with a
  • Angular arranged to each other dipole structures comprises according to an embodiment
  • FIG. 4 shows a schematic view of a reflector, which is extended relative to the reflector of FIG. 1 by a housing part according to an exemplary embodiment
  • 5 shows a schematic side sectional view of a reflector, in which the substrate comprises plated-through holes according to an exemplary embodiment
  • 6 is a schematic block diagram of an antenna device including a reflector and an antenna according to an embodiment
  • Fig. 7 is a schematic block diagram of an antenna device, in which a plurality of reflector structures. 3c on the substrate according to an embodiment
  • FIG. 8 is a schematic block diagram of an antenna device including a horn antenna according to an embodiment
  • FIG. 9 is a schematic block diagram of an antenna device in which a substrate has an uneven shape according to an embodiment
  • 10 is a schematic plan view of a substrate on which a plurality of reflector structures and electrical subcircuits are arranged according to an embodiment
  • 1 1 is a schematic side view of the reflector of Figure 1 to illustrate the function of the impressed phase function according to an embodiment ..
  • 12 shows a schematic side view of an antenna device, which is designed as a folded reflector array antenna according to an exemplary embodiment
  • Fig. 13 is a schematic view of an antenna device according to the horn antenna and the reflector.
  • Fig. 1 comprises according to an embodiment
  • Fig. 14 is a schematic representation of a Reflectarrays according to the prior art.
  • the reflector 10 comprises a substrate 12 and a plurality of reflector structures 14, which are arranged on a surface of the substrate 12.
  • the plurality of reflector structures 14 are configured to reflect an incident electromagnetic wave 16 (radio signal).
  • the reflector 10 further includes an electronic circuit 18 disposed on the same side of the substrate as the plurality of reflector structures.
  • the electronic circuit 18 is configured to control an antenna (not shown) when the antenna is connected to the electronic circuit.
  • the antenna may, for example, be the antenna that generates or emits the electromagnetic wave 16.
  • the substrate may at least partially be a silicon substrate (wafer or parts thereof) or a printed circuit board (PCB).
  • the substrate 12 may have one or more layers (layers), which are interconnected or separated by intermediate layers.
  • the intermediate layers can be, for example, metallic layers which enable a shielding of the electromagnetic wave 16 and / or a supply of electronic components with a supply or reference potential (ground).
  • the intermediate layers can also be air layers, ie two layers of the substrate can be connected to one another by means of spacers. It is also conceivable that different layers 22a and 22b or 22b and 22c have an intermediate layer of air and are screwed together or the like, for example.
  • the intermediate air layers can also be used to accommodate reflector structures or act as reflector structures.
  • the plurality of reflector structures 14 are exemplarily disposed on a first major side of the substrate 12, i. on a side of the substrate 12 which faces the incident electromagnetic wave 16.
  • the electronic circuit 18 is described as being disposed on the same side as the plurality of reflector structures 14, the electronic circuit may also be disposed wholly or partially (such as sub-circuits) on another, approximately opposite side of the substrate 12 be.
  • the plurality of reflector structures 14 and / or the electronic circuit 18 may be wholly or partially disposed on or in the substrate 12, for example, when the substrate 12 is a multi-layered structure.
  • a further layer of the substrate 12 may be arranged so that the related reflector structure and / or the electrical circuit 18 are covered by the further layer.
  • the reflector structures 14 may include electrically conductive materials, such as metals or semiconductors.
  • a surface geometry of the multiplicity of reflector structures can be selected so that the respective surface form of the reflector structures 14 and / or their relative position to each other imparts a phase function to the incoming electromagnetic wave 16.
  • the electrically conductive material may be platinum, gold, silver, aluminum, copper, a (doped) semiconductor, or the like.
  • the multiplicity of reflector structures can be arranged on the substrate 12, for example by means of an adhesive, pressure or sputtering method or by vapor deposition.
  • the plurality of reflector structures in the form of island structures may be formed in a PCB by etching or milling.
  • At least one reflector structure can be arranged by means of a chemical gilding or by vapor deposition.
  • a phase function impressed on the electromagnetic wave 16 by the reflector structures 14 may be embodied such that the electromagnetic wave 16 undergoes bundling by the reflection and is collimated or at least less scattered is reflected by the reflector 10.
  • the imposed phase function can simulate a curvature of the reflector 10, for example convex or concave.
  • the plurality of reflector structures is based on the phase function so matched to each other that the electromagnetic wave 16 locally over the area distribution and design of the reflector structures 14 different (direction, polarization, etc.) is reflected, so that the phase function of the electromagnetic Shaft 16 is impressed.
  • the phase function can be used to obtain beam shaping (beam contour or contra-beam).
  • the reflector 20 comprises the substrate 12, wherein the substrate 12 comprises a board or is designed as a multilayer board.
  • the substrate 12 comprises a first layer 22a, a second layer 22b and a third layer 22c, which together form parts of a stack, wherein between the first layer 22a and the second layer 22b a first at least partially electrically conductive layer 24a and between the second layer 22b and the third layer 22c, a second at least partially electrically conductive layer 24b is arranged.
  • the layers 22a, 22b and / or 22c may comprise, for example, an epoxy material, a semiconductor material and / or a glass fiber material, such as FR-4, Kapton or the like, which may be glued together.
  • the stack of substrate 12 will be described as having the plurality of reflector structures 14 at an upper end of the substrate 12 and the electronic circuit including electronic subcircuits 18a-c disposed at a lower end of the stack. It is obvious that, depending on the orientation of the reflector 20 in space, the term “top” or “bottom” can be replaced by any other name.
  • a multilayer substrate may also comprise only one layer and one conductive layer.
  • the conductive layers 24a and 24b may, for example, comprise metallic materials and be used or contacted as a ground plane.
  • the conductive layers 24a and / or 24b allow (possibly complete) reflection of the electromagnetic wave 16. This may refer to portions of the electromagnetic wave 16 that are not reflected by the reflector structures 14 and penetrate into the substrate 12 .
  • An arrangement of the electronic circuit or subcircuits 18a, 18b and / or 18c on one side of the conductive layers 24a and / or 24b facing away from the incident electromagnetic wave 16 allows shielding of the electronic subcircuits 18a-c from the electromagnetic wave. This offers in operation in particular advantages with respect to a low electromagnetic coupling of the electromagnetic wave 16 in circuit structures, which would lead to an impairment of the functionality of the electronic circuit.
  • the shield thus allows increased electromagnetic compatibility (EMC) of the reflector 20.
  • EMC electromagnetic compatibility
  • the arrangement of the electronic subcircuits 18a-c on a side other than the plurality of reflector structures 14 allows increased area utilization of the top of the stack by the reflector structures 14, since no space needed for the electronic circuit.
  • At least one reflector structure 14 is arranged in a substrate plane different from the top side of the substrate 12, for example as a structure arranged on or in the metallic layer 24a.
  • the metallic layer 24a may be structured. This allows a higher (area) density of the reflector structures 14 with respect to the electromagnetic wave 16, so that a reflected portion of the electromagnetic wave 16 acted upon by a phase function is increased. In operation, this allows a smaller proportion of the electromagnetic wave 16 to couple into the electrically conductive layer. Alternatively or additionally, a higher or the entire portion of the electromagnetic wave 16 can be acted upon by a phase function.
  • the phase function of the reflected electromagnetic wave may have a higher degree of linearity compared to the incoming electromagnetic wave 16, resulting in increased tolerance robustness.
  • one or more electronic subcircuits 18a-c are arranged facing the electromagnetic shaft 16 on the first layer 22a.
  • one or more electronic subcircuits 18a-c may be disposed in the substrate 12, such as the second layer 22b or the first or second electrically conductive layer 24a or 24b.
  • the ground surface 24a is another layer (second layer 22b), which have an electrical function or purely serve the stability of the circuit board.
  • a further ground plane 24b which, for example, galvanically isolated from the upper ground surface 24a, the ground surface for the substrate layers on the underside of Printed circuit board for the active electronics (electronic sub-circuits 18a-c) can form.
  • the substrate 12 may also comprise only one layer, two layers or more than three layers.
  • the second layer 22b may not be arranged or be in the form of multiple layers.
  • the reflector structures 14 can also be embodied embedded in one of the layers 22a, 22b or 22c, for example as conductive "islands" of a printed circuit board. If, for example, the second layer 22b is not arranged, only one of the metallic layers 24a or 24b can be arranged between the layers 22a and 22c.
  • the reflector structures 14 may have mutually different polarization directions (preferred directions). Different polarization directions can be arranged in different substrate planes.
  • the substrate planes may be arranged parallel to a substrate surface (the electromagnetic wave 16 facing or opposite side of the substrate 12).
  • the substrate may, for example, comprise a liquid crystal (LC) substrate layer arranged such that the reflector structures are located between a (virtual) source of the electromagnetic wave and the LC substrate layer.
  • LC liquid crystal
  • Fig. 2 shows a possible layer structure of a main reflector printed circuit board.
  • the uppermost layer i.e., above the first layer 22a
  • the reflective elements which can impart a phase function of the incident radiation 16 and which are on a substrate (first layer 22a).
  • a metallic layer 24a Under this substrate is a metallic layer 24a, which serves for example as a ground surface and ensures the reflection of all incident rays.
  • the reflector 20 may instead of two galvanically separated ground surfaces 24a and 24b for reflective elements and electronics also have only a common ground plane in the layer structure and thus for the reflective elements 14 and the electronics 18a-c without further intermediate layer for the stability of the circuit board.
  • the (upper) substrate layers of the main reflector for the reflective elements can be designed both single-layered and multi-layered, wherein in the case of multi-layered design further reflective elements can be arranged between the metallic layers.
  • adhesive layers that physically connect these layers (multi-layer reflector array) can be arranged.
  • An advantage, possibly the main advantage, of the multilayer design lies in the greater realizable bandwidth of the main reflector. The same applies to the layers of the subreflector, this should be designed as a printed circuit board version.
  • the lower substrate layers (22c) of the main reflector for the electronics can be designed both single-layer and multi-layer, wherein in several layers turn metallic layers with traces and adhesive layers that connect the different substrate layers can be arranged.
  • main reflector board or subreflector board may be glued or mechanically fixed or held together by other means.
  • FIGS. 3a-d each show schematic plan views of possible embodiments of the reflector structures.
  • 3a shows a schematic plan view of a reflector structure 14-1, which is designed as a rectangle with a first side dimension a and a second side dimension b.
  • the side dimensions a and b may have a different or equal value (square).
  • 3b shows a schematic plan view of a reflector structure 14-2, which is designed as an ellipse. A ratio of major and minor axis is arbitrary.
  • 3c shows a schematic plan view of a reflector structure 14-3, which is designed as a combination of two dipole structures 26a and 26b.
  • the dipole structures 26a and 26b are arranged perpendicular to one another, which enables highly isolated or decoupled reflection of incident electromagnetic waves with different polarization directions.
  • a vertical arrangement of the dipole structures 26a and 26b enables, for example, a polarization reflection perpendicular to one another. tions, such as horizontal and vertical, whereby these orientations in each case or together can rotate freely in space or otherwise designated.
  • the dipole structures 26a and 26b may also have an angle other than 90 ° and / or reflect directions of polarization that are the same or different angles.
  • the dipoles 26a and 26b each have an increased reflectance when the electromagnetic wave having a polarization coincident with the arrangement of the respective dipole 26a or 26b is received, and a contrast reduced reflectance when the electromagnetic wave with another, in particular with a polarization direction arranged perpendicular thereto is received.
  • the dipole structure 26a has a high (first) reflectance, for example.
  • the dipole structure 26a has a lower (second) reflectance.
  • the first polarization may be referred to as the preferred direction with respect to the dipole 26a.
  • the dipole 26b has a high (third) reflectance at the second polarization and, when the electromagnetic wave has the first polarization, a low (fourth) reflectance at which the electromagnetic wave is reflected.
  • the first and third reflectances are greater than the second and fourth reflectances.
  • the first and the third or the second and the fourth reflectance can also be the same.
  • the dipole 26a may be configured to reflect the first polarization and the dipole 26b to reflect the second polarization.
  • the dipole structures 26a and 26b may further be configured to impose mutually different phase functions on a reflected electromagnetic wave.
  • FIG. 3d shows a schematic plan view of a reflector structure 14-4, which comprises three dipole structures 26a, 26b and 26c arranged at an angle to each other, which allows a reflection of three corresponding polarizations.
  • the dipole structures 26a-c may be at any angle to each other and, for example, adapted to polarizations of electromagnetic waves to be transmitted. Alternatively, more than three dipole structures or only one dipole structure can be arranged.
  • the reflector structures may also have any other shape, such as a polygonal shape, a circular shape, a freeform or a combination of shapes and / or dipole structures.
  • the reflective elements may have any geometry when the main or subreflector is designed as a reflector array.
  • any method can be used to implement the desired phase change on the aperture of the reflector, such as a variable size of the elements, attached line sections, and / or rotation of the elements to each other.
  • FIG. 4 shows a schematic view of a reflector 40, which is extended in such a way in relation to the reflector 10 that a housing part 28 is arranged on a side of the substrate 12 facing away from the reflector structures 14.
  • the housing part 28 can be used, for example, as a cover of the electronic circuit, which is arranged facing the housing part 28 on the substrate 12.
  • the housing part 28 may comprise non-conductive (for example comprising plastic materials or resin materials) or conductive materials (for example metals).
  • the housing part 28 may be a metallic cover.
  • a radome structure 32 is arranged on the side of the substrate 12 facing the reflector structures 14.
  • the substrate 12 is shown offset only with respect to the housing part 28 and the radome structure 32 for the sake of better illustration, ie, the substrate 12, the housing part 28 and the radome structure 32 can also be arranged such that the substrate 12 is separated from the housing part 28 and the housing 12 Radom Weg 32 enclosed (housed) is.
  • the house can be waterproof and / or chemically resistant.
  • the radome structure 32 comprises an electrically conductive structure 34, at least in regions.
  • the electrically conductive structure 34 is designed to reflect the electromagnetic wave and is arranged with respect to the plurality of reflector structures 14 such that the electromagnetic wave reflected by the electrically conductive structure 34 Direction of the plurality of reflector structures 14 is directed and reflected by these again. If, for example, an antenna is arranged between the housing part 28 and the radome structure 32 (for example on or in the substrate 12), then this antenna can be designed to emit the electromagnetic wave in the direction of the electrically conductive structure 34, so that the electrically conductive structure 34 the electromagnetic wave is reflected in the direction of the reflector structures 14.
  • the electrically conductive structure 34 may provide the function of a subreflector.
  • the sub-reflector can be arranged as part of a double reflector system, in which the reflector 10 or 20 is arranged as a main reflector.
  • the reflector structures 14 may then provide the electromagnetic wave with the phase function and emit (through the radome structure 32).
  • the radome structure 34 can also comprise a further multiplicity of reflector structures.
  • a Radomlage can be placed over the reflective elements / electronics of the main reflector circuit board to cover the elements and protect against corrosion and external influences, or at least reduce the influence.
  • This Radomlage can additionally change the reflection properties of the reflective elements or serve for thermal heat dissipation for the electronics.
  • FIG. 5 shows a schematic side sectional view of a reflector 50, in which the substrate 12 comprises vias 36a and 36b as compared to the reflector 20, so that electrical signals from the electronic circuit 18 through the substrate 12 to those of FIG electronic circuit 18 opposite side of the substrate 12 can be passed.
  • an antenna 38 is arranged, which is designed to emit a radio signal, for example in the form of the electromagnetic wave 16.
  • the antenna 38 is connected, for example, by means of bonding wires 41 a and 41 b to the plated-through holes 36 a and 36 b and thus to the electronic circuit 18.
  • the electronic circuit 18 is designed to control the antenna 38, so that parameters of the electromagnetic wave 16, such as a signal shape, a transmission duration, a signal amplitude and / or a transmission frequency are influenced by the control of the electronic circuit 18.
  • the reflector structures (not shown) are arranged on the same side of the substrate 12 as the antenna 38. Alternatively or additionally, reflector structures can also be arranged in the substrate 12. Alternatively, the electronic circuit 18 may also be arranged on the same side as the antenna 38 on the substrate 12 and / or in the form of sub-circuits. An arrangement of the antenna 38 on the substrate 12 allows a highly integrated interconnection of electronic circuit 18 and antenna 38, which can lead to low power losses and thus an efficient operation.
  • the reflector 50 can therefore also be described as an antenna device comprising the electronic circuit 18, the substrate 12 and the antenna 38.
  • the antenna 38 may be any antenna.
  • it can be an on-chip feed antenna, a patch antenna, a PIFA antenna, a waveguide antenna, a silicon-based antenna, or any other antenna.
  • an antenna form comprising a double reflector system can be obtained.
  • This antenna nform can be embodied, for example, as a Cassegrain antenna or as a Gregorian antenna, so that an integrated Cassegrain antenna or an integrated Gregorian antenna can be obtained.
  • FIG. 5 shows an example of the connection of the electronic components of the lower layers with the on-chip feeding antenna on the upper side of the main reflector printed circuit board.
  • the connection of the electronics to an SMD on-chip antenna is realized by means of vias and optional bonding wires.
  • the subreflector 42 may be part of a radome structure.
  • FIG. 6 shows a schematic block diagram of an antenna device 60 comprising the substrate 12 on which the plurality of reflector structures 14 are arranged.
  • the antenna 38 is disposed on the substrate 12 on the same side as the plurality of reflector structures 14 and configured to generate and emit the electromagnetic wave 16.
  • the electromagnetic wave 16 can be (spatially) wide, ie radiated with a large opening angle. This means that the electromagnetic wave 16 can have a low directivity.
  • Subrefiektor 42 arranged with respect to the substrate 12 a further reflector structure, hereinafter referred to as Subrefiektor 42 arranged.
  • the subreflector 42 may be, for example, a concave or convex conductive layer.
  • the subreflector 42 may also be planar, comprising, for example, a substrate and / or a circuit board with reflector structures which are designed to impose a phase function on the received and reflected electromagnetic wave 16.
  • the subreflector 42 is arranged and configured to scatter the electromagnetic radiation received by the antenna 38 and to reflect at least partially in the direction of the reflector structures 14.
  • the reflector structures 14 are designed to re-reflect the electromagnetic wave 16 reflected by the subreflector 42 and to adapt the phase function of the electromagnetic wave 16 in such a way that the electromagnetic wave 16 is beam-focused relative to the characteristic of the antenna 38.
  • the electromagnetic wave 16 can be emitted approximately or completely collimated, so that it is possible to use the antenna device 60 as a directional antenna.
  • FIG. 7 shows a schematic block diagram of an antenna device 70 in which a multiplicity of reflector structures 14-3 are arranged on the substrate 12.
  • the electronic circuit comprises the subcircuits 18a and 18b which are arranged on the same side of the substrate 12 as the reflector structures 14-3 and the antenna 38.
  • the electronic subcircuits 18a and 18b are connected to the antenna 38 by means of so-called microstrip lines (MSL) 43a and 43b, for example.
  • MSL microstrip lines
  • the subreflector 42 can be tilted by an angle ⁇ with respect to the substrate 12 or with respect to the antenna 38 and / or the reflector structures 14-3.
  • the subreflector is convex shaped or is configured to impart a convex phase function to the electromagnetic wave.
  • the angle ⁇ may, for example, be less than 90 °, less than 60 ° or less than 30 °.
  • the imposed phase function can be tilted in space, so that a total of a radiation pattern with which the electromagnetic wave is reflected by the reflector structures 14-3, is changed.
  • the electromagnetic wave can be reflected in a space direction that varies with the angle ⁇ .
  • the subreflector 42 is also movable along an axial direction 44.
  • a distance between the subreflector 42 and the substrate 12 and the antenna 38 along the axial direction 44 is variable.
  • the axial direction 44 extends, for example, parallel to a surface normal 46 of the substrate 12.
  • a reduced distance between the antenna 38 and the subreflector 42 can, depending on the scattering characteristic of the subreflector 42, narrow or widen a beam lobe lead the electromagnetic wave. That is, a focus of the electromagnetic wave radiated from the reflector structures 14-3 is variable with the distance and the movement along the axial direction 44, respectively. This allows adjustment or correction of the directivity of the antenna structure 70, for example, due to varying environmental influences, such as heating and / or varying materials between the antenna device 70 and another antenna device with which the antenna device 70 communicates.
  • the sub-reflector 42 may also be movable along a lateral direction 48, which is arranged perpendicular to the surface normal 46.
  • the sub-reflector 42 may also be rigid or only tiltable by the angle ⁇ or arranged to be movable along the direction 44.
  • a position of the dipoles of the reflector structures 14-3 can be adapted to one polarization or to several polarizations, with which the electromagnetic wave is emitted by the antenna device 70. Alternatively or additionally, other reflector structures may be arranged.
  • the antenna 38 is designed to conduct an electromagnetic wave sent in the direction of the antenna device and received by the antenna device 70 to the electrical circuit (not shown) or to another electrical circuit which, for example, faces away from the antenna 38 on one side of the substrate 12 is arranged.
  • the substrate 12 or the (main) reflector may also have a plurality of antennas 38, which may be identical or different from each other.
  • a plurality of subreflectors 42 may be arranged.
  • each subreflector may be associated with one of the antennas arranged. This allows the construction of a multi-antenna device.
  • FIG. 8 shows a schematic block diagram of an antenna device 80 comprising an antenna 38 '.
  • the antenna 38 ' is designed as a horn antenna.
  • a subreflector 42' is arranged, which is designed to simulate a concave shape by means of the phase function.
  • the subreflector 42 ' may, for example, be designed as a concave metallic element.
  • the antenna device 80 can be used, for example, as a Gregorian antenna.
  • the shape of the subreflector 42 or 42 'can be selected independently of an embodiment of the antenna 38 and 38'.
  • the antenna device 80 may also include the antenna 38 and / or the sub-reflector 42.
  • FIG. 9 shows a schematic block diagram of an antenna device 90 in which a substrate 12 '(main reflector) has an uneven shape. This is obtained, for example, by an arrangement of a plurality of (possibly even) sub-substrates 12a-e arranged at an angle to each other. This can also be referred to as a sector paraboloid or as a multi-faceted reflector array (multi-surface reflector).
  • a concave or convex or piecewise continuous shape for example a parabolic shape
  • the main reflector and / or the substrate 12 ' can be made in several parts, wherein the parts can be arranged parallel to one another or at an angle.
  • the antenna 38 is arranged displaced, for example, from a center position (so-called offset feed).
  • the antenna 38 may also be arranged in a geometric or areal center of gravity.
  • the antenna device 90 may also be described as a 1D multi-faceted reflector array configuration.
  • the board-based main reflector may be implemented with electronics for driving the feed antenna (s) as a sectoral paraboloid (Multi-Faceted Reflectarray) and / or in a physically domed form (compliant antenna) with one or more printed circuit boards to achieve the desired phase function to realize.
  • the electronics for driving the feeder antenna (s) are arranged.
  • a board-based subreflector may be formed of a plurality of sector-shaped circuit boards.
  • Fig. 1 1 shows a schematic side view of the reflector 10 to illustrate the function of the impressed phase function, the explanations are transferable to a sub-reflector.
  • the phase function impressed by the reflector structures 14 of the electromagnetic wave 16 enables an implementation of a virtual design of the reflector 10.
  • the dashed concave line shows the implemented virtual parabolic shape of the reflector.
  • the reflector 10 may have a planar substrate 12 with the reflector structures 14 arranged thereon.
  • the electromagnetic wave 16 may be reflected as if reflected by a concave (or alternatively convex) or parabolic reflector.
  • Fig. 12 shows a schematic side view of an antenna device 120, which is designed as a folded reflector array antenna.
  • the antenna device 120 includes, for example, the horn antenna 38 'or alternatively any other antenna shape.
  • a sub-reflector in the form of a polarizing grating or slit array 44 is arranged.
  • the polarizing grating or slit array 44 is configured to polarize and reflect the electromagnetic wave 16 when it has a first polarization.
  • the reflector structures 14 are configured to rotate a polarization of the electromagnetic wave and to focus the electromagnetic wave 16.
  • the slit array 44 may be configured to pass the electromagnetic wave 16 largely or completely when it has the rotated (second) polarization.
  • the subreflector can be embodied as a physically curved variant convex (for example for a Cassegrain antenna), concave (for example for a Gregorian antenna) or likewise as a printed circuit board (reflector array).
  • a folded antenna can also be arranged as a reflector system.
  • a focusing or contra-beam function of the main printed circuit board-based reflector as a reflector array is still given in such a case.
  • a sub-reflector for example, a polarization-selective grating in a similar or the same size as the main reflector can be mounted over this.
  • the food antenna may continue to be in a position below the subreflector grid.
  • the incident rays of the food antenna are polarization-dependent reflected by this grid, wherein the reflection of the polarization can be partially rotated.
  • the polarization of the incident radiation is then partially rotated again and at the same time focused or shaped in the desired manner.
  • the rays can Now pass the subreflector without reflection.
  • This folded shape of the antenna can thus also be made very compact, however, be realized by the polarization selectivity of the subreflector only with a polarization and certain reflective elements on the main reflector, which rotate the polarization of the incident rays in the executed reflection.
  • FIG. 13 shows a schematic view of an antenna device 130 comprising the horn antenna 38 'and the reflector 10.
  • a reflector characteristic analogous to a parabolic main reflector is obtained.
  • the subreflector 42 is arranged, which reflects the electromagnetic wave 16 emitted with an opening angle of 2 d ⁇ and reflects back in the direction of the reflector 10.
  • this acts like a virtual antenna (virtual feed) 38 v , which emits the electromagnetic wave 16 with the opening angle 2. Put simply, this implements a function of a Cassegrain antenna.
  • some of the embodiments described above can be implemented as a double reflector system, for example as a Cassegrain antenna, Gregorian antenna or folded antenna.
  • a food antenna may be located centrally on a main reflector and configured to illuminate (illuminate) the subreflector, which in turn is configured to illuminate the main reflector.
  • the subreflector can virtually mirror the function of the food antenna over the main reflector.
  • the virtual mirror point can be displaced by the convex or concave (Gregorian antenna) shape of the subreflector as opposed to mirroring on a planar metallic surface.
  • the main reflector may be parabolic or designed to implement a corresponding phase function, i. it leads to a collimation of the incident radiation and thus to a directivity.
  • the antenna can therefore combine a high directivity with a very compact design.
  • the embodiments relate to a main reflector, which is designed as a printed circuit board (PCB), on the lower or upper side (or another side) in addition to the electronics for feeding the dining antenna is located.
  • a main reflector which is designed as a printed circuit board (PCB)
  • PCB printed circuit board
  • the elements of the reflector array and a food antenna are arranged.
  • the control of this dining antenna can be done by electronics, which is located on the same or another side or on both sides of the circuit board.
  • the electronic circuit active electronics
  • the food antenna can be any antenna and have a narrow or a broad radiation characteristic.
  • the feed antenna can be embodied, for example, as an on-chip antenna, horn antenna, open waveguide or phased array antenna.
  • the food antenna may also comprise a plurality of distributed antenna elements which may be excited individually or in groups for radiation.
  • Further examples of food antennas are, for example, substrate-integrated waveguides, possibly with horn, (planar) mode converters with attached horn, packed antennas, printed planar antennas, such as a patch antenna, PIFA antennas or the like.
  • the food antenna may comprise one or more individual food antennas having the same or different polarizations.
  • a multiplex, demultiplex or duplex transmission of electromagnetic waves can thus also be realized depending on the polarization.
  • crossed dipoles can be arranged as reflective elements.
  • the individual dipole arms can selectively reflect the phase of the incident beams with polarization in a longitudinal direction.
  • the scattering elements can thus selectively reflect different, for example orthogonal linear polarizations, with high insulation and thus impose different phase assignments on the different, for example orthogonally polarized, beams. This allows, for example, a spatial separation, i. two focus points, the two linearly orthogonal polarized food antennas. That is, two dining antennas are arranged.
  • the feed antenna may be located at a (eg vertical) position, ie perpendicular to the aperture of the main reflector, which is at the level of the main reflector (approximately in the form of a patch antenna), higher (approximately in the form of a horn antenna), however also deeper (integrated in about one of the layers of the substrate).
  • Embodiments comprise two or more feed antennas, which are designed in each case to emit an electromagnetic wave with mutually different frequencies (so-called multi-band reflector array).
  • the feed antennas can be controlled in the time-division multiplex method.
  • a horizontal (lateral) position of the feed antenna in the aperture plane of the main reflector
  • the axial or lateral position of the subreflector may be variable.
  • the subreflector can also be tilted by an arbitrary angle ⁇ (for example, less than 90 °).
  • One (possibly essential) function of the double reflector system is, for example, beam focusing, ie a high directivity of the antenna.
  • the antenna can thus be used in directional radio and / or point-to-point connections (direct connections).
  • the possibility of a contours-shaped radiation (Contured Beam) by means of suitable phase assignment of the main reflector reflector array is also possible.
  • a main application here is, for example, the satellite radio.
  • the phase assignment phase function
  • the main or sub-reflector are mechanically movable relative to each other, for example, to perform a beam control or pivoting.
  • Embodiments described above describe implementations of a main reflector that combines the electronics and the radiation reflection with specific phase coverage of the radiation of a subreflector, such as in a Cassegrain antenna system or in a folded antenna on a printed circuit board.
  • An advantage here is the compactness of the antenna system and the integrability of the electronics together with the reflector properties of the antenna on a printed circuit board.
  • antenna devices according to embodiments described above can be used everywhere where a highly integrated antenna with high directivity or contour-shaped radiation is needed.
  • a case segrain reflector array antenna with main and submirror (reflector) can be seen as a printed circuit board design.
  • the subreflector as a printed circuit board can be embedded in a radiation-transmissive Radomgephaseuse, while the main reflector printed circuit board is mounted on a metallic housing, the function of which protects the electronics and their shielding (in the sense of EMC) and / or the heat dissipation of the electronic components.
  • the two housing components can be joined together mechanically (possibly water-resistant and / or chemical-resistant) and enclose the main reflector circuit board with an applied on-chip supply antenna.
  • the connections to the outside, ie for contacting the antenna device, can be carried out for example in the form of a data connection and as a connection for the power supply.
  • antenna and / or the antenna device have been described above as being configured to generate and emit the electromagnetic wave 16, embodiments may also be used to alternatively or additionally receive the electromagnetic wave 16 such that this can be evaluated with the electronic circuit or another electronic circuit.
  • aspects have been described in the context of a device, it will be understood that these aspects also constitute a description of the corresponding method, so that a block or a component of a device is also to be understood as a corresponding method step or as a feature of a method step , Similarly, aspects described in connection with or as a method step also represent a description of a corresponding block or detail or feature of a corresponding device.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Aerials With Secondary Devices (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne un réflecteur qui comprend un substrat, ainsi qu'une pluralité de structures réfléchissantes qui sont agencées contre le substrat ou dans celui-ci et qui sont conçues pour réfléchir une onde électromagnétique incidente. Ce réflecteur comprend en outre un circuit électronique qui est agencé contre le substrat, sur le substrat ou dans celui-ci et qui est conçu pour commander une antenne lorsque celle-ci est reliée au circuit électronique.
EP16705555.7A 2015-02-24 2016-02-22 Réflecteur doté d'un circuit électronique et dispositif d'antenne doté d'un réflecteur Active EP3262713B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP15156378.0A EP3062392A1 (fr) 2015-02-24 2015-02-24 Réflecteur doté d'un circuit électronique et dispositif d'antenne doté d'un réflecteur
PCT/EP2016/053674 WO2016135099A1 (fr) 2015-02-24 2016-02-22 Réflecteur doté d'un circuit électronique et système d'antenne doté d'un réflecteur

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EP3262713A1 true EP3262713A1 (fr) 2018-01-03
EP3262713B1 EP3262713B1 (fr) 2021-01-13

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EP15156378.0A Withdrawn EP3062392A1 (fr) 2015-02-24 2015-02-24 Réflecteur doté d'un circuit électronique et dispositif d'antenne doté d'un réflecteur
EP16705555.7A Active EP3262713B1 (fr) 2015-02-24 2016-02-22 Réflecteur doté d'un circuit électronique et dispositif d'antenne doté d'un réflecteur

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US (1) US10978809B2 (fr)
EP (2) EP3062392A1 (fr)
JP (2) JP2018510559A (fr)
KR (1) KR101952168B1 (fr)
CN (1) CN107548527B (fr)
CA (1) CA2976830C (fr)
WO (1) WO2016135099A1 (fr)

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Also Published As

Publication number Publication date
WO2016135099A1 (fr) 2016-09-01
CN107548527B (zh) 2021-10-15
CA2976830C (fr) 2020-12-01
KR20170117595A (ko) 2017-10-23
KR101952168B1 (ko) 2019-02-26
EP3062392A1 (fr) 2016-08-31
JP2019208241A (ja) 2019-12-05
JP6920374B2 (ja) 2021-08-18
JP2018510559A (ja) 2018-04-12
US20170373401A1 (en) 2017-12-28
US10978809B2 (en) 2021-04-13
CN107548527A (zh) 2018-01-05
CA2976830A1 (fr) 2016-09-01
EP3262713B1 (fr) 2021-01-13

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