EP3257337A1 - Electronic assembly and method for the production thereof - Google Patents

Electronic assembly and method for the production thereof

Info

Publication number
EP3257337A1
EP3257337A1 EP16702538.6A EP16702538A EP3257337A1 EP 3257337 A1 EP3257337 A1 EP 3257337A1 EP 16702538 A EP16702538 A EP 16702538A EP 3257337 A1 EP3257337 A1 EP 3257337A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
carrier
electronic component
cover
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16702538.6A
Other languages
German (de)
French (fr)
Inventor
Andreas Albert
Andreas Plach
Mathias Strecker
Matthias Wieczorek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitesco Technologies Germany GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of EP3257337A1 publication Critical patent/EP3257337A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/066—Hermetically-sealed casings sealed by fusion of the joining parts without bringing material; sealed by brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to an electronic component according to the preamble of claim 1.
  • the invention further relates to a method for producing such an electronic component.
  • Conventional electronic components eg. As a control device of a motor vehicle for arrangement in an engine compartment, such as a transmission control unit, are usually designed as hermetically sealed modules. These have to seal a metal housing through which contact pins are led to the outside. The contact pins are sealed by means of so-called impressions. This creates a connection between an outer space and an interior of the electronic component.
  • the contact pins can, for example, with a flexible
  • Printed circuit board or a lead frame electrically conductively connected and thus led to other functional elements.
  • Another design of a known electronic component which is also hermetically sealed, comprises a support element, which is guided, for example, as a metal plate ⁇ and on which an electrical circuit is adhesively fixed, z. B. by means of a Winnipegleitklebstoffs.
  • the electronic component further comprises a printed circuit board element and a cover element.
  • the printed circuit board element is arranged between the carrier element and the cover element, wherein a connection between the cover element and the circuit board element by means of an oil-tight bond, for.
  • a liquid adhesive or an adhesive tape is executed.
  • an electronic module for a vehicle has a cover element, a component carrier. ger printed circuit board element, a support member having a first side and a second side, a printed circuit board element and at least one contacting, which is ⁇ directed to provide a conductive contact between the component carrier PCB element and PCB element ready ⁇ , wherein the cover and the Bauteilträ ⁇ ger printed circuit board element are arranged on the first side of the Suele ⁇ Mentes. It is provided that the Lei ⁇ terplattenelement is arranged on the second side of the support element and that the support member has at least one opening through which the contacting element is guided.
  • the invention is based on the object to provide an improved over the prior art electronic component and a method for producing such an electronic component.
  • the object is achieved according to the invention with the features specified in claim 1.
  • the object is achieved according OF INVENTION ⁇ dung to those specified in claim 9 features
  • An electronic component comprises a carrier element, a circuit carrier with a number of electronic components, a printed circuit board, which is electrically conductively connected to the circuit carrier, and a cover element for covering the
  • the cover is on one
  • the electronic component designed in this way is to be ⁇ order in a motor vehicle, eg. B. as a transmission control unit, suitable.
  • a motor vehicle eg. B. as a transmission control unit
  • a particularly media-tight, for example, fluid-tight, interior space is produced, in which the circuit carrier is located with the electronic components.
  • the welded joints between the circuit board and the cover member and the support member are formed mechanically particularly stable to glue joints, so that a seal of the circuit carrier is permanently ensured ⁇ .
  • the weldable layer is formed as a thermoplas ⁇ tical layer and is applied for example by means of lamination on the circuit board.
  • the weldable layer can also be as a metallic layer being formed ⁇ .
  • the metallic layer can be applied to the printed circuit board, for example by screen printing or a so-called ink-jet process.
  • circuit carrier is thermally coupled to the carrier element.
  • circuit carrier is adhesively connected, for example by means of a heat conductive adhesive ⁇ with the carrier element. A waste heat from the circuit carrier can thus be removed directly via the Trä ⁇ gerelement.
  • a further embodiment of the invention provides that the circuit board is electrically conductively connected to the circuit carrier by means of at least one electrical connection element.
  • the at least one elekt ⁇ generic connection element is formed as a bonding wire.
  • the printed circuit board is welded to the carrier element and the cover element.
  • the method provides a simple way the Her ⁇ position of an electronic component with a particular media, the fluid-tight interior, so that the circuit carrier with the electronic components against external influences, such as gear oil or metal chips protected.
  • An embodiment of the method provides that the circuit board is welded to the carrier element and the cover by means of friction stir welding and / or laser welding. This is a mechanically stable welding ⁇ compound produced.
  • Figure 2 schematically shows a sectional view of another electronic component according to the prior art and schematically a sectional view of an electro-American component in an imple mentation according to the invention.
  • FIG. 1 shows a in the above-mentioned
  • the electronic component E is for example a STEU ⁇ er réelle for a motor vehicle, eg. As a transmission control unit, and includes a support member 1 and a cover 2. Between the carrier element 1 and the cover element 2, a circuit carrier 3 is arranged in an interior I of the electronic component E, which accommodates a number of electronic components 4, which are merged into an electrical circuit.
  • the circuit substrate 3 is in the illustrated embodiment by means of two electrical connection ⁇ elements 5 electrically connected to a circuit board 6.
  • the illustrated embodiment of the known electronic component E thus results in a layer structure in the direction of a vertical axis z with the support element 1, then placing the printed circuit board 6 and the circuit substrate 3, the scarf ⁇ tion carrier 3 and a portion of the circuit board 6 with the cover 2 closed become.
  • the carrier element 1 is for example a metallic one
  • Base plate, z. B. an aluminum plate, which receives the scarf ⁇ tion carrier 3 and the circuit board 6 on a flat side.
  • the circuit carrier 3 is formed, for example, as a low-temperature burn-in ceramic or micro-circuit board and is connected to the support member 1 cohesively by means of an adhesive K, z. B. by means of a bathleitklebers connected.
  • the circuit carrier 3 is arranged completely in the interior I of the electronic component E and comprises as electronic components 4, for example capacitors, Wi ⁇ resistances, packaged and / or ungefeld semiconductor component, etc., which are glued to the circuit substrate 3, for example, and / or soldered.
  • the further arranged on the carrier element 1 printed circuit board 6 is made of an electrically insulating substrate, for. As epoxy, formed and has at least one layer electrically conductive interconnects 6.1, wherein in the present embodiment, a conductor 6.1 is shown by way of example. Alternatively, the circuit board 6 may also be formed mechanically flexible.
  • the printed circuit board 6 is arranged both in the interior I and in an outer space of the electronic component E and analogous to the circuit substrate 3 cohesively by means of a further adhesive K, z.
  • a further adhesive K, z For example, a liquid adhesive or a tape, oil-tight connected to the support member 1.
  • the printed circuit board 6 forms a connection between the outer space and the inner space I.
  • the printed circuit board 6 has a recess, within which the circuit carrier 3 is arranged.
  • the electrical connection elements 5 are provided, which are each designed as a bonding wire in the illustrated embodiment.
  • the cover 2 is provided, which is connected by means of a further adhesive K material ⁇ conclusive and sealing with the circuit board 6.
  • FIG. 2 shows a further electronic component E in a sectional view, in particular in a longitudinal section.
  • the layer structure is modified relative to the electronic component E shown in FIG. 1 to the effect that the cover element 2 is connected to the carrier element 1.
  • the carrier element 1 thus rests on the printed circuit board 6, which in turn is continuously formed without a recess and accommodates the circuit carrier 3.
  • the sequence of the carrier element 1 and the printed circuit board 6 is interchanged with respect to the cover element 2.
  • the printed circuit board 6 is also intended to provide the function of connecting the electronic components 4 arranged in the interior I into the exterior space, a connection of the circuit carrier 3 in the interior I to the printed circuit board 6 is required.
  • an opening is made in the carrier element 1, which allows an electrical connection of the electronic components 4 to the printed circuit board 6.
  • the electrical connec ⁇ tion elements 5 are guided through the opening to the circuit board 6.
  • the circuit board 6 is connected to the carrier element 1 by means of an adhesive K, z.
  • an adhesive K, z As a liquid adhesive or tape, oil-tight and glued over a wide area.
  • the waste may cover member 2 and the support member 1 also ver together ⁇ welded or bonded together by means of an adhesive or a sealing compound.
  • the invention proposes an electronic component E, as shown and described in more detail in FIG.
  • Figure 3 shows an inventive embodiment of an electronic component E in a sectional view, in particular in a longitudinal section.
  • the electronic component E comprises a carrier element 1, a cover element 2, a
  • Circuit carrier 3 with a number of electronic components 4 and a printed circuit board 6, which is electrically connected by means of electrical connec ⁇ tion elements 5 with the circuit substrate 3.
  • the structure of the electronic component E is analogous to the structure shown in Figure 1, wherein on the support member 1, the
  • Printed circuit board 6 and the circuit substrate 3 are arranged and wherein the circuit substrate 3 and a portion of the circuit board 6 are closed with the cover 2.
  • the carrier element 1 has a smaller material thickness (running in the direction of the vertical axis z) than the embodiment shown in FIG.
  • the cover 2 is not glued to the circuit board 6, but is welded. Furthermore, the circuit board 6 is welded to the carrier element 1.
  • the printed circuit board 6 has a greater material thickness (running in the direction of the vertical axis z) than the embodiment shown in FIG. In the respective regions of the welded connection, the printed circuit board 6 has a weldable layer 6.2.
  • Welding processes are friction stir welding or laser welding.
  • the welding layers are formed for example as 6.2 me ⁇ -metallic layers and can be applied to the printed circuit board 6 by screen printing.
  • a solderable paste is applied to a circuit board surface.
  • the solderable paste may comprise, for example, silver, a silver alloy, copper or a copper alloy.
  • the weldable layers 6.2 may each be formed as a thermoplastic layer and applied, for example by means of lamination on the circuit board 6 or be incorporated in the circuit board 6 already.
  • the cover member 2 and the support element 1 are fluid-tightly and tem ⁇ peraturbestteil connected to the circuit board. 6
  • circuit carrier 3 is adhesively connected to the carrier element 1, so that a waste heat directly through the
  • Carrier element 1 can be removed.
  • a heat-conducting adhesive is preferably used as adhesive K.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laser Beam Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

The invention relates to an electronic assembly (E) comprising: a carrier element (1), a circuit carrier (3) having a number of electronic components (4), a circuit board (6), which is electrically conductively connected to the circuit carrier (3), and a covering element (2) for covering the circuit carrier (3), the covering element (2) being arranged on one flat side of the circuit board (6) and the carrier element (1) being arranged on an opposite flat side of the circuit board (6). According to the invention, the circuit board (6) is welded respectively to the carrier element (1) and to the covering element (2). The invention further relates to a method for producing such an electronic assembly (E).

Description

Beschreibung description
Elektronische Komponente und Verfahren zu deren Herstellung Die Erfindung betrifft eine elektronische Komponente gemäß dem Oberbegriff des Anspruchs 1. Die Erfindung betrifft weiterhin ein Verfahren zur Herstellung einer solchen elektronischen Komponente . Konventionelle elektronische Komponenten, z. B. ein Steuergerät eines Kraftfahrzeugs zur Anordnung in einem Motorraum, wie beispielsweise ein Getriebesteuergerät, werden üblicherweise als hermetisch dichte Module ausgeführt. Diese weisen zur Abdichtung ein Metallgehäuse auf, durch welches Kontaktstifte nach außen geführt werden. Die Kontaktstifte werden mittels sogenannter Einglasungen abgedichtet. Dadurch entsteht eine Verbindung zwischen einem Außenraum und einem Innenraum der elektronischen Komponente. Die Kontaktstifte können beispielsweise mit einer flexiblenThe invention relates to an electronic component according to the preamble of claim 1. The invention further relates to a method for producing such an electronic component. Conventional electronic components, eg. As a control device of a motor vehicle for arrangement in an engine compartment, such as a transmission control unit, are usually designed as hermetically sealed modules. These have to seal a metal housing through which contact pins are led to the outside. The contact pins are sealed by means of so-called impressions. This creates a connection between an outer space and an interior of the electronic component. The contact pins can, for example, with a flexible
Leiterplatte oder einem Stanzgitter elektrisch leitend verbunden und somit zu weiteren Funktionselementen geführt werden. Printed circuit board or a lead frame electrically conductively connected and thus led to other functional elements.
Eine weitere Bauform einer bekannten elektronischen Komponente, welche ebenfalls hermetisch dicht ausgebildet ist, umfasst ein Trägerelement, welches beispielsweise als Metallplatte aus¬ geführt ist und auf welchem eine elektrische Schaltung adhäsiv fixiert ist, z. B. mittels eines Wärmeleitklebstoffs. Die elektronische Komponente umfasst weiterhin ein Leiterplat- tenelement und ein Abdeckelement. Das Leiterplattenelement ist zwischen dem Trägerelement und dem Abdeckelement angeordnet, wobei eine Verbindung zwischen dem Abdeckelement und dem Leiterplattenelement mittels einer öldichten Verklebung, z. B. ein flüssiges Klebemittel oder ein Klebeband, ausgeführt ist. Another design of a known electronic component, which is also hermetically sealed, comprises a support element, which is guided, for example, as a metal plate ¬ and on which an electrical circuit is adhesively fixed, z. B. by means of a Wärmeleitklebstoffs. The electronic component further comprises a printed circuit board element and a cover element. The printed circuit board element is arranged between the carrier element and the cover element, wherein a connection between the cover element and the circuit board element by means of an oil-tight bond, for. As a liquid adhesive or an adhesive tape is executed.
Eine weitere Bauform einer elektronischen Komponente ist aus der DE 10 2012 213 916 AI bekannt. Hierbei weist ein Elektronik¬ modul für ein Fahrzeug ein Abdeckelement, ein Bauteilträ- ger-Leiterplattenelement , ein Trägerelement mit einer ersten Seite und einer zweiten Seite, ein Leiterplattenelement und zumindest ein Kontaktierungselement auf, welches dazu einge¬ richtet ist, eine leitfähige Kontaktierung zwischen Bauteil- träger-Leiterplattenelement und Leiterplattenelement bereit¬ zustellen, wobei das Abdeckelement und das Bauteilträ¬ ger-Leiterplattenelement auf der ersten Seite des Trägerele¬ mentes angeordnet sind. Dabei ist vorgesehen, dass das Lei¬ terplattenelement auf der zweiten Seite des Trägerelementes angeordnet ist und dass das Trägerelement zumindest eine Öffnung aufweist, durch welche das Kontaktierungselement geführt ist. Another design of an electronic component is known from DE 10 2012 213 916 AI. In this case, an electronic module for a vehicle has a cover element, a component carrier. ger printed circuit board element, a support member having a first side and a second side, a printed circuit board element and at least one contacting, which is ¬ directed to provide a conductive contact between the component carrier PCB element and PCB element ready ¬ , wherein the cover and the Bauteilträ ¬ ger printed circuit board element are arranged on the first side of the Trägerele ¬ Mentes. It is provided that the Lei ¬ terplattenelement is arranged on the second side of the support element and that the support member has at least one opening through which the contacting element is guided.
Der Erfindung liegt die Aufgabe zu Grunde, eine gegenüber dem Stand der Technik verbesserte elektronische Komponente sowie ein Verfahren zur Herstellung einer solchen elektronischen Komponente anzugeben. The invention is based on the object to provide an improved over the prior art electronic component and a method for producing such an electronic component.
Hinsichtlich der elektronischen Komponente wird die Aufgabe erfindungsgemäß mit den in Anspruch 1 angegebenen Merkmalen gelöst. Hinsichtlich des Verfahrens wird die Aufgabe erfin¬ dungsgemäß mit den in Anspruch 9 angegebenen Merkmalen gelöst With regard to the electronic component, the object is achieved according to the invention with the features specified in claim 1. Regarding the method, the object is achieved according OF INVENTION ¬ dung to those specified in claim 9 features
Vorteilhafte Ausgestaltungen sind Gegenstand der Unteran¬ sprüche . Advantageous embodiments are the subject of Unteran ¬ claims.
Eine elektronische Komponente umfasst ein Trägerelement, einen Schaltungsträger mit einer Anzahl elektronischer Bauteile, eine Leiterplatte, die elektrisch leitend mit dem Schaltungsträger verbunden ist, und ein Abdeckelement zur Abdeckung des An electronic component comprises a carrier element, a circuit carrier with a number of electronic components, a printed circuit board, which is electrically conductively connected to the circuit carrier, and a cover element for covering the
Schaltungsträgers. Das Abdeckelement ist dabei auf einerCircuit carrier. The cover is on one
Flachseite der Leiterplatte angeordnet, wobei das Trägerelement auf einer gegenüberliegenden Flachseite der Leiterplatte angeordnet ist. Erfindungsgemäß ist vorgesehen, dass die Lei¬ terplatte jeweils mit dem Trägerelement und dem Abdeckelement verschweißt ist. Flat side of the circuit board arranged, wherein the carrier element is arranged on an opposite flat side of the circuit board. According to the invention it is provided that the Lei ¬ terplatte is welded to the carrier element and the cover.
Die derart ausgebildete elektronische Komponente ist zur An¬ ordnung in einem Kraftfahrzeug, z. B. als Getriebesteuergerät, geeignet. Mittels der Schweißverbindung zwischen der Leiterplatte und dem Abdeckelement ist ein insbesondere mediendichter, beispielsweise fluiddichter, Innenraum hergestellt, in welchem sich der Schaltungsträger mit den elektronischen Bauteilen befindet. Die Schweißverbindungen zwischen der Leiterplatte und dem Abdeckelement sowie dem Trägerelement sind gegenüber Klebeverbindungen mechanisch besonders stabil ausgebildet, so dass eine Abdichtung des Schaltungsträgers dauerhaft sicher¬ gestellt ist. The electronic component designed in this way is to be ¬ order in a motor vehicle, eg. B. as a transmission control unit, suitable. By means of the welded connection between the printed circuit board and the cover element, a particularly media-tight, for example, fluid-tight, interior space is produced, in which the circuit carrier is located with the electronic components. The welded joints between the circuit board and the cover member and the support member are formed mechanically particularly stable to glue joints, so that a seal of the circuit carrier is permanently ensured ¬.
Vorzugsweise ist die Leiterplatte für jeweils eine Schwei߬ verbindung mit einer schweißbaren Schicht versehen. Beispielsweise ist die schweißbare Schicht als eine thermoplas¬ tische Schicht ausgebildet und wird beispielsweise mittels Laminieren auf die Leiterplatte aufgebracht. Alternativ kann die schweißbare Schicht auch als eine metallische Schicht ausge¬ bildet sein. Die metallische Schicht kann beispielsweise mittels Siebdruck oder einem sogenannten Ink-Jet-Verfahren auf die Leiterplatte aufgebracht werden. Preferably, the printed circuit board for respectively ¬ a welding connection with a weldable layer provided. For example, the weldable layer is formed as a thermoplas ¬ tical layer and is applied for example by means of lamination on the circuit board. Alternatively, the weldable layer can also be as a metallic layer being formed ¬. The metallic layer can be applied to the printed circuit board, for example by screen printing or a so-called ink-jet process.
Eine Ausgestaltung der Erfindung sieht vor, dass der Schaltungsträger thermisch an das Trägerelement gekoppelt ist. Dazu ist der Schaltungsträger beispielsweise mittels eines Wärme¬ leitklebstoffs adhäsiv mit dem Trägerelement verbunden. Eine Abwärme vom Schaltungsträger kann somit direkt über das Trä¬ gerelement abgeführt werden. An embodiment of the invention provides that the circuit carrier is thermally coupled to the carrier element. For this purpose, the circuit carrier is adhesively connected, for example by means of a heat conductive adhesive ¬ with the carrier element. A waste heat from the circuit carrier can thus be removed directly via the Trä ¬ gerelement.
Eine weitere Ausgestaltung der Erfindung sieht vor, dass die Leiterplatte mittels mindestens eines elektrischen Verbin- dungselements elektrisch leitend mit dem Schaltungsträger verbunden ist. Beispielsweise ist das mindestens eine elekt¬ rische Verbindungselement als Bonddraht ausgebildet. A further embodiment of the invention provides that the circuit board is electrically conductively connected to the circuit carrier by means of at least one electrical connection element. For example, the at least one elekt ¬ generic connection element is formed as a bonding wire.
Bei einem Verfahren zur Herstellung der beschriebenen elekt- ronischen Komponente wird die Leiterplatte jeweils mit dem Trägerelement und dem Abdeckelement verschweißt. Das Verfahren ermöglicht auf einfache Art und Weise die Her¬ stellung einer elektronischen Komponente mit einem insbesondere medien-, fluiddichten Innenraum, so dass der Schaltungsträger mit den elektronischen Bauteilen vor äußeren Einflüssen, wie beispielsweise Getriebeöl oder Metallspäne, geschützt ist. In a method for producing the described electronic component, the printed circuit board is welded to the carrier element and the cover element. The method provides a simple way the Her ¬ position of an electronic component with a particular media, the fluid-tight interior, so that the circuit carrier with the electronic components against external influences, such as gear oil or metal chips protected.
Eine Ausgestaltung des Verfahrens sieht dabei vor, dass die Leiterplatte jeweils mit dem Trägerelement und dem Abdeckelement mittels Reibrührschweißen und/oder Laserschweißen verschweißt wird. Damit ist eine mechanische besonders stabile Schwei߬ verbindung herstellbar. An embodiment of the method provides that the circuit board is welded to the carrier element and the cover by means of friction stir welding and / or laser welding. This is a mechanically stable welding ¬ compound produced.
Die Erfindung wird im Folgenden anhand von Zeichnungen näher erläutert . The invention will be explained in more detail below with reference to drawings.
Dabei zeigen: Showing:
Figur 1 schematisch eine Schnittdarstellung einer elektronischen Komponente gemäß dem Stand der Technik, 1 is a schematic sectional view of an electronic component according to the prior art,
Figur 2 schematisch eine Schnittdarstellung einer weiteren elektronischen Komponente gemäß dem Stand der Technik und schematisch eine Schnittdarstellung einer elektro nischen Komponente in einer erfindungsgemäßen Aus führung . Figure 2 schematically shows a sectional view of another electronic component according to the prior art and schematically a sectional view of an electro-American component in an imple mentation according to the invention.
Einander entsprechende Teile sind in allen Figuren mit den gleichen Bezugszeichen versehen. Corresponding parts are provided in all figures with the same reference numerals.
Figur 1 zeigt eine in der eingangs erwähnten Figure 1 shows a in the above-mentioned
DE 10 2012 213 916 AI gezeigte elektronische Komponente E in einer Schnittdarstellung, insbesondere in einem Längsschnitt.  DE 10 2012 213 916 AI shown electronic component E in a sectional view, in particular in a longitudinal section.
Die elektronische Komponente E ist beispielsweise ein Steu¬ ergerät für ein Kraftfahrzeug, z. B. ein Getriebesteuergerät , und umfasst ein Trägerelement 1 und ein Abdeckelement 2. Zwischen dem Trägerelement 1 und dem Abdeckelement 2 ist in einem Innenraum I der elektronischen Komponente E ein Schaltungsträger 3 angeordnet, welcher eine Anzahl elektronischer Bauteile 4 aufnimmt, die zu einer elektrischen Schaltung zusam- mengeführt sind. Der Schaltungsträger 3 ist im gezeigten Ausführungsbeispiel mittels zwei elektrischen Verbindungs¬ elementen 5 mit einer Leiterplatte 6 elektrisch leitend verbunden . Im gezeigten Ausführungsbeispiel der bekannten elektronischen Komponente E ergibt sich somit ein Schichtaufbau in Richtung einer Hochachse z mit dem Trägerelement 1, darauf aufsetzend die Leiterplatte 6 und der Schaltungsträger 3, wobei der Schal¬ tungsträger 3 und ein Abschnitt der Leiterplatte 6 mit dem Abdeckelement 2 verschlossen werden. The electronic component E is for example a STEU ¬ ergerät for a motor vehicle, eg. As a transmission control unit, and includes a support member 1 and a cover 2. Between the carrier element 1 and the cover element 2, a circuit carrier 3 is arranged in an interior I of the electronic component E, which accommodates a number of electronic components 4, which are merged into an electrical circuit. The circuit substrate 3 is in the illustrated embodiment by means of two electrical connection ¬ elements 5 electrically connected to a circuit board 6. In the illustrated embodiment of the known electronic component E thus results in a layer structure in the direction of a vertical axis z with the support element 1, then placing the printed circuit board 6 and the circuit substrate 3, the scarf ¬ tion carrier 3 and a portion of the circuit board 6 with the cover 2 closed become.
Im Folgenden werden die Bestandteile der gezeigten elektronischen Komponente E näher erläutert. Das Trägerelement 1 ist beispielsweise eine metallische In the following, the components of the electronic component E shown are explained in more detail. The carrier element 1 is for example a metallic one
Grundplatte, z. B. eine Aluminiumplatte, welche den Schal¬ tungsträger 3 und die Leiterplatte 6 auf einer Flachseite aufnimmt . Der Schaltungsträger 3 ist beispielsweise als eine Nieder- temperatur-Einbrand-Keramik oder Mikroleiterplatte ausgebildet und ist mit dem Trägerelement 1 Stoffschlüssig mittels eines Klebstoffs K, z. B. mittels eines Wärmeleitklebers, verbunden. Der Schaltungsträger 3 ist vollständig im Innenraum I der elektronischen Komponente E angeordnet und umfasst als elektronische Bauteile 4 beispielsweise Kondensatoren, Wi¬ derstände, gehäuste und/oder ungehäuste Halbleiterkomponente usw., die mit dem Schaltungsträger 3 beispielsweise verklebt und/oder verlötet sind. Base plate, z. B. an aluminum plate, which receives the scarf ¬ tion carrier 3 and the circuit board 6 on a flat side. The circuit carrier 3 is formed, for example, as a low-temperature burn-in ceramic or micro-circuit board and is connected to the support member 1 cohesively by means of an adhesive K, z. B. by means of a Wärmeleitklebers connected. The circuit carrier 3 is arranged completely in the interior I of the electronic component E and comprises as electronic components 4, for example capacitors, Wi ¬ resistances, packaged and / or ungehäuste semiconductor component, etc., which are glued to the circuit substrate 3, for example, and / or soldered.
Die weiterhin auf dem Trägerelement 1 angeordnete Leiterplatte 6 ist aus einem elektrisch isolierenden Substrat, z. B. Epoxidharz, gebildet und weist mindestens eine Lage elektrisch leitender Leiterbahnen 6.1 auf, wobei im vorliegenden Ausführungsbeispiel eine Leiterbahn 6.1 beispielhaft gezeigt ist. Alternativ kann die Leiterplatte 6 auch mechanisch flexibel ausgebildet sein. The further arranged on the carrier element 1 printed circuit board 6 is made of an electrically insulating substrate, for. As epoxy, formed and has at least one layer electrically conductive interconnects 6.1, wherein in the present embodiment, a conductor 6.1 is shown by way of example. Alternatively, the circuit board 6 may also be formed mechanically flexible.
Die Leiterplatte 6 ist sowohl im Innenraum I als auch in einem Außenraum der elektronischen Komponente E angeordnet und analog zum Schaltungsträger 3 Stoffschlüssig mittels eines weiteren Klebstoffs K, z. B. ein flüssiges Klebemittel oder ein Kle- beband, öldicht mit dem Trägerelement 1 verbunden. The printed circuit board 6 is arranged both in the interior I and in an outer space of the electronic component E and analogous to the circuit substrate 3 cohesively by means of a further adhesive K, z. For example, a liquid adhesive or a tape, oil-tight connected to the support member 1.
Die Leiterplatte 6 bildet eine Verbindung zwischen dem Außenraum und dem Innenraum I. Im Bereich des Schaltungsträgers 3 weist die Leiterplatte 6 eine Aussparung auf, innerhalb welcher der Schaltungsträger 3 angeordnet ist. The printed circuit board 6 forms a connection between the outer space and the inner space I. In the area of the circuit carrier 3, the printed circuit board 6 has a recess, within which the circuit carrier 3 is arranged.
Zur elektrischen Verbindung des Schaltungsträgers 3 mit der Leiterplatte 6 sind die elektrischen Verbindungselemente 5 vorgesehen, die im gezeigten Ausführungsbeispiel jeweils als Bonddraht ausgeführt sind. For the electrical connection of the circuit substrate 3 to the printed circuit board 6, the electrical connection elements 5 are provided, which are each designed as a bonding wire in the illustrated embodiment.
Zum Schutz der elektronischen Bauteile 4 auf dem Schaltungsträger 3 sowie der elektrischen Verbindungselemente 5 vor äußeren Einflüssen, wie z. B. Getriebeöl, Metallspäne usw., und anderen leitenden Ablagerungen, ist das Abdeckelement 2 vorgesehen, welches mittels eines weiteren Klebstoffs K stoff¬ schlüssig und dichtend mit der Leiterplatte 6 verbunden wird. To protect the electronic components 4 on the circuit substrate 3 and the electrical connection elements 5 against external influences, such. As gear oil, metal chips, etc., and other conductive deposits, the cover 2 is provided, which is connected by means of a further adhesive K material ¬ conclusive and sealing with the circuit board 6.
Wie bereits in der DE 10 2012 213 916 AI beschrieben, erfolgt aufgrund unterschiedlicher Wärmedehnungskoeffizienten derAs already described in DE 10 2012 213 916 AI, due to different thermal expansion coefficients of
Leiterplatte 6, des Abdeckelements 2 und der Klebstoffe K eine mechanische Beanspruchung der Klebeverbindung zwischen dem Abdeckelement 2 und der Leiterplatte 6. Beispielsweise wird die Klebeverbindung auf Scherung beansprucht, was zum Versagen der Klebeverbindung führen kann. Hierdurch besteht die Möglichkeit der Entstehung von Undichtheiten, so dass insbesondere die hermetische Abdichtung des Innenraums I nicht mehr sicherge¬ stellt werden kann. Eine weitere, ebenfalls aus der DE 10 2012 213 916 AI bekannte elektronische Komponente E ist in Figur 2 dargestellt. Printed circuit board 6, the cover 2 and the adhesive K, a mechanical stress on the adhesive bond between the cover 2 and the circuit board 6. For example, the adhesive bond is subjected to shear, which can lead to failure of the adhesive bond. As a result, there is the possibility of the formation of leaks, so that in particular the hermetic seal of the interior I can no longer sicherge ¬ provides. Another, also known from DE 10 2012 213 916 AI electronic component E is shown in Figure 2.
Figur 2 zeigt dazu eine weitere elektronische Komponente E in Schnittdarstellung, insbesondere in einem Längsschnitt. FIG. 2 shows a further electronic component E in a sectional view, in particular in a longitudinal section.
Hierbei ist der Schichtaufbau gegenüber der in Figur 1 gezeigten elektronischen Komponente E dahingehend verändert, dass das Abdeckelement 2 mit dem Trägerelement 1 verbunden wird. Das Trägerelement 1 liegt somit auf der Leiterplatte 6 auf, die wiederum durchgehend ohne Aussparung ausgebildet ist und den Schaltungsträger 3 aufnimmt. Mit anderen Worten: In dem in Figur 2 gezeigten Ausführungsbeispiel ist gegenüber dem Abdeckelement 2 die Reihenfolge von Trägerelement 1 und Lei- terplatte 6 vertauscht. In this case, the layer structure is modified relative to the electronic component E shown in FIG. 1 to the effect that the cover element 2 is connected to the carrier element 1. The carrier element 1 thus rests on the printed circuit board 6, which in turn is continuously formed without a recess and accommodates the circuit carrier 3. In other words, in the embodiment shown in FIG. 2, the sequence of the carrier element 1 and the printed circuit board 6 is interchanged with respect to the cover element 2.
Da die Leiterplatte 6 weiterhin die Funktion der Verbindung der im Innenraum I angeordneten elektronischen Bauteile 4 in den Außenraum bereitstellen soll, ist eine Anbindung des Schal- tungsträgers 3 im Innenraum I zur Leiterplatte 6 erforderlich. Hierzu wird in das Trägerelement 1 eine Öffnung eingebracht, welche eine elektrische Verbindung der elektronischen Bauteile 4 mit der Leiterplatte 6 ermöglicht. Die elektrischen Verbin¬ dungselemente 5 werden dabei durch die Öffnung hindurch zur Leiterplatte 6 geführt. Since the printed circuit board 6 is also intended to provide the function of connecting the electronic components 4 arranged in the interior I into the exterior space, a connection of the circuit carrier 3 in the interior I to the printed circuit board 6 is required. For this purpose, an opening is made in the carrier element 1, which allows an electrical connection of the electronic components 4 to the printed circuit board 6. The electrical connec ¬ tion elements 5 are guided through the opening to the circuit board 6.
Die Leiterplatte 6 ist mit dem Trägerelement 1 mittels eines Klebstoffs K, z. B. ein flüssiges Klebemittel oder Klebeband, öldicht und breitflächig verklebt. Alternativ können das Ab- deckelement 2 und das Trägerelement 1 auch miteinander ver¬ schweißt oder mittels einer Klebemasse oder einer Vergussmasse miteinander verbunden sein. The circuit board 6 is connected to the carrier element 1 by means of an adhesive K, z. As a liquid adhesive or tape, oil-tight and glued over a wide area. Alternatively, the waste may cover member 2 and the support member 1 also ver together ¬ welded or bonded together by means of an adhesive or a sealing compound.
Dadurch, dass die Reihenfolge hierbei zwischen dem Träger- element 1 und der Leiterplatte 6 vertauscht ist, ist die Stoffschlüssige Anbindung des Abdeckelements 2 mechanisch stabiler ausgeführt als im Ausführungsbeispiel gemäß Figur 1. Für eine weiter verbesserte Abdichtung des Innenraums I sowie eine verbesserte Temperierung der elektronischen Komponente E gegenüber den in Figur 1 und Figur 2 beschriebenen bekannten elektronischen Komponenten E schlägt die Erfindung eine elektronische Komponente E vor, wie in Figur 3 näher gezeigt und beschrieben ist. Due to the fact that the sequence between the carrier element 1 and the printed circuit board 6 is reversed, the cohesive connection of the cover element 2 is mechanically more stable than in the exemplary embodiment according to FIG. For a further improved sealing of the interior I and an improved temperature control of the electronic component E with respect to the known electronic components E described in FIG. 1 and FIG. 2, the invention proposes an electronic component E, as shown and described in more detail in FIG.
Figur 3 zeigt dazu ein erfindungsgemäßes Ausführungsbeispiel einer elektronischen Komponente E in einer Schnittdarstellung, insbesondere in einem Längsschnitt. Figure 3 shows an inventive embodiment of an electronic component E in a sectional view, in particular in a longitudinal section.
Die elektronische Komponente E umfasst analog zum Stand der Technik ein Trägerelement 1, ein Abdeckelement 2, einen Analogously to the prior art, the electronic component E comprises a carrier element 1, a cover element 2, a
Schaltungsträger 3 mit einer Anzahl elektronischer Bauteile 4 und eine Leiterplatte 6, die mittels elektrischer Verbin¬ dungselemente 5 elektrisch leitend mit dem Schaltungsträger 3 verbunden ist. Circuit carrier 3 with a number of electronic components 4 and a printed circuit board 6, which is electrically connected by means of electrical connec ¬ tion elements 5 with the circuit substrate 3.
Der Aufbau der elektronischen Komponente E ist analog zum in Figur 1 gezeigten Aufbau, wobei auf dem Trägerelement 1 dieThe structure of the electronic component E is analogous to the structure shown in Figure 1, wherein on the support member 1, the
Leiterplatte 6 und der Schaltungsträger 3 angeordnet sind und wobei der Schaltungsträger 3 und ein Abschnitt der Leiterplatte 6 mit dem Abdeckelement 2 verschlossen werden. Das Trägerelement 1 weist eine gegenüber dem in Figur 1 gezeigten Ausführungsbeispiel geringere Materialdicke (in Richtung der Hochachse z verlaufend) auf. Printed circuit board 6 and the circuit substrate 3 are arranged and wherein the circuit substrate 3 and a portion of the circuit board 6 are closed with the cover 2. The carrier element 1 has a smaller material thickness (running in the direction of the vertical axis z) than the embodiment shown in FIG.
Der wesentliche Unterschied besteht hierbei darin, dass das Abdeckelement 2 mit der Leiterplatte 6 nicht verklebt, sondern verschweißt ist. Weiterhin ist die Leiterplatte 6 mit dem Trägerelement 1 verschweißt. Dazu weist die Leiterplatte 6 eine gegenüber dem in Figur 1 gezeigten Ausführungsbeispiel größere Materialdicke (in Richtung der Hochachse z verlaufend) auf. In den jeweiligen Bereichen der Schweißverbindung weist die Leiterplatte 6 eine schweißbare Schicht 6.2 auf. Als The main difference here is that the cover 2 is not glued to the circuit board 6, but is welded. Furthermore, the circuit board 6 is welded to the carrier element 1. For this purpose, the printed circuit board 6 has a greater material thickness (running in the direction of the vertical axis z) than the embodiment shown in FIG. In the respective regions of the welded connection, the printed circuit board 6 has a weldable layer 6.2. When
Schweißverfahren eignen sich Reibrührschweißen oder Laserschweißen . Die schweißbaren Schichten 6.2 sind beispielsweise als me¬ tallische Schichten ausgebildet und können mittels Siebdruck auf die Leiterplatte 6 aufgebracht werden. Dazu wird eine lötbare Paste auf eine Leiterplattenoberfläche aufgebracht. Die lötbare Paste kann beispielsweise Silber, eine Silberlegierung, Kupfer oder eine Kupferlegierung umfassen. Alternativ können die schweißbaren Schichten 6.2 auch jeweils als thermoplastische Schicht ausgebildet sein und beispielsweise mittels Laminieren auf die Leiterplatte 6 aufgebracht werden oder auch in der Leiterplatte 6 bereits eingearbeitet sein. Welding processes are friction stir welding or laser welding. The welding layers are formed for example as 6.2 me ¬-metallic layers and can be applied to the printed circuit board 6 by screen printing. For this purpose, a solderable paste is applied to a circuit board surface. The solderable paste may comprise, for example, silver, a silver alloy, copper or a copper alloy. Alternatively, the weldable layers 6.2 may each be formed as a thermoplastic layer and applied, for example by means of lamination on the circuit board 6 or be incorporated in the circuit board 6 already.
Bei der erfindungsgemäßen elektronischen Komponente E sind das Abdeckelement 2 und das Trägerelement 1 fluiddicht und tem¬ peraturbeständig mit der Leiterplatte 6 verbunden. Die In the inventive electronic component E, the cover member 2 and the support element 1 are fluid-tightly and tem ¬ peraturbeständig connected to the circuit board. 6 The
Schweißverbindung ist dabei auch gegenüber mechanischer Beanspruchung sehr stabil. Dadurch ist der Innenraum I gegenüber äußeren Einflüssen optimal geschützt. Welded connection is also very stable against mechanical stress. As a result, the interior I is optimally protected against external influences.
Weiterhin ist der Schaltungsträger 3 adhäsiv mit dem Träger- element 1 verbunden, so dass eine Abwärme direkt über dasFurthermore, the circuit carrier 3 is adhesively connected to the carrier element 1, so that a waste heat directly through the
Trägerelement 1 abgeführt werden kann. Zur adhäsiven Verbindung wird als Klebstoff K vorzugsweise ein Wärmeleitklebstoff verwendet . Carrier element 1 can be removed. For adhesive bonding, a heat-conducting adhesive is preferably used as adhesive K.
Bezugs zeichenliste Reference sign list
1 Trägerelement 1 support element
2 Abdeckelement  2 cover element
3 Schaltungsträger  3 circuit carrier
4 elektronisches Bauteil  4 electronic component
5 elektrisches Verbindungselement 5 electrical connection element
6 Leiterplatte 6 circuit board
6.1 Leiterbahn  6.1 trace
6.2 schweißbare Schicht  6.2 weldable layer
E elektronische Komponente E electronic component
I Innenraum  I interior
K Klebstoff z Hochachse  K adhesive z vertical axis

Claims

Patentansprüche claims
1. Elektronische Komponente (E) , umfassend: 1. Electronic component (E) comprising:
- ein Trägerelement (1),  a carrier element (1),
- einen Schaltungsträger (3) mit einer Anzahl elektronischer Bauteile (4), a circuit carrier (3) with a number of electronic components (4),
- eine Leiterplatte (6), die elektrisch leitend mit dem  - A printed circuit board (6) which is electrically conductive with the
Schaltungsträger (3) verbunden ist, und Circuit carrier (3) is connected, and
- ein Abdeckelement (2) zur Abdeckung des Schaltungsträgers (3), wobei  - A cover (2) for covering the circuit substrate (3), wherein
das Abdeckelement (2) auf einer Flachseite der Leiterplatte (6) angeordnet ist und the cover element (2) is arranged on a flat side of the printed circuit board (6) and
das Trägerelement (1) auf einer gegenüberliegenden Flachseite der Leiterplatte (6) angeordnet ist, the carrier element (1) is arranged on an opposite flat side of the printed circuit board (6),
dadurch gekennzeichnet, dass die Leiterplatte (6) jeweils mit dem Trägerelement (1) und dem Abdeckelement (2) verschweißt ist . characterized in that the circuit board (6) in each case with the carrier element (1) and the cover (2) is welded.
2. Elektronische Komponente (E) nach Anspruch 1, 2. Electronic component (E) according to claim 1,
dadurch gekennzeichnet, dass die Leiterplatte (6) für jeweils eine Schweißverbindung mit einer schweißbaren Schicht (6.2) versehen ist. characterized in that the circuit board (6) is provided for a respective welded joint with a weldable layer (6.2).
3. Elektronische Komponente (E) nach Anspruch 2, 3. Electronic component (E) according to claim 2,
dadurch gekennzeichnet, dass die schweißbare Schicht (6.2) als eine thermoplastische Schicht ausgebildet ist. characterized in that the weldable layer (6.2) is formed as a thermoplastic layer.
4. Elektronische Komponente (E) nach Anspruch 2, 4. Electronic component (E) according to claim 2,
dadurch gekennzeichnet, dass die schweißbare Schicht (6.2) als eine metallische Schicht ausgebildet ist. characterized in that the weldable layer (6.2) is formed as a metallic layer.
5. Elektronische Komponente (E) nach einem der vorhergehenden Ansprüche, 5. Electronic component (E) according to one of the preceding claims,
dadurch gekennzeichnet, dass der Schaltungsträger (3) thermisch an das Trägerelement (1) gekoppelt ist. characterized in that the circuit carrier (3) is thermally coupled to the carrier element (1).
6. Elektronische Komponente (E) nach Anspruch 5, 6. Electronic component (E) according to claim 5,
dadurch gekennzeichnet, dass der Schaltungsträger (3) mittels eines Wärmeleitklebstoffs adhäsiv mit dem Trägerelement (1) verbunden ist. characterized in that the circuit carrier (3) by means of a Wärmeleitklebstoffs is adhesively connected to the carrier element (1).
7. Elektronische Komponente (E) nach einem der vorhergehenden Ansprüche, 7. Electronic component (E) according to one of the preceding claims,
dadurch gekennzeichnet, dass die Leiterplatte (6) mittels mindestens einem elektrischen Verbindungselement (5) elektrisch leitend mit dem Schaltungsträger (3) verbunden ist. characterized in that the circuit board (6) by means of at least one electrical connection element (5) is electrically conductively connected to the circuit carrier (3).
8. Elektronische Komponente (E) nach Anspruch 7, 8. Electronic component (E) according to claim 7,
dadurch gekennzeichnet, dass das mindestens eine elektrische Verbindungselement (5) als Bonddraht ausgebildet ist. characterized in that the at least one electrical connection element (5) is designed as a bonding wire.
9. Verfahren zur Herstellung einer elektronischen Kompo- nente (E) nach einem der vorhergehenden Ansprüche, 9. A method for producing an electronic component (E) according to one of the preceding claims,
wobei die Leiterplatte (6) jeweils mit dem Trägerelement (1) und dem Abdeckelement (2) verschweißt wird. wherein the circuit board (6) in each case with the carrier element (1) and the cover (2) is welded.
10. Verfahren nach Anspruch 9, 10. The method according to claim 9,
dadurch gekennzeichnet, dass die Leiterplatte (6) jeweils mit dem Trägerelement (1) und dem Abdeckelement (2) mittels Reibrührschweißen und/oder Laserschweißen verschweißt wird. characterized in that the printed circuit board (6) in each case with the carrier element (1) and the cover element (2) by means of friction stir welding and / or laser welding is welded.
EP16702538.6A 2015-02-10 2016-02-01 Electronic assembly and method for the production thereof Withdrawn EP3257337A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015202298 2015-02-10
DE102015208529.5A DE102015208529B3 (en) 2015-02-10 2015-05-07 Electronic component and method for its manufacture
PCT/EP2016/052094 WO2016128244A1 (en) 2015-02-10 2016-02-01 Electronic assembly and method for the production thereof

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EP3257337A1 true EP3257337A1 (en) 2017-12-20

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EP (1) EP3257337A1 (en)
JP (1) JP2018512724A (en)
CN (1) CN107211531A (en)
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WO (1) WO2016128244A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015224270B3 (en) * 2015-12-04 2017-03-16 Conti Temic Microelectronic Gmbh Electronic component and method for its manufacture
DE102017209179A1 (en) * 2017-05-31 2018-12-06 Conti Temic Microelectronic Gmbh electronics assembly

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3850711A (en) * 1972-12-07 1974-11-26 Accra Paint Arrays Corp Method of forming printed circuit
JPS6068661U (en) * 1983-10-18 1985-05-15 日本電気株式会社 Hybrid integrated circuit device
EP0333237A3 (en) * 1984-05-18 1990-03-21 BRITISH TELECOMMUNICATIONS public limited company Integrated circuit chip carrier
JPH0770806B2 (en) * 1990-08-22 1995-07-31 株式会社エーユーイー研究所 Electronic circuit by ultrasonic welding and manufacturing method thereof
JPH04309283A (en) * 1991-04-08 1992-10-30 Toshiba Corp Manufacture of ceramic circuit board
NO911774D0 (en) * 1991-05-06 1991-05-06 Sensonor As DEVICE FOR ENCAPLING A FUNCTIONAL ORGANIZATION AND PROCEDURE FOR PRODUCING THE SAME.
JP3270862B2 (en) * 1992-09-02 2002-04-02 ソニー株式会社 Method for manufacturing solid-state imaging device
JP2001320256A (en) * 2000-05-10 2001-11-16 Daishinku Corp Air-tight sealing method for piezoelectric vibrating device
DE10341404B4 (en) * 2003-09-05 2006-06-01 Siemens Ag Circuit device with a circuit carrier
DE102004036683A1 (en) * 2004-07-28 2006-03-30 Siemens Ag Control device, in particular mechatronic transmission or engine control unit
DE102007017531A1 (en) * 2007-04-13 2008-10-16 Continental Automotive Gmbh Method for producing a signal and potential distribution system for mechatronic modules
DE102010062653A1 (en) * 2010-12-08 2012-06-14 Robert Bosch Gmbh Control module and method for its manufacture
DE102011085172A1 (en) * 2011-10-25 2013-04-25 Robert Bosch Gmbh Transmission control module with solder bridges or cold contacts between inserted circuit carrier and surrounding circuit carrier
JP2013098209A (en) * 2011-10-28 2013-05-20 Seiko Epson Corp Circuit board, electronic device, electronic equipment, and circuit board manufacturing method
DE102012213916A1 (en) * 2011-11-08 2013-05-08 Robert Bosch Gmbh Electronic module for a control unit
CN102623416B (en) * 2012-04-24 2015-09-02 苏州远创达科技有限公司 A kind of power device of radio frequency power amplification modules is without encapsulating structure and assemble method thereof
JP5489305B2 (en) * 2012-06-27 2014-05-14 石原ケミカル株式会社 Circuit board and conductive film forming method
DE102012212025A1 (en) * 2012-07-10 2014-01-16 Osram Gmbh LIGHT MODULE
JP2014175567A (en) * 2013-03-12 2014-09-22 Mitsubishi Electric Corp Ceramic package

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WO2016128244A1 (en) 2016-08-18
JP2018512724A (en) 2018-05-17
DE102015208529B3 (en) 2016-08-04
CN107211531A (en) 2017-09-26
US20170354036A1 (en) 2017-12-07

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