EP3195005A1 - Motor vehicle ultrasonic transducer for distance measurement, corresponding manufacturing method and use - Google Patents

Motor vehicle ultrasonic transducer for distance measurement, corresponding manufacturing method and use

Info

Publication number
EP3195005A1
EP3195005A1 EP15759861.6A EP15759861A EP3195005A1 EP 3195005 A1 EP3195005 A1 EP 3195005A1 EP 15759861 A EP15759861 A EP 15759861A EP 3195005 A1 EP3195005 A1 EP 3195005A1
Authority
EP
European Patent Office
Prior art keywords
printed circuit
motor vehicle
components
ultrasonic sensor
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15759861.6A
Other languages
German (de)
French (fr)
Inventor
Nicolas Marier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Equipements Electriques Moteur SAS
Original Assignee
Valeo Equipements Electriques Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Equipements Electriques Moteur SAS filed Critical Valeo Equipements Electriques Moteur SAS
Publication of EP3195005A1 publication Critical patent/EP3195005A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/521—Constructional features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
    • G01S15/02—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems using reflection of acoustic waves
    • G01S15/06—Systems determining the position data of a target
    • G01S15/08—Systems for measuring distance only
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/004—Mounting transducers, e.g. provided with mechanical moving or orienting device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
    • G01S15/88—Sonar systems specially adapted for specific applications
    • G01S15/93—Sonar systems specially adapted for specific applications for anti-collision purposes
    • G01S15/931—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
    • G01S15/88—Sonar systems specially adapted for specific applications
    • G01S15/93—Sonar systems specially adapted for specific applications for anti-collision purposes
    • G01S15/931—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • G01S2015/932—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles for parking operations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Definitions

  • the present invention relates to a motor vehicle ultrasonic sensor for measuring distance and its manufacturing method.
  • the ultrasonic sensors comprise an ultrasonic transducer by means of which ultrasonic signals are emitted and received successively.
  • This transducer is placed in a housing with an electronic card provided with the appropriate electronics, which is arranged, for example in a bumper of the vehicle.
  • the housing has a connector for making electrical connections to the on-board electrical network and a data bus.
  • the technology of the electronic board of this sensor is that of a printed circuit board with active and passive components mounted on the surface. Due to the presence of components on both sides of the printed circuit, the transducer must be mounted on a support above the components.
  • the present invention therefore aims to satisfy this need with a motor vehicle ultrasonic sensor for distance measurement of the type comprising:
  • a housing provided with an electrical connector
  • At least one ultrasound transducer At least one ultrasound transducer
  • an electronic control card for this ultrasonic transducer arranged inside the casing and formed by a printed circuit supporting active components and passive components.
  • the active components comprise integrated active components completely buried in a printed circuit substrate and the passive components comprise integrated passive components also completely buried in this substrate and the active components and the passive components comprise surface disposed only on one face of the printed circuit and the transducer is mounted on an opposite face.
  • the integrated active components and the integrated passive components comprise copper contacts connected by microvias to copper tracks of the printed circuit.
  • the integrated active components comprise at least one bare silicon chip.
  • this chip is an ASIC.
  • the ultrasonic transducer in the ultrasonic sensor, is formed of a piezoelectric pellet.
  • the invention relates to a method of manufacturing the ultrasonic sensor of a motor vehicle for measuring distance described above, which comprises a general step of producing an electronic card comprising a printed circuit and electronic components.
  • This general step comprises according to the invention:
  • an eighth metallization step for forming vias and microvias comprising a first imaging phase, a second copper deposition phase and a third etching and etching phase;
  • the general step of the manufacturing method of the ultrasonic sensor according to the invention further comprises a first additional step of mounting only on a first face of the printed circuit of at least one of the surface mount component type electronic components.
  • the general step of the method further comprises a second additional step of bonding at least one piezoelectric pellet to a second face opposite the first face and connection by flexible connecting son of this piezoelectric pellet to corresponding microvias.
  • the ultrasonic sensor of a motor vehicle for measuring distance is advantageously used in a parking aid or emergency braking system.
  • Figure 2 shows schematically an ultrasonic sensor of a motor vehicle according to the invention.
  • FIG 3 illustrates the manufacturing method according to the invention of an electronic card of the ultrasonic sensor shown in Figure 2, in particular of the printed circuit.
  • this ultrasonic sensor intended to be integrated in a motor vehicle bumper, comprises a housing 2 and an electrical connector 3 protecting an ultrasonic transducer 4, which is in this example a membrane transducer .
  • CMS surface mount components
  • a distance between this obstacle and the ultrasonic sensor 1 is calculated by the electronic card 5 from the round trip time of these pulses.
  • the printed circuit 6 is of conventional double-sided technology, that is to say to two copper layers separated by an insulating substrate.
  • the passive CMS 7 components (resistors, capacitors, inductors, etc.) and the active components, such as in particular an ASIC (acronym for "Application").
  • the membrane transducer 4 is mounted in the electronic card 5 on a support 8 and connected to the printed circuit 5 by through pins 9
  • This mounting type has the drawbacks of being bulky and unreliable, especially if the ultrasonic sensor 1 is integrated into the bumper of the vehicle, which, by definition, is subjected to shocks.
  • the burying of some of the active components 1 1 and the passive components 12 of the electronic card 13 in the printed circuit 14 makes it possible to release a face opposite to the face where the CMS 7 components are mounted to mount the ultrasonic transducer, which is here a piezoelectric chip 15.
  • the housing 16 of the ultrasonic sensor 10 according to the invention and the electrical connector 17 form a compact unit which is flatter than the conventional ultrasound sensor 1.
  • This housing 16 and this connector 17 are made by plastic injection, in a manner known per se.
  • the ultrasonic sensor according to the invention is made by assembling with the housing 16 the electronic card 13 manufactured during a general embodiment step illustrated in FIG. 3.
  • a preliminary step 17 the electronic components 1 1, 12 intended to be buried in an organic substrate 18 of the printed circuit 14 are subjected to a particular preparation.
  • the active components 1 1 are integrated in the printed circuit 14 in the form of a semiconductor chip (generally silicon) 1 1 naked.
  • the particular preparation of the chips 1 1 is made on the complete wafer in order to produce a copper redistribution layer 19 which will make it possible to interconnect with the tracks 20 of the printed circuit 14 by means of metallized microvias 21. This preparation is carried out in a clean room.
  • the routing of the redistribution layer 19 is performed taking into account the necessary isolation distances between the signals to avoid electromigration problems and also to allow the addition of copper zones facilitating the heat dissipation of the chip 1 1 to the substrate 18.
  • a single ASIC type chip 1 1 performing all the transmission-reception functions of the ultrasound sensor 10 is integrated into the organic substrate 18.
  • the passive components 12 resistor, capacitors, inductances, etc.
  • they are likewise provided with copper terminals 19.
  • marks 23 are made on the copper layers 24 which will subsequently form part of the printed circuit 14.
  • these copper layers 24 are printed with a dielectric material 26 so as to isolate the buried components 11, 12 outside the connection zones 19.
  • a third step 27 the components 28 are placed to be buried on the printed dielectric material 26.
  • the operation of sticking a chip 1 1 on a copper layer 24 is also performed in a clean room.
  • a fourth step 29 the copper layers 24 and layers of the organic substrate 18 are stacked in which recesses 30 receiving the buried components 11, 12 have been provided.
  • the copper layer or layers 24 and the dielectric material 26 are laser-etched opposite the connection zones 19 of the buried components 11, 12 so as to expose them 32 to subsequent production of metallized microvias 21.
  • holes 34 are mechanically drilled in the copper layers and the layers of the substrate 18 for the subsequent production of the metallized vias 35.
  • a seventh step 36 the impurities 32 resulting from laser drilling are removed during the fifth step 31.
  • microvias 21 and vias 35 are produced during a first imaging phase 38, a second copper deposition phase 39 and a third phase 40 of etching and deposition. engraving.
  • a ninth step 41 of automatic inspection by means of machine vision makes it possible to check the conformity of the printed circuit 14 with a reference model.
  • a downstream step 42 performs a treatment of the organic substrate 18 and a finish of the printed circuit 14.
  • the electronic card 13 is provided with active and passive components 7 surface-mounted only on a first face of the printed circuit 14.
  • This arrangement allows to leave free a second face opposite to the first for gluing the piezoelectric wafer 15 in a second additional step.
  • the piezoelectric chip 15 is connected to the ASIC 1 1 by flexible connecting wires 43 soldered to the corresponding microvias 21 (technique known to those skilled in the art under the name of "bonding") .
  • An improvement in the EMC performance also results from the burial of some of the electronic components 1 1, 12 of the card, including the ASIC 1 1, because the two outer copper layers 24 of the printed circuit 14 serve as shielding.
  • the electronic card 13 is more shock resistant than a conventional electronic card 5 where all the components 7 are soldered to the tin. Indeed, tin soldering is the most critical failure in electronic reliability.
  • the ultrasonic sensor 10 Given the use of the ultrasonic sensor 10 according to the invention in a parking aid or emergency braking system, that is to say in applications where the ultrasonic sensor 10 is mounted in the bumper vehicle, the skilled person must solve problems related to moisture and sprinkling water or corrosive elements (pollutants).
  • the type of ultrasound transducer 15 may be different from a piezoelectric pellet, for example of the piezoresistive, magnetostrictive, capacitive or echo-pulse type, and the control circuit may be different from an ASIC 1 1, for example it may be formed of a microcontroller and a power circuit.
  • the invention therefore embraces all the possible variants of embodiment, insofar as the characteristics of this ultrasonic sensor 10 do not go beyond the scope set forth in the claims below.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Remote Sensing (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Multimedia (AREA)
  • Optics & Photonics (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention relates to an ultrasonic transducer (10) of the type comprising a housing (16) provided with an electrical connector (17), at least one ultrasonic transducer (15) and an electronic card (13) for controlling said transducer and which is arranged inside the housing and consists of a printed circuit board (14) on which active components (11) and passive components (12) are mounted. According to the invention, the active components include integrated active components (11) which are completely embedded in a substrate of the printed circuit board and the passive components include integrated passive components (12) which are completely embedded in the substrate. According to another feature, the active components and the passive components include surface-mounted components (7) arranged solely on one side of the printed circuit board and the transducer is mounted on an opposite side.

Description

CAPTEUR A ULTRASON DE VEHICULE AUTOMOBILE POUR MESURE DE DISTANCE, PROCEDE DE FABRICATION  AUTOMOTIVE MOTOR VEHICLE ULTRASONIC SENSOR FOR DISTANCE MEASUREMENT, METHOD OF MANUFACTURE
CORRESPONDANT ET UTILISATION DOMAINE TECHNIQUE DE L'INVENTION.  CORRESPONDENT AND USE TECHNICAL FIELD OF THE INVENTION
La présente invention concerne un capteur à ultrason de véhicule automobile pour mesure de distance et son procédé de fabrication.  The present invention relates to a motor vehicle ultrasonic sensor for measuring distance and its manufacturing method.
Elle concerne également l'utilisation de ce capteur à ultrason dans un véhicule automobile.  It also relates to the use of this ultrasonic sensor in a motor vehicle.
ARRIERE PLAN TECHNOLOGIQUE DE L'INVENTION. BACKGROUND ART OF THE INVENTION.
Il existe de nombreuses réalisations de capteurs à ultrasons pour les applications dans des véhicules automobiles.  There are many achievements of ultrasonic sensors for applications in motor vehicles.
Ces applications ont par exemple pour objet d'assister le conducteur d'un véhicule automobile dans des manœuvres de stationnement en mesurant une distance à un obstacle éventuel. Dans ce but, les capteurs à ultrasons comprennent un transducteur ultrasonore au moyen duquel des signaux ultrasonores sont émis et reçus successivement. Ce transducteur est placé dans un boîtier avec une carte électronique pourvue de l'électronique appropriée, qui est agencé, par exemple dans un pare choc du véhicule. Le boîtier comporte un connecteur pour réaliser des liaisons électriques avec le réseau électrique de bord et un bus de données.  These applications are for example to assist the driver of a motor vehicle in parking maneuvers by measuring a distance to a possible obstacle. For this purpose, the ultrasonic sensors comprise an ultrasonic transducer by means of which ultrasonic signals are emitted and received successively. This transducer is placed in a housing with an electronic card provided with the appropriate electronics, which is arranged, for example in a bumper of the vehicle. The housing has a connector for making electrical connections to the on-board electrical network and a data bus.
Un tel capteur à ultrason est notamment décrit dans la demande de brevet américain US20070277615 au nom de la société VALEO SCHALTER UND SENSOREN.  Such an ultrasound sensor is described in particular in the US patent application US20070277615 in the name of the company VALEO SCHALTER UND SENSOREN.
La technologie de la carte électronique de ce capteur est celle d'un circuit imprimé avec des composants actifs et passifs montés en surface. Du fait de la présence de composants sur les deux faces du circuit imprimé, le transducteur doit être monté sur un support au dessus des composants.  The technology of the electronic board of this sensor is that of a printed circuit board with active and passive components mounted on the surface. Due to the presence of components on both sides of the printed circuit, the transducer must be mounted on a support above the components.
Il en résulte une hauteur importante et une moindre résistance aux chocs. II existe donc un besoin pour un capteur à ultrason plus plat et plus robuste s'intégrant facilement dans les véhicules automobiles, et notamment dans les pare- chocs. DESCRIPTION GENERALE DE L'INVENTION. This results in a high height and lower impact resistance. There is therefore a need for a flatter and more robust ultrasonic sensor integrating easily into motor vehicles, and in particular in bumpers. GENERAL DESCRIPTION OF THE INVENTION
La présente invention vise donc à satisfaire ce besoin avec un capteur à ultrason de véhicule automobile pour mesure de distance du type de ceux comprenant:  The present invention therefore aims to satisfy this need with a motor vehicle ultrasonic sensor for distance measurement of the type comprising:
- un boîtier muni d'un connecteur électrique; a housing provided with an electrical connector;
- au moins un transducteur ultrasonore;  at least one ultrasound transducer;
- une carte électronique de pilotage de ce transducteur ultrasonore agencée à l'intérieur du boîtier et formée par un circuit imprimé supportant des composants actifs et des composants passifs.  an electronic control card for this ultrasonic transducer arranged inside the casing and formed by a printed circuit supporting active components and passive components.
Selon l'invention, les composants actifs comprennent des composants actifs intégrés complètement enfouis dans un substrat du circuit imprimé et les composants passifs comprennent des composants passifs intégrés également complètement enfouis dans ce substrat et les composants actifs et les composants passifs comprennent des composants à montage en surface disposés uniquement sur une face du circuit imprimé et le transducteur est monté sur une face opposée.  According to the invention, the active components comprise integrated active components completely buried in a printed circuit substrate and the passive components comprise integrated passive components also completely buried in this substrate and the active components and the passive components comprise surface disposed only on one face of the printed circuit and the transducer is mounted on an opposite face.
Selon une autre caractéristique de l'invention, les composants actifs intégrés et les composants passifs intégrés comportent des contacts de cuivre reliés par des microvias à des pistes de cuivre du circuit imprimé.  According to another characteristic of the invention, the integrated active components and the integrated passive components comprise copper contacts connected by microvias to copper tracks of the printed circuit.
Selon encore une autre caractéristique de l'invention, les composants actifs intégrés comprennent au moins une puce de silicium nue.  According to yet another characteristic of the invention, the integrated active components comprise at least one bare silicon chip.
Dans le capteur à ultrason selon l'invention, cette puce est un ASIC.  In the ultrasound sensor according to the invention, this chip is an ASIC.
Selon encore une autre caractéristique de l'invention, dans le capteur à ultrason, le transducteur ultrasonore est formé d'une pastille piézoélectrique.  According to yet another characteristic of the invention, in the ultrasonic sensor, the ultrasonic transducer is formed of a piezoelectric pellet.
Selon un autre aspect, l'invention concerne un procédé de fabrication du capteur à ultrason de véhicule automobile pour mesure de distance décrit ci- dessus, qui comprend une étape générale de réalisation d'une carte électronique comportant un circuit imprimé et des composants électroniques.  According to another aspect, the invention relates to a method of manufacturing the ultrasonic sensor of a motor vehicle for measuring distance described above, which comprises a general step of producing an electronic card comprising a printed circuit and electronic components.
Cette étape générale comprend selon l'invention:  This general step comprises according to the invention:
- une étape préliminaire de prétraitement d'au moins un des composants électroniques formant ultérieurement au moins un composant intégré enfoui dans le circuit imprimé;  a preliminary step of pretreatment of at least one of the electronic components subsequently forming at least one integrated component buried in the printed circuit;
- une première étape de perçage au laser de repères sur des couches de cuivre formant ultérieurement partie de ce circuit imprimé;  a first step of laser drilling marks on copper layers that subsequently form part of this printed circuit;
- une deuxième étape d'impression d'au moins une des couches de cuivre avec un matériau diélectrique; a second step of printing at least one of the copper layers with a dielectric material;
- une troisième étape de placement du composant intégré sur le matériau diélectrique;  a third step of placing the integrated component on the dielectric material;
- une quatrième étape d'empilage et de pressage des couches de cuivre et de couches de substrat organique comportant au moins un évidement recevant ce composant intégré;  a fourth step of stacking and pressing the copper layers and organic substrate layers comprising at least one recess receiving this integrated component;
- une cinquième étape de perçage au laser;  a fifth laser drilling step;
- une sixième étape de perçage mécanique;  a sixth step of mechanical drilling;
- une septième étape de purification;  a seventh purification step;
- une huitième étape de métallisation pour former des vias et des microvias comportant une première phase d'imageage, une deuxième phase de déposition de cuivre et une troisième phase de décapage et de gravure; an eighth metallization step for forming vias and microvias comprising a first imaging phase, a second copper deposition phase and a third etching and etching phase;
- une neuvième d'inspection automatique;  - a ninth automatic inspection;
- une étape aval de traitement de ce substrat organique.  a downstream stage of treatment of this organic substrate.
L'étape générale du procédé de fabrication du capteur à ultrason selon l'invention comprend en outre une première étape supplémentaire de montage uniquement sur une première face du circuit imprimé d'au moins un des composants électroniques de type composant à montage en surface.  The general step of the manufacturing method of the ultrasonic sensor according to the invention further comprises a first additional step of mounting only on a first face of the printed circuit of at least one of the surface mount component type electronic components.
Selon l'invention, l'étape générale du procédé comprend en outre une seconde étape supplémentaire de collage d'au moins une pastille piézoélectrique sur une seconde face opposée à la première face et de connexion par des fils de liaison souples de cette pastille piézoélectrique aux microvias correspondants.  According to the invention, the general step of the method further comprises a second additional step of bonding at least one piezoelectric pellet to a second face opposite the first face and connection by flexible connecting son of this piezoelectric pellet to corresponding microvias.
Le capteur à ultrason de véhicule automobile pour mesure de distance selon l'invention est avantageusement utilisé dans un système d'aide au stationnement ou de freinage d'urgence.  The ultrasonic sensor of a motor vehicle for measuring distance according to the invention is advantageously used in a parking aid or emergency braking system.
Ces quelques spécifications essentielles auront rendu évidents pour l'homme de métier les avantages apportés par ce capteur à ultrason par rapport à l'état de la technique antérieur.  These few essential specifications will have made obvious to the skilled person the advantages brought by this ultrasound sensor compared to the state of the prior art.
Les spécifications détaillées de l'invention sont données dans la description qui suit en liaison avec les dessins ci-annexés. Il est à noter que ces dessins n'ont d'autre but que d'illustrer le texte de la description et ne constituent en aucune sorte une limitation de la portée de l'invention.  The detailed specifications of the invention are given in the following description in conjunction with the accompanying drawings. It should be noted that these drawings have no other purpose than to illustrate the text of the description and do not constitute in any way a limitation of the scope of the invention.
BREVE DESCRIPTION DES DESSINS. La Figure 1 montre capteur à ultrason de véhicule automobile connu de l'état de la technique. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows ultrasonic sensor of a motor vehicle known from the state of the art.
La Figure 2 montre schématiquement un capteur à ultrason de véhicule automobile selon l'invention.  Figure 2 shows schematically an ultrasonic sensor of a motor vehicle according to the invention.
La Figure 3 illustre le procédé de fabrication selon l'invention d'une carte électronique du capteur à ultrason montré sur la Figure 2, notamment du circuit imprimé.  Figure 3 illustrates the manufacturing method according to the invention of an electronic card of the ultrasonic sensor shown in Figure 2, in particular of the printed circuit.
DESCRIPTION D'UN MODE DE REALISATION PREFERE DE L'INVENTION. DESCRIPTION OF A PREFERRED EMBODIMENT OF THE INVENTION
Le type de capteur à ultrason concerné par le mode de réalisation préféré de The type of ultrasound transducer concerned by the preferred embodiment of
T'invention est montré sur la Figure 1. The invention is shown in Figure 1.
De manière connue en soi, ce capteur à ultrason 1 , destiné à être intégré dans un pare-choc de véhicule automobile, comprend un boîtier 2 et un connecteur électrique 3 protégeant un transducteur ultrasonore 4, qui est dans cet exemple, un transducteur à membrane.  In a manner known per se, this ultrasonic sensor 1, intended to be integrated in a motor vehicle bumper, comprises a housing 2 and an electrical connector 3 protecting an ultrasonic transducer 4, which is in this example a membrane transducer .
Une carte électronique 5, formée par un circuit imprimé supportant des composants à montage en surface (CMS) 7, pilote le transducteur à membrane 4 pour l'émission d'impulsions ultrasonores et leur réception après réflexion sur un obstacle éventuel dans un rayon de quelques mètres.  An electronic card 5, formed by a printed circuit supporting surface mount components (CMS) 7, drives the membrane transducer 4 for the emission of ultrasonic pulses and their reception after reflection on a possible obstacle in a radius of some meters.
De manière connue en soi également, une distance entre cet obstacle et le capteur à ultrason 1 est calculée par la carte électronique 5 à partir du temps de vol aller-retour de ces impulsions.  In a manner known per se also, a distance between this obstacle and the ultrasonic sensor 1 is calculated by the electronic card 5 from the round trip time of these pulses.
Dans ce capteur 1 connu de l'état de la technique, le circuit imprimé 6 est de technologie classique double face, c'est-à-dire à deux couches de cuivre séparées par un substrat isolant.  In this sensor 1 known from the state of the art, the printed circuit 6 is of conventional double-sided technology, that is to say to two copper layers separated by an insulating substrate.
Les composants CMS 7 passifs (résistances, condensateurs, inductances...) et les composants actifs, tels que notamment un ASIC ( acronyme de "Application The passive CMS 7 components (resistors, capacitors, inductors, etc.) and the active components, such as in particular an ASIC (acronym for "Application").
Spécifie Integrated Circuit" en terminologie anglaise, c'est-à-dire "Circuit IntégréSpecifies Integrated Circuit "in English terminology, ie" Integrated Circuit
Spécifique à une Application") sont montés sur les deux faces du circuit imprimé 6, et empêchent le montage du transducteur à membrane 4 directement sur le circuit imprimé 6. Application Specific ") are mounted on both sides of the printed circuit board 6, and prevent mounting of the membrane transducer 4 directly on the printed circuit board 6.
Le transducteur à membrane 4 est monté dans la carte électronique 5 sur un support 8 et relié au circuit imprimé 5 par des broches traversantes 9 Ce type montage présente les inconvénients d'être encombrant et peu fiable, surtout si le capteur à ultrason 1 est intégré dans le pare choc du véhicule, qui, par définition, est soumis à des chocs. The membrane transducer 4 is mounted in the electronic card 5 on a support 8 and connected to the printed circuit 5 by through pins 9 This mounting type has the drawbacks of being bulky and unreliable, especially if the ultrasonic sensor 1 is integrated into the bumper of the vehicle, which, by definition, is subjected to shocks.
Dans le capteur à ultrason 10 selon l'invention montré schématiquement sur la Figure 2, l'enfouissement de certains des composants actifs 1 1 et passifs 12 des composants 7 de la carte électronique 13 dans le circuit imprimé 14 permet de libérer une face opposée à la face où sont montés les composants CMS 7 pour monter le transducteur ultrasonore, qui est ici une pastille piézoélectrique 15.  In the ultrasonic sensor 10 according to the invention shown diagrammatically in FIG. 2, the burying of some of the active components 1 1 and the passive components 12 of the electronic card 13 in the printed circuit 14 makes it possible to release a face opposite to the face where the CMS 7 components are mounted to mount the ultrasonic transducer, which is here a piezoelectric chip 15.
De la sorte, le boîtier 16 du capteur à ultrason 10 selon l'invention et le connecteur électrique 17 forment un ensemble compact plus plat que le capteur à ultrason conventionnel 1 .  In this way, the housing 16 of the ultrasonic sensor 10 according to the invention and the electrical connector 17 form a compact unit which is flatter than the conventional ultrasound sensor 1.
Ce boîtier 16 et ce connecteur 17 sont fabriqués par injection plastique, de manière connue en soi.  This housing 16 and this connector 17 are made by plastic injection, in a manner known per se.
Le capteur à ultrason selon l'invention est réalisé en assemblant avec le boîtier 16 la carte électronique 13 fabriquée au cours d'une étape générale de réalisation illustrée par la Figure 3.  The ultrasonic sensor according to the invention is made by assembling with the housing 16 the electronic card 13 manufactured during a general embodiment step illustrated in FIG. 3.
Dans une étape préliminaire 17, les composants électroniques 1 1 , 12 destinés à être enfouis dans un substrat organique 18 du circuit imprimé 14 sont soumis à une préparation particulière.  In a preliminary step 17, the electronic components 1 1, 12 intended to be buried in an organic substrate 18 of the printed circuit 14 are subjected to a particular preparation.
Les composants actifs 1 1 sont intégrés dans le circuit imprimé 14 sous la forme de puce à semi-conducteur (généralement du silicium) nue 1 1 . La préparation particulière des puces 1 1 est faite sur la galette complète afin de réaliser une couche de redistribution 19 en cuivre qui permettra de réaliser les interconnexions avec des pistes 20 du circuit imprimé 14 par l'intermédiaire de microvias métallisés 21 . Cette préparation est effectuée en salle blanche.  The active components 1 1 are integrated in the printed circuit 14 in the form of a semiconductor chip (generally silicon) 1 1 naked. The particular preparation of the chips 1 1 is made on the complete wafer in order to produce a copper redistribution layer 19 which will make it possible to interconnect with the tracks 20 of the printed circuit 14 by means of metallized microvias 21. This preparation is carried out in a clean room.
Le routage de la couche de redistribution 19 est réalisé en prenant en compte des distances d'isolement nécessaires entre les signaux pour éviter les problèmes d'électromigration et aussi pour permettre l'ajout de zones de cuivre facilitant la dissipation thermique de la puce 1 1 vers le substrat 18.  The routing of the redistribution layer 19 is performed taking into account the necessary isolation distances between the signals to avoid electromigration problems and also to allow the addition of copper zones facilitating the heat dissipation of the chip 1 1 to the substrate 18.
Dans un mode de réalisation particulier de l'invention, une seule puce 1 1 de type ASIC réalisant toutes les fonctions d'émission- réception du capteur à ultrason 10 est intégrée dans le substrat organique 18. En ce qui concerne les composants passifs 12 (résistances, condensateurs, inductances...) destinés à être enfouis dans le substrat organique 18 du circuit imprimé 14, ceux-ci sont de même munis de terminaisons 19 en cuivre. In a particular embodiment of the invention, a single ASIC type chip 1 1 performing all the transmission-reception functions of the ultrasound sensor 10 is integrated into the organic substrate 18. As regards the passive components 12 (resistors, capacitors, inductances, etc.) intended to be buried in the organic substrate 18 of the printed circuit 14, they are likewise provided with copper terminals 19.
Dans une première étape 22 de perçage au laser on réalise des repères 23 sur les couches de cuivre 24 qui formeront ultérieurement partie du circuit imprimé 14.  In a first laser drilling step 22, marks 23 are made on the copper layers 24 which will subsequently form part of the printed circuit 14.
Dans une deuxième étape 25, on imprime ces couches de cuivre 24 avec un matériau diélectrique 26 de façon à isoler les composants enfouis 1 1 , 12 en dehors des zones de connexions 19.  In a second step 25, these copper layers 24 are printed with a dielectric material 26 so as to isolate the buried components 11, 12 outside the connection zones 19.
Dans une troisième étape 27, on place les composants 28 destinés à être enfouis sur le matériau diélectrique 26 imprimé. L'opération consistant à coller une puce 1 1 sur une couche de cuivre 24 est aussi effectuée en salle blanche.  In a third step 27, the components 28 are placed to be buried on the printed dielectric material 26. The operation of sticking a chip 1 1 on a copper layer 24 is also performed in a clean room.
Dans une quatrième étape 29, on empile les couches de cuivre 24 et des couches du substrat organique 18 dans lesquelles ont été prévus des évidements 30 recevant les composants enfouis 1 1 , 12.  In a fourth step 29, the copper layers 24 and layers of the organic substrate 18 are stacked in which recesses 30 receiving the buried components 11, 12 have been provided.
Dans une cinquième étape 31 , on perce au laser la ou les couches de cuivre 24 et le matériau diélectrique 26 en regard des zones de connexions 19 des composants enfouis 1 1 , 12 de manière à mettre celles-ci à nue 32 en vue de la réalisation ultérieure des microvias métallisés 21 .  In a fifth step 31, the copper layer or layers 24 and the dielectric material 26 are laser-etched opposite the connection zones 19 of the buried components 11, 12 so as to expose them 32 to subsequent production of metallized microvias 21.
Dans une sixième étape 33, on perce mécaniquement des trous 34 dans les couches de cuivre et les couches du substrat 18 en vue de la réalisation ultérieure des vias métallisés 35.  In a sixth step 33, holes 34 are mechanically drilled in the copper layers and the layers of the substrate 18 for the subsequent production of the metallized vias 35.
Dans une septième étape 36, on élimine les impuretés 32 résultant du perçage par laser au cours de la cinquième étape 31 .  In a seventh step 36, the impurities 32 resulting from laser drilling are removed during the fifth step 31.
Dans une huitième étape 37 de métallisation, on réalise les microvias 21 et les vias 35 au cours d'une première phase 38 d'imageage, d'une deuxième phase 39 de déposition de cuivre et d'une troisième phase 40 de décapage et de gravure.  In an eighth metallization step 37, microvias 21 and vias 35 are produced during a first imaging phase 38, a second copper deposition phase 39 and a third phase 40 of etching and deposition. engraving.
Une neuvième étape 41 d'inspection automatique par des moyens de vision industrielle permet de vérifier la conformité du circuit imprimé 14 à un modèle de référence.  A ninth step 41 of automatic inspection by means of machine vision makes it possible to check the conformity of the printed circuit 14 with a reference model.
Une étape aval 42 effectue un traitement du substrat organique 18 et une finition du circuit imprimé 14. Dans une première étape supplémentaire (non illustrée), la carte électronique 13 est pourvue de composants actifs et passifs 7 à montage en surface uniquement sur une première face du circuit imprimé 14. A downstream step 42 performs a treatment of the organic substrate 18 and a finish of the printed circuit 14. In a first additional step (not illustrated), the electronic card 13 is provided with active and passive components 7 surface-mounted only on a first face of the printed circuit 14.
Cette disposition permet de laisser libre une seconde face opposée à la première pour le collage de la pastille piézoélectrique 15 dans une seconde étape supplémentaire.  This arrangement allows to leave free a second face opposite to the first for gluing the piezoelectric wafer 15 in a second additional step.
Au cours de cette seconde étape supplémentaire, la pastille piézoélectrique 15 est connectée à l'ASIC 1 1 par des fils de liaison souples 43 soudés sur les microvias correspondants 21 (technique connue de l'homme de métier sous le nom de "bonding").  During this second additional step, the piezoelectric chip 15 is connected to the ASIC 1 1 by flexible connecting wires 43 soldered to the corresponding microvias 21 (technique known to those skilled in the art under the name of "bonding") .
Le collage de la pastille piézoélectrique 15 directement sur le circuit imprimé 14 et cette technique de "bonding" permettent de raccourcir la longueur des connexions par rapport au montage avec support 8 du capteur à ultrason conventionnel 1 .  The bonding of the piezoelectric chip 15 directly to the printed circuit 14 and this bonding technique make it possible to shorten the length of the connections relative to the mounting with support 8 of the conventional ultrasonic sensor 1.
De ce fait, les effets parasites sont limités et le comportement CEM As a result, the parasitic effects are limited and the EMC behavior
(compatibilité électromagnétique) est amélioré. (electromagnetic compatibility) is improved.
Une amélioration des performances CEM résulte aussi de l'enfouissement de certains des composants électroniques 1 1 , 12 de la carte, notamment l'ASIC 1 1 , car les deux couches de cuivre 24 externes du circuit imprimé 14 font office de blindage.  An improvement in the EMC performance also results from the burial of some of the electronic components 1 1, 12 of the card, including the ASIC 1 1, because the two outer copper layers 24 of the printed circuit 14 serve as shielding.
La connexion des composants intégrés 28 étant réalisée au moyen d'une métallisation de cuivre, la carte électronique 13 est plus robuste aux chocs qu'une carte électronique conventionnelle 5 où tous les composants 7 sont soudés à l'étain. En effet, la soudure à l'étain est la défaillance la plus critique en fiabilité électronique.  The connection of the integrated components 28 being made by means of a copper metallization, the electronic card 13 is more shock resistant than a conventional electronic card 5 where all the components 7 are soldered to the tin. Indeed, tin soldering is the most critical failure in electronic reliability.
Compte tenu de l'utilisation du capteur à ultrason 10 selon l'invention dans un système d'aide au stationnement ou de freinage d'urgence, c'est-à-dire dans des applications où le capteur à ultrason 10 est monté dans les pare chocs du véhicule, l'homme de métier doit résoudre des problèmes liés à l'humidité et à l'aspersion d'eau ou d'éléments corrosifs (polluants).  Given the use of the ultrasonic sensor 10 according to the invention in a parking aid or emergency braking system, that is to say in applications where the ultrasonic sensor 10 is mounted in the bumper vehicle, the skilled person must solve problems related to moisture and sprinkling water or corrosive elements (pollutants).
Leur intégration dans le circuit imprimé 14 permet de protéger les composants actifs 1 1 les plus importants contre ces agressions.  Their integration in the printed circuit 14 makes it possible to protect the most important active components 1 1 against these attacks.
Comme il va de soi, l'invention ne se limite pas au seul mode d'exécution préférentiel décrit ci-dessus. Notamment, le type de transducteur ultrasonore 15 peut être différent d'une pastille piézoélectrique, par exemple de type piézorésistif, magnétostrictif, capacitif ou impulsion- écho, et le circuit de pilotage peut être différent d'un ASIC 1 1 , par exemple il peut être formé d'un microcontrôleur et d'un circuit de puissance. It goes without saying that the invention is not limited to the single preferred embodiment described above. In particular, the type of ultrasound transducer 15 may be different from a piezoelectric pellet, for example of the piezoresistive, magnetostrictive, capacitive or echo-pulse type, and the control circuit may be different from an ASIC 1 1, for example it may be formed of a microcontroller and a power circuit.
L'invention embrasse donc toutes les variantes possibles de réalisation, dans la mesure où les caractéristiques de ce capteur à ultrason 10 ne sortent pas du cadre fixé par les revendications ci-après.  The invention therefore embraces all the possible variants of embodiment, insofar as the characteristics of this ultrasonic sensor 10 do not go beyond the scope set forth in the claims below.

Claims

REVENDICATIONS
1) Capteur à ultrason (1 , 10) de véhicule automobile pour mesure de distance du type de ceux comprenant: 1) ultrasonic sensor (1, 10) of a motor vehicle for distance measurement of the type comprising:
- un boîtier (2, 16) muni d'un connecteur électrique (3, 17);  a housing (2, 16) provided with an electrical connector (3, 17);
- au moins un transducteur ultrasonore (4, 15);  at least one ultrasonic transducer (4, 15);
- une carte électronique (5, 13) de pilotage dudit transducteur ultrasonore (4, 15) agencée à l'intérieur dudit boîtier (2, 16) et formée par un circuit imprimé (6, 14) supportant des composants actifs (7, 1 1 ) et des composants passifs (7, 12);  an electronic card (5, 13) for driving said ultrasonic transducer (4, 15) arranged inside said casing (2, 16) and formed by a printed circuit (6, 14) supporting active components (7, 1); 1) and passive components (7, 12);
caractérisé en ce que lesdits composants actifs (7, 1 1 ) comprennent des composants actifs intégrés (1 1 ) complètement enfouis dans un substrat (18) dudit circuit imprimé (14) et en ce que lesdits composants passifs (7, 12) comprennent des composants passifs intégrés (12) complètement enfouis dans ledit substrat, et en ce que lesdits composants actifs (7, 1 1 ) et lesdits composants passifs (7, 12) comprennent des composants à montage en surface (7) disposés uniquement sur une face dudit circuit imprimé (14) et ledit transducteur (15) est monté sur une face opposée. 2) Capteur à ultrason (10) de véhicule automobile pour mesure de distance selon la revendication 1 , caractérisé en ce que lesdits composants actifs intégrés (1 1 ) et lesdits composants passifs intégrés (12) comportent des contacts de cuivre (19) reliés par des microvias (21 ) à des pistes de cuivre (20) dudit circuit imprimé (14). 3) Capteur à ultrason (10) de véhicule automobile pour mesure de distance selon la revendication 1 ou 2 précédentes, caractérisé en ce que lesdits composants actifs (1 1 ) intégrés comprennent au moins une puce (1 1 ) de silicium nue. characterized in that said active components (7, 1 1) comprise integrated active components (11) completely buried in a substrate (18) of said printed circuit (14) and in that said passive components (7, 12) comprise integrated passive components (12) completely embedded in said substrate, and in that said active components (7, 1 1) and said passive components (7, 12) comprise surface mount components (7) disposed only on one side of said printed circuit board (14) and said transducer (15) is mounted on an opposite side. 2) ultrasonic sensor (10) of a motor vehicle for measuring distance according to claim 1, characterized in that said integrated active components (1 1) and said integrated passive components (12) comprise copper contacts (19) connected by microvias (21) to copper tracks (20) of said printed circuit (14). 3) ultrasonic sensor (10) of a motor vehicle for distance measurement according to claim 1 or 2, characterized in that said integrated active components (1 1) comprise at least one chip (1 1) of bare silicon.
4) Capteur à ultrason de véhicule automobile pour mesure de distance selon la revendication 3, caractérisé en ce que ladite puce (1 1 ) est un ASIC. 4) Ultrasonic sensor of a motor vehicle for distance measurement according to claim 3, characterized in that said chip (1 1) is an ASIC.
5) Capteur à ultrason (10) de véhicule automobile pour mesure de distance selon l'une quelconque des revendications 1 à 4 précédentes, caractérisé en ce que ledit transducteur ultrasonore (15) est formé d'une pastille piézoélectrique (15). 5) ultrasonic sensor (10) of a motor vehicle for measuring distance according to any one of claims 1 to 4 above, characterized in that said ultrasonic transducer (15) is formed of a piezoelectric pellet (15).
6) Procédé de fabrication du capteur à ultrason (1 , 10) de véhicule automobile pour mesure de distance selon l'une quelconque des revendications 1 à 5 précédentes du type de ceux comprenant une étape générale de réalisation d'une carte électronique (5, 13) comportant un circuit imprimé (6, 14), et des composants électroniques (7, 1 1 , 12), caractérisé en ce ladite étape générale comprend: 6) A method of manufacturing the ultrasonic sensor (1, 10) of a motor vehicle for measuring distance according to any one of claims 1 to 5 preceding the type of those comprising a general step of producing an electronic card (5, 13) comprising a printed circuit (6, 14), and electronic components (7, 1 1, 12), characterized in that said general step comprises:
- une étape préliminaire (17) de prétraitement d'au moins un desdits composants électroniques (7, 1 1 , 12) formant ultérieurement au moins un composant intégré (1 1 , 12, 28) enfoui dans ledit circuit imprimé (14);  - a preliminary step (17) of pretreatment of at least one of said electronic components (7, 1 1, 12) subsequently forming at least one integrated component (1 1, 12, 28) buried in said printed circuit (14);
- une première étape (22) de perçage au laser de repères (23) sur des couches de cuivre (24) formant ultérieurement partie dudit circuit imprimé (14);  - a first step (22) of laser drilling of marks (23) on copper layers (24) subsequently forming part of said printed circuit (14);
- une deuxième étape (25) d'impression d'au moins une desdites couches de cuivre (24) avec un matériau diélectrique (26);  a second step (25) of printing at least one of said copper layers (24) with a dielectric material (26);
- une troisième étape (27) de placement dudit composant intégré (28) sur ledit matériau diélectrique (26); a third step (27) for placing said integrated component (28) on said dielectric material (26);
- une quatrième étape (29) d'empilage et de pressage desdites couches de cuivre (24) et de couches de substrat organique (18) comportant au moins un évidement (30) recevant ledit composant intégré (1 1 , 12, 28);  a fourth step (29) for stacking and pressing said copper layers (24) and organic substrate layers (18) comprising at least one recess (30) receiving said integrated component (1 1, 12, 28);
- une cinquième étape (31 ) de perçage au laser; a fifth laser piercing step (31);
- une sixième étape (33) de perçage mécanique;  a sixth step (33) of mechanical drilling;
- une septième étape (36) de purification;  a seventh purification step (36);
- une huitième étape (37) de métallisation pour former des vias (35) et des microvias (21 ) comportant une première phase d'imageage (38), une deuxième phase (39) de déposition de cuivre et une troisième phase (40) de décapage et de gravure;  an eighth metallization step (37) for forming vias (35) and microvias (21) comprising a first imaging phase (38), a second copper deposition phase (39) and a third phase (40) pickling and etching;
- une neuvième étape (41 ) d'inspection automatique;  a ninth step (41) of automatic inspection;
- une étape aval (42) de traitement dudit substrat organique. 7) Procédé de fabrication du capteur à ultrason (10) de véhicule automobile pour mesure de distance selon la revendication 6, caractérisé en ce que ladite étape générale comprend en outre une première étape supplémentaire de montage uniquement sur une première face dudit circuit imprimé (14) d'au moins un desdits composants électroniques (7) de type composant à montage en surface. 8) Procédé de fabrication du capteur à ultrason (10) de véhicule automobile pour mesure de distance selon la revendication 7, caractérisé en ce que ladite étape générale comprend en outre une seconde étape supplémentaire de collage d'au moins une pastille piézoélectrique (15) sur une seconde face opposée à ladite première face et de connexion par des fils de liaison (43) souples de ladite pastille piézoélectrique (15) auxdits microvias (21 ) correspondants. a downstream stage (42) for treating said organic substrate. 7) A method of manufacturing the ultrasonic sensor (10) of a motor vehicle for measuring distance according to claim 6, characterized in that said general step further comprises a first additional step of mounting only on a first face of said printed circuit (14). ) of at least one of said surface mount component type electronic components (7). 8) A method of manufacturing the ultrasonic sensor (10) of a motor vehicle for measuring distance according to claim 7, characterized in that said general step further comprises a second additional step of bonding at least one piezoelectric chip (15) on a second face opposite to said first face and connecting by flexible connecting wires (43) of said piezoelectric chip (15) to said corresponding microvias (21).
9) Utilisation du capteur à ultrason (10) de véhicule automobile pour mesure de distance selon l'une quelconque des revendications 1 à 5 précédentes dans un système d'aide au stationnement ou de freinage d'urgence. 9) Use of the ultrasonic sensor (10) of a motor vehicle for distance measurement according to any one of claims 1 to 5 above in a parking assistance system or emergency braking.
EP15759861.6A 2014-09-15 2015-07-23 Motor vehicle ultrasonic transducer for distance measurement, corresponding manufacturing method and use Withdrawn EP3195005A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1458665A FR3025879B1 (en) 2014-09-15 2014-09-15 MOTOR VEHICLE ULTRASOUND SENSOR FOR DISTANCE MEASUREMENT, PROCESS FOR PRODUCING THE SAME AND USE THEREOF
PCT/FR2015/052044 WO2016042223A1 (en) 2014-09-15 2015-07-23 Motor vehicle ultrasonic transducer for distance measurement, corresponding manufacturing method and use

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EP3195005A1 true EP3195005A1 (en) 2017-07-26

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US (1) US10274591B2 (en)
EP (1) EP3195005A1 (en)
JP (1) JP2017538914A (en)
CN (1) CN107155354A (en)
FR (1) FR3025879B1 (en)
WO (1) WO2016042223A1 (en)

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US10274591B2 (en) 2019-04-30
FR3025879A1 (en) 2016-03-18
FR3025879B1 (en) 2018-03-02
WO2016042223A1 (en) 2016-03-24
JP2017538914A (en) 2017-12-28
US20170254885A1 (en) 2017-09-07

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