FR2809533A1 - Monolithic microsystem with mosaic of components and manufacturing method, for use in microelectronics - Google Patents

Monolithic microsystem with mosaic of components and manufacturing method, for use in microelectronics Download PDF

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Publication number
FR2809533A1
FR2809533A1 FR0008627A FR0008627A FR2809533A1 FR 2809533 A1 FR2809533 A1 FR 2809533A1 FR 0008627 A FR0008627 A FR 0008627A FR 0008627 A FR0008627 A FR 0008627A FR 2809533 A1 FR2809533 A1 FR 2809533A1
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Prior art keywords
components
connection
microsystem
monolithic
face
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French (fr)
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Pierre Gidon
Benoit Giffard
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Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Commissariat a lEnergie Atomique CEA
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Abstract

The monolithic microsystem comprises a set of components, functional (106a) and artificial (106b), each with a connection face (107), in a zone defined by a frame (104), where the components are linked by a binder in contact with the wafers of components, and the connection faces are coplanar so to form a flat surface, which is the connection surface of monolithic system. The manufacturing method comprises the following steps: (a) placing the components (106a, 106b) on a support (100) with an adhesive layer (102) so that the connection faces are in contact with the adhesive layer; (b) linking the components to form a monolithic structure; and (c) separating the monolithic structure from the support so to free the connection surface of monolithic system comprising the connection faces of components. After step (c), electrical connections between components are formed on the connection surface. The connection surface of microsystem is equipped with electrical and/or optical connections, and the connection means include contacts with fusible balls for connection to external devices and/or interconnection lines. The components are of the following types: diode, power diode, transistor, power transistor, logic integrated circuit, analytic integrated circuit, resistor, inductor, capacitor, resonator, photodetector, light-emitting diode, laser diode, micro-mirror, optical guide, integrated optical component, micro-sensor, micro-actuator, acoustic wave component, filter, gyrometer, magnetic component, micro-transformer, writing head, and artificial component. The manufacturing method comprises, before step (a), a preparation of the support to form the adhesive layer, which includes one of the following operations: placing a layer of fine wax, which is maintained at a temperature at which the wax is sticky, at the time of step (a), or placing a layer of auto-binder. At the time of step (c), the layer of wax is fused, or the layer of auto-binder is undone. The interstices between components are filled with a binder at step (b), and the binder is used to encapsulate the components with the formation of a free flat surface. The formation of connections includes making openings in a passivation layer formed on the connection faces of components, and the formation of strip conductors between connection poles. Before or after step (c), the monolithic structure is cut to individualize groups of components.

Description

MICROSYSTEME <B>MONOLITHIQUE A</B> MOSAIQUE COMPOSANTS <U>Domaine technique</U> La présente invention concerne fabrication de microsystèmes monolithiques, encore désignés par "system on a chip" (système sur puce).  TECHNICAL FIELD The present invention relates to the manufacture of monolithic microsystems, also referred to as "system on a chip" (system-on-a-chip).

Les microsystèmes monolithiques visés par l'invention intègrent en un seul bloc plusieurs composants qui dans leur fonctionnement peuvent faire appel à différents principes physiques ou résulter des propriétés de différents matériaux. The monolithic microsystems targeted by the invention integrate in a single block several components which in their operation may use different physical principles or result from the properties of different materials.

A titre d'illustration, un microsystème monolithique peut inclure des composants aussi variés qu un circuit électronique intégré, un transistor de puissance, une résistance, un condensateur, une inductance, un dispositif à ondes acoustiques, une source ou un récepteur de lumière, un composant optique guidé, un composant magnétique, un élément de micromécanique, etc. By way of illustration, a monolithic microsystem can include components as varied as an integrated electronic circuit, a power transistor, a resistor, a capacitor, an inductor, an acoustic wave device, a source or a light receiver, a guided optical component, a magnetic component, a micromechanical element, etc.

En raison du caractère très varié des composants susceptibles d'être intégrés dans un microsystème monolithique, le champ d'application de l'invention est large. I1 concerne de façon générale domaines de l'électronique, de l'optique et de la micromécanique intégrés. En particulier, les microsystèmes de l'invention sont utilisables dans les applications pour lesquelles on souhaite disposer d'un bloc intégrant tous les composants nécessaires à une fonction déterminée. Par exemple, les microsystèmes peuvent être utilisés dans des équipements tels que des ordinateurs ou téléphones portables. Etat <U>de la technique</U> anterieure on connaît des microsystèmes qui incluent un ensemble de composants ces composants mettant en oeuvre les propriétés d' même matériau. I1 s'agit par exemple des circuits intégrés de micro-électronique dont l'ensemble des composants sont formés dans un même matériau semi-conducteur utilisé comme substrat.' Lorsque ces microsystèmes doivent être conçus pour inclure des composants fonctionnant selon des principes physiques differents, leur intégration sur un même matériau pose des problèmes d'adaptation et implique des compromis techniques. Because of the wide variety of components that can be integrated in a monolithic microsystem, the scope of the invention is broad. It relates generally to the fields of integrated electronics, optics and micromechanics. In particular, the microsystems of the invention can be used in applications for which it is desired to have a block integrating all the components necessary for a given function. For example, microsystems can be used in equipment such as computers or mobile phones. <U> state of the prior art </ U> microsystems are known which include a set of components these components implementing the properties of the same material. These are, for example, microelectronics integrated circuits, all of whose components are formed in the same semiconductor material used as a substrate. When these microsystems have to be designed to include components operating on different physical principles, their integration on the same material poses problems of adaptation and involves technical compromises.

Des difficultés apparaissent également lorsque des matériaux différents et en particulier avec des coefficients de dilatation thermique différents, doivent être imbriqués les uns dans les autres. Difficulties also arise when different materials and in particular with different coefficients of thermal expansion, must be nested within each other.

Une solution connue à ces problèmes consiste à réaliser séparément les composants, respectivement sur des matériaux adaptés à leur fonction, puis de les reporter, un à un, sur un support commun. Ce report peut avoir lieu selon des techniques dites d'hybridation. A known solution to these problems consists in separately producing the components, respectively on materials adapted to their function, then to transfer them, one by one, on a common support. This postponement can take place according to so-called hybridization techniques.

Selon ces techniques, l'assemblage des composants a notamment lieu par des billes de matériau fusible. Les billes assurent la cohésion du système finalement obtenu tout en le libérant des contraintes de dilatation thermique. Les billes assurent également l'interconnexion électrique des composants, si nécessaire. <U>Exposé de l'invention</U> L'invention a pour but de proposer un microsystème pouvant inclure des composants fonctionnant selon des principes différents et ne presentant pas les contraintes des microsystemes connus. According to these techniques, the assembly of the components in particular takes place by balls of fusible material. The beads ensure the cohesion of the system finally obtained while freeing it from thermal expansion stresses. The balls also provide electrical interconnection of the components, if necessary. The aim of the invention is to propose a microsystem that may include components operating according to different principles and not presenting the constraints of known microsystems.

A cet effet, l'invention concerne plus precisément un microsystème monolithique comprenant une pluralité de composants, présentant chacun au moins une face, dite de connexion, et une tranche. Conformément à l'invention, les composants sont reliés par un liant en contact avec leurs tranches et les faces de connexion des composants sont coplanaires de façon à former une surface plane, dite face de connexion du système monolithique. To this end, the invention more precisely relates to a monolithic microsystem comprising a plurality of components, each having at least one face, called connection, and a wafer. According to the invention, the components are connected by a binder in contact with their wafers and the connection faces of the components are coplanar so as to form a flat surface, called connection face of the monolithic system.

On distingue par tranche des composants, ou plusieurs faces des composants formant avec la face de connexion un angle non nul, par exemple un angle droit. Dans le microsystème, chaque composant est relié sa tranche aux composants voisins, ou à un cadre qui entoure les composants et qui affleure également à la surface de connexion du microsystème. There is a slice component, or several faces of the components forming with the connection face a non-zero angle, for example a right angle. In the microsystem, each component is connected to its slice to neighboring components, or to a frame that surrounds the components and which is also flush with the connection surface of the microsystem.

Le liant utilisé pour les composants est par exemple un matériau choisi parmi les colles de tous types, les ciments, les matériaux fusibles, les sols- gels. The binder used for the components is for example a material chosen from adhesives of all types, cements, fusible materials, sols.

La face de connexion peut être équipée de bornes de connexion pour relier le microsystème, ou tout au moins certains composants de celui-ci, à des dispositifs extérieurs. Elle peut également être équipée de lignes ou pistes d'interconnexion entre différents composants faisant partie du même microsystème. The connection face can be equipped with connection terminals to connect the microsystem, or at least some components thereof, to external devices. It can also be equipped with interconnecting lines or tracks between different components forming part of the same microsystem.

Les moyens de connexion peuvent être moyens électriques, tels que des plots, des bornes, des bossages conducteurs, des pistes conductrices etc..., ou des moyens optiques tels que des fibres, des guides, des miroirs, etc... The connection means may be electrical means, such as pads, terminals, conductive bosses, conductive tracks, etc., or optical means such as fibers, guides, mirrors, etc.

Les composants peuvent être encapsules par le liant. Celui-ci recouvre alors également leur face opposée à la face de connexion. Cette face peut toutefois comporter aussi des moyens de connexion tels que ceux mentionnés ci-dessus pour relier des composants sensiblement de même épaisseur. The components may be encapsulated by the binder. This then also covers their opposite side to the connection face. This face may, however, also include connecting means such as those mentioned above for connecting components of substantially the same thickness.

Le microsystème peut inclure des composants très variés, fonctionnant selon des principes physiques differents. Par exemple, les composants peuvent être choisis parmi des composants de type diode de puissance, transistor de puissance, circuit intégré logique, circuit intégré analogique, résistance, self, capacité, résonateur, photodétecteur, diode électroluminescente, diode laser, micro-miroir, guide optique, composant optique intégré, micro-capteur, micro- actionneur, composant à onde acoustique filtre, gyromètre, composant magnétique, micro-transformateur, tête d'écriture et composant factice. Le rôle de composants factices est décrit dans la suite du texte. The microsystem can include a wide variety of components, operating on different physical principles. For example, the components may be selected from power diode components, power transistor, logic integrated circuit, analog integrated circuit, resistor, inductor, capacitance, resonator, photodetector, light emitting diode, laser diode, micro-mirror, guide optical, integrated optical component, micro-sensor, micro-actuator, filter acoustic wave component, gyrometer, magnetic component, micro-transformer, writing head and dummy component. The role of dummy components is described later in the text.

L'invention a également pour but de proposer un exemple de procédé d'assemblage de composants differents pour former des microsystèmes monolithiques. The invention also aims to provide an example of a method of assembling different components to form monolithic microsystems.

Un but est en particulier de proposer un tel procédé qui ne fasse pas appel à une technique d'hybridation telle qu'évoquée ci-dessus. (Ceci n'exclut toutefois pas la mise en oeuvre d'une technique d'hybridation pour interconnecter le microsystème monolithique finalement obtenu avec d'autres composants). One aim is in particular to propose such a method that does not use a hybridization technique as mentioned above. (However, this does not exclude the use of a hybridization technique to interconnect the monolithic microsystem finally obtained with other components).

Un but est encore de proposer un procédé et ses variantes permettant de réaliser simultanément plusieurs microsystèmes. A goal is still to propose a method and its variants for simultaneously making several microsystems.

Un but de l'invention est aussi de proposer un procédé permettant la réalisation de connexions sur une face plane et lisse. An object of the invention is also to provide a method for making connections on a flat and smooth face.

Un but est encore de proposer un procédé permettant de reconstituer un élément semblable à plaque et répondant à un standard de fabrication de la microelectronique (NORMES SEMI) pour être compatible avec chaînes de machines conçues pour ce standard. Another aim is to propose a method for reconstituting a plate-like element meeting a standard of manufacture of microelectronics (NORMES SEMI) to be compatible with machine chains designed for this standard.

Pour atteindre ces buts, l'invention a plus précisément pour objet un procédé de fabrication d'un microsystème monolithique à mosaïque de composants comprenant les étapes suivantes a) la mise en place de composants présentant une face de connexion, sur un substrat de support, de façon à les mettre en contact la face de connexion de chaque composant avec une couche adhésive dudit substrat de support, b) la solidarisation mutuelle des composants disposés sur le substrat de support, pour former au moins un système monolithique de composants, c) la séparation de la structure monolithique d'avec substrat de support de façon à libérer une face lisse de connexion du système monolithique lequel affleurent les faces de connexion des composants On entend par solidarisation mutuelle des composants, solidarisation de chaque composant au moins avec les composants les plus proches voisins. La solidarisation est destinée à créer une cohésion de l'ensemble des composants qui soit suffisante pour autoriser le retrait du substrat de support. To achieve these aims, the invention more precisely relates to a method of manufacturing a component mosaic monolithic microsystem comprising the following steps a) the introduction of components having a connection face, on a support substrate, in order to bring them into contact with the connection face of each component with an adhesive layer of said support substrate, b) mutual bonding of the components arranged on the support substrate, to form at least one monolithic system of components, c) the separation of the monolithic structure from the support substrate so as to release a smooth connecting face of the monolithic system which is flush with the connection faces of the components. The expression "mutual joining of the components" is understood to mean joining each component at least to the most important components. close neighbors. The bonding is intended to create a cohesion of all components that is sufficient to allow the withdrawal of the support substrate.

Outre la possibilité d'associer de façon intégrée des composants très disparates, le procédé de l'invention offre la possibilité d'effectuer un tri des composants avant leur assemblage pour éliminer les composants défectueux. Le rendement de fabrication des microsystèmes peut donc être très élevé avec des coûts et des pertes réduits. In addition to the possibility of integrating very disparate components in an integrated manner, the method of the invention offers the possibility of sorting the components before assembly to eliminate the defective components. The microsystems manufacturing efficiency can therefore be very high with reduced costs and losses.

Au terme du procédé, le substrat de support peut être réutilisé pour la fabrication de nouveaux microsystèmes. At the end of the process, the support substrate can be reused for the manufacture of new microsystems.

Il convient de préciser que le même substrat de support peut être utilisé pour la formation concomitante plusieurs microsystèmes monolithiques. It should be noted that the same support substrate can be used for the concomitant formation of several monolithic microsystems.

Après la séparation, les composants peuvent être électriquement ou optiquement interconnectés entre eux, et équipes des bornes de connexion, pour les connecter à d'autres composants extérieurs au microsystème. After separation, the components can be electrically or optically interconnected with each other, and connected to the connection terminals, to connect them to other components outside the microsystem.

En particulier, le procédé peut être complété par la formation de connexions entre composants sur la face de connexion du système monolithique. In particular, the method can be supplemented by the formation of connections between components on the connection face of the monolithic system.

Cette opération peut comporter, par exemple les étapes suivantes - la réalisation d'ouvertures dans une couche de passivation préalablement formée sur la face de connexion des composants, les ouvertures coïncidant avec des bornes de connexion des composants la formation de pistes conductrices entre lesdits plots de connexion selon un schéma câblage déterminé, la formation des pistes ayant lieu par dépôt et mise en forme d'au moins couche métallique. This operation may include, for example the following steps - the making of openings in a passivation layer previously formed on the connection face of the components, the openings coinciding with the connection terminals of the components forming conductive tracks between said pads of connection according to a specific wiring diagram, the formation of the tracks taking place by deposition and shaping of at least one metal layer.

De telles connexions sont destinées en particulier à relier électriquement les composants entre eux. Such connections are intended in particular to electrically connect the components together.

Les composants du microsystème peuvent également être reliés électriquement à des composants extérieurs, par exemple, par hybridation du microsystème avec un support de connexion. Dans ce cas, le procédé peut comporter en outre la formation de bossages de matériau fusible sur les plots connexion et/ou les pistes conductrices. The components of the microsystem can also be electrically connected to external components, for example, by hybridization of the microsystem with a connection medium. In this case, the method may further comprise the formation of bosses of fusible material on the connection pads and / or the conductive tracks.

Lorsque le microsystème comprend un ou plusieurs composants formant source ou récepteur de lumière, le procédé peut inclure la formation d'interconnexions optiques. Celles-ci peuvent remplacer s'ajouter aux connexions électriques. When the microsystem comprises one or more source or light-receiving components, the method may include the formation of optical interconnects. These can replace the electrical connections.

Les interconnexions optiques comportent, par exemple, un guide optique ou un élément de couplage optique tel qu'un miroir, un prisme ou un réseau de formes choisies pour l'application. The optical interconnections comprise, for example, an optical guide or an optical coupling element such as a mirror, a prism or a network of shapes chosen for the application.

I1 convient de préciser que les interconnexions électriques ou optiques peuvent avoir lieu sur une seule face des composants, mais aussi sur deux faces opposées des composants. It should be noted that the electrical or optical interconnections can take place on one side of the components, but also on two opposite sides of the components.

Avant l'étape a) de mise en place des composants, le procédé de l'invention peut comporter l'une opérations suivantes - la formation sur le substrat de support d'une couche de cire fine, la couche étant maintenue lors de l'étape a) à une température à laquelle la cire est dans état poisseux, - la mise en place sur le substrat de support d'une couche autocollante. Before step a) of placing the components, the method of the invention may comprise one of the following operations: - the formation on the support substrate of a layer of fine wax, the layer being maintained during the step a) at a temperature at which the wax is in a sticky state, - placing on the support substrate a self-adhesive layer.

entend par état poisseux de la couche de cire, un état intermédiaire entre l'état liquide dans lequel les composants ne seraient pas maintenus et l'état solide dans lequel la fixation composants deviendrait difficile, voire impossible. By tacky state of the wax layer is meant an intermediate state between the liquid state in which the components would not be maintained and the solid state in which the fixing components would become difficult or impossible.

L'utilisation d'une fine pellicule de cire est très avantageuse car elle permet, en faisant légèrement varier la température de travail, de modifier les conditions de maintien des composants. The use of a thin film of wax is very advantageous because it makes it possible, by slightly varying the working temperature, to modify the conditions for holding the components.

Dans l'état poisseux, les composants peuvent être mis en place et sont maintenus sur substrat de support. Dans l'état solide, les composants préalablement mis en place sont maintenus plus fermement de façon à empêcher tout déplacement intempestif. Ceci permet de poursuivre le procédé en préservant avec plus de sécurité le motif d'emplacement des composants. Enfin, dans l'état liquide de la cire il est possible de détacher, sensiblement sans effort, le microsystème du substrat de support. Le substrat de support peut aussi être équipé d une couche adhésive telle qu'un film de matiere plastique autocollant à température ambiante. In the sticky state, the components can be put in place and held on a support substrate. In the solid state, previously installed components are held more firmly to prevent inadvertent movement. This makes it possible to continue the process while preserving more securely the location pattern of the components. Finally, in the liquid state of the wax it is possible to detach, substantially effortlessly, the microsystem of the support substrate. The support substrate may also be provided with an adhesive layer such as a self-adhesive plastic film at room temperature.

Selon que la couche adhésive est une pellicule cire ou un film de matière plastique autocollant, l'étape c) du procédé peut comporter soit la fusion de la cire, soit le décollement du film autocollant. Depending on whether the adhesive layer is a wax film or a self-adhesive plastic film, step c) of the process may comprise either melting of the wax or peeling of the self-adhesive film.

Le décollement du film autocollant peut avoir lieu de préférence au moyen d'une fine fente sous ou solvant entre le film et le substrat de support et/ou entre le film et le système monolithique, pour neutraliser le collage. La fente sous eau permet limiter les contraintes sur le système monolithique. The detachment of the self-adhesive film may preferably take place by means of a fine slot under or between the film and the support substrate and / or between the film and the monolithic system, to neutralize the bonding. The slot under water allows to limit the constraints on the monolithic system.

Selon une mise en oeuvre particulière du procédé de l'invention, celui-ci peut comporter la mise en place sur le substrat de travail d'un cadre définissant sur la couche adhésive une zone de réception des composants. Le cadre présente de préférence une épaisseur supérieure ou égale à 1 épaisseur maximum des composants pour assurer une protection mécanique de ceux-ci. According to a particular implementation of the method of the invention, it may include the establishment on the working substrate of a frame defining on the adhesive layer a component receiving zone. The frame preferably has a thickness greater than or equal to 1 maximum thickness of the components to provide mechanical protection thereof.

Le cadre fixe de taille du microsystème monolithique pendant la réalisation et ses dimensions peuvent être déterminées, par exemple, en fonction des capacités de préhension de machines destinées à la réalisation des connexions et des passivations des microsystèmes. The fixed size frame of the monolithic microsystem during the production and its dimensions can be determined, for example, according to the gripping capacities of machines intended for making the connections and the passivations of the microsystems.

Le nombre de composants mis en place dans le cadre peut être choisi de préférence de telle façon que la zone qu'il définit soit comblée de manière sensiblement uniforme, à l'instar d'une mosaïque dont les composants constitueraient les abacules. The number of components placed in the frame can be chosen preferably such that the area it defines is filled in a substantially uniform manner, like a mosaic whose components would constitute the abacules.

A cet effet, le système de composants peut comporter ou plusieurs composants factices. Les composants factices ont alors une fonction 'espaceur, de remplissage et de rigidité. For this purpose, the component system may include one or more dummy components. The dummy components then have a function of spacing, filling and rigidity.

Apres la mise en place des composants sur le substrat de support, ceux-ci sont solidarisés, par exemple au moyen d'un liant. Le liant est en place de façon à remplir les interstices entre composants et relier ainsi les composants par leur tranche.  After placing the components on the support substrate, they are secured, for example by means of a binder. The binder is in place to fill the interstices between components and thus connect the components by their edge.

Le liant peut aussi noyer et/ou recouvrir les composants de façon à les encapsuler. The binder may also embed and / or cover the components to encapsulate them.

Dans ce dernier cas, le liant peut etre rendu plan et lisse et constituer une face superficielle du microsystème monolithique. In the latter case, the binder can be made flat and smooth and constitute a superficial surface of the monolithic microsystem.

Après avoir rendu solidaires les composants, et après le décollement du microsystème ou d' mosaïque de microsystèmes, les interconnexions peuvent être formées en utilisant avantageusement la face lisse. After making the components integral, and after detachment of the microsystem or mosaic of microsystems, the interconnections can be formed by advantageously using the smooth face.

Après réalisation des interconnexions, le microsystème peut être découpé pour atteindre sa taille finale et, dans le cas d'une mosaïque de microsystèmes identiques, elle peut être découpée pour en séparer les éléments. After realization of the interconnections, the microsystem can be cut to reach its final size and, in the case of a mosaic of identical microsystems, it can be cut to separate the elements.

L'invention concerne également le microsystème en tant que tel, comprenant une mosaïque de composants maintenus par un liant, de façon à former une structure monolithique, et comprenant un réseau d'interconnexion des composants ménagé sur au moins l'une de ses faces. D'autres caractéristiques et avantages de l'invention ressortiront mieux de la description qui va suivre, en référence aux figures des dessins annexés. Cette description est donnée à titre purement illustratif et non limitatif. The invention also relates to the microsystem itself, comprising a mosaic of components held by a binder, so as to form a monolithic structure, and comprising an interconnection network components arranged on at least one of its faces. Other features and advantages of the invention will become more apparent from the description which follows, with reference to the figures of the accompanying drawings. This description is given for purely illustrative and non-limiting purposes.

<U>Brève description des figures</U> - La figure 1 est une coupe schématique simplifiée d'un substrat de support pour la mise en oeuvre du procédé de l'invention et illustre des opérations de préparation dudit substrat, - la figure 2 est une coupe schématique simplifiée du substrat de la figure 1 équipe de composants, - les figures 3A et 3B illustrent, sous la forme de coupes schématiques, différentes possibilités de solidarisation des composants pour former des microsystemes monolithiques, - la figure 4 illustre, sous la forme de coupe schématique, la séparation du substrat de support d'un microsysteme monolithique conforme à la figure 3A, - la figure 5 est une coupe schématique d'un microsystème monolithique conforme à la figure et illustre la formation d'interconnexions optiques sur celui-ci, - la figure 6 est une coupe schématique 'un microsystème monolithique conforme à la figue 3B et illustre la formation d'interconnexions électriques sur celui-ci, - la figure 7 montre en coupe schématique plusieurs microsystèmes monolithiques après découpe. <U>Description détaillée de modes de mise en oeuvre de</U> <U>l'invention</U> figure 1 montre une plaque verre 100 à faces planes, dont l'une des faces est recouverte d'un film plastique autocollant 102. La plaque de verre ainsi préparée sert de substrat de support pour la mise en oeuvre du procédé de fabrication d' microsystème monolithique. Elle présente à cet effet une épaisseur suffisante pour garantir la rigidité et la solidité nécessaires aux traitements ultérieurs. La plaque de verre peut être remplacée en une plaque d'un autre matériau tel que de la céramique ou du métal, par exemple. BRIEF DESCRIPTION OF THE FIGURES FIG. 1 is a simplified schematic section of a support substrate for carrying out the method of the invention and illustrates operations for preparing said substrate, FIG. 2 is a schematic simplified section of the substrate of Figure 1 team components, - Figures 3A and 3B illustrate, in the form of schematic sections, different possibilities of joining the components to form monolithic microsystems, - Figure 4 illustrates, under the FIG. 5 is a diagrammatic sectional view of a monolithic microsystem according to FIG. FIG. 6 is a diagrammatic section of a monolithic microsystem according to FIG. 3B and illustrates the formation of electrical interconnections on FIG. this, - Figure 7 shows in schematic section several monolithic microsystems after cutting. <U> Detailed Description of Modes of Implementation of </ U> <U> the Invention </ U> FIG. 1 shows a flat-faced glass plate 100, one of whose faces is covered with a plastic film The glass plate thus prepared serves as a support substrate for the implementation of the method for manufacturing a monolithic microsystem. It has for this purpose a sufficient thickness to ensure the rigidity and strength required for subsequent treatments. The glass plate can be replaced into a plate of another material such as ceramic or metal, for example.

Comme indiqué précédemment, le film autocollant peut être remplacé par une pellicule de cire maintenue dans un état poisseux. As indicated above, the self-adhesive film may be replaced by a wax film held in a tacky state.

La référence 104 désigne un cadre par exemple en silicium, en verre ou en métal, disposé sur le substrat de support. Le cadre 104 a pour fonction de délimiter sur le substrat de support une zone de mise en place de composants. I1 est plus petit et coïncide à cet effet avec une région du substrat équipée du film autocollant. Reference 104 designates a frame, for example made of silicon, glass or metal, arranged on the support substrate. The function of the frame 104 is to delimit on the support substrate a zone for placing components. It is smaller and coincides for this purpose with a region of the substrate equipped with the self-adhesive film.

Le cadre fixe par ailleurs les dimensions extérieures du microsystème monolithique finalement obtenu, dans lequel il peut être intégré. Pour assurer également une protection des composants, l'épaisseur du cadre est choisie préférentiellement supérieur ou égale à celle des composants. La figure 2 montre la mise place de differents types de composants sur le support 100, dans la zone définie par le cadre 104. Dans l'exemple de la figure 2 les composants sont disposés façon à préserver entre eux des interstices. The frame also sets the external dimensions of the monolithic microsystem finally obtained, in which it can be integrated. To also provide protection of the components, the thickness of the frame is preferably chosen to be greater than or equal to that of the components. Figure 2 shows the placing of different types of components on the support 100, in the area defined by the frame 104. In the example of Figure 2 the components are arranged to preserve interstices between them.

Parmi les composants mis en place, on distingue des composants fonctionnels 106a qui sont susceptibles de participer au fonctionnement du microsystème finalement obtenu, et des composants factices 106b. Les composants factices 106b participent simplement à la rigidité du microsystème et permettent de paver entierement la zone définie par le cadre. Among the components put in place, there are functional components 106a which are likely to participate in the operation of the microsystem finally obtained, and dummy components 106b. The dummy components 106b simply contribute to the rigidity of the microsystem and allow the area defined by the frame to be completely paved.

Les composants fonctionnels 106a présentent sur au moins l'une de leurs faces des bornes de connexion électriques ou optiques. Ces bornes ne sont pas représentées sur les figures pour des raisons de clarté. Les composants sont reportés sur substrat de support de telle façon que la face 107 comportant les bornes, dite face de connexion, se trouve en contact avec le film autocollant 102. The functional components 106a have on at least one of their faces electrical or optical connection terminals. These terminals are not shown in the figures for the sake of clarity. The components are carried on a support substrate in such a way that the face 107 comprising the terminals, called the connection face, is in contact with the self-adhesive film 102.

La face de connexion des composants est préférentiellement passivée avant leur report sur le substrat de support. Elle peut également être recouverte d'une résine sacrificielle pour faciliter le nettoyage ultérieur. The connection face of the components is preferably passivated before being transferred to the support substrate. It can also be covered with a sacrificial resin to facilitate subsequent cleaning.

Les composants peuvent aussi comporter des bornes de connexion sur une face opposée a face de connexion, qui n'est donc pas en contact avec le film autocollant. The components may also include connection terminals on a face opposite a connection face, which is therefore not in contact with the self-adhesive film.

La figure 3A montre la solidarisation des composants pour former un système monolithique 110 sous la forme d'une mosaïque de composants. La solidarisation est réalisée au moyen d'une colle qui sert de liant et qui vient combler les interstices existant entre les composants. La colle peut être remplacée par un autre liant capable de combler interstices, tels que par exemple un sol-gel ou ciment. Dans cet exemple, la face libre des composants c est-à-dire leur face opposée à la face de connexion reste à nu pour garantir une bonne dissipation thermique. Figure 3A shows the joining of the components to form a monolithic system 110 in the form of a mosaic of components. Bonding is achieved by means of an adhesive which serves as a binder and which fills the gaps between the components. The glue can be replaced by another binder capable of filling interstices, such as for example a sol-gel or cement. In this example, the free face of the components that is to say their face opposite to the connection face remains bare to ensure good heat dissipation.

Dans l'exemple de la figure 3B, qui constitue variante par rapport à la figure 3A, une couche liant 108 vient noyer les composants. Son épaisseur est égale (ou supérieure) à celle des composants les plus épais et elle recouvre entièrement les composants moins épais. La couche de liant 108 (colle par exemple) sert ainsi de couche d'encapsulation. In the example of Figure 3B, which is a variant with respect to Figure 3A, a binder layer 108 comes to embed the components. Its thickness is equal to (or greater than) the thickest components and it completely covers the thinner components. The binder layer 108 (for example glue) thus serves as an encapsulation layer.

La couche d'encapsulation présente l'avantage de gommer les inégalités de taille des composants. Elle confère au composant une surface plane et lisse favorable à une intégration ultérieure du systeme monolithique 110. The encapsulation layer has the advantage of erasing the size inequalities of the components. It gives the component a flat and smooth surface favorable to further integration of the monolithic system 110.

La figure 4 montre une opération de décollement système monolithique 110 formé par les composants rendus solidaires. Figure 4 shows a monolithic system detachment operation 110 formed by the components made integral.

Le décollement, opéré après séchage du liant ou la colle, est indiqué par des flèches D sur la figure. Le décollement peut être obtenu au moyen d' fente sous eau, neutralisant temporairement le collage du film autocollant. Le décollement permet de libérer le système monolithique du substrat de support et de débarrasser du film autocollant. On observe que, dans l'exemple illustré, le cadre 104 maintenu par le liant reste solidaire des composants lors de cette opération. The detachment, performed after drying of the binder or glue, is indicated by arrows D in the figure. The peeling can be obtained by means of a slot under water, temporarily neutralizing the sticking of the self - adhesive film. The detachment releases the monolithic system from the support substrate and rids the self-adhesive film. It is observed that, in the illustrated example, the frame 104 held by the binder remains integral with the components during this operation.

liant assure à ce moment la cohésion de la structure. binder ensures at this moment the cohesion of the structure.

Dans le cas où la couche adhésive est formée une pellicule de cire, le décollement peut être provoqué par une fusion de la cire suivie eventuellement d'un rinçage ou d'un nettoyage aux solvants. In the case where the adhesive layer is formed a film of wax, the peeling may be caused by a melting of the wax optionally followed by rinsing or cleaning with solvents.

Après le décollement du substrat de support, la colle utilisée comme liant pour les composants peut subir une vitrification pour en améliorer la résistance mécanique ou chimique. After detaching the support substrate, the glue used as a binder for the components may undergo vitrification to improve its mechanical or chemical resistance.

La figure 5 montre la formation 'interconnexions optiques entre différents composants d'un système monolithique 110 conforme à la figure Les interconnexions optiques, repérées de façon générale avec la référence 112 peuvent comporter guides optiques ou des éléments de couplage optique. Les guides optiques peuvent être formés par dépôt sur une face de connexion 114 du système monolithique, d'un ensemble de couches de matériaux transparents tels que de la silice (à basse température) ou des polymères. On entend par face de connexion 114 du système monolithique la face libérée par le décollement, qui comprend les faces de connexion des composants individuels. Les éléments de couplage optique, tels que des miroirs des prismes, peuvent être formés selon des techniques connues de dépôt et de gravure des matériaux déposés. FIG. 5 shows the formation of optical interconnections between different components of a monolithic system 110 in accordance with FIG. The optical interconnections, generally identified with the reference 112, may comprise optical guides or optical coupling elements. The optical guides may be formed by depositing on a connection face 114 of the monolithic system, a set of layers of transparent materials such as silica (at low temperature) or polymers. By connecting face 114 of the monolithic system is meant the face released by the detachment, which comprises the connection faces of the individual components. Optical coupling elements, such as prism mirrors, can be formed according to known techniques for depositing and etching deposited materials.

titre d'alternative, la figure 6 montre la réalisation de connexions électriques entre des composants d'un système monolithique 110 conforme à la figure La réalisation des connexions comprend dans l'exemple illustré - l'ouverture d'une couche de passivation représentée) des composants pour libérer leurs bornes de connexion, - le dépôt sous vide d'une couche métallique connexion et la gravure de la couche selon un motif de câblage pour définir des pistes d'interconnexion 116 reliant les bornes selon un schéma de câblage, - le dépot d'une nouvelle couche de passivation représentée), - l'ouverture de la nouvelle couche de passivation pour libérer des plages de contact déterminées sur la couche métallique mise en forme, - la formation de bossages de matériau fusible 118 ces plages. As an alternative, FIG. 6 shows the making of electrical connections between components of a monolithic system 110 according to the figure. The embodiment of the connections comprises, in the illustrated example - the opening of a passivation layer represented). components for releasing their connection terminals, - the vacuum deposition of a metal connection layer and the etching of the layer in a wiring pattern to define interconnection tracks 116 connecting the terminals according to a wiring diagram, - the deposit a new passivation layer shown), - the opening of the new passivation layer to release specific contact pads on the shaped metal layer, - the formation of fusible material bosses 118 these ranges.

bossages de matériau fusible constituent des bornes de connexion et peuvent servir pour report du système monolithique une fois découpé sur une carte de circuit imprimé. Elles peuvent également servir à l'hybridation du système monolithique une fois découpé avec d'autres systèmes ou composants. bosses of fusible material constitute connection terminals and can be used to carry the monolithic system once cut on a printed circuit board. They can also be used to hybridize the monolithic system once cut with other systems or components.

Il convient de préciser que d'autres techniques connues d'interconnexion telles que les techniques de brasure, ou d'eutectique peuvent également être utilisées pour relier électriquement les composants à des équipements extérieurs. It should be noted that other known interconnection techniques such as brazing or eutectic techniques can also be used to electrically connect the components to external equipment.

Il convient de préciser en outre qu'un même microsystème monolithique peut comporter à la fois des interconnexions électriques et optiques. It should be further specified that the same monolithic microsystem may include both electrical and optical interconnections.

Après la formation d'interconnexions électriques et/ou optiques une encapsulation des composants peut encore être effectuée. After the formation of electrical and / or optical interconnections encapsulation of the components can still be performed.

La figure 7 montre une étape supplémentaire possible qui consiste à effectuer un découpage de la mosaïque perpendiculairement à sa face de connexion, de façon à séparer des blocs de plus petite taille 120 qui incluent chacun une pluralité de composants. Figure 7 shows a possible additional step of cutting the mosaic perpendicular to its connecting face, so as to separate smaller blocks 120 which each include a plurality of components.

I1 est ainsi possible de traiter collectivement les étapes du procédé pour la fabrication d'un grand nombre de systèmes monolithiques et en réduire ainsi le coût de production.It is thus possible to process the process steps collectively for the production of a large number of monolithic systems and thus reduce the cost of production.

Claims (2)

REVENDICATIONS 1. Microsystème monolithique comprenant une pluralite de composants (106a, 106b), présentant chacun au moins une face (107), dite de connexion, et une tranche, caractérisé en ce que - composants sont reliés par un liant (108 contact avec leurs tranches, - les faces de connexion des composants sont coplanaires de façon à former une surface plane (114), dite face de connexion du système monolithique.A monolithic microsystem comprising a plurality of components (106a, 106b), each having at least one (107) so-called connecting face, and a wafer, characterized in that - components are connected by a binder (108 contact with their slices) the connecting faces of the components are coplanar so as to form a plane surface (114), called the connection face of the monolithic system. 2. Microsystème selon la revendication 1, dans lequel la face de connexion du microsystème est équipée de moyens de connexion électrique (116, 118) et/ou optique (112). . Microsystème selon la revendication 2, dans lequel moyens de connexion comportent des bornes connexion (118), destinées à la connexion microsystème à des dispositifs extérieurs à celui et/ou des lignes d'interconnexion (112, 116) entre différents composants du microsystème. 4. Microsystème selon la revendication 2, comprenant des composants pourvus, en outre, de moyens de connexion sur une face opposée à la face de connexion. 5. Microsystème selon la revendication 1, dans lequel le liant recouvre une face des composants opposée à leur face de connexion. 6. Microsystème selon la revendication 1, dans lequel les composants sont choisis parmi des composants de type diode, diode de puissance, transistor, transistor de puissance, circuit intégré logique, circuit intégré analytique, résistance, inductance, condensateur, résonateur, photodétecteur, diode électroluminescente, diode laser, micro-miroir, guide optique, composant optique intégré, micro-capteur, micro- actionneur, composant à onde acoustique, filtre, gyromètre, composant magnétique, micro-transformateur, tête d'écriture et composant factice. 7. Microsystème selon la revendication 1, comprenant en outre un cadre, entourant les composants et affleurant la surface de connexion du microsystème. 8. Procédé de fabrication d'un microsystème monolithique à mosaïque de composants comprenant les étapes suivantes a) la mise en place de composants (106a, 106b) présentant une face de connexion, sur un substrat de support, de façon à les mettre en contact la face de connexion de chaque composant avec une couche adhésive (102) dudit substrat de support, b) la solidarisation mutuelle des composants disposés sur le substrat de support pour former moins un système monolithique (110) de composants c) la séparation de la structure monolithique (110) d'avec le substrat de support (100) façon à libérer une face de connexion (114) du système monolithique sur lequel affleurent les faces de connexion des composants. 9. Procédé selon la revendication 8, comprenant en outre, après l'étape c), la formation de connexions (116, 112) entre composants sur la face de connexion (114) du système monolithique. 10. Procédé selon la revendication 8, comprenant, avant l'étape a), une préparation du substrat de support, la préparation comportant l'une des opérations suivantes pour la formation de la couche adhésive (102).: - la mise en place sur le substrat de support d'une couche de cire fine, la couche étant maintenue lors de l'étape a) à une température à laquelle la cire est dans un état poisseux, - la mise en place sur le substrat de support d'une couche autocollante. 11. Procédé selon la revendication 10, comprenant respectivement lors de l'étape c , l'une des opérations suivantes - la fusion de la couche de cire, - le decollement de la couche autocollante. 12. Procédé selon la revendication 8, comprenant en outre avant l'étape a), la mise en place sur le substrat de travail d'un cadre (104) définissant sur la couche adhésive une zone de réception des composants. 13. Procédé selon la revendication 12, dans lequel cadre (104) présente une épaisseur supérieure ou égale à une épaisseur maximum des composants. 14. Procédé selon la revendication 12, dans lequel le cadre présente des dimensions adaptées à une manipulation du système monolithique par machine, le cadre étant entièrement pavé de composants 15. Procédé selon la revendication 8, comprenant la mise en place sûr le substrat support de composants fonctionnels (106a) et composants factices (106b). 16. Procédé selon la revendication 8, dans lequel des interstices sont ménagés entre les composants lors de leur mise en place le substrat support et dans lequel l'étape b) comporte le remplissage des interstices avec un liant. 17. Procédé selon la revendication 8, dans lequel lors de l'étape b), on noie les composants dans liant (108) de façon à les encapsuler et à former face libre plane. 18. Procédé selon la revendication 9, dans lequel l'étape de formation de connexions comprend les operations suivantes - réalisation d'ouvertures dans une couche de passivation préalablement formée sur la face de connexion des composants, les ouvertures coïncident avec des bornes de connexion des composants, - formation de pistes conductrices (116) entre lesdites bornes de connexion selon un schéma de câblage déterminé, par dépôt et mise en forme d'au moins une couche métallique. 19. Procédé selon la revendication 15, comprenant en outre la formation de bossages (118) de matériau fusible sur les bornes de connexion et/ou les pistes conductrices. 20. Procédé selon la revendication 9, comportant la formation d'interconnexions optiques (112). 21. Procédé selon la revendication 20, dans lequel les interconnexions optiques comportent au moins un guide optique et/ou au moins un élément de couplage optique. 22. Procedé selon la revendication 8, comprenant en outre, avant ou après l'étape c), le découpage de la structure monolithique pour individualiser groupes de composants (120).2. Microsystem according to claim 1, wherein the connecting face of the microsystem is equipped with electrical connection means (116, 118) and / or optical (112). . Microsystem according to claim 2, wherein the connection means comprise connection terminals (118) intended for the microsystem connection to devices external to that and / or interconnection lines (112, 116) between different components of the microsystem. 4. Microsystem according to claim 2, comprising components further provided with connection means on a face opposite to the connection face. 5. Microsystem according to claim 1, wherein the binder covers a face of the components opposite their connection face. The microsystem according to claim 1, wherein the components are selected from diode, power diode, transistor, power transistor, logic integrated circuit, analytic integrated circuit, resistor, inductor, capacitor, resonator, photodetector, diode components. electroluminescent, laser diode, micro-mirror, optical guide, integrated optical component, micro-sensor, micro-actuator, acoustic wave component, filter, gyrometer, magnetic component, micro-transformer, writing head and dummy component. 7. Microsystem according to claim 1, further comprising a frame, surrounding the components and flush with the connection surface of the microsystem. A method of manufacturing a component mosaic monolithic microsystem comprising the steps of a) placing components (106a, 106b) having a connection face on a support substrate so as to bring them into contact with each other. the connecting face of each component with an adhesive layer (102) of said support substrate, b) the mutual joining of the components arranged on the support substrate to form less a monolithic system (110) of components c) the separation of the structure monolithic (110) with the support substrate (100) to release a connection face (114) of the monolithic system on which the connection faces of the components are flush. The method of claim 8, further comprising, after step c), forming connections (116, 112) between components on the connection face (114) of the monolithic system. The method according to claim 8, comprising, prior to step a), a preparation of the support substrate, the preparation comprising one of the following operations for the formation of the adhesive layer (102): - setting up on the support substrate of a thin wax layer, the layer being maintained in step a) at a temperature at which the wax is in a sticky state, - placing on the support substrate a self-adhesive layer. 11. The method of claim 10, comprising respectively in step c, one of the following operations - the melting of the wax layer, - the detachment of the adhesive layer. The method of claim 8, further comprising prior to step a), placing on the working substrate a frame (104) defining on the adhesive layer a component receiving area. 13. The method of claim 12, wherein frame (104) has a thickness greater than or equal to a maximum thickness of the components. The method of claim 12, wherein the frame has dimensions suitable for monolithic machine manipulation by machine, the frame being fully paved with components. The method of claim 8 including securely positioning the support substrate of functional components (106a) and dummy components (106b). 16. The method of claim 8, wherein interstices are formed between the components during their establishment the support substrate and wherein step b) comprises filling the interstices with a binder. 17. The method of claim 8, wherein in step b), the components are embedded in binder (108) so as to encapsulate and form flat free face. 18. The method of claim 9, wherein the step of forming connections comprises the following operations - making openings in a passivation layer previously formed on the connection face of the components, the openings coincide with connection terminals of the components, - formation of conductive tracks (116) between said connection terminals according to a given wiring diagram, by deposition and shaping of at least one metal layer. The method of claim 15, further comprising forming bosses (118) of fusible material on the connection terminals and / or the conductive tracks. 20. The method of claim 9, comprising the formation of optical interconnections (112). 21. The method of claim 20, wherein the optical interconnections comprise at least one optical guide and / or at least one optical coupling element. The method of claim 8, further comprising, before or after step c), cutting the monolithic structure to individualize groups of components (120).
FR0008627A 2000-07-03 2000-07-03 Monolithic microsystem with mosaic of components and manufacturing method, for use in microelectronics Pending FR2809533A1 (en)

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