FR2704690A1 - A method of encapsulating semiconductor chips, device obtained by this method and application to the interconnection pads in three dimensions. - Google Patents

A method of encapsulating semiconductor chips, device obtained by this method and application to the interconnection pads in three dimensions. Download PDF

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Publication number
FR2704690A1
FR2704690A1 FR9304962A FR9304962A FR2704690A1 FR 2704690 A1 FR2704690 A1 FR 2704690A1 FR 9304962 A FR9304962 A FR 9304962A FR 9304962 A FR9304962 A FR 9304962A FR 2704690 A1 FR2704690 A1 FR 2704690A1
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pellets
conductors
characterized
material
method
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FR2704690B1 (en )
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Val Christian
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Thales SA
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Thales SA
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    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4824Pads with extended contours, e.g. grid structure, branch structure, finger structure
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    • H01L24/96Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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Abstract

Selon le procédé de l'invention, on câble des fils conducteurs directement sur une rondelle semi-conductrice portant un grand nombre de pastilles, on colle la rondelle sur un film élastique, on scie la rondelle pour individualiser les pastilles puis on étire le film de sorte à écarter les pastilles; According to the method of the invention, conductors son of one cable directly onto a semiconductor wafer carrying a large number of pellets, the washer is adhered on an elastic film, the washer is sawn to individualize the pellets and then stretching the film so as to separate the pellets; on solidarise ensuite l'ensemble des pastilles et des fils dans un matériau isolant, résine polymérisable par exemple, puis, après polissage, on réalise des dépôts métalliques au-dessus des fils de sorte à relier ceux-ci aux côtés des pastilles; then secures all pellets and son in an insulating material, polymerizable resin, for example, then, after polishing, is carried out of metal deposits over the son so as to connect them to the sides of the pellets; on découpe ensuite l'ensemble de façon à séparer les pastilles. then cutting the assembly so as to separate the pellets.

Description

PROCEDE D'ENCAPSULATION DE PASTILLES SEMI-CONDUCTRICES, METHOD FOR PACKAGING OF TABLETS SEMICONDUCTOR,
DISPOSITIF OBTENU PAR CE PROCEDE ET APPLICATION DEVICE OBTAINED BY THE METHOD AND APPLICATION
A L'INTERCONNEXION DE PASTILLES EN A CONNECTING TABLETS IN
TROIS DIMENSIONS THREE DIMENSIONS
La présente invention a pour objet un procédé d'encapsulation de pastilles semi-conductrices ainsi que le dispositif en résultant, chacune des pastilles contenant par exemple un composant électronique, un circuit intégré ou un capteur. The present invention relates to a method for encapsulating semiconductor chips as well as the resulting device, each pellet containing such an electronic component, an integrated circuit or a sensor. Elle a également pour objet l'application d'une telle encapsulation à l'interconnexion en trois dimensions de ces pastilles. It also relates to the application of such encapsulation interconnection in three dimensions of these pellets.

La réalisation des systèmes électroniques actuels, tant civils que militaires, doit tenir compte d'exigences de plus en plus grandes de compacité, du fait du nombre de plus en plus élevé de circuits mis en oeuvre. The achievement of current electronic systems, both civilian and military, must take into consideration requirements of ever greater compactness, since the number of increasingly higher circuits implemented.

En ce sens, il a déjà été proposé de réaliser des empilements de circuits intégrés dits "trois dimensions", comme par exemple décrit dans la demande de brevet français n" 2.670.323 au nom de THOMSON-CSF. Selon cette réalisation, les pastilles sont empilées après avoir été munies de fils de connexion orientés vers les faces latérales de l'empilement, puis elles sont rendues solidaires les unes des autres, à l'aide par exemple d'une résine; les interconnexions des pastilles sont ensuite réalisées sur les faces de l'empilement. In this sense, it has already been proposed to produce integrated circuit stacks called "three dimensions" such as described in French Patent Application No. "2,670,323 on behalf of Thomson-CSF. In this embodiment, the pellets are stacked after having been provided with son connection oriented side faces of the stack, and are then made integral with each other, using for example a resin; interconnections pellets are then conducted on faces of the stack.

La présente invention a pour but de modifier ce processus notamment pour en rendre la réalisation plus facilement intégrable dans une usine de semi-conducteurs et en diminuer le coût. The present invention aims to change this process in particular to make it more easily integrated realization in a semiconductor factory and reduce the cost.

Plus précisément, selon le procédé de l'invention, on câble des conducteurs, fils par exemple, directement sur une rondelle semiconductrice portant un grand nombre de pastilles; More specifically, according to the method of the invention, cable drivers, son for example, directly on a semiconductor wafer carrying a large number of pellets; la rondelle étant collée sur un film élastique, on scie la rondelle pour individualiser les pastilles puis on étire le film de sorte à écarter les pastilles; the washer being bonded to an elastic film, the washer is sawn to individualize the pellets and then the film was stretched so as to separate the pellets; on solidarise ensuite I'ensemble des pastilles et des fils dans un matériau isolant, résine polymérisable par exemple, puis, après polissage, on réalise des dépôts métalliques au-dessus des fils de sorte à relier ceux-ci aux côtés des pastilles; then is secured I'ensemble pastilles and son in an insulating material, polymerizable resin, for example, then, after polishing, is carried out of metal deposits over the son so as to connect them to the sides of the pellets; on découpe ensuite l'ensemble de façon à séparer les pastilles: on obtient alors des pastilles encapsulées dans un enrobage formant boîtier, muni de connexions. then cutting the assembly so as to separate the pellets: are then obtained pellets encapsulated in a coating forming a casing, provided with connections. Pour une application "trois dimensions", on procède à l'empilement des boîtiers précédents, ceux-ci étant simplement collés entre eux à l'aide d'un intercalaire disposé entre chaque pastille et la suivante, puis les interconnexions sont réalisées sur les faces latérales de l'empilement ainsi obtenu, par exemple comme décrit dans la demande de brevet précitée. For application "three-dimensional", we proceed to the stack of the previous cases, the latter being simply glued together with a spacer disposed between each wafer and the next, then the interconnects are formed on the faces side of the stack thus obtained, e.g. as described in the aforementioned patent application.

D'autres objets, particularités et résultats de l'invention ressortiront de la description suivante, donnée à titre d'exemple et illustrée par les dessins annexés, qui représentent: Other objects, features and results of the invention will become apparent from the following description, given by way of example and illustrated by the accompanying drawings, which show:
- la figure 1, un mode de réalisation du procédé selon l'invention; - Figure 1 a process embodiment of the invention;
- les figures 2 à 4a et 5, différents schémas vus en coupe, illustrant différentes étapes du procédé selon l'invention; - Figures 2 to 4a and 5, the different patterns seen in section, illustrating different steps of the method according to the invention;
- la figure 4b, une vue de dessus du schéma de la figure 4a; - Figure 4b, a view of the diagram of Figure 4a;
- les figures 6 et 7, des vues en coupe schématiques de variantes de l'invention. - Figures 6 and 7 are diagrammatic sectional views of variants of the invention.

Sur ces différentes figures, les mêmes références se rapportent aux mêmes éléments. On these figures, the same references refer to the same elements. D'autre part, pour la clarté des dessins, I'échelle réelle n'a pas été respectée. Moreover, the clarity of the drawings, actual I'échelle was not respected.

La figure 1 représente donc un mode de réalisation du procédé selon l'invention. Figure 1 represents one embodiment of the method according to the invention.

La première étape, repérée 10, consiste à fixer (par exemple coller), sur un film élastique, une rondelle de matériau semi-conducteur (également connue sous le nom anglais de "wafer"), dans laquelle on a réalisé un grand nombre de pastilles (couramment de l'ordre de plusieurs centaines), contenant chacune un circuit intégré ou composant discret; The first step, referenced 10, is to attach (e.g., adhere) on an elastic film, a semiconductor material washer (also known under the English name of "wafer"), wherein a large number was carried out in pellets (commonly of the order of several hundreds), each containing an integrated circuit or discrete component; le film est par exemple un auto-adhésif de type polymère. the film is for example a polymer-type self-adhesive.

La deuxième étape, repérée 11, consiste à câbler des conducteurs électriques, fils ou rubans, sur chacun des plots de connexion de chacune des pastilles contenues dans la rondelle. The second step, referenced 11, is to wire electrical conductors, son or ribbons, each of the bonding pads of each of the pellets contained in the washer.

Le résultat de ces opérations est illustré sur la figure 2. The result of these operations is shown in Figure 2.

Sur cette dernière figure, on a représenté une rondelle semiconductrice 1 dans laquelle on a identifié une pastille 21. La rondelle 1 est montée sur le film élastique, repéré 2. Sur chacun des plots, repérés 22, de la rondelle 1 sont connectés des conducteurs 23, par exemple des fils. In the latter figure, a wafer 21. The washer 1 is mounted on the elastic film shows a semiconductor wafer 1 in which it was identified, spotted 2. On each of the pads, referenced 22, of the washer 1 are connected conductors 23, for example son.

Ceux-ci peuvent être connectés verticalement à l'aide de la technique dite "ball bonding" et consistant à faire fondre l'extrémité du fil 23 pour obtenir une petite boule 24, facilitant sa connexion sur le plot 22. D'autres techniques peuvent être employées, comme illustré par exemple ci-après figure 7. Après leur fixation, les fils 23 sont coupés chacun à une hauteur prédéterminée, qui peut être par exemple de 150 à 200 pm, pour un diamètre de fil d'environ 25 à 30 pm, une épaisseur de rondelle de l'ordre de 500 pm et de film 2 de l'ordre de 200 pm, par exemple. These may be connected vertically by means of the technique known as "ball bonding" and of melting the end of the wire 23 for a small ball 24, facilitating its connection to the pad 22. Other techniques may be employed, as illustrated by example below in Figure 7. after fixation, the son 23 are each cut at a predetermined height, which can be for example 150 to 200 microns, for a wire diameter of approximately 25-30 pm, a washer thickness of about 500 pm and film 2 of about 200 pm, for example.

L'étape suivante (12, figure1) consiste à scier la rondelle 2 de préférence sur toute son épaisseur, de sorte à individualiser les pastilles telles que 21. The next step (12, Figure 1) is to saw the washer 2 preferably over its entire thickness, so as to individualize the pellets such as 21.

L'étape suivante, repérée 13, consiste à étirer uniformément le film élastique (2); The next step, referenced 13, is to uniformly stretch the elastic film (2); cela a pour effet d'écarter les pastilles (21) les unes des autres et, ce, de façon régulière. this has the effect to spread the pellets (21) from each other and that a regular basis.

II est à noter que l'étape 11 de câblage des fils sur la rondelle (1) peut être, dans une variante de réalisation, effectuée seulement après cette étape 13 d'étirement du film élastique (2). It should be noted that step 11 of wiring son on the washer (1) may be, in an alternative embodiment, only performed after this step 13 stretching of the elastic film (2).

L'étape suivante, repérée 14, consiste à solidariser les pastilles et leurs fils de connexion et enrober le tout dans un matériau électriquement isolant, par exemple une résine organique, époxy ou polyimide, par une technique de coulage ou de moulage par exemple, le matériau étant ensuite, le cas échéant, polymérisé. The next step, referenced 14, is to bond the pellets and their connecting son and coat all in an electrically insulating material, for example an organic resin, epoxy or polyimide, by a technique of casting or molding for example, material then being, if necessary, polymerized.

Le résultat de cette étape est illustré sur la figure 3. The result of this step is illustrated in Figure 3.

Sur cette figure, on retrouve le film 2 portant des pastilles 21, maintenant individualisées et séparées les unes des autres. In this figure, there is the film 2 on the pellets 21, now individualized and separated from each other. Les pastilles 21 et leurs conducteurs 23 sont noyés dans un matériau isolant 25, qui pénètre également dans les intervalles 26 entre pastilles. The pellets 21 and their conductors 23 are embedded in an insulating material 25 which also penetrates into the gaps 26 between pellets.

L'étape suivante, repérée 15, consiste à polir la face supérieure (27, figure 3) du matériau d'enrobage 25, de sorte à obtenir une surface plane sur laquelle les sections des fils 23 affleurent. The next step, referenced 15, is to polish the upper surface (27, Figure 3) of the coating material 25 so as to obtain a flat surface on which the sections 23 are flush son.

L'épaisseur du matériau d'enrobage 25 dépend de celle de la rondelle 1 et des matériaux concernés, notamment pour des raisons thermomécaniques. The thickness of the coating material 25 depends on that of the washer 1 and the materials involved, in particular for thermo-mechanical reasons. A titre d'exemple, pour une rondelle de 400 à 500 pm d'épaisseur, le matériau 25 peut faire environ 150 pm. For example, for a washer 400 to 500 pm thick, the material 25 may be about 150 microns.

L'étape suivante (16, figure 1) consiste à supprimer le film élastique 2. The next step (16, Figure 1) is to remove the elastic film 2.

Cette suppression peut être réalisée par exemple par décollage du film. This suppression can be achieved for example by taking off the film. Dans une variante de réalisation, on procède à un polissage de la face arrière de l'ensemble, repéré 28 sur la figure 3, c'est-à-dire la face opposée à la face 27 pour supprimer le film 2 etlou amincir les pastilles 21 dans le but d'en réduire l'épaisseur et l'encombrement, ce qui peut être p,articulièrement avantageux dans l'application décrite ci-après d'empilement des pastilles encapsulées en trois dimensions. In an alternative embodiment, the procedure for polishing the rear face of the assembly, marked 28 in Figure 3, that is to say the face opposite to the face 27 to remove the thin film 2 andlor pellets 21 in order to reduce its thickness and size, which can be p, articulièrement advantageous in the application described hereinafter stacking encapsulated pellets in three dimensions.

Dans une variante de réalisation, on ne supprime pas le film élastique 2 qui permet alors d'isoler etlou de protéger la face arrière 28 de la pastille. In an alternative embodiment, it does not remove the elastic film 2 which then allows the isolation andlor protect the rear face 28 of the pellet.

L'étape suivante, repérée 17, consiste à réaliser des connexions reliant chacun des conducteurs 23 à ce qui deviendra la face latérale des pastilles après séparation, ces connexions étant réalisées par métallisations sur la face supérieure 27 au dessus de l'intervalle inter-pastilles. The next step, referenced 17, is to make connections between each of the conductors 23 in what will become the side face of the pellets after separation, these connections being formed by metallizations on the top side 27 above the inter-pellet gap .

Les figures 4a et 4b illustrent cette étape, vue respectivement en coupe et de dessus. Figures 4a and 4b illustrate this step, seen respectively in section and from above.

La figure 4a représente les pastilles 21 avec leurs fils 23 noyés dans le matériau 25. La face supérieure 27 de l'ensemble porte des métallisations 30 au-dessus des fils 23, métallisations qui relient chacun des fils 23 à l'intervalle 26 entre pastilles. 4a represents the pellets 21 with their son 23 embedded in the material 25. The upper face 27 of the door assembly of the metallizations 30 above the son 23, metallizations that connect each of the son 23 in the gap 26 between pellets .

Ces métallisations peuvent affecter différentes formes comme illustré sur la vue de dessus de la figure 4b: elles peuvent relier un fil 23 à la zone inter-pastille 26, relier ensemble deux fils 23 de pastilles différentes ou relier en outre un fil 23 à une zone 31, utilisée ultérieurement pour le test des pastilles par exemple. These metallizations can affect various forms as illustrated in the top view of Figure 4b may connect a wire 23 to the inter-chip area 26, connect together two son 23 different pellets or connect further includes a wire 23 to an area 31, subsequently used for testing the pellets, for example.

La réalisation des connexions 30 peut être faite par tout moyen connu, par exemple dépôt d'une couche métallique et gravure ultérieure de cette couche. Making connections 30 may be made by any known means, for example, depositing a metal layer and subsequent etching of this layer. Le dépôt peut être un dépôt métallique tel que or, nickel et or, nickel-cuivre et or, cuivre et or, effectué par exemple sous vide par pulvérisation cathodique, éventuellement rechargé par voie électrochimique. The deposition can be a metal coating such as gold, nickel and gold, nickel and copper-gold, copper and gold, made for example by vacuum sputtering, possibly reloaded electrochemically.

La gravure ultérieure peut être par exemple une photogravure. Subsequent etching may be for example a photogravure. Dans une variante, on peut utiliser une photogravure dite inverse, c'est-à-dire laissant le métal partout sauf autour des conducteurs, celle-ci permettant de réaliser en outre un blindage électromagnétique. Alternatively, a so-called reverse photoengraving may be used, that is to say leaving the metal everywhere except around the conductors, the latter for achieving further electromagnetic shielding.

La dernière étape de la réalisation des pastilles encapsulées (étape 18, sur la figure 1) consiste en la séparation des pastilles. The last step of the embodiment of the encapsulated pellets (step 18 in Figure 1) consists in the separation of the pellets. Cette séparation est réalisée par découpe du matériau 25 entre les pastilles, par exemple à l'aide d'une scie diamantée. This separation is achieved by cutting the material 25 between the pellets, for example using a diamond saw. On obtient alors des pastilles semi-conductrices enrobées chacune sur cinq de leurs faces dans un matériau isolant formant boîtier, ce dernier étant muni de connexions (métallisations 30), testable et manipulable. Are then obtained semiconductor chips each coated on five of their faces in an insulating material forming the housing, this latter being provided with connections (metallizations 30) testable and manipulated.

Lorsqu'on veut réaliser avec des pastilles ainsi encapsulées un empilement en trois dimensions (étape 19, figure 1), on dispose les boîtiers dans une glissière permettant d'aligner deux des faces latérales des boîtiers, simplifiant ainsi les problèmes de positionnement relatif des boîtiers. When one wants to achieve with pellets and encapsulated a stack in three dimensions (step 19, Figure 1), there is recessed in a guide for aligning two of the side faces of the housings, thereby simplifying positioning problems relative housings . Entre les boîtiers sont disposées des couches de matériau adhésif, tel qu'une résine polymérisable par exemple. Between the housings are arranged adhesive layers, such as a polymerizable resin, for example. On presse ensuite l'ensemble et éventuellement on le polymérise, de sorte à le solidariser. then press the assembly and optionally the polymerized, so that the interlock.

Ceci est illustré sur la figure 5 où on retrouve les pastilles 21 et leur matériau d'enrobage 25, séparés les uns des autres par une couche adhésive 32. Dans une variante de réalisation, on utilise, pour le film élastique 2, un matériau adhésif -ou rendu adhésif par un traitement approprié- qu'on laisse en place, évitant ainsi l'interposition des couches 32. This is illustrated in Figure 5 where we find the pellets 21 and potting material 25, separated from each other by an adhesive layer 32. In an alternative embodiment, is used for the elastic film 2, an adhesive material -or tackified by a approprié- treatment that leaves in place, thus avoiding the interposition of layers 32.

Sur chacune des faces extrêmes de l'empilement, on dispose en outre une couche de fermeture 42 non adhésive, qui est fixée par l'intermédiaire d'une couche 32. Dans une variante de réalisation (non représentée), les couches de fermeture 42 peuvent être adhésives sur l'une de leurs faces, évitant ainsi la couche 32. Les métallisations 30 relient chacun des conducteurs 23 vers la tranche 35 de l'empilement. On each of the end faces of the stack, a sealing layer is additionally available non-adhesive 42, which is fixed by means of a layer 32. In an alternative embodiment (not shown), the cover layers 42 can be adhesive on one of their faces, thus preventing layer 32. the metallizations 30 connect each of the conductors 23 to the wafer 35 of the stack.

L'étape suivante (20, figure 1) consiste à interconnecter entre elles les différentes pastilles de l'empilement et à les relier, le cas échéant, à des plots, dits plots d'empilement, permettant leur connexion à des circuits extérieurs. The next step (20, Figure 1) is to interconnect together the various wafers of the stack and to connect, if necessary, to pads, called stack pads, allowing their connection to external circuits. Ces interconnexions sont réalisées sur les faces de l'empilement, par exemple comme décrit dans la demande de brevet français précitée. These interconnections are formed on the faces of the stack, for example as described in the abovementioned French patent application.

Sur la figure 5, on a représenté à titre d'exemple les différentes connexions 30 toutes reliées entre elles à l'aide d'une métallisation 33 disposée sur la face de l'empilement et se prolongeant (34) par exemple sur l'une ou sur les deux des faces extrêmes de l'empilement. In Figure 5, by way of example there is shown the different connections 30 all interconnected with a metallization 33 arranged on the side of the stack and extending (34) for example on one or both end faces of the stack. Dans ce dernier cas, I'une des faces peut être utilisée pour le test alors que l'autre est utilisée pour le montage de l'empilement sur un circuit imprimé par exemple. In the latter case, I'une faces can be used to test while the other is used for mounting the stack on a printed circuit, for example.

Dans une autre variante de réalisation (non représentée), on peut réaliser en même temps plusieurs empilements, ceux-ci étant éventuellement séparés les uns des autres en outre par un intercalaire non adhésif. In another alternative embodiment (not shown) can be realized at the same time several stacks, these possibly being separated from each other further by a non-adhesive tab. Les interconnexions des pastilles par les faces latérales de l'empilement peuvent alors être réalisées de façon collective, simultanément pour tous les empilements. The interconnections of the pellets by the side faces of the stack can then be performed in a collective manner simultaneously for all the stacks.

Dans une autre variante de réalisation, on peut améliorer le refroidissement des pastilles en fonctionnement par l'insertion de drains thermiques entre les boîtiers, reliés éventuellement à un radiateur. In another embodiment, one can improve the cooling of the pellets in operation by inserting heat sinks between the housings, possibly connected to a radiator.

Dans l'exemple représenté sur la figure 6, on retrouve les pastilles 21, leurs conducteurs 23 et le matériau d'enrobage 25. Les connexions 30 liant les fils 23 à l'une des faces latérales de la pastille sont dirigées de sorte à dégager l'une de ces faces, par exemple la face gauche sur la figure. In the example shown in Figure 6 include the pellets 21, their conductors 23 and the coating material 25. The connections 30 connecting the son 23 to one of the side faces of the wafer are directed so as to disengage one of these faces, for example the left side in FIG. Un drain thermique 38, couche métallique par exemple, en cuivre ou nitrure d'aluminium, ou encore en diamant, est disposé entre chaque pastille 21 par l'intermédiaire d'une couche de colle 36. La face latérale gauche de l'empilement est par exemple collée, par l'intermédiaire d'une couche de colle 39, de préférence thermiquement conductrice, à un radiateur 37, lequel se trouve ainsi en contact thermique avec les drains 38. Pour la clarté du schéma, les couches de colle 36 n'ont pas été hachurées bien que vues en coupe. A heat sink 38, metallic layer, for example, copper or aluminum nitride, or diamond, is disposed between each wafer 21 via an adhesive layer 36. The left side face of the stack is for example glued, by means of an adhesive layer 39, thermally conductive preferably, a radiator 37, which is thus in thermal contact with the drains 38. for clarity of the diagram, the adhesive layers 36 n have not been shaded although section views.

La figure 7 représente, vue en coupe, une variante de réalisation de l'étape 11 de la figure 1, à savoir le câblage de conducteurs sur la rondelle. 7 shows, in sectional view, an alternative embodiment of step 11 of Figure 1, namely the wiring conductors on the washer.

Sur cette figure, on retrouve la rondelle 1 montée sur son film élastique 2 et portant des plots 22, sur lesquels on souhaite câbler des conducteurs 23. Selon cette variante, on munit la face supérieure de la rondelle 1 de morceaux de substrat du type circuit imprimé 39, de préférence au moins un par pastille, le circuit imprimé 39 étant fixé sur la rondelle à l'aide par exemple d'une couche de colle 40. Le circuit imprimé 39 porte au moins une métallisation 41. Selon cette variante, le conducteur 23 n'est plus coupé mais il est courbé de sorte à être connecté de plus à la métallisation 41 portée par le circuit imprimé 39. En outre, le conducteur 23 peut être connecté verticalement sur le plot 22 comme représenté sur les figures précédentes ou bien comme représenté sur la figure 7, connecté horizontalement comme sur la métallisation 41. In this figure, there is the washer 1 mounted on the elastic film 2 and bearing pads 22, on which it is desired wire conductor 23. In this variant, we equip the upper face of the washer 1 circuit type substrate pieces printed 39, preferably at least one per chip, the circuit board 39 being attached to the washer using for example an adhesive layer 40. the printed circuit 39 carries at least one metallization 41. in this variant, the conductor 23 is not cut but it is curved so as to be connected again to the metallization 41 carried by the printed circuit 39. Furthermore, the conductor 23 can be connected vertically to the pad 22 as shown in the previous figures or well as shown in Figure 7, connected horizontally as in metallization 41.

Toutes les opérations ultérieures du procédé selon l'invention se déroulent de la même manière, le conducteur 23 étant coupé iors du polissage du matériau d'enrobage (étape 15) de sorte à venir affleurer comme précédemment sur la face supérieure de la pastille. All subsequent operations of the process according to the invention are conducted in the same manner, the conductor 23 being cut IORS polishing of the coating material (step 15) so as to be flush as above on the upper face of the pellet.

Le procédé décrit ci-dessus, ainsi que les dispositifs obtenus, présentent un certain nombre d'avantages parmi lesquels le fait qu'il est possible de traiter un grand nombre de pastilles simultanément (toutes celles qui appartiennent à une même rondelle) et, ce, avec des techniques connues dans l'industrie des semi-conducteurs, facilement intégrables dans une chaîne de production de circuits semi-conducteurs, ce qui diminue considérablement le coût de la pastille encapsulée et qui permet, de par les techniques utilisées, d'obtenir des dimensions très réduites, notamment par le matériau d'enrobage, qui peut représenter typiquement un accroissement de l'aire (de la pastille) de moins de 1%. The method described above and the obtained devices have a number of advantages including the fact that it is possible to treat a large number of wafers simultaneously (all those which belong to the same washer), and this with techniques known in the semiconductor industry, easily integrated into a production line of semiconductor circuits, which dramatically reduces the cost of the encapsulated pellet and which, by the techniques used to obtain very reduced dimensions, particularly by the coating material, which can typically represent an increase in the area (of the wafer) of less than 1%. En outre, le mode d'encapsulation est bien adapté à un empilement "trois dimensions", réalisable collectivement et simplement, avec les avantages de coût qui en découlent. In addition, the encapsulation mode is well suited to a stack "three dimensional", and collectively achieved simply with cost advantages that result.

Claims (8)

    REVENDICATIONS
  1. 1. Procédé d'encapsulation de pastilles semi-conductrices, caractérisé par le fait qu'il comporte les étapes suivantes: 1. A method of encapsulation of semiconductor chips, characterized in that it comprises the following steps:
    - câblage de conducteurs (23) sur les plots de connexion (22) des pastilles (21), celles-ci étant contenues dans une même rondelle (1) de matériau semi-conducteur; - wiring conductors (23) on the connection pads (22) of the pellets (21), the latter being contained in a single washer (1) of semiconductor material;
    - sciage de la rondelle pour individualiser les pastilles, la rondelle étant fixée sur un film élastique (2); - cutting the washer to individualize the pellets, the washer being fixed to an elastic film (2);
    - étirement du film élastique de sorte à séparer les pastilles; - stretching the elastic film so as to separate the pellets;
    - solidarisation et enrobage des conducteurs et pastilles à l'aide d'un matériau (25) électriquement isolant; - coupling and conductive coating and pellets with a material (25) electrically insulating;
    polissage du matériau d'enrobage de sorte à faire affleurer les conducteurs polishing of the coating material so as to be flush with the conductors
    - réalisation sur le matériau d'enrobage de connexions (30) reliant les conducteurs aux côtés des pastilles; - realization of the coating material connections (30) connecting the conductors to the sides of the pellets;
    - séparation des pastilles. - separation of the pellets.
  2. 2. Procédé selon la revendication 1, caractérisé par le fait que le matériau d'enrobage (25) est une résine polymérisable. 2. Method according to claim 1, characterized in that the coating material (25) is a polymerizable resin.
  3. 3. Procédé selon l'une des revendications précédentes, caractérisé par le fait qu'il comporte en outre, après l'étape de polissage, une étape de suppression du film élastique (2). 3. Method according to one of the preceding claims, characterized in that it further comprises, after the polishing step, a step of removal of the elastic film (2).
  4. 4. Pastille semi-conductrice (21) comportant des plots de connexion (22), caractérisée par le fait qu'elle comporte des conducteurs (23) connectés sur ses plots, que la pastille et ses conducteurs sont enrobés d'un matériau isolant (25), de telle sorte que les conducteurs affleurent la surface (27) du matériau isolant, et qu'elle comporte en outre sur cette dernière surface des connexions électriques (30) reliant les conducteurs aux côtés de la pastille. 4. semiconductor chip (21) having connection pads (22), characterized in that it comprises conductors (23) connected on its pads, the chip and its leads are coated with an insulating material ( 25), such that the conductors are flush with the surface (27) of insulating material, and it further comprises on the latter surface of the electrical connections (30) connecting the conductors to the sides of the pellet.
  5. 5. Pastille selon la revendication 4, caractérisée par le fait que chacun des conducteurs (23) est formé par un fil ou un ruban. 5. A tablet according to claim 4, characterized in that each of the conductors (23) is formed by a wire or a ribbon.
  6. 6. Procédé d'interconnexion de pastilles obtenues par le procédé selon la revendication 1, caractérisé par le fait qu'il comporte en outre les étapes suivantes: 6. A method of interconnecting pellets obtained by the process according to claim 1, characterized in that it further comprises the steps of:
    - empilement des pastilles séparées et solidarisation de l'empilement; - stacking the separated pellets and securing the stack;
    - réalisation de l'interconnexion des connexions des pastilles sur les faces de l'empilement. - realization of the interconnection of the connections of the pellets on the faces of the stack.
  7. 7. Procédé selon la revendication 6, caractérisé par le fait que l'empilement des pastilles séparées est réalisé en disposant entre les pastilles une couche d'un matériau susceptible de les faire adhérer l'une à l'autre. 7. A method according to claim 6, characterized in that the stack of separate pellets is achieved by arranging between the pellets a layer of the material capable of adhering to one another.
  8. 8. Dispositif comportant des pastilles selon la revendication 4, caractérisé par le fait que les pastilles (21) sont empilées et séparées par une couche (2, 32) d'un matériau assurant leur adhérence mutuelle et qu'il comporte en outre des interconnexions (33) portées par les faces de l'empilement, interconnectant les connexions (30) des pastilles. 8. A device comprising pellets according to claim 4, characterized in that the pellets (21) are stacked and separated by a layer (2, 32) of a material ensuring their mutual adhesion and further comprising interconnections (33) carried by the faces of the stack, interconnecting the connections (30) of the pellets.
FR9304962A 1993-04-27 1993-04-27 A method of encapsulating semiconductor chips, device obtained by this method and application to the interconnection pads in three dimensions. Expired - Fee Related FR2704690B1 (en)

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FR9304962A FR2704690B1 (en) 1993-04-27 1993-04-27 A method of encapsulating semiconductor chips, device obtained by this method and application to the interconnection pads in three dimensions.
JP52394194A JPH07509104A (en) 1993-04-27 1994-04-15
EP19940913654 EP0647357A1 (en) 1993-04-27 1994-04-15 Semiconductor chip encapsulation method, device produced by this method and its application to three dimensional chip interconnection
PCT/FR1994/000427 WO1994025987A1 (en) 1993-04-27 1994-04-15 Semiconductor chip encapsulation method, device produced by this method and its application to three dimensional chip interconnection

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EP0647357A1 (en) 1995-04-12 application
JPH07509104A (en) 1995-10-05 application
FR2704690B1 (en) 1995-06-23 grant
WO1994025987A1 (en) 1994-11-10 application

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