EP3137569A1 - Anaerobe härtbare zusammensetzungen mit blockierten (meth)acrylsäureverbindungen - Google Patents
Anaerobe härtbare zusammensetzungen mit blockierten (meth)acrylsäureverbindungenInfo
- Publication number
- EP3137569A1 EP3137569A1 EP15785613.9A EP15785613A EP3137569A1 EP 3137569 A1 EP3137569 A1 EP 3137569A1 EP 15785613 A EP15785613 A EP 15785613A EP 3137569 A1 EP3137569 A1 EP 3137569A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- meth
- vinyl ether
- acrylic acid
- composition
- ether
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 100
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 title claims abstract description 33
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 38
- -1 (meth)acrylic acid compound Chemical class 0.000 claims description 26
- 230000000903 blocking effect Effects 0.000 claims description 15
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 13
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 13
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 claims description 11
- 239000007795 chemical reaction product Substances 0.000 claims description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 239000000178 monomer Substances 0.000 claims description 9
- 229960000834 vinyl ether Drugs 0.000 claims description 9
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- MWZJGRDWJVHRDV-UHFFFAOYSA-N 1,4-bis(ethenoxy)butane Chemical compound C=COCCCCOC=C MWZJGRDWJVHRDV-UHFFFAOYSA-N 0.000 claims description 7
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 7
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 6
- 150000002367 halogens Chemical class 0.000 claims description 6
- 229920001223 polyethylene glycol Polymers 0.000 claims description 5
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical class [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 229940106691 bisphenol a Drugs 0.000 claims description 4
- 150000002431 hydrogen Chemical class 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- HIHSUGQNHLMGGK-UHFFFAOYSA-N 1-ethenoxyhexan-1-ol Chemical compound CCCCCC(O)OC=C HIHSUGQNHLMGGK-UHFFFAOYSA-N 0.000 claims description 3
- OVGRCEFMXPHEBL-UHFFFAOYSA-N 1-ethenoxypropane Chemical compound CCCOC=C OVGRCEFMXPHEBL-UHFFFAOYSA-N 0.000 claims description 3
- GNUGVECARVKIPH-UHFFFAOYSA-N 2-ethenoxypropane Chemical compound CC(C)OC=C GNUGVECARVKIPH-UHFFFAOYSA-N 0.000 claims description 3
- UEIPWOFSKAZYJO-UHFFFAOYSA-N 1-(2-ethenoxyethoxy)-2-[2-(2-ethenoxyethoxy)ethoxy]ethane Chemical compound C=COCCOCCOCCOCCOC=C UEIPWOFSKAZYJO-UHFFFAOYSA-N 0.000 claims description 2
- RJTJPFYIGZWFMK-UHFFFAOYSA-N 1-[2-(2-ethenoxyethoxy)ethoxy]-2-methoxyethane Chemical compound COCCOCCOCCOC=C RJTJPFYIGZWFMK-UHFFFAOYSA-N 0.000 claims description 2
- CZAVRNDQSIORTH-UHFFFAOYSA-N 1-ethenoxy-2,2-bis(ethenoxymethyl)butane Chemical compound C=COCC(CC)(COC=C)COC=C CZAVRNDQSIORTH-UHFFFAOYSA-N 0.000 claims description 2
- JFZBUNLOTDDXNY-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)propoxy]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)OCC(C)OC(=O)C(C)=C JFZBUNLOTDDXNY-UHFFFAOYSA-N 0.000 claims description 2
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 claims description 2
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 claims description 2
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 claims description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 2
- 125000003342 alkenyl group Chemical group 0.000 claims description 2
- 125000002877 alkyl aryl group Chemical group 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 239000004202 carbamide Substances 0.000 claims description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- 125000000392 cycloalkenyl group Chemical group 0.000 claims description 2
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 2
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 claims description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 claims description 2
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 claims description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 claims description 2
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000004334 sorbic acid Substances 0.000 claims description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 2
- 150000003457 sulfones Chemical class 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 239000011593 sulfur Substances 0.000 claims description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 2
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 claims description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 claims 2
- GPHWXFINOWXMDN-UHFFFAOYSA-N 1,1-bis(ethenoxy)hexane Chemical compound CCCCCC(OC=C)OC=C GPHWXFINOWXMDN-UHFFFAOYSA-N 0.000 claims 1
- SKYXLDSRLNRAPS-UHFFFAOYSA-N 1,2,4-trifluoro-5-methoxybenzene Chemical compound COC1=CC(F)=C(F)C=C1F SKYXLDSRLNRAPS-UHFFFAOYSA-N 0.000 claims 1
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 claims 1
- ZXHDVRATSGZISC-UHFFFAOYSA-N 1,2-bis(ethenoxy)ethane Chemical compound C=COCCOC=C ZXHDVRATSGZISC-UHFFFAOYSA-N 0.000 claims 1
- UNMYKPSSIFZORM-UHFFFAOYSA-N 1-(2-ethenoxyethoxy)butane Chemical compound CCCCOCCOC=C UNMYKPSSIFZORM-UHFFFAOYSA-N 0.000 claims 1
- SAMJGBVVQUEMGC-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOC=C SAMJGBVVQUEMGC-UHFFFAOYSA-N 0.000 claims 1
- OZCMOJQQLBXBKI-UHFFFAOYSA-N 1-ethenoxy-2-methylpropane Chemical compound CC(C)COC=C OZCMOJQQLBXBKI-UHFFFAOYSA-N 0.000 claims 1
- LAYAKLSFVAPMEL-UHFFFAOYSA-N 1-ethenoxydodecane Chemical compound CCCCCCCCCCCCOC=C LAYAKLSFVAPMEL-UHFFFAOYSA-N 0.000 claims 1
- QJJDJWUCRAPCOL-UHFFFAOYSA-N 1-ethenoxyoctadecane Chemical compound CCCCCCCCCCCCCCCCCCOC=C QJJDJWUCRAPCOL-UHFFFAOYSA-N 0.000 claims 1
- WULAHPYSGCVQHM-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethanol Chemical compound OCCOCCOC=C WULAHPYSGCVQHM-UHFFFAOYSA-N 0.000 claims 1
- WVXLLHWEQSZBLW-UHFFFAOYSA-N 2-(4-acetyl-2-methoxyphenoxy)acetic acid Chemical compound COC1=CC(C(C)=O)=CC=C1OCC(O)=O WVXLLHWEQSZBLW-UHFFFAOYSA-N 0.000 claims 1
- CYADZXMTKIHVMV-UHFFFAOYSA-N 2-ethenoxy-2-methylbutane Chemical compound CCC(C)(C)OC=C CYADZXMTKIHVMV-UHFFFAOYSA-N 0.000 claims 1
- PGYJSURPYAAOMM-UHFFFAOYSA-N 2-ethenoxy-2-methylpropane Chemical compound CC(C)(C)OC=C PGYJSURPYAAOMM-UHFFFAOYSA-N 0.000 claims 1
- PLWQJHWLGRXAMP-UHFFFAOYSA-N 2-ethenoxy-n,n-diethylethanamine Chemical compound CCN(CC)CCOC=C PLWQJHWLGRXAMP-UHFFFAOYSA-N 0.000 claims 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 claims 1
- DSSAWHFZNWVJEC-UHFFFAOYSA-N 3-(ethenoxymethyl)heptane Chemical compound CCCCC(CC)COC=C DSSAWHFZNWVJEC-UHFFFAOYSA-N 0.000 claims 1
- JPVNTYZOJCDQBK-UHFFFAOYSA-N 3-ethenoxypropan-1-amine Chemical compound NCCCOC=C JPVNTYZOJCDQBK-UHFFFAOYSA-N 0.000 claims 1
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 claims 1
- 230000000977 initiatory effect Effects 0.000 claims 1
- INRGAWUQFOBNKL-UHFFFAOYSA-N {4-[(Vinyloxy)methyl]cyclohexyl}methanol Chemical compound OCC1CCC(COC=C)CC1 INRGAWUQFOBNKL-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 13
- 239000002318 adhesion promoter Substances 0.000 abstract description 12
- 239000000758 substrate Substances 0.000 abstract description 10
- 230000001737 promoting effect Effects 0.000 abstract description 7
- 239000013466 adhesive and sealant Substances 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 description 18
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 238000003860 storage Methods 0.000 description 7
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 6
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- ZETHHMPKDUSZQQ-UHFFFAOYSA-N Betulafolienepentol Natural products C1C=C(C)CCC(C(C)CCC=C(C)C)C2C(OC)OC(OC)C2=C1 ZETHHMPKDUSZQQ-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- HEOKFDGOFROELJ-UHFFFAOYSA-N diacetal Natural products COc1ccc(C=C/c2cc(O)cc(OC3OC(COC(=O)c4cc(O)c(O)c(O)c4)C(O)C(O)C3O)c2)cc1O HEOKFDGOFROELJ-UHFFFAOYSA-N 0.000 description 5
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- UICBCXONCUFSOI-UHFFFAOYSA-N n'-phenylacetohydrazide Chemical compound CC(=O)NNC1=CC=CC=C1 UICBCXONCUFSOI-UHFFFAOYSA-N 0.000 description 4
- QQZOPKMRPOGIEB-UHFFFAOYSA-N n-butyl methyl ketone Natural products CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 125000006519 CCH3 Chemical group 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- PCSMJKASWLYICJ-UHFFFAOYSA-N Succinic aldehyde Chemical compound O=CCCC=O PCSMJKASWLYICJ-UHFFFAOYSA-N 0.000 description 3
- 150000001241 acetals Chemical class 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000002738 chelating agent Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 3
- 235000019204 saccharin Nutrition 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- HTSGKJQDMSTCGS-UHFFFAOYSA-N 1,4-bis(4-chlorophenyl)-2-(4-methylphenyl)sulfonylbutane-1,4-dione Chemical compound C1=CC(C)=CC=C1S(=O)(=O)C(C(=O)C=1C=CC(Cl)=CC=1)CC(=O)C1=CC=C(Cl)C=C1 HTSGKJQDMSTCGS-UHFFFAOYSA-N 0.000 description 2
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 239000012230 colorless oil Substances 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000003760 magnetic stirring Methods 0.000 description 2
- SNVLJLYUUXKWOJ-UHFFFAOYSA-N methylidenecarbene Chemical compound C=[C] SNVLJLYUUXKWOJ-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000010076 replication Effects 0.000 description 2
- 229940081974 saccharin Drugs 0.000 description 2
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 238000007655 standard test method Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 2
- OXYKVVLTXXXVRT-UHFFFAOYSA-N (4-chlorobenzoyl) 4-chlorobenzenecarboperoxoate Chemical compound C1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1 OXYKVVLTXXXVRT-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 150000001253 acrylic acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- BXIQXYOPGBXIEM-UHFFFAOYSA-N butyl 4,4-bis(tert-butylperoxy)pentanoate Chemical compound CCCCOC(=O)CCC(C)(OOC(C)(C)C)OOC(C)(C)C BXIQXYOPGBXIEM-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical group CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 150000003857 carboxamides Chemical class 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229930007927 cymene Natural products 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- JDEJGVSZUIJWBM-UHFFFAOYSA-N n,n,2-trimethylaniline Chemical compound CN(C)C1=CC=CC=C1C JDEJGVSZUIJWBM-UHFFFAOYSA-N 0.000 description 1
- HKJNHYJTVPWVGV-UHFFFAOYSA-N n,n-diethyl-4-methylaniline Chemical compound CCN(CC)C1=CC=C(C)C=C1 HKJNHYJTVPWVGV-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- QUPCNWFFTANZPX-UHFFFAOYSA-M paramenthane hydroperoxide Chemical compound [O-]O.CC(C)C1CCC(C)CC1 QUPCNWFFTANZPX-UHFFFAOYSA-M 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000010944 pre-mature reactiony Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
- C07C69/54—Acrylic acid esters; Methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/593—Dicarboxylic acid esters having only one carbon-to-carbon double bond
- C07C69/60—Maleic acid esters; Fumaric acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/281—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/285—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety
- C08F220/286—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety and containing polyethylene oxide in the alcohol moiety, e.g. methoxy polyethylene glycol (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/02—Acids; Metal salts or ammonium salts thereof, e.g. maleic acid or itaconic acid
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2003/1034—Materials or components characterised by specific properties
- C09K2003/1065—Anaerobically hardenable materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09K2200/0625—Polyacrylic esters or derivatives thereof
Definitions
- the present invention relates to anaerobic curable compositions, such as adhesives and sealants, containing blocked (meth)acrylic acid compounds.
- (meth)acrylic acid compounds are labile (meth)acrylic acid compounds having an acetal linkage, which cleaves to release (meth)acrylic acid during anaerobic cure. In this way, the block (meth)acrylic acid compounds act as an adhesion promoter thereby promoting adhesion to various substrates.
- Anaerobic adhesive compositions generally are well-known. See e.g., R. D. Rich,
- compositions also contain accelerator components to increase the speed with which the composition cures.
- compositions may also include adhesion promoters, which can function to increase adhesion to substrates, thereby enhancing adhesive strength.
- (Meth)acrylic acid (“AA”) is a commonly used adhesion promoter in anaerobic compositions because of its excellent ability to enhance adhesion.
- AA has the disadvantage of being heavily regulated due to its health and safety profile, and thus, requires special considerations during handling, storage, and disposal. These considerations among other things add to cost and inefficiencies.
- efforts have been undertaken to identify replacements for AA. To date, these efforts have not provided an acceptable alternative.
- the present invention provides such a solution.
- the present invention relates to anaerobic curable compositions, such as adhesives and sealants, containing block (meth)acrylic acid compounds.
- the blocked (meth)acrylic acid compounds are liable (meth)acrylic acid compounds having an acetal linkage, which cleaves to release (meth)acrylic acid during anaerobic cure.
- the blocked (meth)acrylic acid compounds act as an adhesion promoter thereby promoting adhesion to various substrates.
- a labile (meth)acrylic acid within the present context is a reaction product that has been prepared from AA and a compound containing a vinyl ether group.
- the so-formed reaction product provides an acetal compound having a structure represented by AA- B (Compound I) or AA-B-AA (Compound II), where AA represents a (meth)acrylic acid unit, B represents a cleavable blocking unit, joined to A A through an acetal bond.
- This general structure is referred to herein as a blocked (meth)acrylic acid compound or a labile (meth)acrylic acid compound, or by the acronym, LAA.
- the labile (meth)acrylic acid compounds are useful as adhesion promoters for anaerobic curable compositions, such as adhesive and sealant.
- the labile (meth)acrylic acid compounds provide adhesion promoting properties upon anaerobic cure of the composition.
- the blocking group is removed under the reaction conditions of anaerobic cure, thereby releasing (meth)acrylic acid to perform its adhesion promoting function.
- anaerobic cure conditions cause the cleavage of the acetal bond and re-formation of (meth)acrylic acid and the vinyl ether compound.
- LAA compound may be represented by the structures:
- B is a blocking unit
- an anaerobic curable composition which includes:
- an anaerobic curable composition comprising the reaction product of:
- a method of promoting anaerobic cure of an anaerobic curable composition which includes:
- composition which includes:
- step (i) adding to the composition of step (i) a labile (meth)acrylic acid compound.
- (meth)acrylic acid is intended to include methacrylic acid and acrylic acid.
- LA A labile (meth)acrylic acid
- LA A is intended to include compounds which will undergo a chemical change and revert to its starting materials, (meth)acrylic acid and vinyl ether compound, during anaerobic cure. This term is used interchangeably with "blocked (meth)acrylic acid”.
- the selection of a blocking unit to form the LAA compound is based on several considerations.
- One such consideration is the ability to "protect” or block the acid group functionality on the AA such that it prevents premature reaction with its surroundings, thereby alleviating health, safety and environmental concerns, all of which require special handling.
- the labile compound must be relatively stable under what would be generally considered normal storage, shelf life and manufacturing conditions for reactant ingredients.
- This stability must be such that it does not prevent the cleavage of the blocking unit and reformation of AA during anaerobic cure.
- the LAA remains substantially stable, and when incorporated into an anaerobic curable composition, this stability continues until the composition is subjected to anaerobic curing conditions.
- the AA unit becomes unblocked and AA is released to perform its adhesion promoting function.
- the present invention joins the AA unit to the blocking unit via an acetyl linage.
- blocking unit Another consideration for selection of appropriate blocking units is the compatibility of the blocked (meth)acrylate acid unit [or more accurately, blocked (meth)acrylic acid] with the anaerobic curable composition to which it will be added.
- the chosen blocked (meth)acrylate acid has good miscibility and/or solubility with (meth)acrylate monomers or resins and does not react prematurely to any significant extent with any portion of the anaerobic curable composition.
- the blocking unit and AA units are separated, the blocking unit must not substantially deleteriously affect the anaerobic cure or substantially deleteriously affect the properties of the anaerobic curable composition or the final properties of the cured composition.
- the selected blocking unit is in liquid form for ease of incorporation into the anaerobic curable composition.
- the blocking agent reforms into a vinyl ether compound and is free to participate in the anaerobic polymerization reaction.
- Desirable blocking units include vinyl ether compounds.
- Mono- and di-vinyl ether compounds are contemplated, non-limiting examples of which include those listed in Table I below.
- the vinyl ether compounds may be used individually or in combination.
- the anaerobic curable composition is based on the (meth)acrylate component, together with an anaerobic cure system, and of course the LAA.
- G may be hydrogen, halogen, or alkyl groups having from 1 to about 4 carbon atoms
- R 1 may be selected from alkyl, cycloalkyl, alkenyl, cycl
- (meth)acrylate monomers may also be used, such as reaction products of the diglycidylether of bisphenol-A with methacrylic acid and a (meth)acrylate ester
- R 4 may be selected from hydrogen, alkyl groups having from 1 to about 4 carbon atoms, hydroxyalkyl groups having from 1 to about 4 carbon atoms or
- R 5 may be selected from hydrogen, halogen, and alkyl groups of from 1 to about 4 carbon atoms;
- R 6 may be selected from hydrogen, hydroxy and
- n is an integer equal to at least I, e.g. , from 1 to about 8 or higher, for instance, from 1 to about 4;
- v is 0 or 1 ;
- n is an integer equal to at least 1, e.g., 1 to about 20 or more.
- Still other (meth)acrylate monomers include silicone (meth)acrylates (“SiMA”), such as those taught by and claimed in U.S. Patent No. 5,605,999 (Chu), the disclosure of which is hereby expressly incorporated herein by reference.
- SiMA silicone (meth)acrylates
- Additional (meth)acrylate monomers include polyfunctional (meth)acrylate monomers, such as, but not limited to, di-or tri-functional (meth)acrylates like polyethylene glycol di(mefh)acrylates, tetrahydrofuran (meth)acrylates and di(meth)acrylates, hydroxypropyl (meth)acrylate ("HPMA”), hexanediol di(meth)acrylate, trimethylol propane tri(meth)acrylate (“TMPTMA”), diethylene glycol dimethacrylate, triethylene glycol dimethacrylate
- polyfunctional (meth)acrylate monomers such as, but not limited to, di-or tri-functional (meth)acrylates like polyethylene glycol di(mefh)acrylates, tetrahydrofuran (meth)acrylates and di(meth)acrylates, hydroxypropyl (meth)acrylate (“HPMA”), hexanediol di(meth)acrylate, trimethylol
- TRIEGMA tetraethylene glycol dimethacrylate, dipropylene glycol dimethacrylate, di- (pentamethylene glycol) dimethacrylate, tetraethylene diglycol diacrylate, diglycerol
- tetramethacrylate tetramethylene dimethacrylate, ethylene dimethacrylate, neopentyl glycol diacrylate, trimethylol propane triacrylate and bisphenol-A mono and di(meth)acrylates, such as ethoxylated bisphenol-A (meth)acrylate (“EBIPMA”), and bisphenol-F mono and
- di(meth)acrylates such as ethoxylated bisphenol-F (meth)acrylate.
- Combinations of (meth)acrylate monomers may also be used.
- the (meth)acrylate component may be present in an amount from about 10 to about 90 percent by weight, such as from about 60 to about 90 percent by weight, based on the total weight of the composition.
- Additional components have been included in traditional anaerobic curable compositions to alter the physical properties of either the curable compositions or reaction products thereof, and such additional components may be used in the so-described anaerobic curable compositions.
- maleimide components may be included to modify the physical properties and/or cure profile of the formulation and/or the strength or temperature resistance of the cured adhesive.
- the maleimide, coreactant, reactive diluent, plasticizer, and/or mono- or poly-hydroxyalkanes may be present in an amount within the range of about 1 percent to about 30 percent by weight, based on the total weight of the composition.
- the anaerobic cure system includes a free-radical initiator, such as a peroxide, and optionally, one or more components selected from free-radical accelerators, free-radical inhibitors, as well as metal catalysts, such as iron and copper.
- a free-radical initiator such as a peroxide
- free-radical accelerators such as a peroxide
- free-radical inhibitors such as iron and copper
- metal catalysts such as iron and copper
- a number of well-known initiators of free radical polymerization are typically incorporated into anaerobic curable compositions including hydroperoxides, such as cymene hydroperoxides ("CHP”), para-menthane hydroperoxide, t-butyl hydroperoxide (“TBH”) and t- butyl perbenzoate.
- hydroperoxides such as cymene hydroperoxides (“CHP”), para-menthane hydroperoxide, t-butyl hydroperoxide (“TBH”) and t- butyl perbenzoate.
- initiators of free radical polymerization include peroxides, such as benzoyl peroxide, dibenzoyl peroxide, l,3-bis(t-butylperoxyisopropyl)benzene, diacetyl peroxide, butyl 4,4-bis(t-butylperoxy)valerate, p-chlorobenzoyl peroxide, cumene
- hydroperoxide hydroperoxide, t-butyl cumyl peroxide, t-butyl perbenzoate, di-t-butyl peroxide, dicumyl peroxide, 2,5-dimethyl-2,5-di-t-butylperoxyhexane, 2,5-dimethyl-2,5-di-t-butyl-peroxyhex-3- yne, 4-methyl-2,2-di-t-butylperoxypentane and combinations thereof.
- Such peroxide compounds are typically employed in the present invention in the range of from about 0.1 to about 10% by weight, based on the total weight of the composition, with about 1 to 5% being desirable.
- Accelerators of free radical polymerization may also be used in the compositions of the present invention including, without limitation, organic amides and imides, such as benzoic sulfimide (also known as saccharin) (see U.S. Patent No. 4,324,349).
- Such accelerators may also be of the hydrazine variety (e.g., acetyl phenyl hydrazine, APH), as disclosed in U.S. Patent No. 4,287,350 (Rich) and U.S. Patent No. 4,321,349 (Rich).
- Maleic acid is often added to APH-containing anaerobic cure systems.
- Additional specific accelerators include, without limitation N,N-diethyl-p-toluidine ("DE-p-T”) and N,N-dimethyl-o-toluidine (“DM-o-T”). Additional classes of accelerators include thiocaprolactams (e.g. , U.S. Patent No. 5,411,988) and throureas (e.g. , U.S. Patent No. 3,970,505).
- accelerators such as saccharin may be present in amounts of about
- Stabilizers and inhibitors such as phenols including hydroquinone and quinones may also be employed to control and prevent premature peroxide decomposition and
- Chelating agents such as the tetrasodium salt of ethylenediamine tetraacetic acid
- EDTA EDTA
- chelating agents may ordinarily be present in the compositions in an amount from about 0.001 % by weight to about 0.1 % by weight, based on the total weight of the composition.
- Metal catalyst solutions or pre-mixes thereof may be used in amounts of about
- Thickeners, plasticizers, fillers, toughening agents (such as elastomers and rubbers) and other well-known additives may be incorporated herein where the skilled artisan believes it would be desirable to do so.
- the anaerobic curable compositions may be prepared using conventional methods that are well known to those persons of skill in the art.
- the components may be mixed together in any convenient order consistent with the roles and functions the components are to perform in the compositions.
- Conventional mixing techniques using known apparatus may be employed.
- the anaerobic curable compositions may be applied to a variety of substrates to perform with the desired benefits and advantages described herein.
- appropriate substrates may be constructed from steel, brass, copper, aluminum, zinc, and other metals and alloys, ceramics, and thermosets.
- the compositions of this invention demonstrate particularly good bond strength on surfaces commonly referred to as "active" surfaces, such as iron, brass and copper.
- An appropriate primer for anaerobic curable compositions may be applied to a surface of the chosen substrate to enhance cure rate.
- a method of preparing an anaerobic curable composition is provided, a step of which includes mixing together a (meth)acrylate component, an anaerobic cure system, and an LAA.
- a process for bonding using the anaerobic curable composition the steps of which include applying the composition to a desired substrate surface and exposing the composition to an anaerobic environment for a time sufficient to cure the composition.
- anaerobic cure promoter compound including (I) mixing the anaerobic cure promoter compound in an anaerobic curable composition or (II) applying onto a surface of a substrate the anaerobic cure promoter compound and applying thereover an anaerobic curable composition.
- a bond formed between mated substrates with the anaerobically curable composition including (I) mixing the anaerobic cure promoter compound in an anaerobic curable composition or (II) applying onto a surface of a substrate the anaerobic cure promoter compound and applying thereover an anaerobic curable composition.
- butyl vinyl ether is butyl vinyl ether.
- An LAA adhesion promoter, 1,4-butanediol diacetal diacrylate (BDDAA), was prepared by reacting (meth)acrylic acid with 1,4-butanediol divinyl ether, as described below.
- reaction was monitored by FT-IR until complete. Once completion was confirmed, the reaction was twice washed with water (100 mL), separated, dried over anhydrous magnesium sulfate, gravity filtered, and concentrated in vacuo at 40°C and ⁇ 50 Torr to an oil. The product was then further dried at 40°C and ⁇ 1 Torr in a vacuum oven. A clear and colorless oil was obtained, later identified as 1-4-butanediol diacetal diacrylate (BDDAA).
- BDDAA 1-4-butanediol diacetal diacrylate
- This compound remained stable during storage in a sealed container at room temperature for 7 months, showing no signs of degradation and remaining unchanged during the storage period. [0060] Further, the compound remained stable when added to an anaerobic curable composition prior to anaerobic cure.
- Composition A represents a commercially available retaining compound sold by Henkel Corporation under the product name Retaining Compound 638. This composition uses free, (unblocked) (meth)acrylic acid as an adhesion promoter.
- Composition B is an inventive composition and has a substantially identical composition to composition A except the LAA of the present invention is used in place of the free AA.
- composition C has substantially the identical composition as A and B, except neither free AA nor LAA is present.
- compositions A and C are comparative examples, with
- Composition A using conventional acrylic acid as an adhesion promoter, and Composition C not using any acrylic acid adhesion promoter.
- Composition B is a labile (meth)acrylic acid compound.
- Comparative shear strengths were conducted using ASTM D4562, ISO 10123, and MIL-R-46082 standard test methods.
- a tension/comparison testing machine equipped with a suitable cell load and capable of maintaining a constant displacement rate was used.
- the pin/collar test specimens were placed on a texture which supported the collar but not the pin and allowed for the pin to be placed under compressive force and to move relative to the collar when the adhesive bond failed.
- the crosshead speed of the testing machine was 2 mm/min.
- Compressive shear strengths as shown in Table III demonstrate substantially better strengths for the Composition B as compared to Compositions A and C.
- composition B The thermal stability for Composition B is within the acceptable range for an anaerobic retaining compound. Moreover, with storage at ambient temperature the stability of the 3 compositions was unchanged over 4 months. The ambient stability of the 3 compositions is summarized in Table IV, below.
- Composition D represents a control retaining compound using free (meth)acrylic acid (unblocked) as an adhesion promoter.
- Composition E has a substantially identical composition to Composition A, except LAA is used in place of the free AA.
- butyl acetal acrylate added on a percent weight basis that is equimolar to the amount of acrylic acid used in Example A; (2) 5% NQ in polyethyleneglycol (meth)acrylate mixture; (3) 3.5% solution; (4) 1- acetyl-2-phenylhydrazine; (5) cumene hydroperoxide.
- BAA butyl acetal acrylate
- Comparative shear strengths were conducted using ASTM D4562, ISO 10123, and MIL-R-46082 standard test methods.
- a tension/comparison testing machine equipped with a suitable cell load and capable of maintaining a constant displacement rate was used.
- the pin/collar test specimens were placed on a texture which supported the collar but not the pin and allowed for the pin to be placed under compressive force and to move relative to the collar when the adhesive bond failed.
- the crosshead speed of the testing machine was 2 mm/min.
- Compressive shear strengths as shown in Table VI demonstrate better strengths for the Composition E as compared to Composition D at 4 and 24 hours.
- composition E The thermal stability for Composition E is within the acceptable range for an anaerobic retaining compound. Moreover, with storage at ambient temperature the stability of the
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- Polymers & Plastics (AREA)
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US201461987201P | 2014-05-01 | 2014-05-01 | |
US201462061389P | 2014-10-08 | 2014-10-08 | |
PCT/US2015/028908 WO2015168630A1 (en) | 2014-05-01 | 2015-05-01 | Anaerobic curable compositions containing blocked (meth)acrylic acid compounds |
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EP3137569A1 true EP3137569A1 (de) | 2017-03-08 |
EP3137569A4 EP3137569A4 (de) | 2017-11-01 |
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EP15785613.9A Active EP3137569B1 (de) | 2014-05-01 | 2015-05-01 | Anaerobe härtbare zusammensetzungen mit blockierten (meth)acrylsäureverbindungen |
EP15786258.2A Active EP3137513B1 (de) | 2014-05-01 | 2015-05-01 | Anaerobe härtbare zusammensetzungen mit blockierten dicarboxylsäureverbindungen |
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JP6608931B2 (ja) * | 2014-12-24 | 2019-11-20 | フイルメニツヒ ソシエテ アノニム | プロフレーバー送達粒子 |
US10638779B2 (en) * | 2014-12-24 | 2020-05-05 | Firmenich Sa | Hemiacetyl proflavors |
EP4067394A4 (de) * | 2019-11-26 | 2024-02-21 | ThreeBond Co., Ltd. | Härtbare zusammensetzung |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3970505A (en) | 1973-01-15 | 1976-07-20 | Loctite Corporation | Anaerobic compositions and surface activator therefor |
US4321349A (en) | 1975-05-23 | 1982-03-23 | Loctite Corporation | Accelerator for curable compositions |
US4302570A (en) * | 1978-08-01 | 1981-11-24 | Eschem Inc. | Reactive plasticizer for anaerobic adhesives |
DE2911661A1 (de) | 1979-03-24 | 1980-09-25 | Bayer Ag | Verfahren zur herstellung von thiazolidin-2-thionen |
US4215209A (en) * | 1979-06-22 | 1980-07-29 | National Starch And Chemical Corporation | Anaerobic curing composition and process for preparing same |
US4324349A (en) | 1980-01-14 | 1982-04-13 | Kaufman John George | Container for dispensing liquid |
US4525232A (en) * | 1984-04-16 | 1985-06-25 | Loctite (Ireland) Ltd. | Polymerizable acrylic compositions having vinyl ether additive |
US5411988A (en) | 1993-10-27 | 1995-05-02 | Bockow; Barry I. | Compositions and methods for inhibiting inflammation and adhesion formation |
US5605999A (en) | 1995-06-05 | 1997-02-25 | Loctite Corporation | Anaerobically curable silicones |
EP1795544B1 (de) | 1997-07-03 | 2010-01-27 | Henkel Loctite Corporation | Anaerobe klebstoffzusammensetzungen kontrollierter stärke für hohe temperaturen welche bei umgebungsbedingungen härtbar sind |
US6048587A (en) * | 1998-10-01 | 2000-04-11 | Ricon Resins, Inc. | Water-dispersible, radiation and thermally-curable polymeric compositions |
US7067601B2 (en) * | 2000-11-15 | 2006-06-27 | Henkel Corporation | Multi-functional alpha-alkoxyalkyl acrylate and methacrylate ester compositions and reworkable polymers formed therefrom |
US6835762B1 (en) * | 2002-05-31 | 2004-12-28 | Henkel Corporation | Cure accelerators for anaerobic curable compositions |
US6627762B1 (en) * | 2002-10-23 | 2003-09-30 | John G. Woods | Acetal and hemiacetal ester linked propylene carbonate functional (meth)acrylic esters and method of making same |
US7728092B1 (en) | 2006-04-13 | 2010-06-01 | Henkel Corporation | Anaerobically curable compositions |
US8598279B2 (en) * | 2007-07-23 | 2013-12-03 | Henkel IP US LLC | Adducts useful as cure components for anaerobic curable compositions |
US8609881B2 (en) * | 2008-05-07 | 2013-12-17 | Henkel IP US LCC | Cure accelerators for anaerobic curable compositions |
US7951884B1 (en) * | 2009-03-31 | 2011-05-31 | Loctite (R&D) Limited | Cure accelerators for anaerobic adhesive compositions |
CN106047183B (zh) | 2009-10-15 | 2018-03-02 | 汉高知识产权控股有限责任公司 | 厌氧固化组合物 |
WO2014043720A1 (en) * | 2012-09-17 | 2014-03-20 | Ndsu Research Foundation | Blocked bio-based carboxylic acids and their use in thermosetting materials |
JP2011190440A (ja) * | 2010-02-18 | 2011-09-29 | Hitachi Chem Co Ltd | 電子部品用液状樹脂組成物及び電子部品装置 |
JP5467469B2 (ja) | 2011-01-04 | 2014-04-09 | 山栄化学株式会社 | プリント配線基板に表面実装する方法 |
JP5554368B2 (ja) * | 2012-04-27 | 2014-07-23 | 富士フイルム株式会社 | レーザー彫刻用樹脂組成物、レーザー彫刻用フレキソ印刷版原版及びその製造方法、並びに、フレキソ印刷版及びその製版方法 |
US9365750B2 (en) * | 2012-06-27 | 2016-06-14 | Henkel IP & Holding GmbH | Accelerators for curable compositions |
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US9828327B2 (en) | 2017-11-28 |
EP3137513A1 (de) | 2017-03-08 |
WO2015168576A1 (en) | 2015-11-05 |
EP3137569B1 (de) | 2020-04-15 |
EP3137513A4 (de) | 2017-11-15 |
US20170044089A1 (en) | 2017-02-16 |
US20170044088A1 (en) | 2017-02-16 |
US9994510B2 (en) | 2018-06-12 |
EP3137569A4 (de) | 2017-11-01 |
WO2015168630A1 (en) | 2015-11-05 |
EP3137513B1 (de) | 2019-12-11 |
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