EP3112315A1 - Method for filling, on wafer, chip-level atomic clock absorption bubbles with high-purity alkali metal - Google Patents
Method for filling, on wafer, chip-level atomic clock absorption bubbles with high-purity alkali metal Download PDFInfo
- Publication number
- EP3112315A1 EP3112315A1 EP14884030.9A EP14884030A EP3112315A1 EP 3112315 A1 EP3112315 A1 EP 3112315A1 EP 14884030 A EP14884030 A EP 14884030A EP 3112315 A1 EP3112315 A1 EP 3112315A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- alkali metal
- wafer
- absorption
- cavities
- absorption cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000010521 absorption reaction Methods 0.000 title claims abstract description 60
- 229910052783 alkali metal Inorganic materials 0.000 title claims abstract description 58
- 150000001340 alkali metals Chemical class 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 44
- 150000001339 alkali metal compounds Chemical class 0.000 claims abstract description 26
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 18
- 239000010703 silicon Substances 0.000 claims abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000011521 glass Substances 0.000 claims abstract description 12
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 229910052792 caesium Inorganic materials 0.000 claims abstract description 8
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000006243 chemical reaction Methods 0.000 claims abstract description 8
- 238000000354 decomposition reaction Methods 0.000 claims abstract description 8
- 229910052701 rubidium Inorganic materials 0.000 claims abstract description 8
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 claims abstract description 8
- 230000008569 process Effects 0.000 claims abstract description 5
- 239000005357 flat glass Substances 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 239000012535 impurity Substances 0.000 abstract description 2
- 230000004308 accommodation Effects 0.000 abstract 3
- 238000005452 bending Methods 0.000 abstract 1
- 230000001112 coagulating effect Effects 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 32
- 239000007789 gas Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- -1 silicon alkali metal Chemical class 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 241001247287 Pentalinon luteum Species 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000005472 transition radiation Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G04—HOROLOGY
- G04F—TIME-INTERVAL MEASURING
- G04F5/00—Apparatus for producing preselected time intervals for use as timing standards
- G04F5/14—Apparatus for producing preselected time intervals for use as timing standards using atomic clocks
Abstract
Description
- The present invention relates to a method for filling wafer-based chip-scale atomic clock absorption cells with a high-purity alkali metal.
- All our daily life, scientific research, navigation, surveying and mapping and other work can't be separated from time. Time measurement relates to two quantities-epochs and time intervals. Any natural phenomena with periodical changes can be used to measure time. As timing instruments have also constantly developed with humans' progress over 3,500 years, people's demand for timing accuracy is becoming higher and higher. As for timing instruments, people developed sundials which take advantage of the periodic change law of earth rotation to identify time changes, then sand clocks, astronomical clock towers, mechanical pendulum clocks, quartz clocks, atomic clocks and optical clocks. It is clear that all of them use the natural phenomena with periodic changes to measure time.
- As one of the most accurate timing instruments at present, the theory of the atomic clocks was first put forward in the 1930s and then the atomic clocks were produced. Gradually, more and more atomic clocks have been used in national defense and scientific research. In recent years, miniature chip-scale atomic clocks produced by using MEMS (Micro-Electro-Mechanical Systems) technology have begun to develop. The development of clocks will make breakthroughs in receivers' clock performance, be more widely applied to timing frequency standards of all kinds and have a revolutionary social impact.
- An atomic clock is an instrument which realizes accurate time measurement by using atomic transition radiation frequency between hyperfine energy levels in the atomic ground state. The miniature atomic clock based on the CPT (Coherent Population Trapping) phenomenon is an inexorable development trend of atomic clock miniaturization. And the miniaturization of its core chip alkalis metal vapor cavity plays a critical role in the miniaturization of the atomic clock.
- At present, the technical methods for filling micro absorption cells with an alkali metal can mainly be divided into two categories. One category is to directly inject a pure alkali metal (such as rubidium and cesium) into the absorption cell. This category needs an sophisticated large vacuum equipment and a strict vacuum environment. A trace of residual oxygen in the cavity may lead to the oxidization of the alkali metal and then reduce the service life of the atomic clocks. The second category is to directly inject alkali metal compounds into the absorption cell cavity to produce the corresponding alkali metal through chemical reactions. This category needs to strictly control the amount of the compounds which are injected into the absorption cell while the residual impurities of the reactions may remain in the absorption cell and then affect the atomic clock performance. In addition, the two categories share the same disadvantage: absorption cells need to be filled one by one so it is difficult to realize production on a large scale.
- The present invention puts forward a method for filling wafer-based chip-scale atomic clock absorption cells with a high-purity alkali metal. The present invention aims at overcoming the problem of the prior art that alkali metals are extremely prone to oxidization during the production of atomic clock absorption cells. Through the method of wafer level filling and partial reactions, the present invention realizes the filling of all absorption cells on the wafer at the same time to meet the demand for large-scale production of atomic clocks. The present invention is characterized by low cost and high efficiency.
- The technical solution to the present invention: a method for filling wafer-based chip-scale atomic clock absorption cells with a high-purity alkali metal. The present invention is characterized in that the method comprises the following process steps:
- (1) using the MEMS ICP etching technique to form micro grooves, absorption cell cavity grooves and placement cavity grooves on the silicon wafer;
- (2) using the three-layer wafer level anodic bonding technique to form prefabricated temporary micro flow channels, absorption cell cavities and placement cavities, and sealing the placement cavities at the center of the wafer after putting the alkali metal compound into the placement cavities;
- (3) controlling the chemical reaction intensity of the alkali metal compounds by separately adjusting the temperature of the placement cavities to realize the decomposition of the alkali metal compounds to produce a needed amount of rubidium or cesium and make rubidium or cesium vaporize;
- (4) passing the prefabricated temporary micro flow channel and cooling part of the absorption cell cavity to make alkali metal gas congeal in the absorption cell cavities; and
- (5) reusing the three-layer wafer level anodic bonding technique to make the sheet glass bend under the influence of electrostatic force to eliminate the prefabricated temporary micro flow channels and seal all the absorption cells at the same time.
- The invention has the advantages of easy processes and rapid, low-cost, large-scale production of atomic clock alkali metal absorption cells.
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FIG. 1 a is a schematic representation of using the MEMS ICP etching technique to formmicro grooves 102, alkali metalplacement cavity grooves 103 and absorptioncell cavity grooves 104 on the double-side polishedsilicon wafer 101. -
FIG. 1b is a schematic representation of using the three-layer wafer level anodic bonding technique to form prefabricated temporarymicro flow channels 108,absorption cell cavities 104 and alkalimetal placement cavities 103. -
FIG. 1c is a schematic representation of making the alkali metal compound decompose by adjusting the temperature of the alkalismetal placement cavities 103 to produce alkali metal gas which passes through the prefabricated temporary micro flow channel and cooling part of the absorption cell cavity to make the alkali metal gas congeal in the absorption cell cavities. -
FIG. 1d is a schematic representation of sealing all the alkali metal absorption cell cavities. -
FIG. 2 is a schematic representation of a single alkali metal absorption cell of an atomic clock. - In the drawings, the following reference numbers are used: 101. double-side polished silicon wafers; 102. shallow micro grooves; 103. alkali metal compound placement cavities; 104. alkali metal absorption cell cavities; 105. sheet glass A; 106. alkali metal compounds; 107. sheet glass B; 108. temporary micro flow channels; 109. alkali metal vapor; 110. equipment for partial cooling; 111. high-purity solid alkali metal; 201. high-purity alkali metal; 202. silicon alkali metal absorption cell cavities; 203. upper-layer glass; and 204. lower-layer glass.
- A method for filling wafer-based chip-scale atomic clock absorption cells with a high-purity alkali metal is characterized in that the method comprises the following process steps:
- (1) using the MEMS ICP etching technique to form micro grooves, absorption cell cavity grooves and placement cavity grooves on the silicon wafer;
- (2) using the three-layer wafer level anodic bonding technique to form prefabricated temporary micro flow channels, absorption cell cavities and placement cavities, and sealing the placement cavities at the center of the wafer after putting the alkali metal compound into the placement cavities;
- (3) controlling the chemical reaction intensity of the alkali metal compound by separately adjusting the temperature of the placement cavities to realize the decomposition of the alkali metal compound to produce a needed amount of rubidium or cesium and make rubidium or cesium vaporize;
- (4) passing the prefabricated temporary micro flow channel and cooling part of the absorption cell cavity to make alkali metal gas congeal in the absorption cell cavities; and
- (5) reusing the three-layer wafer level anodic bonding technique to make the sheet glass bend under the influence of electrostatic force to eliminate the prefabricated temporary micro flow channels and seal all the absorption cells at the same time.
- The glass-silicon-glass three-layer wafer level anodic bonding technique is carried out in two steps: the first step is to form temporary micro flow channels for alkali metal vapor; and the second step is to reuse the anodic bonding technique to realize the sealing of the alkali metal compound.
- Make the alkali metal compound in the placement cavities react chemically by separately adjusting the temperature of the placement cavities to produce high-purity alkali metal through decomposition. The intensity of decomposition reactions can be controlled by adjusting the temperature of the alkali metal placement cavities.
- The flow channel of the alkali metal vapor is that the alkali metal vapor diffuses into the absorption cell through silicon-glass temporary micro flow channel and congeals in the absorption cell through partial cooling.
- Make the silicon wafer with the temporary micro flow channels re-bond with the sheet glass. During the re-bonding process, increase pressure or voltage to make the sheet glass bend under the influence of electrostatic force to eliminate prefabricated temporary micro channels and realize the sealing of all alkali metal absorption cell cavities.
- Carve a shallow
micro groove 102 which is 1-2 µm in depth and 80-90 mm in diameter on one side of a 4-cun double-sidepolished silicon wafer 101, and an alkali metalcompound placement cavity 103 which is 20 mm in diameter at the center of the double-sidepolished silicon wafer 101. Carve an array of alkali metalabsorption cell cavities 104 in square which is 2 mm in length within the scope of the shallowmicro groove 102 on the double-sidepolished silicon wafer 101. The alkali metalcompound placement cavity 103 and the alkali metalabsorption cell cavity 104 both have a through-hole structure, running through the double-sidepolished silicon wafer 101, as shown inFIG. 1a . - Bond the side of the double-side
polished silicon wafer 101 without the shallowmicro groove 102 with asheet glass A 105 through the silicon-glass wafer level anodic bonding. Put a well-computed amount ofalkali metal compound 106 in the alkalimetal compound cavity 103, and bond the side of the double-sidepolished silicon wafer 101 with the shallowmicro groove 102 with asheet glass B 107 through the silicon-glass wafer level anodic bonding. The shallowmicro groove 102 and thesheet glass B 107 constitute the micro flow channel of the alkali metal vapor together to form a small vacuum environment, as shown inFIG. 1 b. - Separately adjust the temperature of the alkali metal
compound placement cavity 103 by a reaction device to make thealkali metal compound 106 decompose to separate outalkali metal vapor 109. Thealkali metal vapor 109 diffuses in the whole cavity including the alkali metalabsorption cell cavity 104 through the temporarymicro flow channel 108. An equipment forpartial cooling 110 can adjust the temperature of the double-sidepolished silicon wafer 101 excluding the alkali metalcompound placement cavity 103. Thealkali metal vapor 109 congeals at the bottom of the alkali metalabsorption cell cavity 104 to become a high-puritysolid alkali metal 111 used to fill the alkali metalabsorption cell cavity 104, as shown inFIG. 1c . - Re-bond the double-side
polished silicon wafer 101 with thesheet glass B 107 through the silicon-glass wafer level anodic bonding. During the bonding process, increase pressure (1800 mbar-2000 mbar) or voltage (-800 V- -1000 V) to make thesheet glass B 107 bend under the influence of electrostatic force to eliminate the prefabricated temporarymicro flow channel 108 and realize the sealing of all the alkali metalabsorption cell cavities 104, as shown inFIG. 1d . - As shown in
FIGS. 1a to 1d , the atomic clock alkali metal absorption cells made by the wafer level technique can be cut into individual atomic clock alkali metal absorption cells by slicing the wafer. As shown inFIG. 2 , a high-purity alkali metal 201 is placed in a silicon alkali metalabsorption cell cavity 202 which is sealed by an upper-layer glass 203 and alower glass 204.
Claims (5)
- A method for filling wafer-based chip-scale atomic clock absorption cells with a high-purity alkali metal, characterized in that the method comprises the following process steps:(1) using a MEMS ICP etching technique to form micro grooves, absorption cell cavity grooves and placement cavity grooves on a silicon wafer;(2) using a three-layer wafer level anodic bonding technique to form prefabricated temporary micro flow channels, absorption cell cavities and placement cavities, and sealing the placement cavities at the center of the wafer after putting alkali metal compound into the placement cavities;(3) controlling the chemical reaction intensity of the alkali metal compound by separately adjusting the temperature of the placement cavities to realize the decomposition of the alkali metal compound to produce a needed amount of rubidium or cesium and make rubidium or cesium vaporize;(4) passing the prefabricated temporary micro flow channel and cooling part of the absorption cell cavity to make alkali metal gas congeal in the absorption cell cavities; and(5) reusing the three-layer wafer level anodic bonding technique to make a sheet glass bend under the influence of electrostatic force to eliminate the prefabricated temporary micro flow channel and seal all absorption cells at the same time.
- The method of claim 1, characterized in that a glass-silicon-glass three-layer wafer level anodic bonding technique is carried out in two steps: the first step is to form temporary micro flow channels for alkali metal vapor; and the second step is to reuse the anodic bonding technique to realize the sealing of the alkali metal compound.
- The method of claim 1, characterized in that the alkali metal compound in the placement cavities react chemically by separately adjusting the temperature of the placement cavities to produce high-purity alkali metal through decomposition and the intensity of decomposition reactions can be controlled by adjusting the temperature of alkali metal placement cavities.
- The method of claim 1, characterized in that flow channel of the alkali metal vapor is that the alkali metal vapor diffuses into the absorption cell through silicon-glass temporary micro flow channel and congeals in the absorption cell through partial cooling.
- The method of claim 1, characterized in that: the silicon wafer with the temporary micro flow channels is re-bonded with the sheet glass by reusing the wafer level anodic bonding technique; during the bonding process, pressure or voltage is increased to make the sheet glass bend under the influence of electrostatic force to eliminate the prefabricated temporary micro flow channel and realize the sealing of all alkali metal absorption cell cavities.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410067976.0A CN103864007B (en) | 2014-02-27 | 2014-02-27 | The high purity alkali metal fill method that chip-scale atomic clock absorbs bubble is realized at sheet |
PCT/CN2014/000816 WO2015127577A1 (en) | 2014-02-27 | 2014-09-02 | Method for filling, on wafer, chip-level atomic clock absorption bubbles with high-purity alkali metal |
Publications (4)
Publication Number | Publication Date |
---|---|
EP3112315A1 true EP3112315A1 (en) | 2017-01-04 |
EP3112315A4 EP3112315A4 (en) | 2017-03-08 |
EP3112315A8 EP3112315A8 (en) | 2017-06-28 |
EP3112315B1 EP3112315B1 (en) | 2021-07-14 |
Family
ID=50903111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP14884030.9A Active EP3112315B1 (en) | 2014-02-27 | 2014-09-02 | Method for filling csac absorption cells with high-purity alkali metal |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3112315B1 (en) |
KR (1) | KR101824789B1 (en) |
CN (1) | CN103864007B (en) |
WO (1) | WO2015127577A1 (en) |
Families Citing this family (5)
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CN103864007B (en) | 2014-02-27 | 2016-03-30 | 中国电子科技集团公司第五十五研究所 | The high purity alkali metal fill method that chip-scale atomic clock absorbs bubble is realized at sheet |
CN104609364B (en) * | 2015-01-28 | 2016-05-11 | 中国科学院上海光学精密机械研究所 | Preparation method and the system of high accuracy mixed buffer gas alkali metal atom steam bubble |
CN107840305B (en) * | 2017-11-13 | 2019-05-10 | 北京无线电计量测试研究所 | A kind of production method of the MEMS Atom-Cavity of chip atomic clock |
CN111855579A (en) * | 2019-04-28 | 2020-10-30 | 核工业理化工程研究院 | Alkali metal atom vapor absorption cell and spectral measurement method thereof |
CN114477074A (en) * | 2021-12-22 | 2022-05-13 | 北京自动化控制设备研究所 | Wafer-level atomic gas chamber processing method and device based on MEMS technology |
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-
2014
- 2014-02-27 CN CN201410067976.0A patent/CN103864007B/en active Active
- 2014-09-02 EP EP14884030.9A patent/EP3112315B1/en active Active
- 2014-09-02 KR KR1020157036179A patent/KR101824789B1/en active IP Right Grant
- 2014-09-02 WO PCT/CN2014/000816 patent/WO2015127577A1/en active Application Filing
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US7893780B2 (en) * | 2008-06-17 | 2011-02-22 | Northrop Grumman Guidance And Electronic Company, Inc. | Reversible alkali beam cell |
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Also Published As
Publication number | Publication date |
---|---|
CN103864007B (en) | 2016-03-30 |
KR101824789B1 (en) | 2018-02-01 |
EP3112315A4 (en) | 2017-03-08 |
CN103864007A (en) | 2014-06-18 |
EP3112315A8 (en) | 2017-06-28 |
KR20160013122A (en) | 2016-02-03 |
EP3112315B1 (en) | 2021-07-14 |
WO2015127577A1 (en) | 2015-09-03 |
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