EP3006885A1 - Ensemble de caloducs hybride avec des ailettes liées à la plaque de base - Google Patents

Ensemble de caloducs hybride avec des ailettes liées à la plaque de base Download PDF

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Publication number
EP3006885A1
EP3006885A1 EP15188786.6A EP15188786A EP3006885A1 EP 3006885 A1 EP3006885 A1 EP 3006885A1 EP 15188786 A EP15188786 A EP 15188786A EP 3006885 A1 EP3006885 A1 EP 3006885A1
Authority
EP
European Patent Office
Prior art keywords
baseplate
heat pipe
heat
complex
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15188786.6A
Other languages
German (de)
English (en)
Other versions
EP3006885B1 (fr
Inventor
Ahmed Zaghlol
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mersen Canada Toronto Inc
Original Assignee
Mersen Canada Toronto Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mersen Canada Toronto Inc filed Critical Mersen Canada Toronto Inc
Publication of EP3006885A1 publication Critical patent/EP3006885A1/fr
Application granted granted Critical
Publication of EP3006885B1 publication Critical patent/EP3006885B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements

Definitions

  • the following disclosure is directed generally to hybrid heat pipe assemblies.
  • a device usually generates heat as a result of losses in efficiency.
  • a heat sink is a passive heat exchanger that can cool a device by transferring heat generated by the device into a surrounding cooling medium, such as air.
  • a heat sink may have a baseplate that can extract heat from a device that is in contact with the baseplate.
  • a heat sink may also include an assembly of fins bonded to the baseplate that can transfer the extracted heat from the baseplate to the surrounding cooling medium.
  • a heat pipe apparatus is also a heat exchanger than can cool a device by transferring heat generated by the device into a surrounding cooling medium.
  • the heat pipe apparatus may include an evaporator plate that can extract heat from a device that is in contact with the evaporator plate.
  • the apparatus may also include a plurality of heat pipes in contact with the evaporator plate that can transfer heat from the evaporator plate to another location using liquid-to-vapor phase changes.
  • Each of the heat pipes includes a working fluid, such as water, sealed in a long thin walled cavity under vacuum.
  • the cavity may be cylindrical or rectangular, but is not limited thereto.
  • the working fluid boils and is converted into vapor.
  • the vapor moves from the heated portion, or an evaporating area, of the pipe to a lower temperature area, or a condensing area, of the heat pipe via an adiabatic portion of the pipe where no phase change takes place.
  • the lower temperature area of the heat pipe is at an opposite end of the heat pipe from the end of the heat pipe in contact with the evaporator plate. In the lower temperature area of the heat pipe, the vapor will condense back into a liquid. The liquid will move back to the heated area of the heat pipe via the adiabatic portion of the pipe to be heated and evaporated again. Thus, a two-phase flow cycle is created.
  • the condensed liquid moves from the lower temperature area of the heat pipe to the heated area of the heat pipe using gravity or a wicking structure. If the liquid moves back to the heated area as a result of gravity, the heat pipe has been oriented in such a way that gravity can draw the condensed liquid down toward the heated portion of the heat pipe.
  • such an orientation may include a heat pipe being angled downwardly from the lower temperature area of the heat pipe to the heated area of the heated pipe. This allows gravity to draw the condensed liquid from the higher, condensing area of the heat pipe toward the lower, evaporating area of the heat pipe.
  • a large fin stack is positioned around the lower temperature area, and possibly the adiabatic portion, of the heat pipe.
  • the fin stack can transfer the heat away from the heat pipes into the air through forced or natural convection.
  • Described herein are multiple example embodiments related to hybrid heat pipe assemblies.
  • a hybrid heat pipe in an aspect, includes a baseplate dimensioned to be placed in surface contact with a device, the baseplate being configured to extract heat from the device.
  • the assembly additionally includes a plurality of fins bonded to the baseplate, the fins being configured to transfer a first portion of the extracted heat from the baseplate to air surrounding the fins.
  • the assembly further includes a complex heat pipe extending from the baseplate and having an end positioned within the baseplate, the complex heat pipe being configured to receive and transfer a second portion of the extracted heat transferred from the baseplate.
  • the assembly includes a heat pipe fin stack to which the complex heat pipe is configured to transfer the second portion of heat, the heat pipe fin stack being joined to the complex heat pipe and configured to transfer the second portion of the extracted heat received from the complex heat pipe to air surrounding the stack.
  • the complex heat pipe extends from the baseplate and through the fins and the heat pipe fin stack.
  • the fins are bonded to the baseplate in a plurality of groups. The groups are separated from each other by the complex heat pipe.
  • the complex heat pipe extends from the baseplate and through two of the fin groups and the heat pipe fin stack.
  • each of the complex heat pipes extends through the heat pipe fin stack.
  • the heat pipe fin stack includes a heat pipe protective fin into which the complex heat pipe extends.
  • the heat pipe protective fin is positioned on an opposite side of the heat pipe fin stack from the fins.
  • the heat pipe protective fin is positioned adjacent to one end of the complex heat pipe.
  • another end of the complex heat pipe is embedded in the baseplate.
  • the fins are mounted to an opposite side of the baseplate from a side of the baseplate in contact with the device.
  • the complex heat pipe is embedded in the baseplate.
  • the complex heat pipe extends at an angle from the baseplate to an end of the complex heat pipe.
  • a hybrid heat pipe assembly for cooling a device in contact.
  • the assembly includes a baseplate dimensioned to be placed in surface contact with a device, the baseplate being configured to extract heat from the device.
  • the assembly also includes a plurality of fins bonded to the baseplate, the fins being configured to transfer a first portion of the extracted heat from the baseplate to air surrounding the fins.
  • the assembly further includes a complex heat pipe apparatus positioned within the baseplate, the apparatus including a chamber positioned within the baseplate and a plurality of complex heat pipes secured within the chamber, the complex heat pipes extending from the baseplate and having ends positioned within the baseplate, the chamber being configured to receive a second portion of the extracted heat transferred from the baseplate and transfer the second heat portion to the complex heat pipes, the complex heat pipes being configured to receive and transfer the second heat portion from the chamber.
  • the assembly additionally includes a heat pipe fin stack to which the complex heat pipes are configured to transfer the second portion of heat, the heat pipe fin stack being joined to the complex heat pipes and configured to transfer the second portion of the extracted heat received from the complex heat pipes to air surrounding the stack.
  • the complex heat pipes extend from the chamber through the fins and the heat pipe fin stack.
  • the fins are bonded to the baseplate in a plurality of groups, and the groups are separated from each other by the complex heat pipes.
  • the complex heat pipes extend from the chamber through two of the fin groups and the heat pipe fin stack.
  • the chamber is mounted horizontally in the baseplate.
  • the chamber is embedded in the baseplate.
  • the chamber is positioned in a baseplate channel comprising walls defining the baseplate channel, the chamber being secured to the walls.
  • FIGS. 1-6 illustrate an example hybrid heat pipe assembly in surface contact with a plurality of devices 4. While the devices 4 illustrated in FIG. 6 bear a common resemblance with electronic modules, embodiments described herein are not limited thereto. In fact, one having ordinary skill in the art may use the hybrid heat pipe assembly 2 to cool any applicable heat-generating device having the ability to be in contact with the hybrid heat pipe assembly 2.
  • the devices 4 illustrated in FIG. 6 are mounted to the hybrid heat pipe assembly 2 using fasteners 6, embodiments described herein are not limited thereto.
  • the devices 4 may merely be in contact with the hybrid heat pipe assembly 2 without being fixed or mounted thereto.
  • the devices 4 contacting the hybrid heat pipe assembly 2 may be related or unrelated to each other.
  • the devices 4 may be in contact with or isolated from each other.
  • the devices 4 to be cooled by the hybrid heat pipe assembly 2 are positioned with respect to the hybrid heat pipe assembly in such a way as to maximize surface contact with the hybrid heat pipe assembly 2, thereby serving to increase an amount of heat extracted from the devices 4 by the hybrid heat pipe assembly 2.
  • the illustrated hybrid heat pipe assembly 2 may combine various aspects and elements of a bonded fin heat sink and a heat pipe apparatus.
  • the hybrid heat pipe assembly 2 is not limited thereto and can be further supplemented by other heat transfer means known by those of ordinary skill in the art.
  • the example hybrid heat pipe assembly 2 described and illustrated herein includes a baseplate 8 in contact with the devices 4, baseplate fins 10 bonded to the baseplate 8, a complex heat pipe 12 extending from the baseplate 8 and having an end positioned within the baseplate 8, and a heat pipe fin stack 14 joined to the complex heat pipe 12.
  • the baseplate 8 is configured to extract heat from the devices 4 in contact with the baseplate 8.
  • the devices 4 illustrated in FIG. 6 are mounted to the baseplate 8 using fasteners 6, embodiments described herein are not limited thereto.
  • the devices 4 may be in contact with the baseplate 8 without being fixed or mounted thereto.
  • the devices 4 may be related or unrelated to each other or other items contacting the baseplate 8.
  • the baseplate 8 may have a shape consistent with that of a rectangular block. However, embodiments disclosed herein are not limited thereto as the baseplate 8 can have any shape or structure that is effective in cooling devices in contact therewith. Further, while the baseplate 8 is illustrated in the example herein as being flat or planar, embodiments described here are not limited thereto, as the baseplate 8 may be curved or otherwise to maximize surface contact with the devices 4 and extract heat from the devices 4 as efficiently as possible. Thus, the shape and design of the baseplate 8 may be adjusted for effective extraction of heat from whatever device might be in surface contact therewith.
  • the baseplate 8 may be mounted on a corresponding structure such that an edge line 20 of the baseplate 8 is parallel with gravity.
  • embodiments disclosed herein are not limited thereto, as the baseplate 8 can be mounted in any plane particularly suited for cooling the devices 4 in contact therewith, as long as requirements for cooling the heat-generating devices 4 are met and acceptable support is provided for the baseplate 8.
  • the heat extracted from the devices 4 by the baseplate 8 may be transferred therefrom to the baseplate fins 10 bonded to the baseplate 8.
  • the heat received by the baseplate fins 10 may be directly transferred to the air surrounding the baseplate fins 10.
  • the baseplate fins 10 may be mounted directly on the baseplate 8 or on a fin plate 30 that is subsequently mounted on the baseplate 8. If mounted directly on the baseplate 8, each of the baseplate fins 10 may include a flange (not shown) via which the baseplate fin 10 is fastened to the baseplate 8. The flange may extend from an edge of a body 32 of the baseplate fin 10 in a substantially perpendicular manner that is additionally substantially parallel with the sides 16, 18 of the baseplate 8.
  • the baseplate fins 10 may be bonded to the baseplate 8 in a plurality of groups.
  • the baseplate fins 10 may be mounted to an opposite side 16 of the baseplate 8 from a side 18 of the baseplate 8 in contact with the devices 4.
  • the heat generated by the devices 4 may be too substantial to be effectively dissipated solely by the baseplate fins 10.
  • the excess heat may be dissipated from the baseplate 8 through the complex heat pipe 12.
  • the complex heat pipe 12 may transfer the received excess heat from the baseplate 8 to the heat pipe fin stack 14 for subsequent dissipation to air surrounding the heat pipe fin stack 14.
  • the complex heat pipe 12 may also be positioned on the opposite side 16 of the baseplate 8 from the side 18 of the baseplate 8 in contact with the devices 4.
  • the complex heat pipe 12 may be mounted on the complex heat pipe side of the baseplate 8 in a location that corresponds with a location of the devices 4 positioned on the opposite side 18 of the baseplate 8. When the complex heat pipe 12 is mounted on the baseplate 8 in such a location, the heat extraction from the devices 4 may be more efficient.
  • the complex heat pipe 12 may be similar in design to a clarinet heat pipe or a tube that has been fabricated to seal a working fluid under vacuum pressure.
  • Several complex heat pipes 12 may be mounted in the baseplate 8 to extend therefrom. Ends of the complex heat pipes 12 may also be embedded in the baseplate 8.
  • a complex heat pipe 12 may separate one group of the baseplate fins 10 from another group of the baseplate fins 10.
  • the complex heat pipe 12 may extend from the baseplate 8 and through the baseplate fins 10 and the heat pipe fin stack 14.
  • the baseplate fins 10 may be mounted to and arranged on the baseplate 8 in a plurality of separated groups.
  • the groups of the baseplate fins 10 may be separated from each other by a complex heat pipe 12 extending from the baseplate 8, between the groups of the baseplate fins 10, and through the heat pipe fin stack 14.
  • two groups of baseplate fins 10 may be separated by a complex heat pipe 12 mounted to the baseplate 8 in an area between the two groups of the baseplate fins 10.
  • the complex heat pipe 12 may extend between and past the baseplate fins 10 and into the heat pipe fin stack 14.
  • the heat pipe fin stack 14 may be separated from the baseplate 8 by the baseplate fins 10.
  • a complex heat pipe apparatus 22 may include a plurality of the complex heat pipes 12 secured within a closed chamber 24 that is positioned within the baseplate 8.
  • the complex heat pipes 12 may be secured within respective recesses in the closed chamber 24 by brazing the heat pipes 12 to respective walls that define the recesses.
  • the chamber 24 may be embedded in a baseplate channel 26 formed within the baseplate 8 such that chamber 24 can fit therein.
  • the chamber 24 may be welded to walls that define the baseplate channel 26.
  • the closed chamber 24 may act as a fluid reservoir within the baseplate 8 to expedite the transfer of heat from the baseplate 8 using a two-phase flow cycle created within the complex heat pipes 12.
  • the closed chamber 24 may be mounted at a location in the baseplate 8 that enhances or maximizes heat extraction from the devices 4.
  • the chamber 24 may be placed within a baseplate channel 26 at a location on the side 18 at which the devices 4 make surface contact with the baseplate 8.
  • the baseplate channel 26 location on the side 16 may be essentially opposite a location on the side 18 at which the devices 4 are in surface contact therewith.
  • the chamber 24 and the channel 26 may be correspondingly oriented to maximize exposure to devices 4 in surface contact with the baseplate 8 in order to enhance or maximize extraction of heat therefrom.
  • both the chamber 24 and the channel 26 are illustrated herein as being straight, embodiments disclosed herein are not limited thereto, as the channel 24 can be correspondingly curved to a curved channel 26 and of the baseplate 8 in order to maximize heat extraction from a correspondingly positioned and/or shaped group of devices 4 making surface contact with the baseplate 8.
  • the heat pipe fin stack 14 may include a heat pipe protective fin 28 to provide protection for a complex heat pipe 12 extending therethrough.
  • the heat pipe protective fin 28 may be positioned on an opposite side of the heat pipe fin stack 14 from the baseplate fins 10 and adjacent to one end 36 of the complex heat pipe 12.
  • the pipe end 36 may extend through the heat pipe protective fin 28, such that the pipe end 36 is separated from a remainder of the complex heat pipe 12 by the heat pipe protective fin 28.
  • an end cap 34 may be positioned on the pipe end 36 of the complex heat pipe 12 to provide additional protection to the complex heat pipe 12.
  • the complex heat pipe 12 is positioned to absorb excess heat from the baseplate 8 when cooling requirements are high enough that the baseplate fins 10 are unable to effectively cool the devices 4 contacting the baseplate 8. As a result, melting of a devices 4 due to insufficient cooling may be inhibited.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP15188786.6A 2014-10-08 2015-10-07 Ensemble de caloducs hybride avec des ailettes liées à la plaque de base Active EP3006885B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462061311P 2014-10-08 2014-10-08
US14/872,259 US20160102920A1 (en) 2014-10-08 2015-10-01 Heat pipe assembly with bonded fins on the baseplate hybrid

Publications (2)

Publication Number Publication Date
EP3006885A1 true EP3006885A1 (fr) 2016-04-13
EP3006885B1 EP3006885B1 (fr) 2020-06-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP15188786.6A Active EP3006885B1 (fr) 2014-10-08 2015-10-07 Ensemble de caloducs hybride avec des ailettes liées à la plaque de base

Country Status (3)

Country Link
US (1) US20160102920A1 (fr)
EP (1) EP3006885B1 (fr)
CA (1) CA2907056C (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016104729A1 (ja) * 2014-12-25 2017-10-05 三菱アルミニウム株式会社 冷却器
JPWO2016104727A1 (ja) * 2014-12-25 2017-10-05 三菱アルミニウム株式会社 冷却器
WO2019229876A1 (fr) * 2018-05-30 2019-12-05 三菱電機株式会社 Dispositif de refroidissement

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM526264U (zh) * 2016-03-21 2016-07-21 Taiwan Microloops Corp 液冷式散熱裝置及其散熱結構
USD822625S1 (en) * 2016-04-26 2018-07-10 Showa Denko K.K. Fin for heat exchanger
CN111788876B (zh) * 2017-12-08 2023-07-07 株式会社Kmw 电子元件的散热装置
CN109659288A (zh) * 2018-12-28 2019-04-19 福建龙净环保股份有限公司 一种组合散热装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0952612A1 (fr) * 1998-04-23 1999-10-27 Ferraz Date Industries Echangeur de chaleur, notamment pour le refroidissement d'un composant électronique de puissance, et son procédé de fabrication
EP1387139A2 (fr) * 2002-08-02 2004-02-04 Mitsubishi Aluminum Co.,Ltd. Caloduc et échangeur de chaleur avec caloducs
US20050094375A1 (en) * 2003-11-05 2005-05-05 Chiang Tsai L. Integrated heat dissipating device with curved fins
US20050135062A1 (en) * 2003-12-23 2005-06-23 Kiley Richard F. Heat sink, assembly, and method of making
US6964295B1 (en) * 2004-11-16 2005-11-15 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
DE102004042154A1 (de) * 2004-08-31 2006-03-02 Asia Vital Components Co., Ltd. Kühler
US20070008702A1 (en) * 2005-07-08 2007-01-11 Asustek Computer Inc. Extendable heat dissipation apparatus
US20070144705A1 (en) * 2005-12-28 2007-06-28 Chun-Chi Chen Heat sink
US20110024088A1 (en) * 2009-07-29 2011-02-03 Kuo-Len Lin Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5253702A (en) * 1992-01-14 1993-10-19 Sun Microsystems, Inc. Integral heat pipe, heat exchanger, and clamping plate
US7140422B2 (en) * 2002-09-17 2006-11-28 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe in direct contact with component
US6894900B2 (en) * 2002-09-17 2005-05-17 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe and base fins
TW553371U (en) * 2002-12-02 2003-09-11 Tai Sol Electronics Co Ltd Liquid/vapor phase heat dissipation apparatus
US6779595B1 (en) * 2003-09-16 2004-08-24 Cpumate Inc. Integrated heat dissipation apparatus
TW200530548A (en) * 2004-03-10 2005-09-16 Quanta Comp Inc Heat dissipation device with heat pipes
US6945319B1 (en) * 2004-09-10 2005-09-20 Datech Technology Co., Ltd. Symmetrical heat sink module with a heat pipe for spreading of heat
US6978829B1 (en) * 2004-09-24 2005-12-27 Asia Vital Component Co., Ltd. Radiator assembly
TWM282235U (en) * 2005-06-24 2005-12-01 Golden Sun News Tech Co Ltd Improved structure of a heat dissipating device using heat pipes
US7509996B2 (en) * 2005-12-27 2009-03-31 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7891411B2 (en) * 2007-06-22 2011-02-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a fan for dissipating heat generated by at least two electronic components
US20100181047A1 (en) * 2009-01-20 2010-07-22 Kuo-Len Lin Fins-type heat sink and method for assembling the same
EP2211135B1 (fr) * 2009-01-22 2013-05-29 Cpumate Inc. Dissipateur de chaleur de type à ailettes et son procédé d'assemblage
CN101861082A (zh) * 2009-04-11 2010-10-13 富准精密工业(深圳)有限公司 散热装置
CN102083296A (zh) * 2009-11-27 2011-06-01 鸿富锦精密工业（深圳）有限公司 散热装置
CN102238847A (zh) * 2010-04-28 2011-11-09 富准精密工业(深圳)有限公司 散热装置
TWM426756U (en) * 2011-08-04 2012-04-11 Cooler Master Co Ltd Heat sink with the heat pipe protection mechanism
CN203057774U (zh) * 2013-01-10 2013-07-10 杭州天明电子有限公司 电除尘器高压电源用热管散热器
JP6104380B2 (ja) * 2013-06-20 2017-03-29 三菱電機株式会社 車両用の電力変換装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0952612A1 (fr) * 1998-04-23 1999-10-27 Ferraz Date Industries Echangeur de chaleur, notamment pour le refroidissement d'un composant électronique de puissance, et son procédé de fabrication
EP1387139A2 (fr) * 2002-08-02 2004-02-04 Mitsubishi Aluminum Co.,Ltd. Caloduc et échangeur de chaleur avec caloducs
US20050094375A1 (en) * 2003-11-05 2005-05-05 Chiang Tsai L. Integrated heat dissipating device with curved fins
US20050135062A1 (en) * 2003-12-23 2005-06-23 Kiley Richard F. Heat sink, assembly, and method of making
DE102004042154A1 (de) * 2004-08-31 2006-03-02 Asia Vital Components Co., Ltd. Kühler
US6964295B1 (en) * 2004-11-16 2005-11-15 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20070008702A1 (en) * 2005-07-08 2007-01-11 Asustek Computer Inc. Extendable heat dissipation apparatus
US20070144705A1 (en) * 2005-12-28 2007-06-28 Chun-Chi Chen Heat sink
US20110024088A1 (en) * 2009-07-29 2011-02-03 Kuo-Len Lin Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016104729A1 (ja) * 2014-12-25 2017-10-05 三菱アルミニウム株式会社 冷却器
JPWO2016104727A1 (ja) * 2014-12-25 2017-10-05 三菱アルミニウム株式会社 冷却器
WO2019229876A1 (fr) * 2018-05-30 2019-12-05 三菱電機株式会社 Dispositif de refroidissement

Also Published As

Publication number Publication date
CA2907056A1 (fr) 2016-04-08
US20160102920A1 (en) 2016-04-14
EP3006885B1 (fr) 2020-06-17
CA2907056C (fr) 2017-11-21

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