EP2989871A1 - Dispositif de placement et procédé de placement permettant d'orienter dans la bonne position un substrat et/ou de l'équiper d'un composant - Google Patents

Dispositif de placement et procédé de placement permettant d'orienter dans la bonne position un substrat et/ou de l'équiper d'un composant

Info

Publication number
EP2989871A1
EP2989871A1 EP14724334.9A EP14724334A EP2989871A1 EP 2989871 A1 EP2989871 A1 EP 2989871A1 EP 14724334 A EP14724334 A EP 14724334A EP 2989871 A1 EP2989871 A1 EP 2989871A1
Authority
EP
European Patent Office
Prior art keywords
substrate
component
camera
placement
camera devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14724334.9A
Other languages
German (de)
English (en)
Inventor
Michael Koch
Matthias Winkler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Finetech GmbH and Co KG
Original Assignee
Finetech GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Finetech GmbH and Co KG filed Critical Finetech GmbH and Co KG
Publication of EP2989871A1 publication Critical patent/EP2989871A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0818—Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts

Definitions

  • Placement device and placement method for positionally accurate alignment and / or equipping a substrate with a component The invention relates to a placement device for
  • the object is to arrange components automatically on a substrate.
  • the components may e.g. Memory chips or microprocessors that need to be deposited on a substrate.
  • Other examples are the mounting of VCSEL devices, photodiodes, MEMS devices or chip-on-glass devices.
  • a further processing of the substrate takes place together with the component.
  • u.U. a more durable connection of substrate and device, e.g. by thermocompression, ultrasound, soldering or gluing.
  • Placers are known, e.g. from DD 242 320 AI or DE 195 24 475 Cl, in which the deposition of a component takes place on a substrate by means of lever arms.
  • Component It has a first holding device for the at least one component or the substrate at the free end of a pivotable about a pivot axis lever arm and a second holding device for each complementary
  • Two camera devices are used, a first optical axis of a first camera device being aligned with a first holding device having at least one component or a substrate and a second optical axis of a second camera device being aligned with the second holding device with the respective complementary substrate or component.
  • a position evaluation device is used to create an output data record from a processing of the images of the camera devices, wherein the output data set a
  • Overlay if necessary simultaneously recorded images of the first and second camera device for display on an output device and / or the output data has image data of the first and second camera device with difference data relative positions of the device and substrate
  • the placement device allows a number of
  • the captured images in the form of the output data set can be automatically, e.g. be further processed with an automatic pattern recognition.
  • the captured images can be automatically, e.g. be further processed with an automatic pattern recognition.
  • Output device eg a screen directly to the placement device
  • Output device eg a screen directly to the placement device
  • the optical axes of the camera devices are movable parallel to the respective object plane, in particular linearly displaceable.
  • a plurality of positions of a component and / or substrate can be optically detected, which is especially true for larger
  • Components or substrates is useful.
  • Camera devices are formed pivotable from the pivoting range of the lever arm.
  • the angle is equal to 180 ° or equal to 90 °.
  • an advantageous embodiment has a
  • Holding device for the substrate or the component, wherein an adjustment in at least one degree of freedom is possible.
  • the adjustment can accordingly along at least one translational degree of freedom and / or a rotational degree of freedom.
  • the pad is thus part of an adjusting device.
  • a particularly simple structure results when the first and second camera device are of identical construction.
  • the placement device has a number of correction means.
  • a first correction means minimizes optical errors, in particular distortions, in the images of the camera devices by means of calibration data.
  • a second correction means is the
  • Correction means serves to clear the mechanical positions of the camera devices. These correction means may be used singly or in combination with each other.
  • Result of the position evaluation device takes place in real time, so that an operator is able to manually with a calibration device a spatial
  • Output device in particular a screen
  • Placement device has means for further processing of the component and the substrate, in particular means for
  • the object is also achieved by a placement method with the features of claim 14.
  • Fig. 1A is a perspective view of a first
  • Embodiment with two fixed camera devices Embodiment with two fixed camera devices
  • Fig. 1B is a side view of the first embodiment
  • Fig. 2A is an illustration of a second embodiment with two camera devices which are slidable in parallel;
  • Fig. 2B is a perspective view of the second
  • Fig. 3A is a perspective view of a third embodiment
  • FIG. 3B is a side view of the third embodiment
  • Fig. 4 is a perspective view of a first
  • Fig. 5 is a perspective view of a fifth
  • Embodiment as a variant of the third embodiment, in which the lever arm is pivotable at an angle other than 90 °;
  • FIG. 6 is a block diagram of the functionality of a
  • Fig. 7 is a block diagram of an embodiment of a
  • Output data sets as an indication on an output device
  • Fig. 8 is a block diagram of an embodiment of a
  • FIG. 9 is a block diagram of an embodiment of a
  • FIGS. 1A and 1B A first embodiment of a placement device 100 is shown in FIGS. 1A and 1B.
  • Such placing devices 100 are e.g. to
  • the component 2 is here arranged on a lever arm 11 on a first holding device 10, and the substrate 1 on a base 21 of a second
  • the substrate 1 is arranged on the lever arm 11 and the component 2 is located on the base 21.
  • component 2 and substrate 1 are guided by a movement to each other, wherein it
  • the device 2 and the substrate 1 are basically irrelevant whether the device 2 and / or the substrate 1 are moved.
  • the device 2 and the substrate 1 are complementary to each other when they
  • the substrate 1 is arranged on a base 21, which is designed to be movable in all three spatial directions. This corresponds to three translatory degrees of freedom.
  • the possibilities of movement along the spatial directions X, Y, Z are shown in FIG. 1A by Double arrows shown.
  • rotational degrees of freedom ⁇ x , ⁇ y , ⁇ z may also be provided. These too are shown in FIG. 1A.
  • the substrate 1 can be positioned in space, this positioning relative to the first
  • Holding device 10 takes place.
  • Embodiments lack the height adjustability in the Z direction. This may be for certain placement tasks
  • the first holding device 10 has a lever arm 11 which can be pivoted about the axis A (see rotary arrow W in FIG. 1A), at the end of which the component 2 which is complementary to the substrate 1 is arranged, ie. that on this
  • Substrate 1 fits.
  • the distance B between the pivot axis A and the component 2 arranged on the lever arm 11 corresponds to the distance B between the pivot axis A and the substrate 1 arranged on the support 21.
  • the lever arm 11 is shown in the here
  • Embodiment by nominal 90 ° pivotally mounted If it requires the assembly, the lever arm 11 can also be pivoted up to 270 °.
  • the first optical axis 32 of the first camera device 31 is aligned perpendicular to the base 21 (see FIG. 1B) in order to optically detect the substrate 1 on the base 21.
  • Perpendicular to the first optical axis 32 is a second optical axis 34 of the second camera device 33
  • the two optical axes 32, 34 are both in a plane E (see Fig. 1B). This level E cuts that
  • Substrate 1 lies on a square with the side length B (see Fig. 1B).
  • the two camera devices 31, 33 are stationary relative to one another and are arranged outside the pivoting range of the lever arm 11, possibly with connected components 1.
  • the two camera devices 31, 33 are with a
  • Position evaluation device 50 e.g. one
  • Lüaustechnischsvorraum 50 may in particular be integrated into the placement device 100. It can also be a correction device 60 (with various correction means 71, 72, 73) and / or an image recognition system 63
  • the independent determination of the spatial position of device 2 and substrate 1 relative to the placement device 100 using the images of the first and second camera device 31, 33 is possible.
  • the images of the camera devices 31, 33 are obtained simultaneously, so that no movements of the camera devices 31, 33 are required.
  • the attitude evaluation device 50 creates a
  • Output data set 41 (which may also consist of several parts) from the captured images of the camera devices 31, 33. Basically, several ways of data processing of the output data set 41 are possible. So can the
  • Output data set 41 can be directly processed by e.g. an automatic image processing is applied, which automatically detects the position of substrate 1 and
  • Component 2 determined and taken into account in the further control. For this, e.g. predetermined markers
  • the output data set 41 has a superposition of the two images of the camera devices 31, 33, which are then displayed on an output device 40.
  • This embodiment is shown schematically in FIG. 1A. A machine operator can on the output device 40 directly the relative
  • Dispenser 40 to use simultaneously
  • the output data set 41 has, for example, difference data that arising from the position of the device 2 relative to the position of the substrate 1.
  • the differences are determined by an automatic image processing, for example by means of pattern recognition from the images, the camera devices 31, 33
  • the camera devices 31, 33 can be equipped with a zoom device (mechanical and / or software).
  • FIG. 2A and 2B A second embodiment is shown in Figs. 2A and 2B
  • Placement device 100 corresponds to the first
  • the camera devices 31, 33 are in this case displaceable parallel to the respective object planes, in particular parallel to the pivot axis A, and outside the pivot range of the
  • Lever arm 11 is arranged. In the first alignment position, this embodiment corresponds to that in FIGS. 1A, 1B
  • the displaceability allows the detection of partial structures of component 1 and substrate 2 at further positions, which is advantageous in particular for precise alignment of large components 1.
  • the third embodiment according to FIGS. 3A, 3B is a
  • first three embodiments can also be used in conjunction with a lever arm 11, which is designed to be pivotable by more than 90 °.
  • lever arm 11 which is designed to be pivotable by more than 90 °.
  • Fig. 4 is another variant of the first two
  • Fig. 4 it is shown that the lever arm 11 is opened by 180 ° relative to the base 21. This becomes more mechanical
  • Free space created e.g. in an efficient way for an automatic tool change or a
  • Fully automatic component feeder can be used.
  • Embodiment - are fixed relative to each other, but together are parallel to the object plane, in particular to the pivot axis A slidably.
  • the camera devices 31, 33 are outside the pivoting range
  • Fig. 5 is a variant of the embodiments
  • the camera devices 31, 33 are arranged within the pivoting range. So if the lever arm 11 is pivoted, must be before
  • Fig. 6 is shown schematically as a
  • Placement device 100 or a placement method allows superposition of images.
  • the two camera devices 31, 33 occupy a substrate 1 (symbolized by a distorted cross) and a
  • Component 2 symbolized by a distorted rectangle.
  • the image of the substrate 35 and the image of the device 36 are superimposed by the position evaluation device 50 in real time and displayed on the display device as an output device 40.
  • the superimposed image 37 shows that component 1 and substrate 2 are not optimally adjusted relative to each other, so that a manual position correction is possible in a simple manner.
  • the output data set 41 in this embodiment comprises the superimposed image 37 of the two images 35, 36 of substrate 1 and component 2.
  • the overlaid image 37 can be displayed.
  • Embodiment shown in FIG. 6 It is assumed that the camera images of the camera devices 31, 33 are a systematic error of the
  • Placement device 100 are offset.
  • Systematic errors can be caused, for example, by optical errors of the
  • Camera devices 31, 33 such as distortions, and / or caused by mechanical errors of the placement.
  • Fig. 7 it is shown that the image of the substrate 35 and the image of the device 36 are distorted by optical errors. Since they are systematic errors, they may be corrected by the correction device 60, which may be coupled to the position evaluation device 50.
  • correction steps 61, 62 can cause optical errors, in particular Distortions in the images of the camera devices 31, 33 are minimized by means of calibration data.
  • a second correction means 72 see eg FIG. 1A
  • Images of the camera devices 31, 33 are compensated with calibration data.
  • a third correction means 73 see, for example, Fig. 1A
  • the mechanical positions of the camera devices 31, 33 are included.
  • Correction device 60 equalized images 35 ', 36' of
  • Substrate 1 and component 2 are generated. These are then superimposed in real time and merged into an output data set 41 (see, e.g., Fig. 1A). When overlaying, the positions of the
  • the further processing corresponds to that in FIG. 6
  • Output data set 41 in this embodiment comprises the superimposed image 37 of the two images 35, 36 of substrate 1 and component 2.
  • FIG. 8 shows a variant of the embodiment according to FIG. 7, but without overlapping the images for the purpose of display on one Output device 40.
  • an equalized image of the substrate 35 'and an equalized image of the component 36' are also generated here. These equalized images 35 ', 36' are then input to
  • Image recognition using e.g. Markers can be evaluated. Taking into account the recorded
  • Pixel scale and the positions of the camera devices 31, 33 takes place for both images 35 ', 36' is a conversion 66, 67 in machine coordinates of the placement device 100. It is considered that the mechanical
  • Placement device 100 is now a calculation of position correction values 68. These position correction values 68 are
  • Position correction values include feedback, e.g. by a coupled to the position evaluation device 50
  • Adjustment can be done.
  • the adjustment device may e.g. these position correction values directly in
  • test step 80 it is determined by means of the output data record 41 whether the
  • Component 2 is positioned correctly relative to the substrate 1. If not, the component 2 and / or the substrate 1 is realigned by means of the adjusting device in an adjusting step 81 and a new one is created
  • the component 2 is placed on the substrate 1 in the placement step 82. Subsequently, in a

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne un dispositif de placement permettant d'orienter dans la bonne position un substrat (1) et/ou de l'équiper d'au moins un composant (2) complémentaire de celui-ci. Ce dispositif est pourvu d'un premier dispositif de retenue (10) pour le ou les composants (2) ou le substrat (1) à l'extrémité libre d'un bras de levier (11) pouvant pivoter autour d'un axe de pivotement (A), d'un deuxième dispositif de retenue (20) pour le substrat (1) respectivement complémentaire ou le composant. • a) Un premier axe optique (34) d'un premier dispositif à caméra (33) est orienté sur le premier dispositif de retenue (10) pourvu d'au moins un composant (2) ou d'un substrat (1), et • b) un deuxième axe optique (32) d'un deuxième dispositif à caméra (31) est disposé sur le deuxième dispositif de retenue (20) pourvu du substrat ou du composant (1, 2) respectivement complémentaire, et • c) le dispositif de placement comprend un dispositif d'évaluation de position (50) destiné à établir un jeu de données de sortie (41) à partir d'un traitement des images des dispositifs à caméra (31, 33), le jeu de données de sortie (41) présentant une superposition des images du premier et du deuxième dispositif à caméra (31, 33) destinées à être affichées sur un dispositif de sortie (40) et/ou le jeu de données de sortie (41) présentant des données de différence par rapport aux positions relatives du composant (2) et du substrat (1), enregistrées avec le premier et le deuxième dispositif à caméra (31, 33).
EP14724334.9A 2013-04-25 2014-04-24 Dispositif de placement et procédé de placement permettant d'orienter dans la bonne position un substrat et/ou de l'équiper d'un composant Withdrawn EP2989871A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201310207599 DE102013207599A1 (de) 2013-04-25 2013-04-25 Platziervorrichtung und Platzierverfahren zum lagegenauen Ausrichten und /oder Bestücken eines Substrates mit einem Bauelement
PCT/EP2014/058359 WO2014174020A1 (fr) 2013-04-25 2014-04-24 Dispositif de placement et procédé de placement permettant d'orienter dans la bonne position un substrat et/ou de l'équiper d'un composant

Publications (1)

Publication Number Publication Date
EP2989871A1 true EP2989871A1 (fr) 2016-03-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP14724334.9A Withdrawn EP2989871A1 (fr) 2013-04-25 2014-04-24 Dispositif de placement et procédé de placement permettant d'orienter dans la bonne position un substrat et/ou de l'équiper d'un composant

Country Status (3)

Country Link
EP (1) EP2989871A1 (fr)
DE (1) DE102013207599A1 (fr)
WO (1) WO2014174020A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10694648B2 (en) 2017-01-06 2020-06-23 Korvis LLC System for inserting pins into an article

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6522644B2 (ja) * 2014-11-11 2019-05-29 株式会社Ｆｕｊｉ 電子部品装着機の制御装置及びその制御装置へのデータ入力装置
NL1041403B1 (en) * 2015-07-21 2017-02-07 Brilan Tech B V Method and device for positioning a substrate and a component for mounting thereon relative to each other.
DE102022100467A1 (de) 2022-01-11 2023-07-13 Nemak, S.A.B. De C.V. Verfahren zum Herstellen eines Kernpaketsegments für eine Gießform

Citations (3)

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Publication number Priority date Publication date Assignee Title
EP0592878A2 (fr) * 1992-10-15 1994-04-20 Eckhard Dr. Ehlermann Procédé et dispositif de contrôle des cartes à pointes pour tester des circuits intégrés
US5883663A (en) * 1996-12-02 1999-03-16 Siwko; Robert P. Multiple image camera for measuring the alignment of objects in different planes
WO2002097534A2 (fr) * 2001-05-31 2002-12-05 Blakell Europlacer Limited Appareil et procede permettant d'aligner un article sur une objet de reference

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Publication number Priority date Publication date Assignee Title
DD242320A1 (de) 1985-11-07 1987-01-21 Inst Fuer Nachrichtentechnik Vorrichtung zum positionieren elektronischer bauelemente auf leitungssubstraten
DE4119401C2 (de) * 1991-06-10 1998-07-23 Finetech Ges Fuer Elektronik T Vorrichtung zum Bestücken eines Schaltungsträgers mit elektronischen Bauelementen
DE19524475C1 (de) 1995-07-10 1996-11-14 Fraunhofer Ges Forschung Optische Zentriervorrichtung zum lagegenauen Bestücken eines Bauelements in Oberflächenmontagetechnik sowie deren Verwendung zur Montage von Laserdioden
DE19708464C2 (de) * 1997-02-19 2001-10-04 Hubert Zach Bestückungsvorrichtung zum koplanaren Aufsetzen von Bauelementen auf Leiterplatten
DE19857263A1 (de) * 1998-12-11 2000-03-16 Peter Gammelin Verfahren und Vorrichtung zum Positionieren von Bauelementen auf Trägern

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Publication number Priority date Publication date Assignee Title
EP0592878A2 (fr) * 1992-10-15 1994-04-20 Eckhard Dr. Ehlermann Procédé et dispositif de contrôle des cartes à pointes pour tester des circuits intégrés
US5883663A (en) * 1996-12-02 1999-03-16 Siwko; Robert P. Multiple image camera for measuring the alignment of objects in different planes
WO2002097534A2 (fr) * 2001-05-31 2002-12-05 Blakell Europlacer Limited Appareil et procede permettant d'aligner un article sur une objet de reference

Non-Patent Citations (1)

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Title
See also references of WO2014174020A1 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10694648B2 (en) 2017-01-06 2020-06-23 Korvis LLC System for inserting pins into an article

Also Published As

Publication number Publication date
DE102013207599A1 (de) 2014-10-30
WO2014174020A1 (fr) 2014-10-30

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