EP2976929B1 - Procédé de fabrication d'un circuit imprimé flexible, circuit imprimé flexible obtenu par ce procédé et module de carte à puce comportant un tel circuit imprimé flexible - Google Patents

Procédé de fabrication d'un circuit imprimé flexible, circuit imprimé flexible obtenu par ce procédé et module de carte à puce comportant un tel circuit imprimé flexible Download PDF

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Publication number
EP2976929B1
EP2976929B1 EP14712260.0A EP14712260A EP2976929B1 EP 2976929 B1 EP2976929 B1 EP 2976929B1 EP 14712260 A EP14712260 A EP 14712260A EP 2976929 B1 EP2976929 B1 EP 2976929B1
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EP
European Patent Office
Prior art keywords
adhesive material
layer
electrically conductive
face
sheet
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Active
Application number
EP14712260.0A
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German (de)
English (en)
French (fr)
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EP2976929A1 (fr
Inventor
Christophe Mathieu
Nordin BOUZID
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Linxens Holding SAS
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Linxens Holding SAS
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to the field of flexible printed circuits.
  • Such flexible printed circuits can be used for example to produce electronic modules for smart cards, RFID antennas, light emitting diodes.
  • the invention is illustrated below by taking the example of electronic modules for smart cards, but it is easily transferable to other applications of flexible printed circuits such as those mentioned above.
  • Smart cards are well known to the public, which has multiple uses: credit cards, SIM card for mobile phones, transport cards, identity cards, etc.
  • Smart cards generally consist of a rigid plastic support type PVC, PVC / ABS or polycarbonate constituting the bulk of the card, which is incorporated into a separately manufactured electronic module.
  • This electronic module comprises a generally flexible circuit board provided with an electronic chip (integrated circuit) and transmission means for transmitting data from the chip to a card reader device (reading) or from this device to the card (writing) .
  • the document EP1975856A1 for example describes such a printed circuit.
  • the data transmission means can be "contact”, “non-contact” or “dual” when they combine the two previous means.
  • a connector comprises contact pads electrically connected to the chip and flush with the electronic module, on the surface of the support, for an electrical contact connection with a card reader device.
  • the data is transmitted to the chip by means of a radiofrequency system operating between an antenna in the reader and an antenna in the card.
  • the transmission means are both "contact” and “non-contact”
  • the electronic module comprising a flexible circuit is provided with a single electronic chip capable of managing both transmission modes of data.
  • the modules are generally formed from a dielectric substrate covered on at least one of its faces by an electrically conductive layer, constituted for example by a metal such as copper or an alloy of copper, steel or aluminum.
  • an electrically conductive layer constituted for example by a metal such as copper or an alloy of copper, steel or aluminum.
  • transmission means such as electrical contact pads.
  • the dielectric substrates used in the prior art are made of composite materials (glass-epoxy) or plastic materials (PET, PEN, polyimide, etc.).
  • PET, PEN, polyimide, etc. This dielectric substrate is generally thin (the thickness of which is for example of the order of 100 ⁇ m) to maintain flexibility compatible with continuous electronic module manufacturing processes.
  • the assembly consisting of the substrate covered with the conductive layer forms a flexible circuit.
  • the conductive layer is generally bonded to the substrate by means of a thin layer of electrically insulating adhesive material (the thickness of which is for example of the order of 20 ⁇ m) previously coated on the substrate.
  • An object of the invention is to provide an alternative to the methods of manufacturing flexible circuits of the prior art, which meets the requirements and specifications required for this type of application while being more economical.
  • an object of the invention is to provide a flexible circuit compatible with the usual methods and techniques of continuous assembly of modules for smart cards (chip fixing die-attach according to the English terminology, son welding - "wire-bonding" according to the English terminology, UV or thermal encapsulation) and with the usual methods of inserting the modules in the card bodies.
  • a method of manufacturing a flexible circuit wherein the insulating substrate usually made of composite or plastic materials or the like is removed.
  • a complex consisting essentially of at least one sheet of electrically conductive material and a layer of electrically insulating adhesive material may be sufficient to structure and metallize a printed circuit (this printed circuit comprising, for example, Examples of electrical contact pads, conductive tracks or alternating conductive tracks and planar antenna conductive inter-tracks as used in "contact” or “dual” chip card modules).
  • the adhesive material is for example a epoxy modified with a thermoplastic (polyamide type for example). Its viscosity is adapted so that it can be spread by coating at ambient temperature on an electrically conductive layer or a removable substrate. For example, its viscosity is of the order of 77 to 88 mPa.s. It has for example a glass transition temperature Tg of the order of 51.5 ° C plus or minus 5 ° C. Its solids content corresponds to about 20% (for example 20.6% plus or minus 0.6%). Its modulus E 'measured at 1 Hz and at 20.539 ° C. is, for example, 1.4 ⁇ 10 9 Pa and has a maximum tan ⁇ equal to 0.5945 at 56.307 ° C.
  • an adhesive material which can be applied by coating at ambient temperature (below 50 ° C.) is chosen. It is adhesive in that it adheres to the substrate on which it is coated. It can also be adhesive in that even after coating and drying, its adhesive properties can be reactivated by heating, its glass transition temperature Tg preferably being less than 100 ° C.
  • the method of manufacturing a flexible circuit therefore comprises providing a first sheet of electrically conductive material and depositing thereon a layer of electrically insulating adhesive material.
  • a first face of the adhesive material is contacted with one of the faces of the first sheet of electrically conductive material.
  • the second face of the adhesive material is not in contact with an insulating substrate, unlike the methods of the prior art.
  • the method according to the invention passes through a step at which the flexible circuit comprises only the first sheet of electrically conductive material and the layer of adhesive material, without insulating or dielectric substrate to support this complex.
  • the second side of the adhesive material is free. At least one zone of the second face of the adhesive material can be left uncovered.
  • this characteristic is combined with the use of an adhesive material formulated specifically to have hot-melt properties (hot-melt according to the English terminology) and reactivable at conventional embedding temperatures (for example at a temperature of order of 180 ° C).
  • hot-melt according to the English terminology
  • conventional embedding temperatures for example at a temperature of order of 180 ° C.
  • the complex thus obtained can be used to make a single-face flexible circuit, that is to say with an electrically conductive material on one side to form for example electrical contact pads while the other side (the second face of the layer of adhesive material) consists essentially of the free adhesive material.
  • the complex obtained by the process according to the invention can be used to form a double-sided flexible circuit, that is to say with an electrically conductive material on each of its faces (the layer of adhesive material being between the first and second sheets of electrically conductive material) to form, for example, electrical contact pads on one face and conductive tracks and / or coils of planar antenna (for example an ISO 14443-1 class 1 - so-called ISO antenna - or class 2 - so-called 1 ⁇ 2 ISO antenna) on the other side.
  • an electrically conductive material on each of its faces (the layer of adhesive material being between the first and second sheets of electrically conductive material) to form, for example, electrical contact pads on one face and conductive tracks and / or coils of planar antenna (for example an ISO 14443-1 class 1 - so-called ISO antenna - or class 2 - so-called 1 ⁇ 2 ISO antenna) on the other side.
  • the main face of the flexible circuit for chip card modules on which the contacts are arranged is called the front face or contact face (intended to come opposite a smart card reader).
  • the flexible circuit has of course a thickness delimited by this front face and another main face opposite thereto and called back face or face of the chip, by which or on which can be glued a chip.
  • the flexible circuit for chip card modules does not necessarily include a chip when first sold, but for a subsequent electrical connection of the chip with the contact pads of the front panel, it is expected to achieve at least one connecting well at least partially closed by a rear area of the contact.
  • the connection wells are made during a punch-matrix type mechanical perforation step or by laser.
  • the chip is mounted in the thickness of the substrate or on the back side of the substrate. It is then electrically connected to the contacts of the front face by conductive son welded into the connection wells.
  • the chip provided with appropriate protuberances can be connected to the contacts according to the technology of the flip chip (“flip-chip” according to the English technology), it that is to say on metal pads located on the rear face and connected to the contacts of the front face by connecting wells whose wall is metallized (double-sided structure with metallized holes).
  • One of the advantages of the present invention is to be able to connect a chip provided with these conductive protrusions to the contact pads of the front face not only in a double-sided structure but also in a single-sided structure by the easy adjustment of the thickness of the layer of adhesive material with the height of the conductive protrusions of the chip (for example of the order of 30 ⁇ m high).
  • the coating techniques such as reverse roll coating (English-language reverse roll coating) or curtain coating (curtain coating according to the English terminology) make it possible to deposit thicknesses of materials. Very thin adhesives (up to 5 ⁇ m after drying for example) with a tight tolerance to adjust to the height of the conductive protuberances.
  • Such a single-sided module with a chip thus connected directly through openings made in the layer of adhesive material is economically very advantageous compared to a single-sided module with a chip connected with 25 ⁇ m diameter welded gold wires. , or a double-sided module with metallized holes to connect the chip.
  • the layer of adhesive material is not necessarily self-supporting. In this case, it must be deposited on a support with the coating technologies mentioned above.
  • the first sheet of electrically conductive material can then be used as a support.
  • the complex thus obtained can then be perforated and then covered with the second sheet of electrically conductive material.
  • the layer of adhesive material is deposited on a removable substrate (a substrate consisting of a sheet of transfer paper for example).
  • the intermediate complex thus obtained may be perforated and then covered with the first sheet of electrically conductive material.
  • the removable substrate can then be removed. For example, it may be peeled at the time of hot lamination of the sheet of electrically conductive material.
  • the first and second sheets of electrically conductive material are for example constituted, each or both, of a metal such as copper or a copper alloy, steel or aluminum.
  • the electrical contact pads and the conductive tracks can be made on the first and second sheets of electrically conductive material by chemical etching or by mechanical cutting according to the so-called "leadframe" technology. That is to say that a connection grid is cut with a mechanical press in a sheet of electrically conductive material to form several electrical contacts possibly connected by conductive tracks. After mechanical cutting, then possibly metallization of the connection grid, it is laminated on the layer of adhesive material previously coated on a first sheet of electrically conductive material or on a removable substrate.
  • the invention also relates to a flexible circuit for a smart card module obtained by this method, or even a smart card module comprising such a flexible circuit.
  • a smart card 1 comprises a module 2.
  • the module 2 comprises a flexible circuit 3 and a chip 100.
  • the module 2 is generally made in the form of a separate element which is inserted into a cavity 4 formed in the card 1.
  • the flexible circuit 3 comprises a plurality of contacts 15 to which the chip 100 is connected.
  • the flexible circuit 3 is represented (at the top) as seen by its front face 6 (contact face). It is also shown (bottom) seen by its rear face 7.
  • the flexible circuit 3 shown is a single-sided flexible circuit for "contact” card. But it could just as easily be a flexible double-sided circuit for a "dual" card.
  • the flexible circuit 3 thus produced can be used to connect a chip and produce an electronic module according to different microelectronic assembly technologies.
  • the figure 2l schematically represents the result of steps in which a chip 100 is bonded, with a layer of adhesive 101, to the rear face 7 and connected to the front face 6 of the flexible circuit by son 102 of 25 ⁇ m diameter gold connections subsequently protected by an encapsulation resin 103.
  • the "flip-chip” technology makes it possible to bond, with a glue layer 101, a chip 100 connected to the front face 6 of the flexible circuit by conductive protrusions 104 ("bumps" according to the English technology) located under the chip on the rear face 7.
  • the module 2 therefore comprises a chip 100 electrically connected directly to the contacts 15 by means of conductive protuberances 104 housed in the connection wells 9.
  • an adhesive material 8 specially formulated to have intrinsic and irreversible hot-melt properties makes it possible to directly embed the module 2 obtained in the cavity 4 arranged in the body of the card 1 without the addition of additional hot melt film ( Fig. 2m ) as is the case in the prior art. All that is required is to subject the assembly consisting of the module 2 pressed on the card body 1, an appropriate heat treatment which allows the zones (at the level of the arrows HM) where the adhesive 8 is bare to stick to the edges of the cavity 4.
  • the module of the figure 2l but the module represented on the Figure 2l ' can be used in an equivalent way.
  • FIG. figure 3e An example of a flexible circuit 3 obtained by this other manufacturing method is shown in FIG. figure 3e .
  • the resulting structure is a double-sided non-metallized hole structure for "dual" cards for example.
  • This flexible circuit comprises a front face 6 with metallized contacts (here the layers of precious metals are not individually represented, they are combined in first 110 and second 120 conductive layers constituted respectively of a first and second layers of conductive material. , such as a copper alloy, coated with nickel and gold or palladium, It also comprises a rear face 7 with connection holes 9 and a cavity for receiving a chip at a later time. remain uncovered so as to be used, for example at the HM arrows, for a subsequent bonding of the module 2 in its cavity 4 (by the "hot-melt" technique for example).
  • FIG. 4 An example of a flexible circuit for producing a "dual" card is schematically represented on the figure 4 . It comprises metallized contacts on the front face 6 and a planar antenna 16 on the rear face 7. The conductive tracks and the antenna 16 made on the rear face 7 are shown in broken lines while the contacts 15 of the front face 6 are represented in solid lines. Between the contacts 15 on the one hand and the conductive tracks and the antenna 16 on the other hand is interposed a layer of adhesive material 8.
  • the antenna is in ISO 14443-1 class 2 format to be compatible with a card with embossing lines (forbidden zone for the antenna turns), but a flexible circuit for a "dual" card with an antenna twice as large (ie in ISO 14443-1 class 1 format) is feasible in the same way if the card does not have embossing lines.
  • this example corresponds to a structure on which a chip can be glued to the rear face and connected by means of wires to the contacts 15 through the connection holes 9. The transposition to a metallized hole structure is obviously all it's possible.
EP14712260.0A 2013-03-19 2014-03-19 Procédé de fabrication d'un circuit imprimé flexible, circuit imprimé flexible obtenu par ce procédé et module de carte à puce comportant un tel circuit imprimé flexible Active EP2976929B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1352468A FR3003722A1 (fr) 2013-03-19 2013-03-19 Procede de fabrication d'un circuit imprime flexible, circuit imprime flexible obtenu par ce procede et module de carte a puce comportant un tel circuit imprime flexible
FR1357749A FR3003723B1 (fr) 2013-03-19 2013-08-02 Procede de fabrication d'un circuit imprime flexible, circuit imprime flexible obtenu par ce procede et module de carte a puce comportant un tel circuit imprime flexible
PCT/EP2014/055555 WO2014147154A1 (fr) 2013-03-19 2014-03-19 Procédé de fabrication d'un circuit imprimé flexible, circuit imprimé flexible obtenu par ce procédé et module de carte à puce comportant un tel circuit imprimé flexible

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EP2976929A1 EP2976929A1 (fr) 2016-01-27
EP2976929B1 true EP2976929B1 (fr) 2018-12-12

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EP14712260.0A Active EP2976929B1 (fr) 2013-03-19 2014-03-19 Procédé de fabrication d'un circuit imprimé flexible, circuit imprimé flexible obtenu par ce procédé et module de carte à puce comportant un tel circuit imprimé flexible

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EP (1) EP2976929B1 (ko)
KR (1) KR102190847B1 (ko)
CN (1) CN105230134B (ko)
FR (2) FR3003722A1 (ko)
WO (1) WO2014147154A1 (ko)

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FR3020548B1 (fr) 2014-04-24 2020-02-14 Linxens Holding Procede de fabrication d'une structure pour carte a puce et structure de carte a puce obtenue par ce procede
FR3034614A1 (fr) * 2015-04-03 2016-10-07 Linxens Holding Procede de fabrication d’un circuit flexible, circuit flexible obtenu par ce procede et carte a puce comportant un tel circuit flexible
FR3040516B1 (fr) * 2015-08-27 2017-09-15 Linxens Holding Procede de fabrication d’un circuit electrique, circuit electrique obtenu par ce procede et carte a puce comportant un tel circuit electrique
WO2017095332A1 (en) * 2015-11-30 2017-06-08 Linxens Holding Method of manufacturing a laminated substrate for smart cards
FR3051313B1 (fr) * 2016-05-10 2019-08-02 Linxens Holding Procede de fabrication d’un circuit imprime, circuit imprime obtenu par ce procede et module de carte a puce comportant un tel circuit imprime
TWI567011B (zh) * 2016-06-15 2017-01-21 All Ring Tech Co Ltd Method and device for conveying the components of the bonding process
FR3063414B1 (fr) * 2017-02-27 2021-07-23 Linxens Holding Procede de fabrication d’un circuit electrique, circuit electrique obtenu par ce procede et carte a puce comportant un tel circuit electrique.
CN109522999A (zh) * 2017-09-19 2019-03-26 北京同方微电子有限公司 一种新的双界面卡片结构及封装方案
FR3098371B1 (fr) * 2019-07-05 2021-09-24 Linxens Holding Dispositif de connexion de carte a puce sur textile

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TWI299699B (en) * 2000-02-14 2008-08-11 Kaneka Corp Laminate comprising polyimide and conductor layer, wiring board with the use of the same and process for producing the same
TWI268813B (en) * 2002-04-24 2006-12-21 Sipix Imaging Inc Process for forming a patterned thin film conductive structure on a substrate
FR2914460B1 (fr) * 2007-03-30 2009-08-21 Oberthur Card Syst Sa Module electronique mince pour carte a microcircuit.
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Also Published As

Publication number Publication date
CN105230134A (zh) 2016-01-06
CN105230134B (zh) 2018-07-31
FR3003723A1 (fr) 2014-09-26
KR20150133249A (ko) 2015-11-27
FR3003723B1 (fr) 2018-11-16
FR3003722A1 (fr) 2014-09-26
EP2976929A1 (fr) 2016-01-27
WO2014147154A1 (fr) 2014-09-25
KR102190847B1 (ko) 2020-12-14

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