EP2945227A1 - Device for the connection of an electrical component with at least one electrical conductor and method for producing such a device - Google Patents

Device for the connection of an electrical component with at least one electrical conductor and method for producing such a device Download PDF

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Publication number
EP2945227A1
EP2945227A1 EP15167826.5A EP15167826A EP2945227A1 EP 2945227 A1 EP2945227 A1 EP 2945227A1 EP 15167826 A EP15167826 A EP 15167826A EP 2945227 A1 EP2945227 A1 EP 2945227A1
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EP
European Patent Office
Prior art keywords
carrier component
electrical conductor
electrical
plastic
component
Prior art date
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Granted
Application number
EP15167826.5A
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German (de)
French (fr)
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EP2945227B1 (en
Inventor
Michael Grotz
Sven Sautter
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Eugen Forschner GmbH
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Eugen Forschner GmbH
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Publication of EP2945227A1 publication Critical patent/EP2945227A1/en
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Publication of EP2945227B1 publication Critical patent/EP2945227B1/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405Securing in non-demountable manner, e.g. moulding, riveting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6683Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24Assembling by moulding on contact members

Definitions

  • the invention relates to a device for connecting an electrical component with at least one electrical conductor according to the preamble of claim 1.
  • the invention further relates to a method for producing such a device according to the preamble of claim 9.
  • a carrier element for electrical components in which a wire, which serves to produce an electrical connection, is embedded in a plastic material of the carrier element.
  • the object of the invention is to provide an improved device for connecting an electrical component with at least one electrical conductor and a method for producing such a device.
  • the inventive solution provides that at least one support member made of plastic connects to at least one strand of a cable as an electrical conductor and the other at least one connecting element for coupling an electrical component or an electrical assembly.
  • the carrier component ensures a simple, process-reliable, permanently sealed connection between the electrical conductor and the electrical component.
  • the carrier component with the strands fixed thereto replaces a three-dimensional 3D circuit carrier (MID) in a cost-effective manner, in which the electrical connections are in the form of copper conductor tracks.
  • MID three-dimensional 3D circuit carrier
  • the connection points for wired components can be made very flexible. For the fixation of the strands cheap joining techniques can be used and freely combined, such as splicing, crimping, soldering or welding.
  • the support member is formed of a molded plastic by injection molding.
  • a macromelt process or a hotmelt process in the form of thermoplastic or reactive (PUR) hotmelts.
  • the casting materials of the macromelt process are thermoplastic hot melt adhesives based on polyamide.
  • the carrier component can also be formed by at least one already prefabricated plastic molded part. This can optionally be additionally encapsulated after fixing the electrical conductors and the connecting elements with a plastic material. According to a further alternative, after fixing the electrical conductors and the connecting elements, a first prefabricated plastic molded part can also be surrounded by a second prefabricated plastic molded part or can be completed to a closed whole.
  • the fixation surrounds at least partially a plastic insulation of the at least one electrical conductor.
  • the fixation can be formed for example as a groove, in which the plastic insulation of the at least one electrical conductor is pressed and clamped there.
  • the connecting elements in turn, for example, as wires, as a connector or may be formed as sockets, be embedded in correspondingly shaped recesses on the support member.
  • the fixation of the electrical conductors can also be done in other ways, for example, by splicing, crimping, soldering or welding.
  • the support member has at least one recess, are guided over the spaced-apart stripped portions of the electrical conductors.
  • the stripping can also be done later after positioning and fixing the electrical conductor over this recess, the recess access to the tool - for example a Novaabisoliervorraum - facilitates stripping.
  • the carrier component additionally has holders for electronic components. This additionally increases the usefulness of the carrier component.
  • These holders for the electronic components are preferably provided on correspondingly shaped projections of the carrier component.
  • the projections may be integrally formed on the support member, but also be formed as a separate component and, for example, by a positive connection (clips, locking) or a cohesive connection (molding, plastic welding) are connected to the support member.
  • the carrier component comprises a cable receptacle for receiving a cable sheath of a cable having a plurality of electrical conductors.
  • the integration of a cable receptacle on the support member allows a well protected from dirt and moisture introduction of the electrical conductors in the support member.
  • the fixation is formed on an already prefabricated plastic molded part, which is placed for example in a mold and encapsulated by a non-conductive plastic.
  • FIG. 1 is an electronic assembly 40 electrically contacted with a cable 20 via a support member 10.
  • a projection 16 on the carrier component 10 serves to hold further electronic components.
  • FIG. 2 is the support member 10 and all other components required for the contacting are shown as an exploded view in not yet assembled state.
  • the five stranded wires 21, 22, 23, 24 and 25 have a stripped portion 28 just before their end.
  • the carrier component 10 has a cable receptacle 11 on the side of the cable 20.
  • the carrier component 10 furthermore has a strand holder 12 on which a plurality of fixations 13 are formed for the ends of the stranded conductors 21, 22, 23, 24 and 25. Fixations 13 are also provided at the other end of the support member 10. These serve to fix electrical conductors 17 or 18 or connectors 30.
  • the support member 10 has in its central region between the fixings 13 a recess 14 which is large enough that a tool for stripping the arranged within the recess 14 areas of Litz wires 21, 22, 23, 24 and 25 has access to the insulations of the stranded wires 21, 22, 23, 24 and 25 in order to partially remove them to produce the desired contact.
  • the conductors 17 are used in the embodiment shown for contacting a Hall IC or Hall sensor 32.
  • the lines 18 serve for contacting a capacitor 34.
  • the Hall IC 32 and the capacitor 34 are arranged as well as a magnet 36 on a projection 16 which either formed as an integral part of the support member 10 on an extension 15 thereof or which is connected as a separate prefabricated member 16 with the support member 10.
  • the projection 16 has a plurality of receptacles 161, 162 for mounting the electronic components (Hall sensor 32, capacitor 34, magnet 36), in which these are preferably held or locked in a form-fitting manner.
  • the holder 162 for the Hall sensor 32 is preferably designed so that the Hall sensor 32 is held in relation to the oppositely arranged magnet 36 under a defined bias voltage.
  • the support member 10 is preferably after fixing the in FIG. 2 shown stranded lines 21, 22, 23, 24 and 25, the lines 17 and 18 and the connector 30 and the additional electronic components 32, 34 and 36 of a further plastic component 19 sheathed or surrounded.
  • the further plastic component 19 can be produced as encapsulation in a mold; Alternatively, however, it can also be pushed over the carrier component 10 as a prefabricated hollow component and latched, welded or glued thereto. Due to the further plastic component 19, which forms a component of the carrier component 10 after application, a secure and permanent protection of the electrical connections from mechanical stresses and all weather influences arises in each case.
  • connection between the stranded conductors 21, 22, 23, 24 and 25 and the conductors 17 and the connectors 30 is produced by splice connections 31.
  • Splicing is a tried-and-tested process for reliable connections in the field of connection technology for printed circuit boards with strands.
  • the two wire leads 23 and 24 are additionally connected to the conductors 18 of the capacitor 34.
  • the two outer Litzentechnischen 21 and 25 are conductively connected to the connectors 30 and can be connected, for example, in a simple manner with the ends of the assembly 40 belonging, not shown in detail coil.
  • the connectors 30 are preferably formed as Preci-dip contacts. These provide a particularly secure connection by a multi-point support by several lamellar contacts.

Abstract

Die Erfindung betrifft eine Vorrichtung zur Verbindung eines elektrischen Bauteils (30; 32; 34) oder einer Baugruppe (40) mit wenigstens einem elektrischen Leiter (21, 22, 23, 24, 25), mit einem Trägerbauteil (10), in das zumindest ein elektrisch leitendes Verbindungselement (17; 18; 30) integriert ist. Erfindungsgemäß ist am Trägerbauteil (10) zumindest eine Fixierung (12; 13) des wenigstens einen elektrischen Leiters (21, 22, 23, 24, 25) integriert, über die der wenigstens eine elektrische Leiter (21, 22, 23, 24, 25) mit dem Verbindungselement (17; 18; 30) in eine leitende Verbindung gebracht wird. Die Erfindung betrifft auch ein Verfahren zur Herstellung einer derartigen Vorrichtung.The invention relates to a device for connecting an electrical component (30, 32, 34) or an assembly (40) to at least one electrical conductor (21, 22, 23, 24, 25), with a carrier component (10) into which at least an electrically conductive connecting element (17; 18; 30) is integrated. According to the invention, at least one fixing (12, 13) of the at least one electrical conductor (21, 22, 23, 24, 25) is integrated on the carrier component (10), via which the at least one electrical conductor (21, 22, 23, 24, 25 ) is brought into a conductive connection with the connecting element (17; 18; 30). The invention also relates to a method for producing such a device.

Description

Die Erfindung betrifft eine Vorrichtung zur Verbindung eines elektrischen Bauteils mit wenigstens einem elektrischen Leiter gemäß dem Oberbegriff des Anspruchs 1. Die Erfindung betrifft weiterhin ein Verfahren zur Herstellung einer derartigen Vorrichtung gemäß dem Oberbegriff des Anspruchs 9.The invention relates to a device for connecting an electrical component with at least one electrical conductor according to the preamble of claim 1. The invention further relates to a method for producing such a device according to the preamble of claim 9.

Aus der DE 10 2008 057 478 A1 ist ein Trägerelement für Elektrokomponenten bekannt, bei dem ein Draht, der zur Herstellung einer elektrischen Verbindung dient, in ein Kunststoffmaterial des Trägerelements eingebettet ist.From the DE 10 2008 057 478 A1 a carrier element for electrical components is known, in which a wire, which serves to produce an electrical connection, is embedded in a plastic material of the carrier element.

Aufgabe der Erfindung ist die Bereitstellung einer verbesserten Vorrichtung zur Verbindung eines elektrischen Bauteils mit wenigstens einem elektrischen Leiter sowie eines Verfahrens zur Erzeugung einer derartigen Vorrichtung.The object of the invention is to provide an improved device for connecting an electrical component with at least one electrical conductor and a method for producing such a device.

Diese Aufgabe wird hinsichtlich der Vorrichtung durch die Merkmale des Anspruchs 1 gelöst. Ein verbessertes Verfahren ist im Anspruch 9 angegeben. Vorteilhafte Ausgestaltungen der Erfindung sind in den jeweils darauf bezogenen Unteransprüchen angegeben.This object is achieved with regard to the device by the features of claim 1. An improved method is specified in claim 9. Advantageous embodiments of the invention are specified in the respective dependent claims.

Die erfinderische Lösung sieht vor, dass wenigstens ein Trägerbauteil aus Kunststoff zum einen wenigstens eine Litze eines Kabels als elektrischen Leiter und zum anderen wenigstens ein Verbindungselement zur Ankopplung eines elektrischen Bauteils oder einer elektrischen Baugruppe verbindet.The inventive solution provides that at least one support member made of plastic connects to at least one strand of a cable as an electrical conductor and the other at least one connecting element for coupling an electrical component or an electrical assembly.

Durch das Trägerbauteil wird eine einfache, prozesssichere, dauerhaft dichte Verbindung zwischen dem elektrischen Leiter und dem elektrischen Bauteil gewährleistet. Das Trägerbauteil mit den daran fixierten Litzen ersetzt in kostengünstiger Weise einen dreidimensionalen 3D-Schaltungsträger (MID), bei dem die elektrischen Verbindungen als kupferne Leitungsbahnen ausgebildet sind. Durch den Entfall bisher verwendeter Stanzgitter reduzieren sich die Werkzeugkosten erheblich. Die Anbindungspunkte für bedrahtete Bauteile können sehr flexibel gestaltet werden. Für die Fixierung der Litzen können günstige Verbindungstechniken verwendet und frei kombiniert werden, wie beispielsweise Splicen, Crimpen, Löten oder Schweißen.The carrier component ensures a simple, process-reliable, permanently sealed connection between the electrical conductor and the electrical component. The carrier component with the strands fixed thereto replaces a three-dimensional 3D circuit carrier (MID) in a cost-effective manner, in which the electrical connections are in the form of copper conductor tracks. The elimination of previously used stamped grid, the tool costs are reduced significantly. The connection points for wired components can be made very flexible. For the fixation of the strands cheap joining techniques can be used and freely combined, such as splicing, crimping, soldering or welding.

Vorzugsweise ist das Trägerbauteil aus einem durch Spritzen geformten Kunststoff ausgebildet. Alternativ zu einer klassischen Umspritzung kann auch ein Makromelt-Verfahren oder ein Hotmelt-Verfahren in Form von thermoplastischen oder reaktiven (PUR-) Hotmelts zum Einsatz kommen. Bei den Vergusswerkstoffen des Makromelt-Verfahrens handelt es sich um thermoplastische Schmelzklebstoffe auf Basis von Polyamid. Mittels dieser Verfahren kann ebenfalls eine "Umspritzung" im Sinne dieser Erfindung erzeugt werden.Preferably, the support member is formed of a molded plastic by injection molding. As an alternative to conventional overmolding, it is also possible to use a macromelt process or a hotmelt process in the form of thermoplastic or reactive (PUR) hotmelts. The casting materials of the macromelt process are thermoplastic hot melt adhesives based on polyamide. By means of these methods, an "encapsulation" in the sense of this invention can likewise be produced.

Gemäß einer weiteren Alternative kann das Trägerbauteil auch von wenigstens einem bereits vorgefertigten Kunststoffformteil gebildet sein. Dieses kann optional nach dem Fixieren der elektrischen Leiter und der Verbindungselemente auch zusätzlich mit einem Kunststoffmaterial umspritzt werden. Gemäß einer weiteren Alternative kann auch ein erstes vorgefertigtes Kunststoffformteil nach dem Fixieren der elektrischen Leiter und der Verbindungselemente von einem zweiten vorgefertigten Kunststoffformteil umgeben oder zu einem geschlossenen Ganzen vervollständigt werden.According to a further alternative, the carrier component can also be formed by at least one already prefabricated plastic molded part. This can optionally be additionally encapsulated after fixing the electrical conductors and the connecting elements with a plastic material. According to a further alternative, after fixing the electrical conductors and the connecting elements, a first prefabricated plastic molded part can also be surrounded by a second prefabricated plastic molded part or can be completed to a closed whole.

Vorzugsweise umgibt die Fixierung zumindest teilweise eine Kunststoffisolierung des wenigstens einen elektrischen Leiters. Die Fixierung kann dabei beispielsweise als Nut ausgebildet sein, in die die Kunststoffisolierung des wenigstens einen elektrischen Leiters hineingedrückt und dort festgeklemmt wird. Ebenso können die Verbindungselemente, die ihrerseits beispielsweise als Drähte, als Steckverbinder oder als Buchsen ausgebildet sein können, in entsprechend geformte Aussparungen am Trägerbauteil eingebettet sein. Die Fixierung der elektrischen Leiter kann aber auch auf andere Art, beispielsweise durch Splicen, Crimpen, Löten oder Schweißen erfolgen.Preferably, the fixation surrounds at least partially a plastic insulation of the at least one electrical conductor. The fixation can be formed for example as a groove, in which the plastic insulation of the at least one electrical conductor is pressed and clamped there. Likewise, the connecting elements, in turn, for example, as wires, as a connector or may be formed as sockets, be embedded in correspondingly shaped recesses on the support member. The fixation of the electrical conductors can also be done in other ways, for example, by splicing, crimping, soldering or welding.

Vorteilhaft ist es ferner, wenn das Trägerbauteil wenigstens eine Aussparung aufweist, über die voneinander beabstandete abisolierte Abschnitte der elektrischen Leiter geführt sind. Das Abisolieren kann nach dem Positionieren und Fixieren der elektrischen Leiter über dieser Aussparung auch erst nachträglich erfolgen, wobei die Aussparung den Zugang für das Werkzeug - beispielsweise eine Fensterabisoliervorrichtung - zum Abisolieren erleichtert.It is also advantageous if the support member has at least one recess, are guided over the spaced-apart stripped portions of the electrical conductors. The stripping can also be done later after positioning and fixing the electrical conductor over this recess, the recess access to the tool - for example a Fensterabisoliervorrichtung - facilitates stripping.

Besonders vorteilhaft ist es, wenn das Trägerbauteil zusätzlich Halterungen für elektronische Bauteile aufweist. Dadurch wird der Nutzen des Trägerbauteils zusätzlich erhöht.It is particularly advantageous if the carrier component additionally has holders for electronic components. This additionally increases the usefulness of the carrier component.

Diese Halterungen für die elektronischen Bauteile sind bevorzugt an entsprechend geformten Vorsprüngen des Trägerbauteils vorgesehen. Die Vorsprünge können dabei integral am Trägerbauteil ausgebildet sein, aber auch als separates Bauteil ausgebildet sein und beispielsweise durch eine formschlüssige Verbindung (Clipsen, Verrasten) oder eine stoffschlüssige Verbindung (Anspritzen, Kunststoffschweißen) mit dem Trägerbauteil verbunden werden.These holders for the electronic components are preferably provided on correspondingly shaped projections of the carrier component. The projections may be integrally formed on the support member, but also be formed as a separate component and, for example, by a positive connection (clips, locking) or a cohesive connection (molding, plastic welding) are connected to the support member.

Es ist weiterhin vorteilhaft, wenn das Trägerbauteil eine Kabelaufnahme zur Aufnahme eines Kabelmantels eines mehrere elektrische Leiter aufweisenden Kabels umfasst. Die Integration einer Kabelaufnahme am Trägerbauteil ermöglicht eine vor Schmutz und Feuchtigkeit bestens geschützte Einführung der elektrischen Leiter in das Trägerbauteil.It is also advantageous if the carrier component comprises a cable receptacle for receiving a cable sheath of a cable having a plurality of electrical conductors. The integration of a cable receptacle on the support member allows a well protected from dirt and moisture introduction of the electrical conductors in the support member.

Ein Verfahren zur Herstellung einer erfindungsgemäßen Vorrichtung zeichnet sich durch folgende Verfahrensschritte aus:

  1. a) Einlegen des zumindest teilweise abisolierten Endes wenigstens eines elektrischen Leiters in eine Fixierung,
  2. b) Einlegen zumindest eines elektrisch leitenden Verbindungselements und optional weiterer elektronischer Bauteile in eine Form,
  3. c) Umspritzen des zumindest einen teilweise abisolierten Endes des wenigstens einen elektrischen Leiters sowie des elektrisch leitenden Verbindungselements und der optionalen weiteren elektronischen Bauteile in der Form mit einem nichtleitenden Kunststoff.
A method for producing a device according to the invention is characterized by the following method steps:
  1. a) inserting the at least partially stripped end of at least one electrical conductor into a fixation,
  2. b) inserting at least one electrically conductive connecting element and optionally further electronic components in a mold,
  3. c) encapsulating the at least one partially stripped end of the at least one electrical conductor and the electrically conductive connecting element and the optional further electronic components in the mold with a non-conductive plastic.

Bei einem alternativen Verfahren ist vorgesehen, dass die Fixierung an einem bereits vorgefertigten Kunststoffformteil ausgebildet ist, das beispielsweise in eine Form eingelegt und von einem nichtleitenden Kunststoff mit umspritzt wird.In an alternative method it is provided that the fixation is formed on an already prefabricated plastic molded part, which is placed for example in a mold and encapsulated by a non-conductive plastic.

Nachfolgend wird ein Ausführungsbeispiel einer erfindungsgemäßen Vorrichtung sowie eines zu dessen Herstellung besonders geeignetes Verfahren unter Bezugnahme auf die Zeichnungen näher erläutert. Dabei bezeichnen gleiche Bezugszeichen in den verschiedenen Figuren die gleichen Elemente. Es zeigt:

  • Fig. 1 eine schematische Ansicht einer elektrischen Baugruppe, die mittels eines
  • Trägerbauteils kontaktiert wird;
  • Fig. 2 eine schematische Ansicht der noch nicht zusammengefügten Teile einer erfindungsgemäßen Vorrichtung,
  • Fig. 3 eine schematische Seitenansicht eines erfindungsgemäßen Trägerbauteils,
  • Fig. 4 eine schematische Ansicht aller für die Kontaktierung notwendigen Bauteile unter Weglassung des Trägerbauteils,
  • Fig. 5 eine schematische Ansicht aller für die Kontaktierung notwendigen, am Trägerbauteil angeordneten Bauteile, und
  • Fig. 6 eine schematische Ansicht einer Alternative zur Figur 4 mit am Trägerbauteil angeordneten Splice-Verbindungen.
An exemplary embodiment of a device according to the invention and of a method particularly suitable for its production will be explained in more detail below with reference to the drawings. The same reference numerals in the various figures denote the same elements. It shows:
  • Fig. 1 a schematic view of an electrical assembly, by means of a
  • Carrier component is contacted;
  • Fig. 2 a schematic view of the not yet assembled parts of a device according to the invention,
  • Fig. 3 a schematic side view of a carrier component according to the invention,
  • Fig. 4 a schematic view of all components necessary for the contacting, omitting the carrier component,
  • Fig. 5 a schematic view of all necessary for contacting, arranged on the support member components, and
  • Fig. 6 a schematic view of an alternative to FIG. 4 with arranged on the support member splice connections.

In Figur 1 ist eine elektronische Baugruppe 40 mit einem Kabel 20 über ein Trägerbauteil 10 elektrisch kontaktiert. Ein Vorsprungs 16 am Trägerbauteil 10 dient zur Halterung weiterer elektronischer Bauteile.In FIG. 1 is an electronic assembly 40 electrically contacted with a cable 20 via a support member 10. A projection 16 on the carrier component 10 serves to hold further electronic components.

In Figur 2 ist das Trägerbauteil 10 und sind alle weiteren für die Kontaktierung erforderlichen Bauteile als Explosionsdarstellung in noch nicht montierten Zustand dargestellt. Dazu gehört auf der einen Seite ein Kabel 20, das von einem Kabelmantel 26 umgeben ist und im Ausführungsbeispiel fünf Litzenleitungen 21, 22, 23, 24 und 25 umfasst. Die fünf Litzenleitungen 21, 22, 23, 24 und 25 weisen kurz vor ihrem Ende einen abisolierten Abschnitt 28 auf.In FIG. 2 is the support member 10 and all other components required for the contacting are shown as an exploded view in not yet assembled state. This includes on the one hand a cable 20 which is surrounded by a cable sheath 26 and in the embodiment comprises five stranded wires 21, 22, 23, 24 and 25. The five stranded wires 21, 22, 23, 24 and 25 have a stripped portion 28 just before their end.

Das Trägerbauteil 10 weist auf der Seite des Kabels 20 eine Kabelaufnahme 11 auf. Das Trägerbauteil 10 weist ferner einen Litzenhalter 12 auf, an dem mehrere Fixierungen 13 für die Enden der Litzenleitungen 21, 22, 23, 24 und 25 ausgebildet sind. Fixierungen 13 sind auch am anderen Ende des Trägerbauteils 10 vorgesehen. Diese dienen zur Fixierung von elektrischen Leitern 17 oder 18 oder von Steckverbindern 30. Das Trägerbauteil 10 weist in seinem mittleren Bereich zwischen den Fixierungen 13 eine Aussparung 14 auf, die groß genug ist, dass ein Werkzeug zum Abisolieren der innerhalb der Aussparung 14 angeordneten Bereiche der Litzenleitungen 21, 22, 23, 24 und 25 Zugriff auf die Isolierungen der Litzenleitungen 21, 22, 23, 24 und 25 hat, um diese zur Herstellung der gewünschten Kontaktierung partiell zu entfernen.The carrier component 10 has a cable receptacle 11 on the side of the cable 20. The carrier component 10 furthermore has a strand holder 12 on which a plurality of fixations 13 are formed for the ends of the stranded conductors 21, 22, 23, 24 and 25. Fixations 13 are also provided at the other end of the support member 10. These serve to fix electrical conductors 17 or 18 or connectors 30. The support member 10 has in its central region between the fixings 13 a recess 14 which is large enough that a tool for stripping the arranged within the recess 14 areas of Litz wires 21, 22, 23, 24 and 25 has access to the insulations of the stranded wires 21, 22, 23, 24 and 25 in order to partially remove them to produce the desired contact.

Die Leiter 17 dienen im gezeigten Ausführungsbeispiel zur Kontaktierung eines Hall-IC bzw. Hallsensors 32. Die Leitungen 18 dienen zur Kontaktierung eines Kondensators 34. Der Hall-IC 32 und der Kondensator 34 sind ebenso wie ein Magnet 36 an einem Vorsprung 16 angeordnet, der entweder als integraler Bestandteil des Trägerbauteils 10 an einem Fortsatz 15 desselben ausgebildet ist oder der als separates vorgefertigtes Bauteil 16 mit dem Trägerbauteil 10 verbunden ist. Der Vorsprung 16 weist mehrere Aufnahmen 161, 162 zur Halterung der elektronischen Bauteile (Hallsensor 32, Kondensator 34, Magnet 36) auf, in welchen diese bevorzugt formschlüssig gehalten oder verrastet sind. Die Halterung 162 für den Hallsensor 32 ist dabei bevorzugt so ausgelegt, dass der Hallsensor 32 in Bezug zum gegenüberliegend angeordneten Magneten 36 unter einer definierten Vorspannung gehalten wird.The conductors 17 are used in the embodiment shown for contacting a Hall IC or Hall sensor 32. The lines 18 serve for contacting a capacitor 34. The Hall IC 32 and the capacitor 34 are arranged as well as a magnet 36 on a projection 16 which either formed as an integral part of the support member 10 on an extension 15 thereof or which is connected as a separate prefabricated member 16 with the support member 10. The projection 16 has a plurality of receptacles 161, 162 for mounting the electronic components (Hall sensor 32, capacitor 34, magnet 36), in which these are preferably held or locked in a form-fitting manner. The holder 162 for the Hall sensor 32 is preferably designed so that the Hall sensor 32 is held in relation to the oppositely arranged magnet 36 under a defined bias voltage.

Das Trägerbauteil 10 wird bevorzugt nach Fixierung der in Figur 2 gezeigten Litzenleitungen 21, 22, 23, 24 und 25, der Leitungen 17 bzw. 18 und der Steckverbinder 30 sowie der zusätzlichen elektronischen Bauteile 32, 34 und 36 von einem weiteren Kunststoffbauteil 19 ummantelt bzw. umgeben. Das weitere Kunststoffbauteil 19 kann als Umspritzung in einer Form hergestellt werden; es kann alternativ aber auch als vorgefertigtes hohles Bauteil über das Trägerbauteil 10 geschoben und mit diesem verrastet, verschweißt oder verklebt werden. Durch das weitere Kunststoffbauteil 19, das nach dem Aufbringen einen Bestandteil des Trägerbauteils 10 bildet, entsteht in jedem Falle ein sicherer und dauerhafter Schutz der elektrischen Verbindungen vor mechanischen Beanspruchungen und allen Witterungseinflüssen.The support member 10 is preferably after fixing the in FIG. 2 shown stranded lines 21, 22, 23, 24 and 25, the lines 17 and 18 and the connector 30 and the additional electronic components 32, 34 and 36 of a further plastic component 19 sheathed or surrounded. The further plastic component 19 can be produced as encapsulation in a mold; Alternatively, however, it can also be pushed over the carrier component 10 as a prefabricated hollow component and latched, welded or glued thereto. Due to the further plastic component 19, which forms a component of the carrier component 10 after application, a secure and permanent protection of the electrical connections from mechanical stresses and all weather influences arises in each case.

In Figur 6 wird die Verbindung zwischen den Litzenleitungen 21, 22, 23, 24 und 25 und den Leitern 17 bzw. den Steckverbindern 30 durch Splice-Verbindungen 31 hergestellt. Im Bereich der Verbindungstechnologie von Leiterplatten mit Litzen stellt das Splicen ein erprobtes Verfahren für prozesssichere Verbindungen dar.In FIG. 6 the connection between the stranded conductors 21, 22, 23, 24 and 25 and the conductors 17 and the connectors 30 is produced by splice connections 31. Splicing is a tried-and-tested process for reliable connections in the field of connection technology for printed circuit boards with strands.

Im gezeigten Ausführungsbeispiel (siehe insbesondere Fig. 4) dienen die mittleren drei Litzenleitungen 22, 23 und 24 der Kontaktierung mit den Leitungen 17 des Hallsensors 32. Die beiden Litzenleitungen 23 und 24 sind zusätzlich mit den Leitern 18 des Kondensators 34 verbunden. Die beiden äußeren Litzenleitungen 21 und 25 sind mit den Steckverbindern 30 leitend verbunden und können beispielsweise in einfacher Weise mit den Enden einer zur Baugruppe 40 gehörenden, im Detail nicht dargestellten Spule verbunden werden.In the embodiment shown (see in particular Fig. 4 ) serve the middle three stranded wires 22, 23 and 24 of the contacting with the lines 17 of the Hall sensor 32. The two wire leads 23 and 24 are additionally connected to the conductors 18 of the capacitor 34. The two outer Litzenleitungen 21 and 25 are conductively connected to the connectors 30 and can be connected, for example, in a simple manner with the ends of the assembly 40 belonging, not shown in detail coil.

Die Steckverbinder 30 sind bevorzugt als Preci-Dip- Kontakte ausgebildet. Diese stellen durch eine Mehrpunktauflage durch mehrere Lamellenkontakte eine besonders sichere Verbindung her.The connectors 30 are preferably formed as Preci-dip contacts. These provide a particularly secure connection by a multi-point support by several lamellar contacts.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

1010
Trägerbauteilsupport component
1111
Kabelaufnahmecable storage
1212
Litzenhalterheald
1313
Fixierungfixation
1414
Aussparungrecess
1515
Fortsatzextension
1616
Vorsprunghead Start
161161
Halterung (an 16)Bracket (on 16)
162162
Halterung (an 16)Bracket (on 16)
1717
Leiterladder
1818
Leiterladder
1919
Kunststoffbauteil (Umspritzung)Plastic component (encapsulation)
2020
Kabelelectric wire
2121
Litzenleitungstranded
2222
Litzenleitungstranded
2323
Litzenleitungstranded
2424
Litzenleitungstranded
2525
Litzenleitungstranded
2626
Kabelmantelcable sheath
2828
(abisolierter) Abschnitt (von 21-25)(stripped) section (from 21-25)
3030
SteckverbinderConnectors
3131
Splice-VerbindungenSplice connections
3232
HallsensorHall sensor
3434
Kondensatorcapacitor
3636
Magnetmagnet
4040
Baugruppemodule

Claims (10)

Vorrichtung zur Verbindung eines elektrischen Bauteils (30; 32; 34) oder einer Baugruppe (40) mit wenigstens einem elektrischen Leiter (21, 22, 23, 24, 25), mit einem Trägerbauteil (10), in das zumindest ein elektrisch leitendes Verbindungselement (17; 18; 30) integriert ist, dadurch gekennzeichnet, dass am Trägerbauteil (10) zumindest eine Fixierung (12; 13) des wenigstens einen elektrischen Leiters (21, 22, 23, 24, 25) integriert ist, über die der wenigstens eine elektrische Leiter (21, 22, 23, 24, 25) mit dem Verbindungselement (17; 18; 30) in eine leitende Verbindung gebracht wird.Device for connecting an electrical component (30, 32, 34) or an assembly (40) with at least one electrical conductor (21, 22, 23, 24, 25), with a carrier component (10), into which at least one electrically conductive connecting element (17; 18; 30) is integrated, characterized in that on the support member (10) at least one fixation (12; 13) of the at least one electrical conductor (21, 22, 23, 24, 25) is integrated over which the at least an electrical conductor (21, 22, 23, 24, 25) is brought into conductive connection with the connecting element (17; 18; 30). Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass das Trägerbauteil (10) von wenigstens einem Kunststoffformteil gebildet wird.Apparatus according to claim 1, characterized in that the carrier component (10) is formed by at least one plastic molded part. Vorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Fixierung (13) eine Kunststoffisolierung des wenigstens einen elektrischen Leiters (21, 22, 23, 24, 25) umgibt.Apparatus according to claim 1 or 2, characterized in that the fixation (13) surrounds a plastic insulation of the at least one electrical conductor (21, 22, 23, 24, 25). Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Trägerbauteil (10) wenigstens eine Aussparung (14) aufweist, über die voneinander beabstandete abisolierte Abschnitte (28) der elektrischen Leiter (21, 22, 23, 24, 25) geführt sind.Device according to one of the preceding claims, characterized in that the carrier component (10) has at least one recess (14) over which spaced-apart stripped sections (28) of the electrical conductors (21, 22, 23, 24, 25) are guided. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Trägerbauteil (10) Halterungen (161, 162) für elektronische Bauteile (32; 34; 36) aufweist.Device according to one of the preceding claims, characterized in that the carrier component (10) has holders (161, 162) for electronic components (32, 34, 36). Vorrichtung nach Anspruch 5, dadurch gekennzeichnet, dass die Halterungen (161, 162) an entsprechend geformten Vorsprüngen (16) des Trägerbauteils (10) vorgesehen sind.Apparatus according to claim 5, characterized in that the holders (161, 162) are provided on correspondingly shaped projections (16) of the carrier component (10). Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Trägerbauteil (10) eine Kabelaufnahme (11) zur Aufnahme eines Kabelmantels (26) eines mehrere elektrische Leiter (21, 22, 23, 24, 25) aufweisenden Kabels (20) umfasst.Device according to one of the preceding claims, characterized in that the carrier component (10) has a cable receptacle (11) for receiving a cable sheath (26) of a plurality of electrical conductors (21, 22, 23, 24, 25) comprising cable (20). Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Trägerbauteil (10) aus zwei Teilen gebildet wird, von denen zumindest eines als Kunststoffspritzteil (19) gebildet istDevice according to one of the preceding claims, characterized in that the carrier component (10) is formed from two parts, of which at least one is formed as a plastic injection molded part (19) Verfahren zur Herstellung einer Vorrichtung gemäß einem der Ansprüche 1 bis 8, gekennzeichnet durch folgende Verfahrensschritte: a) Einlegen des zumindest teilweise abisolierten Endes wenigstens eines elektrischen Leiters (21, 22, 23, 24, 25) in eine Fixierung (13), b) Einlegen zumindest eines elektrisch leitenden Verbindungselements (17; 18; 30) und optional weiterer elektronischer Bauteile (32; 34; 36) in eine Form, c) Umspritzen des zumindest einen teilweise abisolierten Endes des wenigstens einen elektrischen Leiters (21, 22, 23, 24, 25), des elektrisch leitenden Verbindungselements (17; 18; 30) und der optionalen weiteren elektronischen Bauteile (32; 34; 36) in der Form mit einem nichtleitenden Kunststoff zur Erzeugung eines Trägerbauteils (10; 19). Method for producing a device according to one of Claims 1 to 8, characterized by the following method steps: a) inserting the at least partially stripped end of at least one electrical conductor (21, 22, 23, 24, 25) into a fixation (13), b) inserting at least one electrically conductive connecting element (17; 18; 30) and optionally further electronic components (32; 34; 36) into a mold, c) encapsulating the at least one partially stripped end of the at least one electrical conductor (21, 22, 23, 24, 25), the electrically conductive connecting element (17, 18, 30) and the optional further electronic components (32, 34, 36) in the mold with a non-conductive plastic for producing a carrier component (10; 19). Verfahren nach Anspruch 9, dadurch gekennzeichnet, dass die Fixierung (13) an einem Kunststoffformteil (10) ausgebildet ist, das vom nichtleitenden Kunststoff (19) mit umspritzt wird.A method according to claim 9, characterized in that the fixing (13) on a plastic molded part (10) is formed, which is encapsulated by the non-conductive plastic (19).
EP15167826.5A 2014-05-16 2015-05-15 Device for the connection of an electrical component with at least one electrical conductor and method for producing such a device Not-in-force EP2945227B1 (en)

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Application Number Priority Date Filing Date Title
DE102014106913.7A DE102014106913A1 (en) 2014-05-16 2014-05-16 Device for connecting an electrical component with at least one electrical conductor and method for producing such a device

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EP2945227A1 true EP2945227A1 (en) 2015-11-18
EP2945227B1 EP2945227B1 (en) 2017-09-13

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2883424A1 (en) * 2005-03-16 2006-09-22 Pgs Americas Inc FULL DESIGNED ELECTRICAL CONNECTOR FOR USE WITH SEISMIC DATA ACQUISITION SYSTEMS
WO2006108119A1 (en) * 2005-04-05 2006-10-12 Molex Incorporated Electronic part connector
DE102008057478A1 (en) 2008-11-14 2010-05-20 Kiekert Ag Supporting/carrier element for electrically contactable components, e.g. in motor-vehicle lock, has a plug connector and contacts for a component
WO2011137949A1 (en) * 2010-05-04 2011-11-10 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft Würzburg Electrical assembly connection of a motor vehicle

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2883424A1 (en) * 2005-03-16 2006-09-22 Pgs Americas Inc FULL DESIGNED ELECTRICAL CONNECTOR FOR USE WITH SEISMIC DATA ACQUISITION SYSTEMS
WO2006108119A1 (en) * 2005-04-05 2006-10-12 Molex Incorporated Electronic part connector
DE102008057478A1 (en) 2008-11-14 2010-05-20 Kiekert Ag Supporting/carrier element for electrically contactable components, e.g. in motor-vehicle lock, has a plug connector and contacts for a component
WO2011137949A1 (en) * 2010-05-04 2011-11-10 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft Würzburg Electrical assembly connection of a motor vehicle

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EP2945227B1 (en) 2017-09-13

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