EP2919944A1 - Bearbeitungsscheibe zur bearbeitung eines untergrundes - Google Patents
Bearbeitungsscheibe zur bearbeitung eines untergrundesInfo
- Publication number
- EP2919944A1 EP2919944A1 EP13789559.5A EP13789559A EP2919944A1 EP 2919944 A1 EP2919944 A1 EP 2919944A1 EP 13789559 A EP13789559 A EP 13789559A EP 2919944 A1 EP2919944 A1 EP 2919944A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- carrier body
- segment
- segments
- cooling
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000012545 processing Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 title claims abstract description 17
- 238000001816 cooling Methods 0.000 claims abstract description 72
- 238000003754 machining Methods 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 3
- 230000004308 accommodation Effects 0.000 abstract 1
- 238000000227 grinding Methods 0.000 description 82
- 239000002826 coolant Substances 0.000 description 21
- 230000000694 effects Effects 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 4
- 238000010008 shearing Methods 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 102100037010 Fidgetin Human genes 0.000 description 2
- 101000878296 Homo sapiens Fidgetin Proteins 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with cooling provisions
Definitions
- the present invention relates to a machining disk for machining a substrate according to the preamble of claim 1.
- machining disk covers all machining disks for machining a substrate by grinding, cutting and similar machining methods.
- the machining disks may be formed as flat or pot-shaped machining disks and consist of a carrier body and a processing section of one or more segments, which are connected to the carrier body.
- the machining disks may comprise a plurality of segments or a single annular segment. Depending on the particular machining process of a machining disk, the segments are also referred to as sanding segments or separating segments.
- EP 0 865 878 A1 discloses a machining disk designed as a grinding wheel for the surface treatment of a mineral, coated or other substrate.
- the grinding wheel is cup-shaped and consists of a carrier body with a receiving area and a grinding area as well as a processing section with a plurality of grinding segments.
- the abrasive segments are connected on a back side facing away from the substrate to be processed with a connecting region of the carrier body.
- soldering and welding are used, among others.
- the grinding wheel in the carrier body on suction openings is sucked through the removed material from an exhaust system.
- the grinding segments heat up by friction with the substrate to be processed.
- the grinding wheel is cooled during machining.
- the coolant flows via the intermediate spaces between the abrasive segments and the suction openings in the carrier body into the interior. range of the grinding wheel.
- the abrasive segments are cooled on the one hand via the coolant and on the other hand give the abrasive segments heat to the cooled carrier body.
- the known machining disk has the disadvantage that the life of the segments is limited despite the supply of a coolant through the spaces between the cutting segments. In addition, the cooling is difficult with small gaps between the segments.
- the object of the present invention is the development of a processing disc for processing a substrate with an increased service life of the segments.
- the processing speed should be increased during processing.
- a cooling opening is provided at least partially in at least one segment and / or in at least one connecting region of the carrier body to form a segment. Cooling openings, which are provided in the connecting region of the carrier body, in the segment or in the carrier body and in the segment, improve the heat removal from the segments during the processing of a substrate. The improved heat dissipation increases the service life of the segments and the machining speed during machining.
- the at least one cooling opening is provided completely in at least one segment and / or in at least one connecting region of the carrier body.
- the cooling hole is completely located in the segment or in the segment and in the joint area, the contact area for the coolant with the segment is increased and the cooling effect is increased.
- the coolant is liquid or gaseous, wherein especially air is used as the coolant.
- the cooling opening is formed in the carrier body, wherein the cooling opening is formed as a passage opening or as a blind opening.
- the design of the cooling opening in the carrier body has the advantage of ease of manufacture.
- the carrier body is designed, for example, as a steel body and the cooling opening is produced by drilling, milling, punching or comparable manufacturing methods in the carrier body.
- a through the support body passing through the cooling hole which is referred to as a through hole, has the advantage that the coolant comes into contact with the back of the segments and the heat is released from the segment directly to the coolant.
- the size and geometry of the passage opening is chosen so that a secure attachment of the segment is ensured with the connection region of the carrier body and the required for the approval of the processing disc shearing forces are met.
- the passage opening has a further advantage, it reduces the connecting surface between the segment and the carrier body and thereby increases the contact pressure during welding. The higher contact pressure leads to a better connection between the segment and the carrier body.
- a cooling opening which is not completely penetrated by the carrier body and is referred to as a blind opening, has the advantage that the connecting surface between the carrier body and the segments is not reduced by the cooling opening.
- the bag opening in the carrier body is suitable for processing disks in which the attachment of the segments to the carrier body is critical.
- the cooling opening is formed in the carrier body and in the segment.
- the formation of the cooling opening in the carrier body and in the segment increases the contact area between the segment and the coolant and thereby increases the heat transfer from the segment to the coolant. The greater the contact area between the segment and the coolant, the better the cooling effect for the segment and the longer the life of the segments.
- the cooling opening is formed as a passage opening in the carrier body and as a passage opening in the segment.
- a completely passing through the support body and the segment cooling opening increases the contact area between the segment and the coolant and improves the cooling effect.
- the coolant flows through the entire segment and transports the heat away from the segment.
- material removed via the cooling openings can be removed.
- the cooling opening is alternatively formed as a passage opening in the carrier body and as a blind opening in the segment.
- An incomplete through the segment cooling opening has the advantage that the entire cross-sectional area of the segment is available for processing.
- the cooling opening is designed as a passage opening in the segment.
- the passage opening in the segment reduces the connection area between the segment and the carrier body and thereby increases the contact pressure during welding. Of the higher contact pressure leads to a better connection between the segment and the carrier body.
- the cooling opening is in a preferred embodiment up to 80% of the cross-sectional area of the segment.
- the connecting surface between the segment and the carrier body is at least 20% of the cross-sectional area of the segments.
- the cooling opening is filled in a further preferred embodiment with a heat-conducting material, wherein the thermal conductivity of the material is higher than the thermal conductivity of the carrier body.
- Suitable materials for steel support bodies include copper, resin and aluminum.
- the filling of the cooling hole with a thermally conductive material is suitable for machining wheels whose stability is to be increased.
- a material is selected whose thermal conductivity is higher than the thermal conductivity of the carrier body.
- FIGS. 1A-C show a first embodiment of a grinding wheel according to the invention, comprising a carrier body and a plurality of grinding segments in a view from below of the grinding segments (FIG. 1A), in a section through the grinding wheel along the line I-I in FIG. 1A (FIG.1B) and in a top view of the carrier body (FIG.1C); and FIGs. 2A, B show a second embodiment of a machining disk according to the invention consisting of a carrier body and a plurality of abrasive segments in a view from below of the abrasive segments (FIG. 2A) and in a section through the grinding wheel along the line II-II in FIG. 2A (FIG.2B).
- FIGS. 1 A-C show a first embodiment of a machining disk 10 according to the invention for machining a mineral or coated substrate.
- the machining disk is designed as a cup-shaped grinding wheel 10.
- the grinding wheel 10 consists of a carrier body 11 and a plurality of grinding segments 12, which are connected to the carrier body 11.
- the grinding segments 12 are, for example, soldered to the carrier body 11, welded or fastened to the carrier body 11 with the aid of similar processing methods.
- FIG. 1A shows the grinding wheel 10 in a view of the grinding segments 12 from below.
- the carrier body 11 of the grinding wheel 10 comprises a receiving area 13, a processing area 14 designed as a grinding area, and a transition area connecting the receiving and grinding area 13, 14 through the pot shape of the grinding wheel 10 15; with flat processing discs the transition area is eliminated.
- the receiving area 13 of the carrier body 11 serves to fix the grinding wheel 10 on a drive shaft of a power tool.
- a central opening 16 is provided for the drive shaft.
- the abrasive segments 12 are connected to the carrier body 11.
- the cutting segments 12 are collectively referred to as the processing section 17 (see FIG.1B).
- the grinding wheel 10 has a machining section 17 with seven triangular sanding segments 12, the sides of the sanding segments 12 being curved outwards. To distinguish the abrasive segments and other elements in the figures, an index ".i" is used.
- the number of grinding segments 12 and the geometry of Abrasive segments 12 are adapted to the diameter of the grinding wheel 10 and to the substrate to be processed.
- L-shaped grinding segments, U-shaped grinding segments and rectangular grinding segments with curved side surfaces are known, among other things.
- the grinding segments 12 each have two grooves 19 on a front side 18 facing away from the grinding region 14 of the carrier body 11. The grooves 19 serve to be able to suck off worn material better.
- the grinding region 14 has a plurality of suction openings 21, which are arranged in the direction of contact of the grinding wheel 10 and have substantially the same distance from each other.
- material removed from the substrate to be processed is extracted via the suction openings 21.
- the suction openings 21 are formed oval in the grinding wheel 10 and moved to the transition region 15 of the carrier body 1 1.
- the suction openings 21 should be as large as possible.
- the carrier body 11 in the grinding region 14 must have sufficient stability.
- FIG. FIG. 1B shows a section through the grinding wheel 10 and the first grinding segment 12.1 along the line I-I in FIG. 1A in the processing of a substrate 22.
- the connection between the carrier body 1 1 and the grinding segments 12 is described using the example of the first grinding segment 12.1 and applies analogously to the six other grinding segments 12.2 to 12.7 of the processing section 17, which are identical to the first grinding segment 12.1 ,
- the first grinding segment 12. 1 is connected to the carrier body 11 on a rear side 23 facing away from the front side 18.
- the carrier body 11 has a connecting region 24.1, on which the grinding segment 12.1 is fastened to the carrier body 11.
- the connection region is the entire region of the carrier body 11 to which the first abrasive segment 12.1 adjoins; the connection area not only includes the connection area.
- an opening 25.1 is provided in the connecting region 24.1 of the carrier body 11, which is referred to as a cooling opening.
- the cooling opening 25.1 is formed in the carrier body 11 as a passage opening which passes completely through the carrier body 1 1.
- a coolant flows through the through-opening 25.1 through the carrier body 11 to the grinding segment 12.1 and cools the grinding segment 12.1 on the back 22.
- the coolant is liquid or gaseous, in which air is used as the coolant.
- FIG. 1 C shows the grinding wheel 10 in a view from above of the carrier body 1 1.
- the circular cooling openings 21.1 to 21.7 are located in the connecting areas 24.1 to 24.7 of the carrier body 11 and the suction openings 21.1 to 21.7 are arranged in the grinding area 14 between the connecting areas 24.1 to 24.7.
- the coolant flows into the cooling holes 25 and cools the abrasive segments 12 on the backside 22.
- the heat of the abrasive segments 12 is delivered directly to the coolant.
- the cooling of the abrasive segments 12 improves as the size of the cooling openings 25 increases.
- the size of the cooling openings 25 is limited by the fact that the abrasive segments 12 on the rear side 22 are connected to the carrier body 11. Therefore, the size of the cooling openings 25 is chosen so that in addition to a good cooling secure attachment of the abrasive segments 12 on the support body 11 is ensured and the prescribed Ab shear forces for the approval of the machining disk 10 can be achieved.
- the cooling openings in the carrier body 11 may be formed as blind openings. Sack openings do not reduce the connecting surface between the carrier body 1 1 and the abrasive segments 12, but the cooling effect is less at blind openings than at through holes.
- the grinding wheel 10 has seven triangular grinding segments 12.1 to 12.7 and seven circular cooling openings 25.1 to 25.7 in the connecting areas 24.1 to 24.7 of the carrier body 11.
- the grinding wheel may have different grinding segments with differently shaped cooling openings, the cooling openings may be arranged at differently positioned grinding segments at different positions in the connecting areas or the geometry of the cooling openings is different for similarly constructed grinding segments.
- the geometry of the cooling openings 25 is adapted to the geometry of the abrasive segments 12, the substrate to be processed, etc.
- a circular shape, a triangle, a rectangle, an octagon, a star shape or an ellipse are suitable as the geometry for the cooling openings 25.
- FIGS. 2A, B show a second embodiment of a processing disk 30 according to the invention for the surface treatment of a mineral or coated substrate.
- the machining disk 30, like the machining disk 10, is designed as a cup-shaped grinding wheel.
- the grinding wheel 30 consists of a carrier body 31 and a plurality of grinding segments 32, which are connected to the carrier body 31.
- the grinding wheel 30 differs from the grinding wheel 10 of FIGS. 1A-C through the cooling holes provided in the carrier body 31 and in the abrasive segments 32.
- FIG. FIG. 2A shows the grinding wheel 30 in a view from below of the grinding segments 32.
- the carrier body 31 of the grinding wheel 30, like the carrier body 11 of the grinding wheel 10, consists of the grinding area 14, the transition area 15 and the receiving area 13 with the central opening 16.
- the abrasive segments 32 are triangular in shape and on the front side facing away from the grinding region 14, the abrasive segments 32 each have two grooves 19.
- Each grinding segment 32 is associated with a cooling opening 33.
- the cooling openings 33 are formed as circular passage openings which through the support body 31 and the
- FIG. 2B shows the grinding wheel 30 in a section through the grinding wheel 30 and the first grinding segment 32.1 along the line II-II in FIG. 2A in the processing of the substrate 22.
- the connection between the carrier body 31 and the abrasive segments 32 and the arrangement of the cooling openings 33 in the carrier body 31 and the cutting segments 32 is described using the example of the first grinding segment 32.1 and applies analogously to the other grinding segments 32.2 to 32.7.
- the carrier body 31 has a connecting region 34.1, on which the grinding segment 32.1 is connected to the carrier body 31.
- the cooling opening 33.1 is in two parts from a through opening 35.1 in the carrier body 31 and a through opening 36.1 in
- Abrasive segment 32.1 formed.
- the completely through the support body 31 and the abrasive segment 32.1 cooling opening 33 has the advantage that the cooling effect is improved by the large contact area between the coolant and the abrasive segment 32.1.
- the cross-sectional area of the cooling openings 33 is limited by the fact that the connection surface for fastening the abrasive segment 32 around the cross-section of the cooling opening 33 is reduced.
- connection surface for fastening the abrasive segment 32 around the cross-section of the cooling opening 33 is reduced.
- prescribed shearing forces must be achieved.
- a certain connection surface between the carrier body 1 1 and the abrasive segment 32 is required.
- the size of the cross-sectional area of the cooling openings 33 is chosen so that in addition to good cooling a secure attachment of the abrasive segment 32 on the support body 1 1 is ensured and the prescribed shearing forces are achieved.
- the cooling openings in the carrier body 1 1 may be formed as passage openings and in the grinding segment 12 as a blind openings.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102012220944.1A DE102012220944A1 (de) | 2012-11-16 | 2012-11-16 | Bearbeitungsscheibe zur Bearbeitung eines Untergrundes |
| PCT/EP2013/073577 WO2014076059A1 (de) | 2012-11-16 | 2013-11-12 | Bearbeitungsscheibe zur bearbeitung eines untergrundes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2919944A1 true EP2919944A1 (de) | 2015-09-23 |
Family
ID=49578301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP13789559.5A Withdrawn EP2919944A1 (de) | 2012-11-16 | 2013-11-12 | Bearbeitungsscheibe zur bearbeitung eines untergrundes |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150328746A1 (de) |
| EP (1) | EP2919944A1 (de) |
| JP (1) | JP2015534908A (de) |
| DE (1) | DE102012220944A1 (de) |
| WO (1) | WO2014076059A1 (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019211349A1 (de) * | 2019-07-30 | 2021-02-04 | Robert Bosch Gmbh | Schleifwerkzeug |
| EP4450176A1 (de) * | 2023-04-17 | 2024-10-23 | Boldan Oy | Drehbares schleifwerkzeug |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1600054A (en) * | 1925-08-24 | 1926-09-14 | American Emery Wheel Works | Grinding wheel |
| US2819568A (en) * | 1957-04-18 | 1958-01-14 | John N Kasick | Grinding wheel |
| US3397493A (en) * | 1964-12-09 | 1968-08-20 | Engelhard Hanovia Inc | Surfacing apparatus |
| JPS6383269U (de) * | 1986-11-17 | 1988-06-01 | ||
| US5076024A (en) * | 1990-08-24 | 1991-12-31 | Intelmatec Corporation | Disk polisher assembly |
| DE69635133T2 (de) * | 1995-12-08 | 2006-07-06 | Norton Co., Worcester | Trägerplatten für schleifscheiben |
| US6007415A (en) * | 1995-12-08 | 1999-12-28 | Norton Company | Sanding disks |
| WO1998017438A1 (fr) * | 1996-10-18 | 1998-04-30 | Kanebo Limited | Appareil de polissage de surface |
| DE19707445A1 (de) * | 1997-02-25 | 1998-08-27 | Hilti Ag | Topfförmige Schleifscheibe |
| JP2000084858A (ja) * | 1998-09-10 | 2000-03-28 | Noritake Diamond Ind Co Ltd | 貫通孔付きカップ型回転砥石 |
| KR100314287B1 (ko) * | 1999-07-29 | 2001-11-23 | 김세광 | 연마 휠 |
| JP4381520B2 (ja) * | 1999-09-13 | 2009-12-09 | クレトイシ株式会社 | 研削面観察用透視孔が開けられたオフセット型フレキシブル砥石 |
| DE20004501U1 (de) * | 2000-03-14 | 2000-06-15 | Krebs & Riedel Schleifscheibenfabrik GmbH & Co. KG, 34385 Bad Karlshafen | Diamant-Schleifsegment und Schleifwerkzeug zur Oberflächenbehandlung von Werkstücken |
| DE10012073B4 (de) * | 2000-03-14 | 2004-12-16 | Krebs & Riedel Schleifscheibenfabrik Gmbh & Co. Kg | Diamant-Schleifsegment und Schleifwerkzeug zur Oberflächenbearbeitung von Werkstücken |
| JP2002046073A (ja) * | 2000-08-04 | 2002-02-12 | Kanto Seito Kk | 研磨用軟質孔あきディスク及びその製造方法 |
| DE10161931A1 (de) * | 2001-12-17 | 2003-06-18 | Hilti Ag | Schleifscheibe mit Schleifsegmenten |
| US7744447B2 (en) * | 2005-03-16 | 2010-06-29 | Goei, Co., Ltd. | Abrasive disc |
| CA125471S (en) * | 2007-10-08 | 2008-11-13 | Rin Soon Park | Grinding wheel |
| WO2012020275A1 (en) * | 2010-08-10 | 2012-02-16 | Miksa Marton | Sanding apparatus |
| US9028300B2 (en) * | 2011-08-31 | 2015-05-12 | Ehwa Diamond Industrial Co., Ltd. | Grinding tool adapted to collect grinding particles |
-
2012
- 2012-11-16 DE DE102012220944.1A patent/DE102012220944A1/de not_active Ceased
-
2013
- 2013-11-12 US US14/442,914 patent/US20150328746A1/en not_active Abandoned
- 2013-11-12 EP EP13789559.5A patent/EP2919944A1/de not_active Withdrawn
- 2013-11-12 WO PCT/EP2013/073577 patent/WO2014076059A1/de not_active Ceased
- 2013-11-12 JP JP2015542239A patent/JP2015534908A/ja active Pending
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2014076059A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US20150328746A1 (en) | 2015-11-19 |
| DE102012220944A1 (de) | 2014-05-22 |
| WO2014076059A1 (de) | 2014-05-22 |
| JP2015534908A (ja) | 2015-12-07 |
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| RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: SPYCHER, MARTIN Inventor name: KHATIBI, ELHAM Inventor name: SHAH, BRIJESH RASIKLAL Inventor name: RUSSELL, JOHN |
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