EP2910334A4 - Polishing method and method for producing alloy material - Google Patents

Polishing method and method for producing alloy material

Info

Publication number
EP2910334A4
EP2910334A4 EP13844066.4A EP13844066A EP2910334A4 EP 2910334 A4 EP2910334 A4 EP 2910334A4 EP 13844066 A EP13844066 A EP 13844066A EP 2910334 A4 EP2910334 A4 EP 2910334A4
Authority
EP
European Patent Office
Prior art keywords
alloy material
producing alloy
polishing
polishing method
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13844066.4A
Other languages
German (de)
French (fr)
Other versions
EP2910334A1 (en
Inventor
Hitoshi Morinaga
Kazusei Tamai
Yutaka Niwano
Maiko Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of EP2910334A1 publication Critical patent/EP2910334A1/en
Publication of EP2910334A4 publication Critical patent/EP2910334A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP13844066.4A 2012-10-03 2013-10-01 Polishing method and method for producing alloy material Withdrawn EP2910334A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012221448 2012-10-03
PCT/JP2013/076647 WO2014054611A1 (en) 2012-10-03 2013-10-01 Polishing method and method for producing alloy material

Publications (2)

Publication Number Publication Date
EP2910334A1 EP2910334A1 (en) 2015-08-26
EP2910334A4 true EP2910334A4 (en) 2016-08-03

Family

ID=50434937

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13844066.4A Withdrawn EP2910334A4 (en) 2012-10-03 2013-10-01 Polishing method and method for producing alloy material

Country Status (7)

Country Link
US (1) US20150251293A1 (en)
EP (1) EP2910334A4 (en)
JP (1) JPWO2014054611A1 (en)
KR (1) KR20150065757A (en)
CN (1) CN104684684A (en)
TW (1) TW201424933A (en)
WO (1) WO2014054611A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6415569B2 (en) * 2014-08-07 2018-10-31 株式会社フジミインコーポレーテッド Composition for polishing titanium alloy material
JP6085708B1 (en) * 2016-04-01 2017-02-22 株式会社フジミインコーポレーテッド Polishing composition for alloy material and method for polishing alloy material
JP6760880B2 (en) * 2017-03-31 2020-09-23 株式会社フジミインコーポレーテッド Magnesium or magnesium alloy polishing composition and polishing method using it
KR102349153B1 (en) * 2019-12-16 2022-01-10 주식회사 포스코 Polishing composition for aluminum alloy, manufacturing method thereof, and polishing method using thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323254A (en) * 2000-05-12 2001-11-22 Kao Corp Polishing liquid composition
JP2004243518A (en) * 2004-04-08 2004-09-02 Toshiba Corp Polishing device
US20060112647A1 (en) * 2004-11-30 2006-06-01 Kao Corporation Polishing composition
US20070010098A1 (en) * 2005-06-30 2007-01-11 Cabot Microelectronics Corporation Use of CMP for aluminum mirror and solar cell fabrication
US20100227435A1 (en) * 2009-03-09 2010-09-09 Joon-Sang Park Chemical-mechanical polishing method for polishing phase-change material and method of fabricating phase-change memory device using the same
JP2010205796A (en) * 2009-02-27 2010-09-16 Ebara Corp Substrate processing device and method, semiconductor manufacturing device, semiconductor manufacturing device engineering system, and system
JP2011219358A (en) * 2004-02-25 2011-11-04 Hoya Corp Method for manufacturing glass substrate for mask blank, method for manufacturing mask blank, method for manufacturing exposure mask, method for manufacturing reflective mask blank and method for manufacturing reflective mask blank
US20120058709A1 (en) * 2010-09-08 2012-03-08 Makoto Fukushima Polishing apparatus and method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01246068A (en) 1988-03-29 1989-10-02 Kobe Steel Ltd Mirror face finishing of aluminum alloy substrate
JPH03228564A (en) 1990-02-02 1991-10-09 Nkk Corp Specular finishing method for magnetic disc substrate made of titanium
JPH07142430A (en) * 1993-09-24 1995-06-02 Fujitsu Ltd Polishing apparatus for semiconductor substrate
JP3788810B2 (en) * 1995-02-20 2006-06-21 株式会社東芝 Polishing equipment
US5597442A (en) * 1995-10-16 1997-01-28 Taiwan Semiconductor Manufacturing Company Ltd. Chemical/mechanical planarization (CMP) endpoint method using measurement of polishing pad temperature
JP2005056987A (en) * 2003-08-01 2005-03-03 Nitta Haas Inc Polishing apparatus and method
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
TWI385050B (en) * 2005-02-18 2013-02-11 Nexplanar Corp Customized polishing pads for cmp and methods of fabrication and use thereof
CN101628389A (en) * 2008-07-17 2010-01-20 西北工业大学 Method for grinding plane of TC17 titanium alloy
SG176151A1 (en) * 2009-05-27 2011-12-29 Rogers Corp Polishing pad, polyurethane layer therefor, and method of polishing a silicon wafer
JP2012148376A (en) * 2011-01-20 2012-08-09 Ebara Corp Polishing method and polishing apparatus
US8821215B2 (en) * 2012-09-07 2014-09-02 Cabot Microelectronics Corporation Polypyrrolidone polishing composition and method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323254A (en) * 2000-05-12 2001-11-22 Kao Corp Polishing liquid composition
JP2011219358A (en) * 2004-02-25 2011-11-04 Hoya Corp Method for manufacturing glass substrate for mask blank, method for manufacturing mask blank, method for manufacturing exposure mask, method for manufacturing reflective mask blank and method for manufacturing reflective mask blank
JP2004243518A (en) * 2004-04-08 2004-09-02 Toshiba Corp Polishing device
US20060112647A1 (en) * 2004-11-30 2006-06-01 Kao Corporation Polishing composition
US20070010098A1 (en) * 2005-06-30 2007-01-11 Cabot Microelectronics Corporation Use of CMP for aluminum mirror and solar cell fabrication
JP2010205796A (en) * 2009-02-27 2010-09-16 Ebara Corp Substrate processing device and method, semiconductor manufacturing device, semiconductor manufacturing device engineering system, and system
US20100227435A1 (en) * 2009-03-09 2010-09-09 Joon-Sang Park Chemical-mechanical polishing method for polishing phase-change material and method of fabricating phase-change memory device using the same
US20120058709A1 (en) * 2010-09-08 2012-03-08 Makoto Fukushima Polishing apparatus and method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014054611A1 *

Also Published As

Publication number Publication date
JPWO2014054611A1 (en) 2016-08-25
WO2014054611A1 (en) 2014-04-10
CN104684684A (en) 2015-06-03
US20150251293A1 (en) 2015-09-10
EP2910334A1 (en) 2015-08-26
TW201424933A (en) 2014-07-01
KR20150065757A (en) 2015-06-15

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